WO2017143941A1 - 散热组件 - Google Patents

散热组件 Download PDF

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Publication number
WO2017143941A1
WO2017143941A1 PCT/CN2017/073948 CN2017073948W WO2017143941A1 WO 2017143941 A1 WO2017143941 A1 WO 2017143941A1 CN 2017073948 W CN2017073948 W CN 2017073948W WO 2017143941 A1 WO2017143941 A1 WO 2017143941A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
pcb board
chip
conductive
heat
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Application number
PCT/CN2017/073948
Other languages
English (en)
French (fr)
Inventor
马光明
於明剑
Original Assignee
中兴通讯股份有限公司
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Publication of WO2017143941A1 publication Critical patent/WO2017143941A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields

Definitions

  • the present invention relates to the field of communication electronic devices, and in particular, to a heat dissipation component.
  • the heat sink is one of the indispensable components of high-power communication or electronic equipment. It can improve the heat dissipation capability of the high-power devices of the equipment, effectively reduce the operating temperature of these devices, and create favorable conditions for the stable operation of the equipment.
  • the heat sink avoids heat build-up and temperature rise in high-power devices, but at the same time introduces new problems.
  • the heat sink is mostly made of a conductive metal material, which can form a large interference current as electromagnetic interference of the antenna receiving space.
  • the distance between the heat sink and the chip is very small.
  • the spatial interference received further affects the normal operation of the chip to create conditions.
  • the main object of the present invention is to provide a heat dissipating component, which aims to solve the technical problem that the existing heat sink can easily receive spatial electromagnetic interference and affect the normal operation of the chip.
  • an embodiment of the present invention provides a heat dissipating component, which includes a PCB board, a chip disposed on the PCB board, a conductive connecting member, and a heat sink, wherein the heat sink cover is disposed on the chip
  • the conductive connecting member is disposed around the chip, and the conductive connecting member communicates with the ground signal layer of the PCB board and the heat sink.
  • the conductive connecting member, the PCB board and the heat sink together form a The cavity is shielded and the chip is located inside the shield cavity.
  • the PCB board is provided with a ground via that communicates with the ground signal layer, the ground via is a plurality of and arranged around the chip, and the conductive connector communicates with the ground via and the ground Said radiator.
  • the conductive connector is a conductive pad, the conductive pad is sandwiched between the heat sink and the PCB, and one side of the conductive pad is attached to the ground via and the other side Bonding to the heat sink.
  • the PCB board is further provided with a printed circuit connecting the grounding vias in series, and the distribution of the conductive pads is adapted to the shape of the printed circuit layout, the conductive pads and the conductive pads The printed circuit is attached.
  • the heat sink faces a side of the PCB board with a groove adapted to the shape of the printed circuit layout, the conductive pad portion being snapped into the groove.
  • the heat sink includes a base that is attached to the chip and a base disposed away from the PCB a heat dissipating fin on the board side, the base being provided with a groove adapted to the shape of the printed circuit layout toward a side of the PCB board.
  • the conductive pad is an elastic member, a width of the groove is smaller than a width of the conductive pad, a depth of the groove is smaller than a thickness of the conductive pad, and the conductive pad is Groove interference fit.
  • the conductive connecting member is a pin connected to the heat sink, and a side of the PCB board facing the heat sink is provided with a soldering structure corresponding to the position of the pin, and the lead is soldered to The soldering structure is configured to connect the PCB board and the heat sink.
  • the soldering structure is a ground via that communicates with the ground signal layer.
  • the heat sink and the chip are connected by a thermal conductive gasket or a thermal grease.
  • the invention forms a relatively closed shielding cavity by the conductive connecting member, the PCB board and the heat sink, and the chip is located inside the shielding cavity, the radiator and the conductive connecting component receive electromagnetic interference to generate interference current; the interference current is due to the shielding cavity
  • the shielding function cannot reach the inside of the shielding cavity, so that it can not interfere with the normal operation of the chip, thereby solving the technical problem that the existing heat sink easily receives space electromagnetic interference and affects the normal operation of the chip.
