JP2021004330A - Lcptダイ押出未延伸フィルム、並びにこれを用いたフレキシブル積層体及びその製造方法 - Google Patents
Lcptダイ押出未延伸フィルム、並びにこれを用いたフレキシブル積層体及びその製造方法 Download PDFInfo
- Publication number
- JP2021004330A JP2021004330A JP2019119826A JP2019119826A JP2021004330A JP 2021004330 A JP2021004330 A JP 2021004330A JP 2019119826 A JP2019119826 A JP 2019119826A JP 2019119826 A JP2019119826 A JP 2019119826A JP 2021004330 A JP2021004330 A JP 2021004330A
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- Japan
- Prior art keywords
- extruded film
- acid
- lcp
- lcp extruded
- flexible laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims abstract description 32
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims abstract description 21
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims abstract description 20
- XBNGYFFABRKICK-UHFFFAOYSA-N 2,3,4,5,6-pentafluorophenol Chemical compound OC1=C(F)C(F)=C(F)C(F)=C1F XBNGYFFABRKICK-UHFFFAOYSA-N 0.000 claims abstract description 16
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- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
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Classifications
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Abstract
Description
(1)パラヒドロキシ安息香酸、テレフタル酸、イソフタル酸、6−ナフタレンジカルボン酸、4,4’−ビフェノール、ビスフェノールA、ヒドロキノン、4,4−ジヒドロキシビフェノール、エチレンテレフタレート及びこれらの誘導体よりなる群から選択される1種以上と6−ヒドロキシ−2−ナフトエ酸及びその誘導体とをモノマー成分として少なくとも有する芳香族ポリエステル系液晶ポリマーを含有し、ペンタフルオロフェノールへの60℃での溶解率が25%以上である、LCP押出フィルム。
(3)前記芳香族ポリエステル系液晶ポリマー中の6−ヒドロキシ−2−ナフトエ酸の含有割合が10モル%以上70モル%未満である(1)又は(2)に記載のLCP押出フィルム。
(4)フィルム厚みが10μm以上500μm未満である(1)〜(3)のいずれか一項に記載のLCP押出フィルム。
(7)前記芳香族ポリエステル系液晶ポリマー中の6−ヒドロキシ−2−ナフトエ酸の含有割合が10モル%以上70モル%未満である(5)又は(6)に記載のフレキシブル積層体の製造方法。
(8)前記LCP押出フィルムは、10μm以上500μm未満の厚みを有する(5)〜(7)のいずれか一項に記載のフレキシブル積層体の製造方法。
(10)前記LCP押出フィルムと前記金属箔とのピール強度が1.0(N/mm)以上のフレキシブル積層体を得る(5)〜(9)のいずれか一項に記載のフレキシブル積層体の製造方法。
(13)前記芳香族ポリエステル系液晶ポリマー中の6−ヒドロキシ−2−ナフトエ酸の含有割合が10モル%以上70モル%未満である(11)又は(12)に記載のフレキシブル積層体。
(14)前記LCP押出フィルムと前記金属箔とのピール強度が1.0(N/mm)以上である(11)〜(13)のいずれか一項に記載のフレキシブル積層体。
(15)前記LCP押出フィルムは、10μm以上500μm未満の厚みを有する(11)〜(14)のいずれか一項に記載のフレキシブル積層体。
