JP2020053518A - 基板処理システムおよび処理流体供給方法 - Google Patents
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- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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Abstract
Description
まず、実施形態に係る基板処理装置1の構成について図1を参照して説明する。図1は、実施形態に係る基板処理装置1の構成例を示す図である。なお、以下では、位置関係を明確にするために、互いに直交するX軸、Y軸およびZ軸を規定し、Z軸正方向を鉛直上向き方向とする。
次に、液処理ユニット17の構成について、図2を参照しながら説明する。図2は、液処理ユニット17の構成例を示す図である。液処理ユニット17は、たとえば、スピン洗浄によりウェハWを1枚ずつ洗浄する枚葉式の洗浄装置として構成される。
つづいて、乾燥ユニット18の構成について、図3を参照しながら説明する。図3は、乾燥ユニット18の構成例を示す模式斜視図である。
つづいて、実施形態に係る基板処理システム100の構成について、図4を参照しながら説明する。図4は、実施形態に係る基板処理システム100のシステム全体の構成例を示す図である。なお、以下に示す基板処理システム100の各部は、制御部7によって制御可能である。
つづいて、実施形態に係る基板処理システム100における基板処理の詳細について、図5〜図9を参照しながら説明する。図5は、実施形態に係る循環ライン62の循環圧および乾燥ユニット18の内圧の推移を示す図である。
つづいて、実施形態の変形例について、図10および図11を参照しながら説明する。図10は、実施形態の変形例に係る基板処理システム100の昇圧処理および保持処理を説明するための図である。
つづいて、図12を参照しながら、実施形態に係る処理流体供給装置60が実行する処理流体供給処理の詳細について説明する。図12は、実施形態に係る処理流体供給処理の処理手順を示すフローチャートである。
1 基板処理装置
18 乾燥ユニット(基板処理部の一例)
44 ヒータ(別の加熱部の一例)
60 処理流体供給装置
61 ガス供給ライン
62 循環ライン
63 分岐ライン
67 フィルタ
68 コンデンサ(冷却部の一例)
70 ポンプ
72 分岐部
74 スパイラルヒータ(加熱部の一例)
75 背圧弁(調圧部の一例)
100 基板処理システム
Claims (7)
- 処理流体で基板を処理する基板処理装置と、
前記基板処理装置に前記処理流体を供給する処理流体供給装置と、
を備え、
前記処理流体供給装置は、
前記処理流体を循環させる循環ラインと、
気体状態の前記処理流体を前記循環ラインに供給するガス供給ラインと、
前記循環ラインに設けられ、気体状態の前記処理流体を冷却して液体状態の前記処理流体を生成する冷却部と、
前記循環ラインにおける前記冷却部の下流側に設けられるポンプと、
前記循環ラインにおける前記ポンプの下流側に接続され、液体状態の前記処理流体を分岐部から分岐させる分岐ラインと、
前記分岐部の下流側に設けられ、液体状態の前記処理流体を加熱して超臨界状態の前記処理流体を生成する加熱部と、
前記循環ラインにおける前記加熱部の下流側かつ前記ガス供給ラインの上流側に設けられ、超臨界状態の前記処理流体を減圧して気体状態の前記処理流体を生成する調圧部と、
を有する基板処理システム。 - 前記処理流体供給装置は、前記循環ラインにおける前記ガス供給ラインと前記冷却部との間に設けられ、気体状態の前記処理流体を濾過するフィルタをさらに有する、請求項1に記載の基板処理システム。
- 前記処理流体供給装置は、
前記分岐ラインから液体状態の前記処理流体を前記基板処理装置に供給する、請求項1または2に記載の基板処理システム。 - 前記基板処理装置は、
液体状態の前記処理流体を加熱して超臨界状態の前記処理流体を生成する別の加熱部と、
前記別の加熱部から供給される超臨界状態の前記処理流体で前記基板を処理する基板処理部と、
を有する請求項3に記載の基板処理システム。 - 前記基板処理部内での超臨界状態の前記処理流体は90℃以上である、請求項4に記載の基板処理システム。
- 前記別の加熱部で生成される超臨界状態の前記処理流体の温度は、前記基板処理部内での前記処理流体の温度より高い、請求項4または5に記載の基板処理システム。
- 循環ラインに気体状態の処理流体を供給する工程と、
前記循環ラインで気体状態の前記処理流体を冷却し、液体状態の前記処理流体を生成する工程と、
液体状態の前記処理流体を前記循環ラインから分岐ラインに分岐させる工程と、
前記循環ラインで液体状態の前記処理流体を加熱し、超臨界状態の前記処理流体を生成する工程と、
を含む処理流体供給方法。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018180303A JP7109328B2 (ja) | 2018-09-26 | 2018-09-26 | 基板処理システム |
TW108133770A TWI831834B (zh) | 2018-09-26 | 2019-09-19 | 基板處理系統及處理流體供給方法 |
