JP2020027798A - 異方性導電フィルム - Google Patents
異方性導電フィルム Download PDFInfo
- Publication number
- JP2020027798A JP2020027798A JP2019145850A JP2019145850A JP2020027798A JP 2020027798 A JP2020027798 A JP 2020027798A JP 2019145850 A JP2019145850 A JP 2019145850A JP 2019145850 A JP2019145850 A JP 2019145850A JP 2020027798 A JP2020027798 A JP 2020027798A
- Authority
- JP
- Japan
- Prior art keywords
- arrangement
- conductive particles
- oblique lattice
- terminal
- conductive film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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Abstract
Description
導電粒子が所定ピッチでa方向に配置されている導電粒子の配列軸a1が、a方向と角度αで斜交するb方向に複数配列している第1斜方格子領域と、
導電粒子が所定ピッチでa方向に配置されている導電粒子の配列軸a2が、前記b方向をa方向に対して反転させたc方向に複数配列している第2斜方格子領域とが、繰り返し配置されている異方性導電フィルムを提供する。
図1Aは実施例の異方性導電フィルム10Aの導電粒子の配置を示す平面図であり、図2はそのX−X断面図である。この異方性導電フィルム10Aは、導電粒子1が絶縁性樹脂層2の表面又はその近傍に単層で配置され、その上に低粘度樹脂層3が積層された層構成を有している。なお、本発明において、低粘度樹脂層3は必要に応じて設けられ、図3に示す異方性導電フィルム10Bの断面図のように、低粘度樹脂層3を省略した層構成としてもよい。この異方性導電フィルム10Bの導電粒子1の平面配置は、低粘度樹脂層3を有する異方性導電フィルム10Aと同様とすることができる。
・粒子材料
導電粒子1としては、ニッケル、コバルト、銀、銅、金、パラジウムなどの金属粒子、ハンダなどの合金粒子、金属被覆樹脂粒子などが挙げられる。2種以上を併用することもできる。中でも、金属被覆樹脂粒子が、接続された後に樹脂粒子が反発することで端子との接触が維持され易くなり、導通性能が安定する点から好ましい。また、導電粒子の表面には導通特性に支障を来さない絶縁処理が施されていてもよく、例えば公知の技術により絶縁性微粒子が付着していてもよく、絶縁性樹脂により絶縁コートされていてもよい。
導電粒子1の粒子径は、用途によって適宜選択される。通常、導通抵抗の上昇を抑制し、且つショートの発生を抑制するために、好ましくは1μm以上30μm以下、ファインピッチ用途であれば、好ましくは2μm以上10μm未満である。絶縁性樹脂層に分散させる前の導電粒子の粒子径は、一般的な粒度分布測定装置により測定することができ、また、平均粒子径も粒度分布測定装置を用いて求めることができる。測定装置としては、一例として画像型のFPIA−3000(マルバーン社)を挙げることができる。この場合、導電粒子径を測定するサンプル数を1000以上、好ましくは2000以上とすることが望ましい。異方性導電フィルムにおける導電粒子の粒子径は、SEMなどの電子顕微鏡観察から求めることができる。この場合、導電粒子径を測定するサンプル数を200以上、好ましくは1000以上とすることが望ましい。