  • FIG. 1 is a cross-sectional structural view showing an embodiment of a heat dissipation structure of the present invention
  • FIG. 2 is a schematic top plan view of the heat dissipation structure of FIG. 1;
  • FIG. 3 is a cross-sectional structural view showing another embodiment of the heat dissipation structure of the present invention.
  • FIG. 4 is a schematic top plan view of the heat dissipation structure of FIG. 3.
  • PCB board 1 ground via 11 trench 43 chip 2
  • first, second, and the like in the present invention are used for the purpose of description only, and are not to be construed as indicating or implying their relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include at least one of the features, either explicitly or implicitly.
  • the technical solutions between the various embodiments may be combined with each other, but must be based on the realization of those skilled in the art, and when the combination of the technical solutions is contradictory or impossible to implement, it should be considered that the combination of the technical solutions does not exist. It is also within the scope of protection required by the present invention.
  • the present invention provides a heat dissipating component, which is mainly used in a communication device or an electronic device.
  • the heat dissipating component includes a printed circuit board (Printed Circuit Board). a printed circuit board), a chip 2 disposed on the PCB board 1, a conductive connecting member 31 and a heat sink 4, the heat sink 4 is disposed on the top of the chip 2, and the conductive connecting member 31 is disposed around the chip 2, and the conductive
  • the connecting member 31 communicates with the ground signal layer (not shown) of the PCB board 1 and the heat sink 4.
  • the conductive connecting member 31, the PCB board 1 and the heat sink 4 together form a shielding cavity, and the chip 2 is located in the shielding cavity. internal.
  • the chip 2 is mounted on the surface of the PCB 1 , and the side of the chip 2 facing away from the PCB 1 is attached to the heat sink 4 , that is, the top of the chip 2 is attached to the side of the heat sink 4 adjacent to the PCB 1 , optionally, heat dissipation
  • the device 4 is connected to the chip 2 by a thermal pad or thermal grease.
  • the heat sink 4 and the conductive connecting member 31 are preferably metal conductive members, and the conductive connecting member 31 is disposed around the chip 2 on the PCB.
  • the conductive connecting member 31, the PCB board 1 and the heat sink 4 together form a relatively closed shielding cavity, and the chip 2 is located inside the shielding cavity, and the heat sink 4 and the conductive connecting member 31 are "receiving antennas".
  • the effect ie, the electromagnetic interference as the antenna receiving space forms an interference current
  • the existing radiator is easy to receive space electromagnetic interference, which affects the technical problems of the normal operation of the chip.
  • the electronic device or the communication device using the heat dissipation structure of the invention has no special requirement for the electromagnetic interference resistance of the chip, and the chip with strong electromagnetic interference resistance cannot be selected through multiple tests, thereby saving a lot of time cost and capital cost; There is no need to cut or attenuate the path of electromagnetic interference, so that it is not necessary to spend human and material resources to overcome the technical problems and adverse effects caused by the transmission path of cutting off or attenuating electromagnetic interference.
  • the PCB board 1 is provided with a ground via 11 communicating with the ground signal layer (ie, the ground layer of the PCB board 1).
  • the ground vias 11 are plural and arranged around the chip 2, and the conductive connection is provided.
  • the piece 31 communicates with the ground via 11 and the heat sink 4.
  • the ground vias 11 on the PCB board 1 communicate with the layer structures of the PCB board 1, thereby preventing the conductive connectors 31 from contacting only the surface of the PCB board and affecting the shielding effect of the PCB board 1.
  • the ground vias 11 are plural, and may be distributed in a regular shape (for example, a rectangle) around the chip 2 to facilitate the processing and production of the PCB 2.
  • the conductive connectors 31 and the ground vias 11 on the PCB 1 respectively dissipate heat.
  • the device 4 is connected to ensure that the circuit between the conductive connecting member 31, the ground via 11 and the heat sink 4 is turned on, so that the heat sink 4, the conductive connecting member 31 and the PCB board 1 form a closed shielding cavity, thereby the chip 2 Wrapped inside the shield cavity to avoid interference current on the chip 2.
