JP2020136667A - 高周波識別(rfid)ラベル又は伝導性トレース熱転写印刷方法 - Google Patents
高周波識別(rfid)ラベル又は伝導性トレース熱転写印刷方法 Download PDFInfo
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- 238000010023 transfer printing Methods 0.000 title 1
- 229910052751 metal Inorganic materials 0.000 claims abstract description 183
- 239000002184 metal Substances 0.000 claims abstract description 183
- 230000008569 process Effects 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims description 84
- 238000007651 thermal printing Methods 0.000 claims description 60
- 238000007639 printing Methods 0.000 claims description 54
- 238000000926 separation method Methods 0.000 claims description 13
- 238000012546 transfer Methods 0.000 claims description 12
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- 229920001721 polyimide Polymers 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 150000001879 copper Chemical class 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 3
- 238000011084 recovery Methods 0.000 claims description 3
- 229910000838 Al alloy Inorganic materials 0.000 claims description 2
- 229910001020 Au alloy Inorganic materials 0.000 claims description 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 239000000969 carrier Substances 0.000 claims description 2
- 238000005553 drilling Methods 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 18
- 230000003287 optical effect Effects 0.000 abstract description 6
- 238000000206 photolithography Methods 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000013461 design Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
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- 238000010586 diagram Methods 0.000 description 2
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- 150000002739 metals Chemical class 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011022 operating instruction Methods 0.000 description 1
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- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000013404 process transfer Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
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- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/66—Applications of cutting devices
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/35—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads providing current or voltage to the thermal head
- B41J2/355—Control circuits for heating-element selection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/007—Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
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Abstract
Description
Claims (20)
- 電気回路を形成するための方法であって、
犠牲印刷媒体と物理的に接触させて金属層を配置することと、
前記金属層が取り付けられたキャリア層を加熱することであって、前記キャリアに適用された加熱パターンが第1のパターンである、加熱することと、
前記キャリアに取り付けられた前記金属層の第1の部分を加熱することであって、前記金属層の前記第1の部分に適用された加熱パターンが前記第1のパターンに近似する、加熱することと、
前記金属層の前記第1の部分を前記犠牲印刷媒体に取り付けることと、
前記キャリアを前記犠牲印刷媒体から分離することであって、
前記分離中、前記金属層の前記第1の部分が、前記犠牲印刷媒体に取り付けられたままであり、かつ前記キャリアから取り外され、
