JP2020088275A - 基板保持装置、基板処理装置および基板保持方法 - Google Patents
基板保持装置、基板処理装置および基板保持方法 Download PDFInfo
- Publication number
- JP2020088275A JP2020088275A JP2018223741A JP2018223741A JP2020088275A JP 2020088275 A JP2020088275 A JP 2020088275A JP 2018223741 A JP2018223741 A JP 2018223741A JP 2018223741 A JP2018223741 A JP 2018223741A JP 2020088275 A JP2020088275 A JP 2020088275A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- stage
- correction block
- holding device
- warp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 245
- 238000012545 processing Methods 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 18
- 238000012937 correction Methods 0.000 claims abstract description 93
- 230000002093 peripheral effect Effects 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims description 7
- 239000000428 dust Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 description 24
- 239000011248 coating agent Substances 0.000 description 21
- 239000007789 gas Substances 0.000 description 20
- 230000008569 process Effects 0.000 description 11
- 238000009423 ventilation Methods 0.000 description 8
- 238000001514 detection method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000032258 transport Effects 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
Abstract
Description
3…矯正機構
11…ステージ
30…非接触押圧手段
31…矯正ブロック
34…対向平板
35…移動部
36…エア層
38…エア層形成部
100…塗布装置(基板処理装置)
101…(スリット)ノズル
112…エア供給部(気体供給部)
113…エア吸引部(吸引部)
S…基板
Claims (7)
- 基板を下方から支持するステージと、前記ステージに支持された前記基板の反りを矯正する矯正機構とを備え、前記矯正機構により前記反りが矯正された前記基板を前記ステージで保持する基板保持装置であって、
前記矯正機構は、
前記基板の上面の周縁部の上方で上下方向に移動可能な矯正ブロックと、
前記矯正ブロックの下面から前記基板の上面に向けて第1気体を噴出して前記基板の上面と前記矯正ブロックの下面との間に気体層を形成する気体層形成部と、
前記基板と非接触状態を保ちつつ前記矯正ブロックを下方に移動させることで前記気体層を前記周縁部に押し付けて前記基板の反りを矯正する移動部と
を有することを特徴とする基板保持装置。 - 請求項1に記載の基板保持装置であって、
前記基板の下面が前記ステージにより支持されるとともに前記周縁部が前記気体層により押し付けられた状態で、前記基板の側端部を前記基板の外側から当接して前記ステージ上での前記基板の水平位置を調整するアライメント部をさらに備える基板保持装置。 - 請求項2に記載の基板保持装置であって、
前記アライメント部により前記基板の水平位置を調整している間、前記ステージから前記基板の下面に向けて第2気体を供給する気体供給部をさらに備える基板保持装置。 - 請求項2または3に記載の基板保持装置であって、
前記アライメント部により前記基板の水平位置が調整された後で前記矯正機構により前記反りが矯正された前記基板の下面を吸引して前記基板を前記ステージに吸着保持させる吸引部をさらに備える基板保持装置。 - 請求項4に記載の基板保持装置であって、
前記移動部は、前記ステージでの前記基板の吸着保持を開始した後に、前記矯正ブロックを前記ステージから離れた退避位置に移動させる基板保持装置。 - 請求項1ないし5のいずれか一項に記載の基板保持装置と、
前記基板保持装置により保持された前記基板の上面に向けて処理液を吐出するノズルと
を備えることを特徴とする基板処理装置。 - ステージにより下方から支持された基板の反りを矯正した上で前記基板を前記ステージで保持させる基板保持方法であって、
前記基板の上面の周縁部の上方に矯正ブロックを配置し、
前記矯正ブロックの下面から前記基板の上面に向けて第1気体を噴出して前記基板の上面と前記矯正ブロックの下面との間に気体層を形成し、
前記基板と非接触状態を保ちつつ前記矯正ブロックを下方に移動させることで前記気体層を前記周縁部に押し付けて前記基板の反りを矯正する
ことを特徴とする基板保持方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018223741A JP6875357B2 (ja) | 2018-11-29 | 2018-11-29 | 基板保持装置、基板処理装置および基板保持方法 |
CN201911086918.1A CN111244020A (zh) | 2018-11-29 | 2019-11-08 | 基板保持装置、基板处理装置和基板保持方法 |
TW108141303A TWI742464B (zh) | 2018-11-29 | 2019-11-14 | 基板保持裝置、基板處理裝置和基板保持方法 |
KR1020190152120A KR102336820B1 (ko) | 2018-11-29 | 2019-11-25 | 기판 유지 장치, 기판 처리 장치 및 기판 유지 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018223741A JP6875357B2 (ja) | 2018-11-29 | 2018-11-29 | 基板保持装置、基板処理装置および基板保持方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020088275A true JP2020088275A (ja) | 2020-06-04 |
JP6875357B2 JP6875357B2 (ja) | 2021-05-26 |
Family
ID=70866171
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018223741A Active JP6875357B2 (ja) | 2018-11-29 | 2018-11-29 | 基板保持装置、基板処理装置および基板保持方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6875357B2 (ja) |
KR (1) | KR102336820B1 (ja) |
CN (1) | CN111244020A (ja) |
TW (1) | TWI742464B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114121486A (zh) * | 2020-08-25 | 2022-03-01 | 日机装株式会社 | 层叠装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006054388A (ja) * | 2004-08-16 | 2006-02-23 | Disco Abrasive Syst Ltd | 被加工物搬送装置,スピンナー洗浄装置,研削装置,被加工物搬送方法 |
JP2013219069A (ja) * | 2012-04-04 | 2013-10-24 | Tokyo Electron Ltd | 基板保持装置および基板保持方法 |