  • the conductive connector 31 is a conductive pad (hereinafter indicated by 31), and the conductive pad 31 is sandwiched between the heat sink 4 and the PCB 1.
  • the conductive pad 31 is attached to the ground via 11 and One side is attached to the heat sink 4.
  • the conductive pad 31 may also be a conductive cloth, a conductive rubber tape or the like.
  • the extended shape of the conductive pad 31 attached to the PCB board is adapted to the layout shape formed by the arrangement of the ground vias 11.
  • the conductive pad 31 is a strip around the chip 2.
  • the conductive gasket 31 closes the gap between the heat sink 4 and the PCB board 1, so that the conductive gasket 31 is in good contact with the heat sink 4 and the ground via 11, so that the heat sink 4, the conductive gasket 31 and the PCB board are formed.
  • the PCB board 1 is further provided with a printed circuit (not shown) for connecting the respective ground vias 11 in series, and the distribution of the conductive pads 31 is adapted to the shape of the printed circuit layout, and the conductive pads 31 and The printed circuit fits.
  • the printed circuit is a wire (such as solder) covering the surface of the PCB, and the printed circuit connects the grounding vias 11 in series (for example, the printed circuit connects the ground via 11 to form a rectangular conductive frame), which is increased.
  • the contact area of the ground via 11 and the conductive pad 31 is prevented from being in contact due to the contact area of the ground via 11 and the conductive pad 31 being too small, thereby avoiding the contact between the ground via 11 and the conductive pad 31.
  • the side of the heat sink 4 facing the PCB board 1 is provided with a groove 43 adapted to the shape of the printed circuit layout, and the conductive pad 31 is partially caught in the groove 43; the size of the groove 43 In combination with the conductive pad 31, the conductive pad 31 can be clamped in the groove 43, and the conductive pad 31 is left partially outside the groove 43 to be in contact with the ground via 11 and the printed wiring on the PCB 1.
  • the conductive pad 31, and the PCB board 1 so that the heat sink 4, the conductive pad 31, and the PCB board 1 form a completely closed conductive shielding cavity, which can ensure the heat sink 4 and the chip. 2 good thermal contact, to achieve a good heat dissipation effect, and can play a good shielding effect on the chip 2.
  • the conductive pad 31 is an elastic member
  • the width of the groove 43 is smaller than the width of the conductive pad 31
  • the depth of the groove 43 is smaller than the thickness of the conductive pad 31
  • the conductive pad 31 is interference fit with the groove 43.
  • the width of the trench 43 is such that it can accommodate the conductive pad 31 and has a certain interference fit.
  • the depth of the trench 43 is determined by the height of the conductive pad 31 and the height of the chip, so that the conductive pad maintains its specifications. Appropriate compression required by the book After the conductive pad 31 is inserted into the trench 43, the conductive pad 31 can block the gap between the heat sink 4 and the PCB board 1 to make the conductive pad 31 in a simple and easy-to-implement structure. It is firmly connected with the heat sink 4 and the PCB board to form a completely closed conductive shielding cavity, thereby preventing the chip 2 from being affected by the interference current.
  • the heat sink 4 includes a base 42 that is attached to the chip 2 and a heat dissipating fin 41 disposed on a side of the base 42 facing away from the PCB board 1 .
  • the base 42 is disposed on a side facing the PCB board 1 and printed on the printed circuit. A groove 43 of a shape fit is laid out.
  • the heat sink 4 is made of a metal having good thermal conductivity.
  • the heat dissipating fins 41 of the heat sink 4 are arranged in parallel on the side of the base 42 facing away from the PCB board 1.
  • the base 42 is a plate-shaped member, which increases the heat dissipation area of the heat sink 4.
  • the heat dissipation efficiency of the heat sink 4 is improved; at the same time, the base 42 is attached to the chip 2 through a thermal pad or thermal grease, so that the base 42 has good thermal contact with the chip 2, and the heat generated by the chip 2 can pass through the heat sink 4. Dissipate into the air in time.
  • the conductive connecting member 3 is a pin 32 connected to the heat sink 4, and the PCB board 1 is provided with a lead toward the side of the heat sink 4.
  • the soldering structure corresponding to the position of the foot 32 is soldered to the soldering structure to connect the PCB board and the heat sink 4.
  • the soldering structure may be a pad, a soldering hole, or the like disposed on the PCB 1.
  • the pin 32 may be fixedly connected or integrally formed with the heat sink 4.
  • the spacing between the pins 32 is generally not more than 10 mm, and the pin 32 is After the solder structure is soldered, the height of the pin 32 should not be greater than the distance between the PCB board 1 and the bottom of the heat sink 4 (the state when the heat sink 4 is placed on the chip 2), ensuring that the heat sink 4 can pass through the thermal pad or The thermal grease is in good contact with the chip 2, so that the pin 32 communicates with the ground signal layer of the PCB board 1 and the heat sink 4, and the heat sink 4, the pin 32, and the PCB board together form a substantially closed shielding cavity when the electrostatic discharge interferes.
  • the radiator 4 receives these disturbances and forms an electromagnetic interference current, but because of the skin effect, these electromagnetic interferences can only flow on the outer surface of the shielding cavity, and the chip 2 is in the shielding cavity. The inside of the body will not be disturbed, so as to achieve the purpose of effectively dissipating heat and preventing external electromagnetic interference.
  • the electronic device or the communication device using the heat dissipation structure of the invention has no special requirement for the electromagnetic interference resistance of the chip, and does not need to pass multiple tests to select a chip with strong electromagnetic interference resistance, thereby saving a lot of time cost and capital cost; There is no need to cut or attenuate the path of electromagnetic interference, so that it is not necessary to spend human and material resources to overcome the technical problems and adverse effects caused by the transmission path of cutting off or attenuating electromagnetic interference.