前記分離中、前記金属層の第2の部分が、前記キャリアに取り付けられたままであり、
前記金属層の前記第2の部分が、前記第1のパターンの逆画像である第2のパターンを有する、分離することと、を含み、
前記金属層の前記第2の部分が、前記電気回路の少なくとも一部分を提供する、方法。 - 前記金属層が取り付けられる前記キャリア層の前記加熱中に、熱印刷ヘッドを使用して前記キャリア層を加熱することを更に含む、請求項1に記載の方法。
- 前記分離後、前記金属層の前記第2の部分を加熱することと、
前記金属層の前記第2の部分の加熱後、前記金属層の前記第2の部分を回路基板に転写することと、を更に含む、請求項1に記載の方法。 - 前記回路基板を切断して、複数の電気回路を互いに分離することを更に含む、請求項3に記載の方法。
- 前記金属層の前記第2の部分の前記加熱中に、熱/圧力定着器を使用して前記金属層の前記第2の部分を加熱することを更に含む、請求項3に記載の方法。
- 前記金属層は、0.5マイクロメートル(μm)〜15μmの厚さを有する銀、銀/銅複合体、銅、アルミニウム、金、及び金属合金のうちの少なくとも1つを含み、
前記キャリアは、25μm〜75μmの厚さを有する紙、ポリエステル、ポリイミド、及び布地のうちの少なくとも1つを含み、
前記犠牲印刷媒体は、25μm〜75μmの厚さを有する紙、ポリエステル、ポリイミド、及び布地のうちの少なくとも1つを含む、請求項1に記載の方法。 - 前記キャリア層の前記加熱は、175℃〜225℃の温度に前記キャリア層を加熱することを含み、
前記金属層の前記第1の部分の前記加熱は、前記金属層の前記第1の部分を175℃〜225℃の温度に加熱する、請求項6に記載の方法。 - 印刷プロセスを使用して電気回路を形成する方法であって、
キャリアと金属層とを含むリボンを熱印刷ヘッド及び犠牲印刷媒体の間に配置することと、
前記キャリアを前記熱印刷ヘッドと物理的に接触させることにより、前記キャリアを第1の熱パターンで加熱することと、
前記キャリアに取り付けられた前記金属層の第1の部分を加熱することであって、前記金属層の前記第1の部分の第1のパターンが、前記第1の熱パターンに近似し、前記金属層の前記第1の部分を溶融させる、加熱することと、
前記金属層の前記第1の部分を冷却することと、
前記リボンを前記犠牲印刷媒体から分離することであって、
前記分離中、前記金属層の前記第1の部分が、前記犠牲印刷媒体に取り付けられたままであり、かつ前記キャリアから取り外され、
前記分離中、前記金属層の第2の部分が前記キャリアに取り付けられたままであり、前記金属層の前記第2の部分が、前記第1のパターンの逆画像である第2のパターンを有する、分離することと、
前記金属層の前記第2の部分を回路基板と物理的に接触させることと、
前記キャリアに取り付けられた前記金属層の前記第2の部分を加熱することと、
前記金属層の前記第2の部分を冷却することと、
前記キャリアを前記回路基板から分離することであって、前記回路基板からの前記キャリアの前記分離中、前記金属層の前記第2の部分が、前記回路基板に取り付けられたままであり、かつ前記キャリアから取り外される、分離することと、を含む、方法。 - リボン供給リールを使用して前記リボンを前記熱印刷ヘッドに供給することと、
前記回路基板からの前記キャリアの前記分離後、キャリア巻取りリールを使用して前記キャリアを回収することと、を更に含む、請求項8に記載の方法。 - 前記回路基板を切断して、複数の電気回路を互いに分離することを更に含む、請求項8に記載の方法。
- 犠牲印刷媒体供給リールを使用して前記犠牲印刷媒体を前記熱印刷ヘッドに供給することと、
前記犠牲印刷媒体からの前記リボンの前記分離後、犠牲印刷媒体巻取りリールを使用して前記犠牲印刷媒体及び前記金属層の前記第1の部分を回収することと、を更に含む、請求項8に記載の方法。 - 前記キャリアに取り付けられた前記金属層の前記第2の部分の前記加熱中に、加熱素子を使用して前記金属層の前記第2の部分を加熱することと、
回路基板供給リールを使用して前記回路基板を前記加熱素子に供給することと、
前記回路基板からの前記キャリアの前記分離後、前記回路基板の少なくとも一部分を回路基板巻取りリール上に回収することと、を更に含む、請求項8に記載の方法。 - 前記回路基板の前記少なくとも一部分の前記回収が、前記回路基板巻取りリール上に複数の電気回路を回収することを更に含む、請求項12に記載の方法。
- 前記回路基板を切断して、複数の電気回路を互いに分離することを更に含む、請求項12に記載の方法。
- 複数の電気回路を形成するための熱印刷システムであって、
熱印刷ヘッドと、
前記熱印刷ヘッドに隣接して位置付けられた犠牲印刷媒体と、
前記熱印刷ヘッドと前記犠牲印刷媒体との間に位置付けられたリボンであって、
前記リボンが、キャリア及び金属層を含み、
前記熱印刷ヘッドが、前記金属層の第1の部分を前記犠牲印刷媒体上に印刷するように構成されており、
前記金属層の前記第1の部分が、少なくとも1つの電気回路の陰画像であり、
前記金属層の前記第1の部分の印刷後、前記金属層の第2の部分が前記キャリア上に残る、リボンと、
前記キャリア及び前記金属層の前記第2の部分に隣接して位置付けられた回路基板と、
前記キャリアから前記回路基板上に前記金属層の前記第2の部分を転写するための加熱素子と、を備える、熱印刷システム。 - 前記リボンを前記熱印刷ヘッドに供給するように構成されたリボン供給リールと、
前記金属層の前記第2の部分を前記回路基板に転写した後、前記キャリアを受容するように構成されたキャリア巻取りリールと、を更に備える、請求項15に記載の熱印刷システム。 - 前記犠牲印刷媒体を前記熱印刷ヘッドに供給するように構成された犠牲印刷媒体供給リールと、
前記金属層の前記第1の部分の印刷後、前記犠牲印刷媒体及び前記金属層の前記第1の部分を受容するように構成された犠牲印刷媒体巻取りリールと、を更に備える、請求項16に記載の熱印刷システム。 - 前記回路基板を前記加熱素子に供給するように構成された回路基板供給リールと、
前記回路基板への前記金属層の前記第2の部分の前記転写後、前記回路基板の少なくとも一部分を受容するように構成された回路基板巻取りリールと、を更に備える、請求項17に記載の熱印刷システム。 - 前記金属層の前記第2の部分を前記回路基板に転写した後、前記回路基板から前記複数の電気回路の外周を穿孔し、それによって前記複数の電気回路を個別化するように構成された少なくとも1つのカッターを更に備える、請求項16に記載の熱印刷システム。
- 前記熱印刷ヘッドに印刷命令を提供するように構成されたコントローラを更に備える、請求項15に記載の熱印刷システム。
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