導電粒子の平面配置は、図1Aに示したように、第1斜方格子領域11と第2斜方格子領域12とが、a方向と垂直なy方向に、交互に繰り返し配置されたものとなっている。本実施例において、第1斜方格子領域11は、導電粒子1が一定ピッチpaでa方向に配置されている配列軸a1が、a方向と角度αで斜交するb方向に複数配列している領域である。また、第2斜方格子領域12は、導電粒子1が前記ピッチpaでa方向に配置されている導電粒子の配列軸a2が、c方向に複数配列している領域であり、このc方向は、a方向の配列軸に平行な直線を対象の軸としてb方向を反転させた方向である。あるいは、c方向は、a方向と角度−αで斜交する方向である。この粒子配置は、第1斜方格子領域11のb方向の配列と、第2斜方格子領域12のc方向の配列からなる、図1Aに二点鎖線で囲った屈曲した配列dを単位としているとも見ることができる。
第1斜方格子領域11と第2斜方格子領域12との距離をL3、
第1斜方格子領域11において隣接する配列軸a1同士の距離をL1、
第2斜方格子領域12において隣接する配列軸a2同士の距離をL2、
隣接する第1斜方格子領域11の配列軸a1と第2斜方格子領域12の配列軸a2における、導電粒子の位置のa方向のずれ量をLd、
配列軸a1、a2のピッチをpa
としたときに、
L3=L1,L2であり、かつ、Ld=(1/2)×paであると、第1斜方格子領域11におけるb方向の配列軸と同方向の配列軸が第2斜方格子領域12にも存在し、かつその第2斜方格子領域の配列軸の延長線が第1斜方格子領域のb方向の配列軸となる。このようにa方向と斜交する配列軸について、双方の斜方格子領域11、12のうちの一方の斜方格子領域の配列軸がそのまま他方の斜方格子領域の配列軸にもなると、異方性導電フィルム全体において、a方向と交差する配列軸はジグザグにはならず、このような粒子配置は本発明の効果を得られない。従って、このような粒子配置は本発明から除かれる。
図1A〜図1Kのいずれの粒子配置においても、本発明の異方性導電フィルムでは導電粒子の個数密度を接続する電子部品の端子の形状、大きさ、配列ピッチなどに応じて定めることができる。通常、導電粒子の個数密度は接続する電子部品の組み合わせや用途によって好ましい条件が変わるために特に制限はないが、下限は実用上30個/mm2以上であればよく、150個/mm2以上が好ましい。導電粒子数が少なければ、コスト削減効果が見込まれる。また上限は実用上70000個/mm2以下が好ましく、42000個/mm2以下がより好ましく、特にファインピッチ用途の場合には、6000〜35000個/mm2の範囲にすることが好ましい。また、導電粒子の平均粒子径が10μm以上の場合は、50〜2000個/mm2の範囲にすることが好ましい。
導電粒子の面積占有率(%)=[平面視における導電粒子の個数密度]×[導電粒子1
個の平面視面積の平均]×100
導電粒子1のフィルム厚方向の位置は揃っていることが好ましい。例えば、図2に示したように、導電粒子1のフィルム厚方向の埋込量Lbを揃えることができる。これにより、端子における導電粒子1の捕捉性が安定し易い。一方、本発明において、導電粒子1は、絶縁性樹脂層2から露出していても、完全に埋め込まれていてもよい。
導電粒子1の平均粒子径Dに対する埋込量Lbの割合を埋込率(Lb/D)とした場合に、埋込率は30%以上105%以下が好ましい。埋込率(Lb/D)を30%以上とすることにより、導電粒子1を絶縁性樹脂層2によって所定の位置に維持し、また、105%以下とすることにより、異方性導電接続時に端子間の導電粒子を不用に流動させるように作用する絶縁性樹脂層の樹脂量を低減させることができる。
本発明において、絶縁性樹脂層2は、特許6187665号公報に記載の異方性導電フィルムの絶縁性樹脂層と同様に、重合性化合物と重合開始剤から形成される硬化性樹脂組成物を用いて形成することができる。この場合、重合開始剤としては熱重合開始剤を使用してもよく、光重合開始剤を使用してもよく、それらを併用してもよい。例えば、熱重合開始剤としてカチオン系重合開始剤、熱重合性化合物としてエポキシ樹脂を使用し、光重合開始剤として光ラジカル重合開始剤、光重合性化合物としてアクリレート化合物を使用する。熱重合開始剤として、熱アニオン重合開始剤を使用してもよい。熱アニオン重合開始剤としては、イミダゾール変性体を核としその表面をポリウレタンで被覆してなるマイクロカプセル型潜在性硬化剤を用いることが好ましい。