図1は、本実施形態のLCP押出フィルム11を示す概略模式図である。本実施形態のLCP押出フィルム11は、6−ヒドロキシ−2−ナフトエ酸及びその誘導体(以降において、単に「モノマー成分B」と称する場合がある。)を基本構造とし、パラヒドロキシ安息香酸、テレフタル酸、イソフタル酸、6−ナフタレンジカルボン酸、4,4’−ビフェノール、ビスフェノールA、ヒドロキノン、4,4−ジヒドロキシビフェノール、エチレンテレフタレート及びこれらの誘導体よりなる群から選択される1種以上(以降において、単に「モノマー成分A」と称する場合がある。)をモノマー成分として少なくとも有する芳香族ポリエステル系液晶ポリマーを含有し、ペンタフルオロフェノールへの60℃での溶解率が25%以上であることを特徴とする。
図2は、本実施形態のフレキシブル積層体31を示す概略模式図である。本実施形態のフレキシブル積層体31(金属ラミネートフィルム)は、上述したLCP押出フィルム11と、このLCP押出フィルム11の少なくとも一方の表面上に設けられた、1以上の金属箔21を備えるものである。ここで本明細書において、「〜の一方(他方)の面側に設けられた」とは、LCP押出フィルム11の一方の表面11aのみに金属箔21が設けられた態様のみならず、LCP押出フィルム11の他方の表面11bに金属箔21が設けられた態様、LCP押出フィルム11の双方の表面11a,11bに金属箔21が設けられた態様のいずれをも包含する概念である。
撹拌機及び減圧蒸留装置を備える反応槽にp−ヒドロキシ安息香酸(74モル%)と、6−ヒドロキシ−2−ナフトエ酸(26モル%)と、全モノマー量に対し1.025倍モルの無水酢酸を仕込み、窒素雰囲気下で150℃まで反応槽を昇温し、30分保持した後、副生する酢酸を留去させつつ190℃まですみやかに昇温し、1時間保持し、アセチル化反応物を得た。得られたアセチル化反応物を320℃まで3.5時間かけて昇温した後、約30分かけて2.7kPaにまで減圧して溶融重縮合を行ったのち、徐々に減圧して常圧に戻し、ポリマー固形物を得た。得られたポリマー固形物を粉砕し二軸押出機を用いて300℃で造粒して、p−ヒドロキシ安息香酸と6−ヒドロキシ−2−ナフトエ酸からなる芳香族ポリエステル系液晶ポリマー(モル比74:26)のペレットを得た。得られたペレットを用いて、Tダイキャスティング法で製膜することで、融点280℃及び厚さ50μmを有するLCP押出フィルムを得た。
撹拌機及び減圧蒸留装置を備える反応槽にp−ヒドロキシ安息香酸(80モル%)と、6−ヒドロキシ−2−ナフトエ酸(19モル%)と、テレフタル酸(1モル%)と、全モノマー量に対し1.025倍モルの無水酢酸を仕込み、窒素雰囲気下で150℃まで反応槽を昇温し、30分保持した後、副生する酢酸を留去させつつ190℃まですみやかに昇温し、1時間保持し、アセチル化反応物を得た。得られたアセチル化反応物を330℃まで3.5時間かけて昇温した後、約30分かけて2.7kPaにまで減圧して溶融重縮合を行ったのち、徐々に減圧して常圧に戻し、ポリマー固形物を得た。得られたポリマー固形物を粉砕し二軸押出機を用いて330℃で造粒して、p−ヒドロキシ安息香酸と6−ヒドロキシ−2−ナフトエ酸とテレフタル酸からなる芳香族ポリエステル系液晶ポリマー(モル比80:19:1)のペレットを得た。得られたペレットを用いて、Tダイキャスティング法で製膜することで、融点310℃及び厚さ50μmを有するLCP押出フィルムを得た。
撹拌機及び減圧蒸留装置を備える反応槽にp−ヒドロキシ安息香酸(22モル%)と、6−ヒドロキシ−2−ナフトエ酸(49モル%)と、テレフタル酸(16モル%)と、4,4’−ビフェノール(13モル%)と、全モノマー量に対し1.025倍モルの無水酢酸を仕込み、窒素雰囲気下で150℃まで反応槽を昇温し、30分保持した後、副生する酢酸を留去させつつ190℃まですみやかに昇温し、1時間保持し、アセチル化反応物を得た。得られたアセチル化反応物を360℃まで4時間かけて昇温した後、約30分かけて2.7kPaにまで減圧して溶融重縮合を行ったのち、徐々に減圧して常圧に戻し、ポリマー固形物を得た。得られたポリマー固形物を粉砕し二軸押出機を用いて360℃で造粒して、p−ヒドロキシ安息香酸と6−ヒドロキシ−2−ナフトエ酸とテレフタル酸と4,4’−ビフェノールからなる芳香族ポリエステル系液晶ポリマー(モル比22:49:16:13)のペレットを得た。得られたペレットを用いて、Tダイキャスティング法で製膜することで、融点340℃及び厚さ50μmを有するLCP押出フィルムを得た。
実施例1のLCP押出フィルムに、ダブルベルト熱プレス機を用いて320℃で30秒間の接触式の熱処理をすることで、融点280℃のLCP押出フィルムを得た。
実施例1のLCP押出フィルムに、オーブンを用いて260℃で2時間の非接触式の熱処理をした後、さらに280℃で4時間の非接触式の熱処理をすることで、融点290℃のLCP押出フィルムを得た。