  • the soldering structure is a ground via 11 that communicates with the ground signal layer of the PCB board, so that no special soldering structure is added on the PCB board, and only the common ground via 11 can be used to realize the lead 31 and the PCB board.
  • the electrical connection between 1 reduces the manufacturing process difficulty and production cost of the heat dissipating component of the present invention to some extent.
  • the heat dissipating component of the present application can be used for high-power communication or electronic equipment, and a relatively closed shielding cavity is formed by a conductive connecting member, a PCB board and a heat sink, and the chip is located inside the shielding cavity, and the heat sink and the conductive connecting member receive Electromagnetic interference generates interference current; the interference current cannot reach the inside of the shielding cavity due to the shielding effect of the shielding cavity, so it can not interfere with the normal operation of the chip, thereby solving the technology that the existing radiator easily receives space electromagnetic interference and affects the normal operation of the chip. problem.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本发明公开了一种散热组件，散热组件包括PCB板、设于PCB板上的芯片、导电连接件和散热器，散热器盖设于芯片顶部，导电连接件围设于芯片的周围，且该导电连接件连通PCB板的地信号层和散热器，导电连接件、PCB板和散热器共同构成一个屏蔽腔体，并且芯片位于该屏蔽腔体内部。本发明通过导电连接件、PCB板和散热器共同构成一个较为封闭的屏蔽腔体，并且芯片位于该屏蔽腔体内部，散热器和导电连接件接收电磁干扰产生干扰电流；干扰电流由于屏蔽腔体的屏蔽作用而无法到达屏蔽腔内部，从而无法干扰到芯片的正常工作。

Description

散热组件 技术领域
本发明涉及通讯电子设备技术领域，尤其涉及一种散热组件。
背景技术
散热器是大功率通讯或者电子设备不可缺少的部件之一，能提高设备大功率器件的散热能力，有效降低这些器件的工作温度，为设备稳定工作创造良好的条件。
散热器避免了大功率器件的热量集聚和温度攀升，但是同时带来了新的问题。散热器大多由导电的金属材料制成，可以作为天线接收空间的电磁干扰形成较大的干扰电流。而为了更好的散热，散热器与芯片之间的距离非常小，很多情况下只有一层薄薄的导热硅脂，散热器金属体与芯片内部电路之间非常靠近，这就为散热器上接收的空间干扰进一步影响到芯片正常工作创造了条件。大量的EMC(Electro Magnetic Compatibility，电磁兼容性)试验也证明了这一点，特别是静电放电引起的电磁干扰，通过散热器的“接收天线”效应，在芯片表面形成干扰电流，最终导致芯片误码甚至复位。
发明内容