絶縁性樹脂層2の最低溶融粘度は、特に限定はないが、1000Pa・s以上でもよく、特許6187665号公報に記載の異方性導電フィルムの絶縁性樹脂層の最低溶融粘度と同様とすることができ、好ましくは1500Pa・s以上、より好ましくは2000Pa・s以上、さらに好ましくは3000〜15000Pa・s、特に好ましくは3000〜10000Pa・sである。この最低溶融粘度は、一例として回転式レオメータ(TA instrument社製)を用い、測定圧力5gで一定に保持し、直径8mmの測定プレートを使用し求めることができ、より具体的には、温度範囲30〜200℃において、昇温速度10℃/分、測定周波数10Hz、前記測定プレートに対する荷重変動5gとすることにより求めることができる。なお、最低溶融粘度の調整は、溶融粘度調整剤として含有させる微小固形物の種類や配合量、樹脂組成物の調整条件の変更などにより行うことができる。
低粘度樹脂層3は、30〜200℃の範囲の最低溶融粘度が絶縁性樹脂層2よりも低い樹脂層である。本発明において、低粘度樹脂層3は必要に応じて設けられるが、低粘度樹脂層3を絶縁性樹脂層2に積層することにより、異方性導電フィルム10Aを介して対峙する電子部品を熱圧着する場合に、電子部品の電極やバンプによって形成される空間を低粘度樹脂層3で充填し、電子部品同士の接着性を向上させることができる。
絶縁性樹脂層2の層厚は、後述する異方性導電フィルムの製造工程において、絶縁性樹脂層2へ導電粒子1を安定して押し込めるようにするため、導電粒子1の平均粒子径Dに対して、好ましくは0.3倍以上、より好ましくは0.6倍以上、さらに好ましくは0.8倍以上、特に好ましくは1倍以上である。また、絶縁性樹脂層2の層厚の上限については接続する電子部品の端子形状、端子厚、配列ピッチ等に応じて定めることができるが、層厚が厚くなりすぎると接続時に導電粒子1が樹脂流動の影響を不用に受け易くなるため、導電粒子1の平均粒子径Dの好ましくは20倍以下、より好ましくは15倍以下である。
本発明の異方性導電フィルムは、その製品形態において巻装体とすることができる。巻装体の長さについて特に制限はないが、出荷物の取り扱い性の点から好ましくは5000m以下、より好ましくは1000m以下、さらに好ましくは500m以下である。一方、巻装体の量産性の点からは5m以上が好ましい。フィルム幅としては、特に制限はないが、実装体の小型化の観点からは狭いことが求められている。一方、一括して複数部品を異方性導電接続する、もしくはある程度大きいサイズで一括して異方性導電接続してから切削する、といった使用方法の観点からは面積が大きいことが求められることから、幅が広いものにも需要はある。
本発明の異方性導電フィルムの製造方法自体には特に限定はないが、例えば、導電粒子を所定の配列に配置するための転写型を製造し、転写型の凹部に導電粒子を充填し、その上に、剥離フィルム上に形成した絶縁性樹脂層を被せて圧力をかけ、絶縁性樹脂層に導電粒子を押し込むことにより、絶縁性樹脂層に導電粒子を転着させ、あるいはさらにその導電粒子上、もしくは導電粒子を転着した面と反対の面に低粘度樹脂層を積層することで、異方性導電フィルムを製造する。
本発明の異方性導電フィルムを用いて電子部品を接続する方法としては、例えば、ステージに一方の電子部品を載置し、その上に異方性導電フィルムを介してもう一方の電子部品を載置し、圧着ツールで加熱押圧することにより双方の電子部品の端子同士を異方性導電接続して接続構造体を製造する。この場合、ステージに載置する電子部品をICチップ、ICモジュール、FPC、ガラス基板、プラスチック基板、リジッド基板、セラミック基板などの第2の電子部品とし、圧着ツールで加熱加圧する電子部品をFPC、ICチップ、ICモジュールなどの第1の電子部品とする。より詳細な方法としては、各種基板等の第2の電子部品に異方性導電フィルムを仮貼りして仮圧着し、仮圧着した異方性導電フィルムにICチップ等の第1の電子部品を合わせ、熱圧着することにより異方性導電接続して接続構造体を製造する。なお、第2の電子部品ではなく、第1の電子部品に異方性導電フィルムを仮貼りして接続構造体を製造することもできる。また、接続方法は熱圧着に限定されるものではなく、光硬化を利用した圧着や、熱と光を併用した圧着などを行っても良い。