実施例1のLCP押出フィルムに、オーブンを用いて260℃で2時間の非接触式の熱処理をし、さらに290℃で20時間の非接触式の熱処理をすることで、融点310℃及び厚さ50μmを有するLCP押出フィルムを得た。
撹拌機及び減圧蒸留装置を備える反応槽にp−ヒドロキシ安息香酸(71モル%)と、6−ヒドロキシ−2−ナフトエ酸(27モル%)と、テレフタル酸(1モル%)と、全モノマー量に対し1.025倍モルの無水酢酸を仕込み、窒素雰囲気下で150℃まで反応槽を昇温し、30分保持した後、副生する酢酸を留去させつつ190℃まですみやかに昇温し、1時間保持し、アセチル化反応物を得た。得られたアセチル化反応物を320℃まで3.5時間かけて昇温した後、約30分かけて2.7kPaにまで減圧して溶融重縮合を行ったのち、徐々に減圧して常圧に戻し、ポリマー固形物を得た。得られたポリマー固形物を粉砕し二軸押出機を用いて300℃で造粒して、p−ヒドロキシ安息香酸と6−ヒドロキシ−2−ナフトエ酸とテレフタル酸からなる芳香族ポリエステル系液晶ポリマー(モル比71:27:1)のペレットを得た。得られたペレットを用いて、インフレーション法で製膜した後、オーブンを用いて260℃で2時間の非接触式の熱処理をし、さらに290℃で6時間の非接触式の熱処理をすることで、融点335℃及び厚さ50μmを有するLCP押出フィルムを得た。
LCP押出フィルムの溶解率は、以下の条件で測定した。
凍結粉砕したLCP押出フィルム10mgを、60℃のペンタフルオロフェノール10g中に浸漬させ、攪拌下で15分間放置して溶解させた後、溶解せずに残った樹脂固形物を400メッシュの金網で濾別して乾燥し、この濾別前後の金網質量に基づいてLCP押出フィルムの溶解率を算出した。
溶解率(%)=(LCP押出フィルム質量−(濾別乾燥後金網質量−濾別前金網質量))/LCP押出フィルム質量×100
フレキシブル積層体のピール強度は、以下の条件で測定した。
測定対象となるLCP押出フィルムを、表1及び表2に記載の温度条件で、電解銅箔(三井金属社製、TQ−M7VSP)と面厚5MPaで1分間熱圧着させることで、LCP押出フィルム及び銅箔からなるフレキシブル積層体を得た。得られたフレキシブル積層体から幅10mmの試験片を短冊状に切り出し、ストログラフVE1D(東洋精機製作所社製)を用いて、温度23℃相対湿度50%の環境下で引張速度50mm/分で180度方向の剥離を行って、銅箔ピール強度を測定し、以下の基準にしたがって評価した。
◎ 材破(剥離不可) 測定限界超、およそ1.5N/mm以上
〇 剥離 1.0N/mm以上
× 剥離 1.0N/mm未満
21 ・・・金属箔
31 ・・・フレキシブル積層体
Claims (15)
- パラヒドロキシ安息香酸、テレフタル酸、イソフタル酸、6−ナフタレンジカルボン酸、4,4’−ビフェノール、ビスフェノールA、ヒドロキノン、4,4−ジヒドロキシビフェノール、エチレンテレフタレート及びこれらの誘導体よりなる群から選択される1種以上と6−ヒドロキシ−2−ナフトエ酸及びその誘導体とをモノマー成分として少なくとも有する芳香族ポリエステル系液晶ポリマーを含有し、
ペンタフルオロフェノールへの60℃での溶解率が25%以上である、
LCP押出フィルム。 - 250〜360℃の融点を有する
請求項1に記載のLCP押出フィルム。 - 前記芳香族ポリエステル系液晶ポリマー中の6−ヒドロキシ−2−ナフトエ酸の含有割合が10モル%以上70モル%未満である
請求項1又は2に記載のLCP押出フィルム。 - フィルム厚みが10μm以上500μm未満である
請求項1〜3のいずれか一項に記載のLCP押出フィルム。 - パラヒドロキシ安息香酸、テレフタル酸、イソフタル酸、6−ナフタレンジカルボン酸、4,4’−ビフェノール、ビスフェノールA、ヒドロキノン、4,4−ジヒドロキシビフェノール、エチレンテレフタレート及びこれらの誘導体よりなる群から選択される1種以上と6−ヒドロキシ−2−ナフトエ酸及びその誘導体とをモノマー成分として少なくとも有する芳香族ポリエステル系液晶ポリマーを含有し、ペンタフルオロフェノールへの60℃での溶解率が25%以上である1以上のLCP押出フィルムを準備する工程と、
前記LCP押出フィルムと1以上の金属箔とを重ね合わせる工程と、
得られた積層体を、前記芳香族ポリエステル系液晶ポリマーの融点より50℃低い温度以上、前記融点以下に加熱して熱圧着する工程と、を少なくとも有する、
フレキシブル積層体の製造方法。 - 前記LCP押出フィルムは、250〜360℃の融点を有する
請求項5に記載のフレキシブル積層体の製造方法。 - 前記芳香族ポリエステル系液晶ポリマー中の6−ヒドロキシ−2−ナフトエ酸の含有割合が10モル%以上70モル%未満である
請求項5又は6に記載のフレキシブル積層体の製造方法。 - 前記LCP押出フィルムは、10μm以上500μm未満の厚みを有する