本发明的主要目的在于提供一种散热组件，旨在解决现有散热器容易接收空间电磁干扰，影响芯片正常工作的技术问题。
为实现上述目的，本发明实施例提供一种散热组件，所述散热组件包括PCB板、设于所述PCB板上的芯片、导电连接件和散热器，所述散热器盖设于所述芯片顶部，所述导电连接件围设于所述芯片的周围，且该导电连接件连通所述PCB板的地信号层和所述散热器，所述导电连接件、PCB板和散热器共同构成一个屏蔽腔体，并且所述芯片位于该屏蔽腔体内部。
优选地，所述PCB板上开设有连通所述地信号层的接地过孔，所述接地过孔为多个且围绕所述芯片排列设置，所述导电连接件连通所述接地过孔和所述散热器。
优选地，所述导电连接件为导电衬垫，所述导电衬垫夹设于所述散热器和PCB板之间，所述导电衬垫一侧与所述接地过孔贴合、另一侧与所述散热器贴合。
优选地，所述PCB板上还设置有将各个所述接地过孔串联连接的印制线路，所述导电衬垫的分布与所述印制线路布局形状适配，所述导电衬垫与所述印制线路贴合。
优选地，所述散热器朝向所述PCB板的一侧设有与所述印制线路布局形状适配的沟槽，所述导电衬垫部分卡入所述沟槽中。
优选地，所述散热器包括与所述芯片贴合的底座和设于所述底座背离所述PCB 板侧的散热翅片，所述底座朝向所述PCB板的一侧设有与所述印制线路布局形状适配的沟槽。
优选地，所述导电衬垫为弹性件，所述沟槽的宽度小于所述导电衬垫的宽度，所述沟槽的深度小于所述导电衬垫的厚度，所述导电衬垫与所述沟槽过盈配合。
优选地，所述导电连接件为与所述散热器连接的引脚，所述PCB板朝向所述散热器的一侧设有与所述引脚位置对应的焊接结构，所述引脚焊接于所述焊接结构中以连通所述PCB板和所述散热器。
优选地，所述焊接结构为连通所述地信号层的接地过孔。
优选地，所述散热器与所述芯片通过导热衬垫或导热硅脂贴合连接。
本发明通过导电连接件、PCB板和散热器共同构成一个较为封闭的屏蔽腔体，并且芯片位于该屏蔽腔体内部，散热器和导电连接件接收电磁干扰产生干扰电流；干扰电流由于屏蔽腔体的屏蔽作用而无法到达屏蔽腔内部，从而无法干扰到芯片的正常工作，进而解决了现有散热器容易接收空间电磁干扰，影响芯片正常工作的技术问题。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明散热结构一实施例的剖视结构示意图；
图2为图1散热结构的俯视结构示意图；
图3为本发明散热结构另一实施例的剖视结构示意图；
图4为图3散热结构的俯视结构示意图。
附图标号说明：
PCB板1            接地过孔11         沟槽43           芯片2
导电连接件3       导电衬垫31         引脚32           散热器4
底座41            散热翅片42
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获 得的所有其他实施例，都属于本发明保护的范围。
需要说明，本发明实施例中所有方向性指示(诸如上、下、左、右、前、后……)仅用于解释在某一特定姿态(如附图所示)下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，在本发明中涉及“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本发明要求的保护范围之内。
本发明提出一种散热组件，该散热组件主要应用于通讯设备或电子设备中，在本发明散热组件一实施例中，参照图1和图2，该散热组件包括PCB板1(Printed Circuit Board，印制电路板)、设于PCB板1上的芯片2、导电连接件31和散热器4，散热器4盖设于芯片2顶部，导电连接件31围设于芯片2的周围，且该导电连接件31连通PCB板1的地信号层(图中未示出)和散热器4，导电连接件31、PCB板1和散热器4共同构成一个屏蔽腔体，并且芯片2位于该屏蔽腔体内部。
芯片2贴装于PCB板1的表面，芯片2背离PCB板1的一侧与散热器4贴合，即芯片2顶部与散热器4靠近PCB板1的一侧贴合，可选地，散热器4与芯片2通过导热衬垫或导热硅脂贴合连接。散热器4和导电连接件31优选为金属导电件，导电连接件31围设于PCB板上芯片2的周围。
在本实施例中，导电连接件31、PCB板1和散热器4共同构成一个较为封闭的屏蔽腔体，并且芯片2位于该屏蔽腔体内部，散热器4和导电连接件31因为“接收天线效应”(即作为天线接收空间的电磁干扰形成干扰电流)接收电磁干扰产生干扰电流，干扰电流由于屏蔽腔体的屏蔽作用而无法到达屏蔽腔内部，从而无法干扰到芯片2的正常工作，进而解决了现有散热器容易接收空间电磁干扰，影响芯片正常工作的技术问题。同时，采用本发明散热结构的电子设备或通讯设备，对芯片的电磁干扰抵抗能力无特别要求，无法通过多次试验来选取电磁干扰抵抗能力强的芯片，节省了不少时间成本和资金成本；对电磁干扰的传播途径无需进行切断或衰减措施，从而无需花费人力物力去克服切断或衰减电磁干扰的传播途径所带来的技术难题和附带不良影响。