実験例1〜5
表1の仕様のファンアウト型の端子列A又はBにおいて、表2に示す、実験例1〜5の粒子配置の異方性導電フィルムを接続した場合の以下の(a)〜(d)の評価項目をシミュレーションにより計測し、評価した。このうち実験例1〜3が本発明の実施例である。評価結果を表2に示す。(d)の評価結果に関連し、実験例1、3、4、5導電粒子の配置で個数密度を16000個/mm2にした場合の端子列Bにおける導電粒子の捕捉状態のシミュレーション結果(端子上及び端子間における粒子間距離の拡大比率も表1と同様)を図7A〜図7Dに示す。
OK:5個以上
NG:4個以下
なお、この評価基準は、シミュレーションにおける評価であるため、より厳格な評価基準とした。
(b)端子間において端子の長手方向に連結した導電粒子数(端子列Bにおけるシミュレーション)
OK:3個以下
NG:4個以上
(c)端子上において直線状に並んだ導電粒子数(端子列Bにおけるシミュレーション)
OK:3個以下
NG:4個以上
(d)端子配列の右側と左側における導電粒子の捕捉性の左右の均一性(端子列Bにおけるシミュレーション)
均一:端子配列において左右対称の距離にある端子で捕捉される導電粒子の分布パターン同士が同一に見える場合
不均一:端子配列において左右対称の距離にある端子で捕捉される導電粒子の分布パターン同士が同一に見えない場合
(異方性導電フィルムの作製)
表3に示した配合で絶縁性樹脂層形成用樹脂組成物及び低粘度樹脂層形成用樹脂組成物を調製し、この樹脂組成物を用いて特許第6187665号の実施例3と同様にして実験例6〜9の異方性導電フィルムを作製した。この場合、絶縁性樹脂層の層厚を4μm、低粘度樹脂層の層厚を14μmとした。導電粒子としては、金属被覆樹脂粒子(積水化学工業(株)、AUL703、平均粒子径3μm)を使用した。
実験例6:図1Kに示した配置(L1=L2=L3:7.5μm、ピッチpa:8.4μm、ひずみ量s:2.1μm、角度α:75°、粒子個数密度:16000個/mm2)。
実験例7:図1Aに示した配置(L1=L2=L3:7.4μm、ピッチpa:8.6μm、ひずみ量s:1.8μm、角度α:76°、粒子個数密度:16000個/mm2)。
実験例8:6方格子で、図5Bに示したようにx方向に対する配列軸の傾斜角が0°(x方向の粒子ピッチ(粒子中心間距離):8.5μm、粒子個数密度:16000個/mm2)。
実験例9:6方格子で、図5Aに示したx方向に対する配列軸の傾斜角γが15°(粒子個数密度:16000個/mm2)。
したがって、実験例6、7が本発明の実施例となる。
実験例6〜9で製造した異方性導電フィルムを用いて、各端子の軸がストレートで同方向にストレートに配列している端子列を有する次の導通評価用ICとガラス基板とを次の熱圧着方法で接続し、各端子における導電粒子の捕捉数を数えた。
外形:0.7×20mm、厚みt=0.2mm
端子幅:14μm
端子長:100μm
端子高さ:12μm
端子間スペース:14μm
ノンアルカリガラス基板
電極:ITO配線
厚み:0.7mm
実験例6〜9の異方性導電フィルムを導通評価用ICとガラス基板との間に挟み、熱圧着ツール(ツール幅1.0mm)で加熱加圧(180℃、60MPa、5秒)し、評価用の接続構造体を得た。この場合、実験例6、7では粒子配置のa方向を端子の配列方向xとした。
実験例6〜9で製造した異方性導電フィルムを用いて、次の仕様のファンアウト型端子配列の導通評価用FPCとガラス基板とを接続試験1と同様の熱圧着方法で接続し、各端子における導電粒子の捕捉数とその捕捉数となった端子の出現割合(頻度)を接続試験1と同様の方法で求めた。結果を図9A〜図9Dに示す。また、実験例6、8、9について、熱圧着後の圧痕写真を図10A〜図10Cに示す。