US16/578,587 US11482427B2 (en) | 2018-09-26 | 2019-09-23 | Substrate processing system and method for supplying processing fluid |
KR1020190116804A KR102469166B1 (ko) | 2018-09-26 | 2019-09-23 | 기판 처리 시스템 및 처리 유체 공급 방법 |
CN201910899672.3A CN110957239A (zh) | 2018-09-26 | 2019-09-23 | 基片处理系统和处理流体供给方法 |
JP2022112176A JP7285992B2 (ja) | 2018-09-26 | 2022-07-13 | 処理流体供給方法 |
US17/949,437 US11735439B2 (en) | 2018-09-26 | 2022-09-21 | Substrate processing system and method for supplying processing fluid |
KR1020220121703A KR20220134508A (ko) | 2018-09-26 | 2022-09-26 | 처리 유체 공급 방법 |
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Cited By (2)
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JP2022189762A (ja) * | 2021-06-11 | 2022-12-22 | セメス カンパニー,リミテッド | 基板処理装置 |
KR20230021384A (ko) * | 2021-08-05 | 2023-02-14 | 주식회사 에프알디 | 반도체용 고순도 아세틸렌 공급 장치 |
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JP2022140019A (ja) * | 2021-03-12 | 2022-09-26 | 東京エレクトロン株式会社 | 処理装置及びガス供給方法 |
TWI799172B (zh) * | 2021-03-19 | 2023-04-11 | 日商斯庫林集團股份有限公司 | 基板處理裝置、及基板處理方法 |
CN115540527B (zh) * | 2022-09-29 | 2024-02-27 | 浙江大学 | 超临界流体干燥系统及干燥方法 |
WO2024085014A1 (ja) * | 2022-10-21 | 2024-04-25 | 東京エレクトロン株式会社 | 処理流体供給装置および処理流体供給方法 |
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JP2013159499A (ja) * | 2012-02-02 | 2013-08-19 | Japan Organo Co Ltd | 液化炭酸ガス製造装置及びその洗浄方法 |
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Cited By (4)
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JP2022189762A (ja) * | 2021-06-11 | 2022-12-22 | セメス カンパニー,リミテッド | 基板処理装置 |
JP7441890B2 (ja) | 2021-06-11 | 2024-03-01 | セメス カンパニー,リミテッド | 基板処理装置 |
KR20230021384A (ko) * | 2021-08-05 | 2023-02-14 | 주식회사 에프알디 | 반도체용 고순도 아세틸렌 공급 장치 |
KR102502667B1 (ko) * | 2021-08-05 | 2023-02-23 | 주식회사 에프알디 | 반도체용 고순도 아세틸렌 공급 장치 |
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US11482427B2 (en) | 2022-10-25 |
CN110957239A (zh) | 2020-04-03 |
TW202029316A (zh) | 2020-08-01 |
KR20200035357A (ko) | 2020-04-03 |
US20200098594A1 (en) | 2020-03-26 |
KR102469166B1 (ko) | 2022-11-18 |
US11735439B2 (en) | 2023-08-22 |
JP7109328B2 (ja) | 2022-07-29 |
KR20220134508A (ko) | 2022-10-05 |
US20230028053A1 (en) | 2023-01-26 |
TWI831834B (zh) | 2024-02-11 |
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