进一步地，参照图1和图2，PCB板1上开设有连通地信号层(即PCB板1的地层)的接地过孔11，接地过孔11为多个且围绕芯片2排列设置，导电连接件31连通接地过孔11和散热器4。
当PCB板1为多层结构时，PCB板1上的接地过孔11连通PCB板1的各层结构，从而避免导电连接件31仅与PCB板的表面接触而影响PCB板1的屏蔽效果。并且，接地过孔11为多个，可呈规则形状(例如矩形)分布于芯片2的周围，便于PCB板2的加工生产；导电连接件31分别与PCB板1上的接地过孔11、散热器4连接，以保证导电连接件31、接地过孔11和散热器4之间电路导通，从而使散热器4、导电连接件31和PCB板1构成封闭的屏蔽腔体，从而将芯片2包裹在屏蔽腔体内部以避免干扰电流对芯片2的影响。
进一步地，导电连接件31为导电衬垫(以下以31表示)，导电衬垫31夹设于散热器4和PCB板1之间，导电衬垫31一侧与接地过孔11贴合、另一侧与散热器4贴合。当然，导电衬垫31也可以为导电布、导电橡胶带等其它导电件。
参照图2，导电衬垫31贴合于PCB板上的延伸形状与接地过孔11排列所构成的布局形状适配，可选地，导电衬垫31为一围设于芯片2周围的条状件，且导电衬垫31封闭散热器4和PCB板1之间的缝隙，从而导电衬垫31与散热器4、接地过孔11接触良好，从而散热器4、导电衬垫31和PCB板构成一个容纳芯片2的导电屏蔽腔，由于趋肤效应，散热器4接收空间中的电磁波所形成的干扰电流自所述导电屏蔽腔表面流过，而无法靠近芯片2，以防止干扰电流影响芯片2的正常工作。
进一步地，PCB板1上还设置有将各个接地过孔11串联连接的印制线路(图中未示出)，导电衬垫31的分布与印制线路布局形状适配，导电衬垫31与印制线路贴合。印制线路为覆盖于PCB板表面的导线(例如焊锡)，印制线路将各个接地过孔11串联导通(例如印制线路将接地过孔11连通，共同构成矩形导电框)，增大了接地过孔11与导电衬垫31的接触面积，避免由于接地过孔11与导电衬垫31的接触面积过小而引起接触不良，从而避免因接地过孔11与导电衬垫31接触不良而引起散热器4、导电衬垫31和PCB板构成的导电屏蔽腔的屏蔽效果。
可选地，参照图1，散热器4朝向PCB板1的一侧设有与印制线路布局形状适配的沟槽43，导电衬垫31部分卡入沟槽43中；沟槽43的尺寸与导电衬垫31适配，导电衬垫31可卡紧于沟槽43中，且导电衬垫31留有部分在沟槽43外以与PCB板1上的接地过孔11和印制线路接触，保证散热器4、导电衬垫31、PCB板1之间的良好接触，从而散热器4、导电衬垫31、PCB板1形成完全封闭的导电屏蔽腔体，既能保证散热器4与芯片2的良好热接触，达到良好的散热效果，又能对芯片2起到良好的屏蔽效果。
优选地，导电衬垫31为弹性件，沟槽43的宽度小于导电衬垫31的宽度，沟槽43的深度小于导电衬垫31的厚度，导电衬垫31与沟槽43过盈配合。沟槽43的宽度以能恰好容纳导电衬垫31嵌入并有一定的过盈配合为准，沟槽43的深度由导电衬垫31的高度和芯片的高度确定，在使导电衬垫保持其规格书所要求的适当压缩为前 提，同时导电衬垫31卡入沟槽43中之后，该导电衬垫31能够遮挡散热器4和PCB板1之间的缝隙，从而以一种简单且易于实现的结构，使导电衬垫31与散热器4、PCB板稳固连接，以形成完全封闭的导电屏蔽腔体，从而避免芯片2受到干扰电流的影响。
进一步地，参照图1，散热器4包括与芯片2贴合的底座42和设于底座42背离PCB板1侧的散热翅片41，底座42朝向PCB板1的一侧设有与印制线路布局形状适配的沟槽43。散热器4由导热性良好的金属制成，散热器4的散热翅片41平行排列于底座42背离PCB板1的一侧，底座42为板状件，增大了散热器4的散热面积，提高了散热器4的散热效率；同时底座42通过导热衬垫或导热硅脂与芯片2贴合连接，使底座42与芯片2具有良好的热接触，保证芯片2产生的热量能够通过散热器4及时散发到空气中。
此外，在本发明散热组件的另一实施例中，参照图3和图4，导电连接件3为与散热器4连接的引脚32，PCB板1朝向散热器4的一侧设有与引脚32位置对应的焊接结构，引脚32焊接于焊接结构中以连通PCB板和散热器4。焊接结构可以为设置在PCB板1上的焊盘、焊接孔等结构，引脚32可与散热器4固定连接或一体成型，引脚32之间的间距一般不大于10mm，引脚32在与焊接结构焊接后，引脚32的高度不应大于PCB板1与散热器4底部之间的间距(散热器4盖设于芯片2上时的状态)，保证散热器4能够通过导热衬垫或导热硅脂与芯片2良好接触，从而引脚32连通PCB板1的地信号层和散热器4，进而散热器4、引脚32、PCB板共同形成基本封闭的屏蔽腔体，当静电放电干扰或者其他电磁干扰以电磁波的形式到来时，散热器4虽然接收到了这些干扰并形成电磁干扰电流，但是因为存在趋肤效应，这些电磁干扰只能在屏蔽腔体外表面流动，而芯片2处于屏蔽腔体的内部，不会受到干扰，从而达到既能有效散热又能防止外界电磁干扰的目的。
