JP2020501375A - 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム - Google Patents

導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム Download PDF

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Publication number
JP2020501375A
JP2020501375A JP2019531090A JP2019531090A JP2020501375A JP 2020501375 A JP2020501375 A JP 2020501375A JP 2019531090 A JP2019531090 A JP 2019531090A JP 2019531090 A JP2019531090 A JP 2019531090A JP 2020501375 A JP2020501375 A JP 2020501375A
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Prior art keywords
layer
material layer
conductive
etching
substrate
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Pending
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JP2019531090A
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English (en)
Japanese (ja)
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JP2020501375A5 (enExample
Inventor
ナヴァ シュパイスマン，
ナヴァ シュパイスマン，
モシェ フレンケル，
モシェ フレンケル，
Original Assignee
カティーバ， インコーポレイテッド
カティーバ， インコーポレイテッド
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Application filed by カティーバ， インコーポレイテッド, カティーバ， インコーポレイテッド filed Critical カティーバ， インコーポレイテッド
Publication of JP2020501375A publication Critical patent/JP2020501375A/ja
Publication of JP2020501375A5 publication Critical patent/JP2020501375A5/ja
Priority to JP2023111882A priority Critical patent/JP7878726B2/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2019531090A 2016-12-12 2017-12-11 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム Pending JP2020501375A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023111882A JP7878726B2 (ja) 2016-12-12 2023-07-07 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662432710P 2016-12-12 2016-12-12
US62/432,710 2016-12-12
US15/835,116 2017-12-07
US15/835,116 US10398034B2 (en) 2016-12-12 2017-12-07 Methods of etching conductive features, and related devices and systems
PCT/IL2017/051338 WO2018109762A1 (en) 2016-12-12 2017-12-11 Methods of etching conductive features, and related devices and systems

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023111882A Division JP7878726B2 (ja) 2016-12-12 2023-07-07 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム

Publications (2)

Publication Number Publication Date
JP2020501375A true JP2020501375A (ja) 2020-01-16
JP2020501375A5 JP2020501375A5 (enExample) 2021-01-28

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Family Applications (2)

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JP2019531090A Pending JP2020501375A (ja) 2016-12-12 2017-12-11 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム
JP2023111882A Active JP7878726B2 (ja) 2016-12-12 2023-07-07 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム

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Country Status (6)

Country Link
US (3) US10398034B2 (enExample)
EP (1) EP3551781B1 (enExample)
JP (2) JP2020501375A (enExample)
KR (1) KR20190093576A (enExample)
CN (1) CN110249075A (enExample)
WO (1) WO2018109762A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023059886A (ja) * 2019-02-14 2023-04-27 オルボテック リミテッド 高密度導体を有するｐｃｂ製品を調製するための装置及び感光性インク
JP2023139049A (ja) * 2016-12-12 2023-10-03 カティーバ， インコーポレイテッド 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム
US12270111B2 (en) 2015-08-13 2025-04-08 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
US12414239B2 (en) 2015-06-04 2025-09-09 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface

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US11963300B2 (en) 2020-08-14 2024-04-16 Au Optronics Corporation Panel device and manufacturing method of panel device
DE102021122646A1 (de) * 2021-09-01 2023-03-02 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger-Ätzsystem mit physisch getrennten Äzmodulen und Komponententräger
TWI849785B (zh) 2023-03-08 2024-07-21 友達光電股份有限公司 電路裝置
CN118612936B (zh) * 2024-06-21 2024-12-06 南华大学 一种可拉伸的金属基电/热导件
CN119603888B (zh) * 2024-12-18 2025-09-23 西安电子科技大学 一种面向曲面电路三维打印的基材表面改性与附着力增强方法
CN120512823B (zh) * 2025-05-29 2026-04-07 都看(江苏)数码科技有限公司 基于喷墨掩模的陶瓷电路板高精度蚀刻方法及设备

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US12414239B2 (en) 2015-06-04 2025-09-09 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
US12270111B2 (en) 2015-08-13 2025-04-08 Kateeva, Inc. Methods for producing an etch resist pattern on a metallic surface
JP2023139049A (ja) * 2016-12-12 2023-10-03 カティーバ， インコーポレイテッド 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム
JP7878726B2 (ja) 2016-12-12 2026-06-23 カティーバ， インコーポレイテッド 導電性特徴をエッチングする方法、ならびに関連するデバイスおよびシステム
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JP7624021B2 (ja) 2019-02-14 2025-01-29 オルボテック リミテッド 高密度導体を有するｐｃｂ製品を調製するための装置及び感光性インク

Also Published As

Publication number Publication date
CN110249075A (zh) 2019-09-17
US10398034B2 (en) 2019-08-27
EP3551781B1 (en) 2025-09-24
WO2018109762A1 (en) 2018-06-21
EP3551781A4 (en) 2020-09-02
US20210227696A1 (en) 2021-07-22
US11006528B2 (en) 2021-05-11
US20190335589A1 (en) 2019-10-31
US20180192521A1 (en) 2018-07-05
JP7878726B2 (ja) 2026-06-23
US11425822B2 (en) 2022-08-23
EP3551781A1 (en) 2019-10-16
JP2023139049A (ja) 2023-10-03
KR20190093576A (ko) 2019-08-09

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