請求項5〜7のいずれか一項に記載のフレキシブル積層体の製造方法。 - 前記金属箔が、銅箔、アルミニウム箔、ステンレス箔、及び銅とアルミニウムとの合金箔よりなる群から選択される1種以上である
請求項5〜8のいずれか一項に記載のフレキシブル積層体の製造方法。 - 前記LCP押出フィルムと前記金属箔とのピール強度が1.0(N/mm)以上のフレキシブル積層体を得る
請求項5〜9のいずれか一項に記載のフレキシブル積層体の製造方法。 - パラヒドロキシ安息香酸、テレフタル酸、イソフタル酸、6−ナフタレンジカルボン酸、4,4’−ビフェノール、ビスフェノールA、ヒドロキノン、4,4−ジヒドロキシビフェノール、エチレンテレフタレート及びこれらの誘導体よりなる群から選択される1種以上と6−ヒドロキシ−2−ナフトエ酸及びその誘導体とをモノマー成分として少なくとも有する芳香族ポリエステル系液晶ポリマーを含有し、ペンタフルオロフェノールへの60℃での溶解率が25%以上である1以上のLCP押出フィルム、並びに
前記LCP押出フィルムの少なくとも一方の表面上に設けられた、1以上の金属箔、
を備えることを特徴とする、フレキシブル積層体。 - 前記LCP押出フィルムは、250〜360℃の融点を有する
請求項11に記載のフレキシブル積層体。 - 前記芳香族ポリエステル系液晶ポリマー中の6−ヒドロキシ−2−ナフトエ酸の含有割合が10モル%以上70モル%未満である
請求項11又は12に記載のフレキシブル積層体。 - 前記LCP押出フィルムと前記金属箔とのピール強度が1.0(N/mm)以上である
請求項11〜13のいずれか一項に記載のフレキシブル積層体。 - 前記LCP押出フィルムは、10μm以上500μm未満の厚みを有する
請求項11〜14のいずれか一項に記載のフレキシブル積層体。
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CN202080040729.5A CN113993702A (zh) | 2019-06-27 | 2020-06-19 | Lcp挤出膜、以及使用其的柔性层叠体及其制造方法 |
KR1020227000291A KR20220027936A (ko) | 2019-06-27 | 2020-06-19 | Lcp 압출 필름, 그리고 이것을 사용한 플렉시블 적층체 및 그의 제조 방법 |
US17/622,516 US20220250371A1 (en) | 2019-06-27 | 2020-06-19 | Lcp extruded film, and flexible laminate using the same and manufacturing method thereof |
PCT/JP2020/024220 WO2020262255A1 (ja) | 2019-06-27 | 2020-06-19 | Lcp押出フィルム、並びにこれを用いたフレキシブル積層体及びその製造方法 |
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JP7458329B2 (ja) * | 2019-01-25 | 2024-03-29 | デンカ株式会社 | 両面金属張積層体とその製造方法、絶縁フィルムおよび電子回路基板 |
US20210070927A1 (en) * | 2019-09-10 | 2021-03-11 | Ticona Llc | Polymer Composition and Film for Use in 5G Applications |
CN113024785A (zh) * | 2021-02-05 | 2021-06-25 | 桂林理工大学 | 一种低介电热致液晶聚合物及其制备方法 |
CN113024784A (zh) * | 2021-02-05 | 2021-06-25 | 桂林理工大学 | 一种低介电热致液晶聚合物及其制备方法 |
CN113099608B (zh) * | 2021-04-06 | 2022-07-15 | 深圳市华盈新材料有限公司 | 一种5g天线用复合材料 |
CN113502040B (zh) * | 2021-07-23 | 2022-08-16 | 宁夏清研高分子新材料有限公司 | 一种高频传输lcp薄膜及其制备方法 |
CN113698642A (zh) * | 2021-09-29 | 2021-11-26 | 宁夏清研高分子新材料有限公司 | 一种高强度液晶高分子薄膜及其制备方法 |
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JP6850320B2 (ja) | 2021-03-31 |
TW202110937A (zh) | 2021-03-16 |
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