JP2021005586A5 - - Google Patents

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Publication number
JP2021005586A5
JP2021005586A5 JP2019117123A JP2019117123A JP2021005586A5 JP 2021005586 A5 JP2021005586 A5 JP 2021005586A5 JP 2019117123 A JP2019117123 A JP 2019117123A JP 2019117123 A JP2019117123 A JP 2019117123A JP 2021005586 A5 JP2021005586 A5 JP 2021005586A5
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JP
Japan
Prior art keywords
land
semiconductor device
plan
view
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2019117123A
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English (en)
Japanese (ja)
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JP7080852B2 (ja
JP2021005586A (ja
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Priority to JP2019117123A priority Critical patent/JP7080852B2/ja
Priority claimed from JP2019117123A external-priority patent/JP7080852B2/ja
Priority to US16/901,117 priority patent/US11309235B2/en
Priority to CN202010563479.5A priority patent/CN112135418B/zh
Publication of JP2021005586A publication Critical patent/JP2021005586A/ja
Publication of JP2021005586A5 publication Critical patent/JP2021005586A5/ja
Application granted granted Critical
Publication of JP7080852B2 publication Critical patent/JP7080852B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019117123A 2019-06-25 2019-06-25 半導体モジュール、電子機器、及びプリント配線板 Active JP7080852B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2019117123A JP7080852B2 (ja) 2019-06-25 2019-06-25 半導体モジュール、電子機器、及びプリント配線板
US16/901,117 US11309235B2 (en) 2019-06-25 2020-06-15 Semiconductor module, electronic device, and printed wiring board
CN202010563479.5A CN112135418B (zh) 2019-06-25 2020-06-19 半导体模块、电子装置和印刷线路板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019117123A JP7080852B2 (ja) 2019-06-25 2019-06-25 半導体モジュール、電子機器、及びプリント配線板

Publications (3)

Publication Number Publication Date
JP2021005586A JP2021005586A (ja) 2021-01-14
JP2021005586A5 true JP2021005586A5 (enExample) 2021-09-09
JP7080852B2 JP7080852B2 (ja) 2022-06-06

Family

ID=73850874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019117123A Active JP7080852B2 (ja) 2019-06-25 2019-06-25 半導体モジュール、電子機器、及びプリント配線板

Country Status (3)

Country Link
US (1) US11309235B2 (enExample)
JP (1) JP7080852B2 (enExample)
CN (1) CN112135418B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11818844B2 (en) * 2021-05-31 2023-11-14 Canon Kabushiki Kaisha Semiconductor module and electronic apparatus
US20240324109A1 (en) * 2023-03-20 2024-09-26 Western Digital Technologies, Inc. Solder barrier contact for an integrated circuit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6449836B1 (en) * 1999-07-30 2002-09-17 Denso Corporation Method for interconnecting printed circuit boards and interconnection structure
JP4643062B2 (ja) * 2001-06-21 2011-03-02 株式会社東芝 配線基板装置
US7183652B2 (en) * 2005-04-27 2007-02-27 Infineon Technologies Ag Electronic component and electronic configuration
JP2006344824A (ja) * 2005-06-09 2006-12-21 Nec Electronics Corp 半導体装置および半導体装置の製造方法
KR100850243B1 (ko) * 2007-07-26 2008-08-04 삼성전기주식회사 인쇄회로기판 및 그 제조방법
JP5107959B2 (ja) 2009-04-09 2012-12-26 ルネサスエレクトロニクス株式会社 基板
JP2011029287A (ja) * 2009-07-22 2011-02-10 Renesas Electronics Corp プリント配線基板、半導体装置及びプリント配線基板の製造方法
US9474166B2 (en) * 2012-12-21 2016-10-18 Canon Kabushiki Kaisha Printed wiring board, printed circuit board, and method for manufacturing printed circuit board
US9237647B2 (en) * 2013-09-12 2016-01-12 Taiwan Semiconductor Manufacturing Company, Ltd. Package-on-package structure with through molding via
JP6230520B2 (ja) * 2014-10-29 2017-11-15 キヤノン株式会社 プリント回路板及び電子機器
JP6750872B2 (ja) * 2016-09-01 2020-09-02 キヤノン株式会社 プリント配線板、プリント回路板及び電子機器

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