KR20190093576A - 전도성 특징부를 에칭하는 방법 및 관련 디바이스와 시스템 - Google Patents

전도성 특징부를 에칭하는 방법 및 관련 디바이스와 시스템 Download PDF

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Publication number
KR20190093576A
KR20190093576A KR1020197016384A KR20197016384A KR20190093576A KR 20190093576 A KR20190093576 A KR 20190093576A KR 1020197016384 A KR1020197016384 A KR 1020197016384A KR 20197016384 A KR20197016384 A KR 20197016384A KR 20190093576 A KR20190093576 A KR 20190093576A
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KR
South Korea
Prior art keywords
layer
etch
substrate
conductive
corrosion resistant
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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KR1020197016384A
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English (en)
Korean (ko)
Inventor
나바 쉬파이즈만
모쉬 프렌켈
Original Assignee
카티바, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 카티바, 인크. filed Critical 카티바, 인크.
Publication of KR20190093576A publication Critical patent/KR20190093576A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1184—Underetching, e.g. etching of substrate under conductors or etching of conductor under dielectrics; Means for allowing or controlling underetching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
KR1020197016384A 2016-12-12 2017-12-11 전도성 특징부를 에칭하는 방법 및 관련 디바이스와 시스템 Ceased KR20190093576A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662432710P 2016-12-12 2016-12-12
US62/432,710 2016-12-12
US15/835,116 2017-12-07
US15/835,116 US10398034B2 (en) 2016-12-12 2017-12-07 Methods of etching conductive features, and related devices and systems
PCT/IL2017/051338 WO2018109762A1 (en) 2016-12-12 2017-12-11 Methods of etching conductive features, and related devices and systems

Publications (1)

Publication Number Publication Date
KR20190093576A true KR20190093576A (ko) 2019-08-09

Family

ID=62558108

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197016384A Ceased KR20190093576A (ko) 2016-12-12 2017-12-11 전도성 특징부를 에칭하는 방법 및 관련 디바이스와 시스템

Country Status (6)

Country Link
US (3) US10398034B2 (enExample)
EP (1) EP3551781B1 (enExample)
JP (2) JP2020501375A (enExample)
KR (1) KR20190093576A (enExample)
CN (1) CN110249075A (enExample)
WO (1) WO2018109762A1 (enExample)

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EP3304197A4 (en) 2015-06-04 2019-01-23 Kateeva, Inc. METHOD FOR PRODUCING AN ESTETRESIST PATTERN ON A METALLIC SURFACE
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US10398034B2 (en) * 2016-12-12 2019-08-27 Kateeva, Inc. Methods of etching conductive features, and related devices and systems
WO2020165897A1 (en) 2019-02-14 2020-08-20 Orbotech Ltd A method and apparatus for preparing a pcb product having highly dense conductors
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US11963300B2 (en) 2020-08-14 2024-04-16 Au Optronics Corporation Panel device and manufacturing method of panel device
DE102021122646A1 (de) * 2021-09-01 2023-03-02 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Komponententräger-Ätzsystem mit physisch getrennten Äzmodulen und Komponententräger
TWI849785B (zh) 2023-03-08 2024-07-21 友達光電股份有限公司 電路裝置
CN118612936B (zh) * 2024-06-21 2024-12-06 南华大学 一种可拉伸的金属基电/热导件
CN119603888B (zh) * 2024-12-18 2025-09-23 西安电子科技大学 一种面向曲面电路三维打印的基材表面改性与附着力增强方法

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Also Published As

Publication number Publication date
US20210227696A1 (en) 2021-07-22
EP3551781A4 (en) 2020-09-02
WO2018109762A1 (en) 2018-06-21
JP2023139049A (ja) 2023-10-03
US20190335589A1 (en) 2019-10-31
EP3551781B1 (en) 2025-09-24
US11006528B2 (en) 2021-05-11
US10398034B2 (en) 2019-08-27
EP3551781A1 (en) 2019-10-16
JP2020501375A (ja) 2020-01-16
US20180192521A1 (en) 2018-07-05
CN110249075A (zh) 2019-09-17
US11425822B2 (en) 2022-08-23

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