同时，采用本发明散热结构的电子设备或通讯设备，对芯片的电磁干扰抵抗能力无特别要求，无需通过多次试验来选取电磁干扰抵抗能力强的芯片，节省了不少时间成本和资金成本；对电磁干扰的传播途径无需进行切断或衰减措施，从而无需花费人力物力去克服切断或衰减电磁干扰的传播途径所带来的技术难题和附带不良影响。
可选地，焊接结构为连通PCB板的地信号层的接地过孔11，从而无需在PCB板上另外增设特殊的焊接结构，仅利用常用的接地过孔11即可实现引脚31与PCB板1之间的电连接，从而在一定程度降低了本发明散热组件的制造工艺难度和生产成本。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是在本发明的发明构思下，利用本发明说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。
工业实用性
本申请的散热组件可用于大功率通讯或者电子设备，通过导电连接件、PCB板和散热器共同构成一个较为封闭的屏蔽腔体，并且芯片位于该屏蔽腔体内部，散热器和导电连接件接收电磁干扰产生干扰电流；干扰电流由于屏蔽腔体的屏蔽作用而无法到达屏蔽腔内部，从而无法干扰到芯片的正常工作，进而解决了现有散热器容易接收空间电磁干扰，影响芯片正常工作的技术问题。

Claims (10)

  1. 一种散热组件，其中，所述散热组件包括PCB板、设于所述PCB板上的芯片、导电连接件和散热器，所述散热器盖设于所述芯片顶部，所述导电连接件围设于所述芯片的周围，且该导电连接件连通所述PCB板的地信号层和所述散热器，所述导电连接件、PCB板和散热器共同构成一个屏蔽腔体，并且所述芯片位于该屏蔽腔体内部。
  2. 如权利要求1所述的散热组件，其中，所述PCB板上开设有连通所述地信号层的接地过孔，所述接地过孔为多个且围绕所述芯片排列设置，所述导电连接件连通所述接地过孔和所述散热器。
  3. 如权利要求2所述的散热组件，其中，所述导电连接件为导电衬垫，所述导电衬垫夹设于所述散热器和PCB板之间，所述导电衬垫一侧与所述接地过孔贴合、另一侧与所述散热器贴合。
  4. 如权利要求3所述的散热组件，其中，所述PCB板上还设置有将各个所述接地过孔串联连接的印制线路，所述导电衬垫的分布与所述印制线路布局形状适配，所述导电衬垫与所述印制线路贴合。
  5. 如权利要求4所述的散热组件，其中，所述散热器朝向所述PCB板的一侧设有与所述印制线路布局形状适配的沟槽，所述导电衬垫部分卡入所述沟槽中。
  6. 如权利要求5所述的散热组件，其中，所述散热器包括与所述芯片贴合的底座和设于所述底座背离所述PCB板侧的散热翅片，所述底座朝向所述PCB板的一侧设有与所述印制线路布局形状适配的所述沟槽。
  7. 如权利要求5所述的散热组件，其中，所述导电衬垫为弹性件，所述沟槽的宽度小于所述导电衬垫的宽度，所述沟槽的深度小于所述导电衬垫的厚度，所述导电衬垫与所述沟槽过盈配合。
  8. 如权利要求1所述的散热组件，其中，所述导电连接件为与所述散热器连接的引脚，所述PCB板朝向所述散热器的一侧设有与所述引脚位置对应的焊接结构，所述引脚焊接于所述焊接结构中以连通所述PCB板和所述散热器。
  9. 如权利要求8所述的散热组件，其中，所述焊接结构为连通所述地信号层的接地过孔。
  10. 如权利要求1至9任意一项所述的散热组件，其中，所述散热器与所述芯片通过导热衬垫或导热硅脂贴合连接。
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CN112003003A (zh) * 2020-08-27 2020-11-27 成都天锐星通科技有限公司 相控阵天线结构和电子设备
CN112118187A (zh) * 2020-09-22 2020-12-22 深圳市世纪本原科技股份有限公司 一种基于物联网的防电磁干扰的无线通信路由器
CN113075979A (zh) * 2021-03-26 2021-07-06 山东英信计算机技术有限公司 一种使用pcb散热的传导结构及实现方法
CN114206090A (zh) * 2021-11-30 2022-03-18 四川天邑康和通信股份有限公司 一种能够有效解决pon/全光网关发热和屏蔽信号互绕的方法
CN114206090B (zh) * 2021-11-30 2024-04-16 四川天邑康和通信股份有限公司 一种能够有效解决pon/全光网关发热和屏蔽信号互绕的方法
WO2023098751A1 (zh) * 2021-12-03 2023-06-08 Oppo广东移动通信有限公司 芯片散热结构和电子设备

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