ポリイミドフィルム(S’perFlex、住友金属鉱山株式会社) フィルム厚:38μm、端子高さ:8μm
測定長(端子測定に用いた長さ):400μm
端子幅:8μm
端子ピッチ:20μm
ファンアウト角度:−9°〜9°
電極:ITO配線
厚み:0.7mm
2 絶縁性樹脂層
3 低粘度樹脂層
10A、10B 異方性導電フィルム
11、11a、11b 第1斜方格子領域
12、12a、12b 第2斜方格子領域
20、20a、20b 端子
A 導電粒子の密集領域
a 配列軸の方向
a1 第1斜方格子領域の配列軸
a2 第2斜方格子領域の配列軸
b 第1斜方格子領域において配列軸aに斜交する配列軸の方向
c 第2斜方格子領域において配列軸aに斜交する配列軸の方向
D 導電粒子の平均粒子径
Lb 埋込量
Ld ずれ量
s ひずみ量
x 端子の配列方向
y a方向に垂直な方向
pa 配列軸aにおける粒子ピッチ
α a方向とb方向とがなす角度
β ファンアウト配列の場合にはファンアウト角、ファンアウト配列でない場合には端子の配列方向と端子の長手方向とがなす角度
γ 6方格子の配列軸のx方向に対する傾斜角
Claims (14)
- 導電粒子が絶縁性樹脂層に配置された異方性導電フィルムであって、
導電粒子が所定ピッチでa方向に配置されている導電粒子の配列軸a1が、a方向と角度αで斜交するb方向に複数配列している第1斜方格子領域と、
導電粒子が所定ピッチでa方向に配置されている導電粒子の配列軸a2が、前記b方向をa方向に対して反転させたc方向に複数配列している第2斜方格子領域とが、繰り返し配置されている異方性導電フィルム。 - a方向と斜交する配列軸について、一方の斜方格子領域の配列軸の延長線が他方の斜方格子領域の配列軸となることなく、第1斜方格子領域と第2斜方格子領域が繰り返し配置される請求項1記載の異方性導電フィルム。
- 第1斜方格子領域と第2斜方格子領域とが交互に繰り返し配置されている請求項1又は2記載の異方性導電フィルム。
- 第1斜方格子領域の配列軸a1と第2斜方格子領域の配列軸a2において、それぞれ導電粒子が一定のピッチで配置されている請求項1〜3のいずれかに記載の異方性導電フィルム。
- 第1斜方格子領域の配列軸a1と第2斜方格子領域の配列軸a2の導電粒子のピッチが等しい請求項4記載の異方性導電フィルム。
- 第1斜方格子領域において隣接する配列軸a1同士の距離L1と、第2斜方格子領域において隣接する配列軸a2同士の距離L2とが等しい請求項1〜5のいずれかに記載の異方性導電フィルム。
- 隣接する第1斜方格子領域の配列軸a1と第2斜方格子領域の配列軸a2において、導電粒子の位置がa方向にずれている請求項3〜6のいずれかに記載の異方性導電フィルム。
- 隣接する第1斜方格子領域の配列軸a1と第2斜方格子領域の配列軸a2における、導電粒子のa方向のずれ量Ldが、導電粒子の平均粒子径より大きい請求項7記載の異方性導電フィルム。
- 第1斜方格子領域における配列軸a1の配列数と第2斜方格子領域における配列軸a2の配列数とが等しい請求項1〜8のいずれかに記載の異方性導電フィルム。
- 第1斜方格子領域における配列軸a1の配列数と第2斜方格子領域における配列軸a2の配列数とが4以下である請求項1〜9のいずれかに記載の異方性導電フィルム。
- 配列軸a1が、異方性導電フィルムの長手方向と平行である、請求項1〜10のいずれかに記載の異方性導電フィルム。
- 第1斜方格子領域と第2斜方格子領域の、a方向に垂直な方向の繰り返しピッチが、接続対象とする端子の端子長以下である請求項3〜11のいずれかに記載の異方性導電フィルム。
- 請求項1〜12のいずれかに記載の異方性導電フィルムを用いて、第1の電子部品の端子と第2の電子部品の端子を異方性導電接続する接続構造体の製造方法。
- 請求項1〜12のいずれかに記載の異方性導電フィルムを介して第1の電子部品と第2の電子部品とが異方性導電接続されている接続構造体。
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