JP2020042076A - レーザ光走査装置及びレーザ加工装置 - Google Patents
レーザ光走査装置及びレーザ加工装置 Download PDFInfo
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- JP2020042076A JP2020042076A JP2018167427A JP2018167427A JP2020042076A JP 2020042076 A JP2020042076 A JP 2020042076A JP 2018167427 A JP2018167427 A JP 2018167427A JP 2018167427 A JP2018167427 A JP 2018167427A JP 2020042076 A JP2020042076 A JP 2020042076A
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- laser
- light
- laser light
- laser beam
- light transmitting
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
- B23K26/0821—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head using multifaceted mirrors, e.g. polygonal mirror
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/108—Scanning systems having one or more prisms as scanning elements
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Laser Beam Processing (AREA)
- Mechanical Optical Scanning Systems (AREA)
Abstract
Description
21 集光部材
23 レーザ光走査装置
31 回転部材
32 ガラスホルダ
33 透光ガラス(透光部材)
42 ミラー(導光部材)
Claims (7)
- 回転軸線を中心に回転する回転部材と、
前記回転部材に配置されている透光部材と、
前記透光部材にレーザ光が入射されるように当該レーザ光を導く導光部材と、
を備え、
視線方向を前記回転軸線と平行にして前記回転部材を見たときに、前記透光部材の前記回転軸線側の面である内面を接続した形状が多角形であり、
前記透光部材の前記内面と、前記回転軸線に平行な直線と、がなす角を傾斜角としたときに、前記透光部材の複数の傾斜角のうち少なくとも2つは値が異なることを特徴とするレーザ光走査装置。 - 請求項1に記載のレーザ光走査装置であって、
前記導光部材は、前記透光部材の前記内面にレーザ光が入射されるように前記レーザ光を導くことを特徴とするレーザ光走査装置。 - 請求項1に記載のレーザ光走査装置であって、
前記多角形の辺数が偶数であり、前記回転軸線を挟んで対向する2つの前記内面が平行であり、
前記導光部材は、前記透光部材の前記内面とは反対側の面である外面にレーザ光が入射されるように前記レーザ光を導き、
当該外面を透過したレーザ光は、対向する前記透光部材の前記内面に入射されることを特徴とするレーザ光走査装置。 - 請求項1から3までの何れか一項に記載のレーザ光走査装置であって、
前記透光部材は平板状であり、視線方向を前記回転軸線と平行にして前記回転部材を見たときに、複数の前記透光部材が前記多角形となるように並べて配置されていることを特徴とするレーザ光走査装置。 - 請求項1から4までの何れか一項に記載のレーザ光走査装置であって、
前記透光部材の隣接する2つの内面をそれぞれ第1内面及び第2内面と称したときに、
前記第1内面を透過したレーザ光の照射領域と、前記第2内面を透過したレーザ光の照射領域と、の間の領域に、前記第1内面及び前記第2内面の両方と隣接していない前記内面を透過したレーザ光が照射されることを特徴とするレーザ光走査装置。 - 請求項1から5までの何れか一項に記載のレーザ光走査装置と、
前記レーザ光を発生させるレーザ発生器と、
前記レーザ光を集光する集光部材と、
を備えることを特徴とするレーザ加工装置。 - 請求項6に記載のレーザ加工装置であって、
前記レーザ光を照射する加工ヘッドを備え、
前記加工ヘッドが移動可能に構成されていることを特徴とするレーザ加工装置。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018167427A JP7011557B2 (ja) | 2018-09-07 | 2018-09-07 | レーザ光走査装置及びレーザ加工装置 |
KR1020217008470A KR102611972B1 (ko) | 2018-09-07 | 2019-08-30 | 레이저광 주사 장치 및 레이저 가공 장치 |
BR112021004120-6A BR112021004120A2 (pt) | 2018-09-07 | 2019-08-30 | digitalizador a laser e aparelho de processamento a laser |
EP19858500.2A EP3848744A4 (en) | 2018-09-07 | 2019-08-30 | LASER SCANNER AND LASER PROCESSING DEVICE |
CN201980057959.XA CN112689785B (zh) | 2018-09-07 | 2019-08-30 | 激光扫描装置及激光加工装置 |
US17/250,805 US20210316395A1 (en) | 2018-09-07 | 2019-08-30 | Laser scanner and laser machining device |
CA3111965A CA3111965A1 (en) | 2018-09-07 | 2019-08-30 | Laser scanner and laser processing apparatus |
PCT/JP2019/034038 WO2020050148A1 (ja) | 2018-09-07 | 2019-08-30 | レーザ光走査装置及びレーザ加工装置 |
TW108131818A TWI764039B (zh) | 2018-09-07 | 2019-09-04 | 雷射光掃描裝置以及雷射加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018167427A JP7011557B2 (ja) | 2018-09-07 | 2018-09-07 | レーザ光走査装置及びレーザ加工装置 |
Publications (2)
Publication Number | Publication Date |
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JP2020042076A true JP2020042076A (ja) | 2020-03-19 |
JP7011557B2 JP7011557B2 (ja) | 2022-01-26 |
Family
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Family Applications (1)
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JP2018167427A Active JP7011557B2 (ja) | 2018-09-07 | 2018-09-07 | レーザ光走査装置及びレーザ加工装置 |
Country Status (9)
Country | Link |
---|---|
US (1) | US20210316395A1 (ja) |
EP (1) | EP3848744A4 (ja) |
JP (1) | JP7011557B2 (ja) |
KR (1) | KR102611972B1 (ja) |
CN (1) | CN112689785B (ja) |
BR (1) | BR112021004120A2 (ja) |
CA (1) | CA3111965A1 (ja) |
TW (1) | TWI764039B (ja) |
WO (1) | WO2020050148A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023045543A (ja) * | 2021-09-22 | 2023-04-03 | 川崎重工業株式会社 | レーザ加工方法 |
Citations (9)
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JPH01321422A (ja) * | 1988-06-13 | 1989-12-27 | Eotron Corp | 走査装置および方法 |
JPH06148556A (ja) * | 1992-11-10 | 1994-05-27 | Canon Inc | 光走査装置 |
JPH06202029A (ja) * | 1992-12-29 | 1994-07-22 | Canon Inc | ポリゴンミラー |
JPH11305156A (ja) * | 1998-04-23 | 1999-11-05 | Aisin Seiki Co Ltd | 光走査装置 |
JP2001225183A (ja) * | 2000-02-14 | 2001-08-21 | Nec Corp | レーザ加工光学装置 |
US20100020377A1 (en) * | 2008-07-25 | 2010-01-28 | Spudnik, Inc. | Beam Scanning Based on Two-Dimensional Polygon Scanner for Display and Other Applications |
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-
2018
- 2018-09-07 JP JP2018167427A patent/JP7011557B2/ja active Active
-
2019
- 2019-08-30 EP EP19858500.2A patent/EP3848744A4/en active Pending
- 2019-08-30 CN CN201980057959.XA patent/CN112689785B/zh active Active
- 2019-08-30 CA CA3111965A patent/CA3111965A1/en active Pending
- 2019-08-30 WO PCT/JP2019/034038 patent/WO2020050148A1/ja unknown
- 2019-08-30 US US17/250,805 patent/US20210316395A1/en active Pending
- 2019-08-30 BR BR112021004120-6A patent/BR112021004120A2/pt unknown
- 2019-08-30 KR KR1020217008470A patent/KR102611972B1/ko active IP Right Grant
- 2019-09-04 TW TW108131818A patent/TWI764039B/zh active
Patent Citations (9)
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JPS4430545B1 (ja) * | 1966-07-08 | 1969-12-09 | ||
JPH01185610A (ja) * | 1988-01-19 | 1989-07-25 | Fuji Facom Corp | 光走査装置 |
JPH01321422A (ja) * | 1988-06-13 | 1989-12-27 | Eotron Corp | 走査装置および方法 |
JPH06148556A (ja) * | 1992-11-10 | 1994-05-27 | Canon Inc | 光走査装置 |
JPH06202029A (ja) * | 1992-12-29 | 1994-07-22 | Canon Inc | ポリゴンミラー |
JPH11305156A (ja) * | 1998-04-23 | 1999-11-05 | Aisin Seiki Co Ltd | 光走査装置 |
JP2001225183A (ja) * | 2000-02-14 | 2001-08-21 | Nec Corp | レーザ加工光学装置 |
US20100020377A1 (en) * | 2008-07-25 | 2010-01-28 | Spudnik, Inc. | Beam Scanning Based on Two-Dimensional Polygon Scanner for Display and Other Applications |
JP2017144465A (ja) * | 2016-02-17 | 2017-08-24 | 凸版印刷株式会社 | 蒸着用メタルマスク加工方法及び蒸着用メタルマスク加工装置 |
Also Published As
Publication number | Publication date |
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KR20210047910A (ko) | 2021-04-30 |
KR102611972B1 (ko) | 2023-12-08 |
EP3848744A4 (en) | 2022-06-08 |
BR112021004120A2 (pt) | 2021-05-25 |
CN112689785B (zh) | 2023-06-02 |
US20210316395A1 (en) | 2021-10-14 |
TWI764039B (zh) | 2022-05-11 |
TW202017684A (zh) | 2020-05-16 |
WO2020050148A1 (ja) | 2020-03-12 |
CN112689785A (zh) | 2021-04-20 |
EP3848744A1 (en) | 2021-07-14 |
JP7011557B2 (ja) | 2022-01-26 |
CA3111965A1 (en) | 2020-03-12 |
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