JP2017112197A (ja) * | 2015-12-16 | 2017-06-22 | 株式会社Screenホールディングス | 基板保持装置、塗布装置、基板保持方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4283926B2 (ja) * | 1999-02-22 | 2009-06-24 | 株式会社アルバック | ウエハカセットのウエハ保持システム |
US8580078B2 (en) * | 2007-01-26 | 2013-11-12 | Lam Research Corporation | Bevel etcher with vacuum chuck |
KR100877102B1 (ko) * | 2007-05-28 | 2009-01-09 | 주식회사 하이닉스반도체 | 열처리 장치 및 이를 이용한 열처리 방법 |
KR20120134368A (ko) * | 2011-06-02 | 2012-12-12 | 엘아이지에이디피 주식회사 | 기판 척킹 디척킹 장치 |
TW201314372A (zh) * | 2011-09-26 | 2013-04-01 | Dainippon Screen Mfg | 塗佈裝置 |
JP5977042B2 (ja) | 2012-02-27 | 2016-08-24 | 株式会社Screenホールディングス | 塗布装置、基板保持装置および基板保持方法 |
JP2014072321A (ja) * | 2012-09-28 | 2014-04-21 | Hitachi High-Technologies Corp | 板状体保持機構、基板貼り合わせ装置及び基板貼り合わせ方法 |
CN104538331B (zh) * | 2014-12-12 | 2018-06-05 | 通富微电子股份有限公司 | 一种晶圆翘曲处理的装置及方法 |
JP2016127086A (ja) * | 2014-12-26 | 2016-07-11 | 東京エレクトロン株式会社 | 基板吸着補助部材及び基板搬送装置 |
CN204289408U (zh) * | 2014-12-29 | 2015-04-22 | 昆山国显光电有限公司 | 产品翘曲矫正装置 |
JP2018120935A (ja) * | 2017-01-25 | 2018-08-02 | 東レエンジニアリング株式会社 | ウエーハ保持装置 |
-
2018
- 2018-11-29 JP JP2018223741A patent/JP6875357B2/ja active Active
-
2019
- 2019-11-08 CN CN201911086918.1A patent/CN111244020A/zh active Pending
- 2019-11-14 TW TW108141303A patent/TWI742464B/zh active
- 2019-11-25 KR KR1020190152120A patent/KR102336820B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006054388A (ja) * | 2004-08-16 | 2006-02-23 | Disco Abrasive Syst Ltd | 被加工物搬送装置,スピンナー洗浄装置,研削装置,被加工物搬送方法 |
JP2013219069A (ja) * | 2012-04-04 | 2013-10-24 | Tokyo Electron Ltd | 基板保持装置および基板保持方法 |
JP2017112197A (ja) * | 2015-12-16 | 2017-06-22 | 株式会社Screenホールディングス | 基板保持装置、塗布装置、基板保持方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114121486A (zh) * | 2020-08-25 | 2022-03-01 | 日机装株式会社 | 层叠装置 |
CN114121486B (zh) * | 2020-08-25 | 2024-06-04 | 日机装株式会社 | 层叠装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6875357B2 (ja) | 2021-05-26 |
CN111244020A (zh) | 2020-06-05 |
TWI742464B (zh) | 2021-10-11 |
KR102336820B1 (ko) | 2021-12-07 |
KR20200064921A (ko) | 2020-06-08 |
TW202021172A (zh) | 2020-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI743614B (zh) | 基板處理裝置及基板處理方法 | |
JP2019192775A (ja) | ワーク矯正方法およびワーク矯正装置 | |
JP6516664B2 (ja) | 基板保持装置、塗布装置、基板保持方法 | |
JP2007048828A (ja) | 板状体の変形処理装置及び該板状体の変形処理方法 | |
JP2009004545A (ja) | 基板載置装置および基板処理装置 | |
TWI742464B (zh) | 基板保持裝置、基板處理裝置和基板保持方法 | |
JP2007214227A (ja) | 基板保持装置、基板保持方法、並びに該装置及び方法を利用する部品実装装置、部品実装方法 | |
JP4084393B2 (ja) | 部品実装装置および部品実装方法 | |
JP6595276B2 (ja) | 基板処理装置および基板処理方法 | |
JP7368263B2 (ja) | 基板処理装置および基板処理方法 | |
JP4371939B2 (ja) | 基板搬入装置、部品実装装置、及び基板搬入方法 | |
JP2012023104A (ja) | 基板載置装置 | |
JP4701567B2 (ja) | 部品装着方法及びその装置 | |
JP2000307299A (ja) | 部品装着装置 | |
JP2004172318A (ja) | ワークテーブル、ワーク搬送装置、液滴吐出装置、ワーク受け渡し方法、電気光学装置、電気光学装置の製造方法および電子機器 | |
JP4116911B2 (ja) | 導電性ボールの搭載治具及び導電性ボールの搭載方法 | |
JP2019005683A (ja) | 基板処理装置及び基板処理方法 | |
JP2010118478A (ja) | 基板浮上装置、及び、基板検査装置 | |
JP6339002B2 (ja) | ステージ | |
JP2012160630A (ja) | 基板載置装置及び基板載置方法 | |
JP2016012580A (ja) | 膜形成装置及び膜形成方法 | |
JP6131077B2 (ja) | 転写剥離装置、転写剥離方法およびパターン形成システム | |
JP2009295861A (ja) | 微小ボール搭載装置 | |
JP5663260B2 (ja) | 基板の撓み補正装置および基板の取り出し方法 | |
JP2015008252A (ja) | 基板保持装置、液滴吐出装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191031 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20201106 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20201117 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210114 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210330 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210422 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6875357 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE Ref document number: 6875357 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |