JP2020085919A - 板状部材の製造方法及び積層体 - Google Patents
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Abstract
Description
図1は、本発明に係る板状部材の製造方法により製造される板状部材の一例を示す模式的正面断面図である。図1に示す板状部材は、対向し合う第1の主面1a及び第2の主面1bを有する矩形板状の波長変換部材1である。なお、波長変換部材1の形状は矩形板状には限定されない。
以下において、本発明の一実施形態に係る板状部材の製造方法の一例を説明する。なお、本実施形態における板状部材は、上述した板状の波長変換部材である。
図2は、本発明の一実施形態に係る板状部材の製造方法に用いられる第1の分割溝及び第2の分割溝が形成された板状部材の母材を示す模式的平面図である。図3(a)及び図3(b)は、本発明の一実施形態に係る板状部材の製造方法における積層体の作製工程を説明するための模式的正面断面図である。図4は、本発明の一実施形態に係る板状部材の製造方法に用いられる支持フィルムの模式的拡大正面断面図である。図5は、本発明の一実施形態に係る板状部材の製造方法に用いられる粘着フィルムの模式的拡大正面断面図である。
図7(a)〜図7(d)は、本発明の一実施形態に係る板状部材の製造方法における割断工程を説明するための模式的正面断面図である。
図3(b)に示すように、積層体10は、波長変換部材の母材11と、支持フィルム14と、粘着フィルム17とを備える。積層体10は、上述の波長変換部材1を製造する際の中間体である。もっとも、波長変換部材の母材11は、他の板状部材の母材であってもよい。すなわち、波長変換部材1以外の他の板状部材を製造する際の中間体であってもよい。他の板状部材としては、例えば、ガラス板やセラミック板などの無機材料により構成される脆性材料基板、あるいは板状の半導体素子等を挙げることができる。この場合、波長変換部材の母材11の代わりに上述の板状部材の母材を用いることができる。
1a…第1の主面
1b…第2の主面
2…蛍光体粒子
3…無機マトリクス
10…積層体
11…波長変換部材の母材
11a…第1の主面
11b…第2の主面
12a…第1の分割溝
12b…割断面
13a…第2の分割溝
14…支持フィルム
14a…支持層
14b…粘着層
17…粘着フィルム
17a…基材層
17b…粘着層
18…押圧部材
18a…ブレード
19…支持体
19a…スリット
Claims (11)
- 板状部材の母材を割断することにより複数の板状部材を製造する方法であって、
対向し合う第1の主面及び第2の主面を有する板状部材の母材を用意する工程と、
前記板状部材の母材の前記第1の主面に分割溝を形成する工程と、
前記板状部材の母材の前記第2の主面に支持フィルムを貼り付ける工程と、
前記板状部材の母材の前記第1の主面を覆うように、粘着フィルムを貼り付ける工程と、
前記板状部材の母材に前記粘着フィルムを貼り付けた状態で、前記板状部材の母材の前記分割溝が形成された領域を前記支持フィルム側から押圧することにより、前記分割溝に沿って前記板状部材の母材を割断する割断工程と、
を備える、板状部材の製造方法。 - 前記分割溝が、互いに交差する第1の分割溝及び第2の分割溝であり、
前記割断工程が、前記板状部材の母材を前記第1の分割溝に沿って割断する第1の割断工程と、前記第1の割断工程後に、前記板状部材の母材を前記第2の分割溝に沿って割断する第2の割断工程とを有する、請求項1に記載の板状部材の製造方法。 - 前記第1の分割溝と前記第2の分割溝とが直交する、請求項2に記載の板状部材の製造方法。
- 前記割断工程において、前記板状部材の母材の前記第1の主面に平行に、かつ直線状に延びる押圧部材によって、前記支持フィルム側から前記板状部材の母材を押圧することにより、前記分割溝に沿って前記板状部材の母材を割断する、請求項1〜3のいずれか一項に記載の板状部材の製造方法。
- 前記割断工程において、スリットを有する支持部材によって前記板状部材の母材を前記粘着フィルム側から支持した状態で、前記押圧部材によって前記支持フィルム側から前記板状部材の母材を押圧し、前記支持部材及び前記押圧部材によって前記板状部材の母材を挟圧することにより、前記分割溝に沿って前記板状部材の母材を割断する、請求項4に記載の板状部材の製造方法。
- 平面視において、前記支持フィルムの面積が、前記板状部材の母材の前記第2の主面の面積より大きく、
