JP2020519018A5 - - Google Patents
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- Publication number
- JP2020519018A5 JP2020519018A5 JP2019559058A JP2019559058A JP2020519018A5 JP 2020519018 A5 JP2020519018 A5 JP 2020519018A5 JP 2019559058 A JP2019559058 A JP 2019559058A JP 2019559058 A JP2019559058 A JP 2019559058A JP 2020519018 A5 JP2020519018 A5 JP 2020519018A5
- Authority
- JP
- Japan
- Prior art keywords
- high pressure
- chamber
- lift plate
- pressure region
- batch processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002347 injection Methods 0.000 claims 16
- 239000007924 injection Substances 0.000 claims 16
- 239000000758 substrate Substances 0.000 claims 15
- 239000012530 fluid Substances 0.000 claims 9
- 238000000034 method Methods 0.000 claims 6
- 238000001816 cooling Methods 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 230000009969 flowable effect Effects 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 1
- 239000012808 vapor phase Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 239000000080 wetting agent Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762492700P | 2017-05-01 | 2017-05-01 | |
| US62/492,700 | 2017-05-01 | ||
| PCT/US2018/028258 WO2018204078A1 (en) | 2017-05-01 | 2018-04-19 | High pressure anneal chamber with vacuum isolation and pre-processing environment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020519018A JP2020519018A (ja) | 2020-06-25 |
| JP2020519018A5 true JP2020519018A5 (enExample) | 2021-05-27 |
| JP7235678B2 JP7235678B2 (ja) | 2023-03-08 |
Family
ID=63917378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019559058A Active JP7235678B2 (ja) | 2017-05-01 | 2018-04-19 | 真空分離及び前処理環境を伴う高圧アニールチャンバ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20180315626A1 (enExample) |
| JP (1) | JP7235678B2 (enExample) |
| KR (1) | KR20190137935A (enExample) |
| CN (2) | CN110574150B (enExample) |
| TW (1) | TW201842590A (enExample) |
| WO (1) | WO2018204078A1 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5541274B2 (ja) * | 2011-12-28 | 2014-07-09 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
| JP6054471B2 (ja) | 2015-05-26 | 2016-12-27 | 株式会社日本製鋼所 | 原子層成長装置および原子層成長装置排気部 |
| JP6050860B1 (ja) * | 2015-05-26 | 2016-12-21 | 株式会社日本製鋼所 | プラズマ原子層成長装置 |
| JP6054470B2 (ja) | 2015-05-26 | 2016-12-27 | 株式会社日本製鋼所 | 原子層成長装置 |
| US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
| US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
| KR102405723B1 (ko) | 2017-08-18 | 2022-06-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 및 고온 어닐링 챔버 |
| US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
| US11177128B2 (en) | 2017-09-12 | 2021-11-16 | Applied Materials, Inc. | Apparatus and methods for manufacturing semiconductor structures using protective barrier layer |
| CN111357090B (zh) | 2017-11-11 | 2024-01-05 | 微材料有限责任公司 | 用于高压处理腔室的气体输送系统 |
| KR102622303B1 (ko) * | 2017-11-16 | 2024-01-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 스팀 어닐링 프로세싱 장치 |
| WO2019099255A2 (en) | 2017-11-17 | 2019-05-23 | Applied Materials, Inc. | Condenser system for high pressure processing system |
| WO2019173006A1 (en) | 2018-03-09 | 2019-09-12 | Applied Materials, Inc. | High pressure annealing process for metal containing materials |
| US10714331B2 (en) | 2018-04-04 | 2020-07-14 | Applied Materials, Inc. | Method to fabricate thermally stable low K-FinFET spacer |
| US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
| US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
| US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
| JP7179172B6 (ja) | 2018-10-30 | 2022-12-16 | アプライド マテリアルズ インコーポレイテッド | 半導体用途の構造体をエッチングするための方法 |
| CN112996950B (zh) | 2018-11-16 | 2024-04-05 | 应用材料公司 | 使用增强扩散工艺的膜沉积 |
| TWI738002B (zh) * | 2018-12-05 | 2021-09-01 | 洪義明 | 高溫烘箱的溫度調整設備 |
| WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
| KR102759821B1 (ko) * | 2019-01-30 | 2025-01-23 | 어플라이드 머티어리얼스, 인코포레이티드 | 진공 시스템을 세정하기 위한 방법, 기판의 진공 프로세싱을 위한 방법, 및 기판을 진공 프로세싱하기 위한 장치 |
| CN113614884B (zh) * | 2019-03-22 | 2024-04-12 | 株式会社国际电气 | 基板处理装置、半导体装置的制造方法以及存储介质 |
| FI130051B (en) | 2019-04-25 | 2023-01-13 | Beneq Oy | DEVICE AND METHOD |
| CN110133969B (zh) * | 2019-04-26 | 2024-08-30 | 厦门通富微电子有限公司 | 一种用于烘烤光刻胶的烘烤设备、烘烤系统及烘烤方法 |
| EP4013905B1 (en) | 2019-08-12 | 2023-02-22 | Kurt J. Lesker Company | Ultra high purity conditions for atomic scale processing |
| US12225641B2 (en) * | 2019-12-20 | 2025-02-11 | Applied Materials, Inc. | Bake devices for handling and uniform baking of substrates |
| FI129609B (en) * | 2020-01-10 | 2022-05-31 | Picosun Oy | Substrate processing apparatus |
| US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
| US20210398824A1 (en) * | 2020-06-19 | 2021-12-23 | Applied Materials, Inc. | Batch wafer degas chamber and integration into factory interface and vacuum-based mainframe |
| KR20230029414A (ko) * | 2021-08-24 | 2023-03-03 | 삼성전자주식회사 | Ale용 배치-타입 장치, 및 그 장치에 기반한 ale 방법과 반도체 소자 제조방법 |
| TWI775691B (zh) * | 2021-12-02 | 2022-08-21 | 奈盾科技股份有限公司 | 半導體缺陷修復的裝置及方法 |
| KR20230085072A (ko) * | 2021-12-06 | 2023-06-13 | 에이에스엠 아이피 홀딩 비.브이. | 반도체 처리 툴용 반응물 증기 전달 시스템 및 방법 |
| US12354855B2 (en) | 2022-05-27 | 2025-07-08 | Applied Materials, Inc. | Process kits and related methods for processing chambers to facilitate deposition process adjustability |
| US12221696B2 (en) | 2022-05-27 | 2025-02-11 | Applied Materials, Inc. | Process kits and related methods for processing chambers to facilitate deposition process adjustability |
| US12428731B2 (en) | 2022-07-12 | 2025-09-30 | Applied Materials, Inc. | Flow guide structures and heat shield structures, and related methods, for deposition uniformity and process adjustability |
| US20240120220A1 (en) * | 2022-10-06 | 2024-04-11 | Applied Materials, Inc. | Load lock chambers and related methods and structures for batch cooling or heating |
| US12467144B2 (en) | 2022-10-27 | 2025-11-11 | Applied Materials, Inc. | Methods of correlating zones of processing chambers, and related systems and methods |
| US12243761B2 (en) | 2022-10-27 | 2025-03-04 | Applied Materials, Inc. | Detection and analysis of substrate support and pre-heat ring in a process chamber via imaging |
| US12428753B2 (en) | 2022-12-14 | 2025-09-30 | Applied Materials, Inc. | Lift assemblies, and related methods and components, for substrate processing chambers |
| DE102023111609A1 (de) | 2023-05-04 | 2024-11-07 | VON ARDENNE Asset GmbH & Co. KG | Vakuumanordnung, eine Prozessanordnung und ein Verfahren zum Bewegen einer Haltevorrichtung einer Vakuumanordnung |
| CN117174620B (zh) * | 2023-10-09 | 2025-02-25 | 宸微设备科技(苏州)有限公司 | 一种基片处理腔室 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2766856B2 (ja) * | 1988-11-11 | 1998-06-18 | 東京エレクトロン株式会社 | 縦型加圧酸化装置 |
| JP3471100B2 (ja) * | 1994-11-07 | 2003-11-25 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
| JP3445148B2 (ja) * | 1998-05-21 | 2003-09-08 | 株式会社神戸製鋼所 | 被処理基板の高温高圧処理装置 |
| JP4207354B2 (ja) * | 2000-03-07 | 2009-01-14 | 東京エレクトロン株式会社 | 熱処理装置及びその運用方法 |
| JP2003077974A (ja) * | 2001-08-31 | 2003-03-14 | Hitachi Kokusai Electric Inc | 基板処理装置および半導体装置の製造方法 |
| US20040060519A1 (en) * | 2002-10-01 | 2004-04-01 | Seh America Inc. | Quartz to quartz seal using expanded PTFE gasket material |
| JP4456341B2 (ja) * | 2003-06-30 | 2010-04-28 | 株式会社日立国際電気 | 半導体装置の製造方法および基板処理装置 |
| US7158221B2 (en) * | 2003-12-23 | 2007-01-02 | Applied Materials, Inc. | Method and apparatus for performing limited area spectral analysis |
| JP2008521261A (ja) * | 2004-11-22 | 2008-06-19 | アプライド マテリアルズ インコーポレイテッド | バッチ処理チャンバを用いた基板処理装置 |
| JP4683332B2 (ja) | 2005-12-28 | 2011-05-18 | 株式会社Ihi | 熱処理装置 |
| JP2007242785A (ja) | 2006-03-07 | 2007-09-20 | Ihi Corp | 熱処理装置及び熱処理方法 |
| US8445078B2 (en) | 2011-04-20 | 2013-05-21 | Applied Materials, Inc. | Low temperature silicon oxide conversion |
| JP2013084643A (ja) | 2011-10-06 | 2013-05-09 | Nano Material Kenkyusho:Kk | 半導体製造装置及び製造方法 |
| KR101224520B1 (ko) | 2012-06-27 | 2013-01-22 | (주)이노시티 | 프로세스 챔버 |
| KR102291460B1 (ko) | 2013-04-30 | 2021-08-19 | 어플라이드 머티어리얼스, 인코포레이티드 | 공간적으로 분포된 가스 통로들을 갖는 유동 제어 라이너 |
| JP6068633B2 (ja) * | 2013-05-31 | 2017-01-25 | 株式会社日立国際電気 | 基板処理装置、半導体装置の製造方法及び炉口蓋体 |
-
2018
- 2018-04-19 KR KR1020197035331A patent/KR20190137935A/ko not_active Ceased
- 2018-04-19 WO PCT/US2018/028258 patent/WO2018204078A1/en not_active Ceased
- 2018-04-19 CN CN201880028790.0A patent/CN110574150B/zh active Active
- 2018-04-19 CN CN202310566128.3A patent/CN116504679A/zh active Pending
- 2018-04-19 JP JP2019559058A patent/JP7235678B2/ja active Active
- 2018-04-19 TW TW107113314A patent/TW201842590A/zh unknown
- 2018-04-27 US US15/964,300 patent/US20180315626A1/en not_active Abandoned
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