前記板状部材の母材の前記第1の主面を覆うように、前記粘着フィルムを貼り付けるに際し、前記粘着フィルムが前記第1の主面から前記支持フィルムに至るように貼り付ける、請求項1〜5のいずれか一項に記載の板状部材の製造方法。 - 前記粘着フィルムが、自己粘着性のフィルムである、請求項1〜6のいずれか一項に記載の板状部材の製造方法。
- 前記支持フィルムの表面に粘着層が設けられており、
前記支持フィルムにおける前記粘着層を前記板状部材の母材の前記第2の主面に貼り付ける、請求項1〜7のいずれか一項に記載の板状部材の製造方法。 - 前記粘着フィルムの接着力が、前記支持フィルムの接着力より低い、請求項1〜8のいずれか一項に記載の板状部材の製造方法。
- 前記板状部材が、無機マトリクス中に蛍光体粒子が分散された波長変換部材である、請求項1〜9のいずれか一項に記載の板状部材の製造方法。
- 板状部材の母材を割断することにより複数の板状部材を製造する際に用いられる積層体であって、
対向し合う第1の主面及び第2の主面を有し、前記第1の主面に分割溝が設けられている、板状部材の母材と、
前記板状部材の母材の前記第2の主面に貼り付けられている、支持フィルムと、
前記板状部材の母材の前記第1の主面を覆うように貼り付けられている、粘着フィルムと、
を備える、積層体。
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JP2018214315A JP7206829B2 (ja) | 2018-11-15 | 2018-11-15 | 板状部材の製造方法及び積層体 |
PCT/JP2019/041825 WO2020100552A1 (ja) | 2018-11-15 | 2019-10-25 | 板状部材の製造方法及び積層体 |
US17/263,191 US11975519B2 (en) | 2018-11-15 | 2019-10-25 | Method of manufacturing plate-like member and laminate |
CN201980054256.1A CN112567539A (zh) | 2018-11-15 | 2019-10-25 | 板状部件的制造方法和层叠体 |
KR1020217000770A KR20210090154A (ko) | 2018-11-15 | 2019-10-25 | 판상 부재의 제조 방법 및 적층체 |
DE112019005727.8T DE112019005727T5 (de) | 2018-11-15 | 2019-10-25 | Verfahren zur Herstellung eines plattenartigen Elements und Laminat |
TW108140054A TW202024681A (zh) | 2018-11-15 | 2019-11-05 | 板狀構件之製造方法及積層體 |
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2019
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- 2019-10-25 DE DE112019005727.8T patent/DE112019005727T5/de active Pending
- 2019-10-25 US US17/263,191 patent/US11975519B2/en active Active
- 2019-10-25 KR KR1020217000770A patent/KR20210090154A/ko not_active Application Discontinuation
- 2019-11-05 TW TW108140054A patent/TW202024681A/zh unknown
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JP7206829B2 (ja) | 2023-01-18 |
WO2020100552A1 (ja) | 2020-05-22 |
CN112567539A (zh) | 2021-03-26 |
TW202024681A (zh) | 2020-07-01 |
US20210187929A1 (en) | 2021-06-24 |
US11975519B2 (en) | 2024-05-07 |
DE112019005727T5 (de) | 2021-08-26 |
KR20210090154A (ko) | 2021-07-19 |
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