JP2020013892A - 被加工物自動搬送車 - Google Patents
被加工物自動搬送車 Download PDFInfo
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- JP2020013892A JP2020013892A JP2018135227A JP2018135227A JP2020013892A JP 2020013892 A JP2020013892 A JP 2020013892A JP 2018135227 A JP2018135227 A JP 2018135227A JP 2018135227 A JP2018135227 A JP 2018135227A JP 2020013892 A JP2020013892 A JP 2020013892A
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- 230000007246 mechanism Effects 0.000 claims abstract description 67
- 238000001514 detection method Methods 0.000 claims abstract description 36
- 230000032258 transport Effects 0.000 claims description 248
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- 238000000034 method Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 7
- 230000001105 regulatory effect Effects 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D63/00—Motor vehicles or trailers not otherwise provided for
- B62D63/02—Motor vehicles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
- B23Q15/20—Automatic control or regulation of feed movement, cutting velocity or position of tool or work before or after the tool acts upon the workpiece
- B23Q15/22—Control or regulation of position of tool or workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/64—Movable or adjustable work or tool supports characterised by the purpose of the movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62D—MOTOR VEHICLES; TRAILERS
- B62D63/00—Motor vehicles or trailers not otherwise provided for
- B62D63/02—Motor vehicles
- B62D63/04—Component parts or accessories
-
- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/06—Receivers
- H04B1/16—Circuits
Abstract
Description
図1は、本実施形態に係る搬送システム2の構成例を示す平面図であり、図2は、搬送システム2の接続関係の例を示す機能ブロック図である。図1に示すように、本実施形態に係る搬送システム2は、切削装置(加工装置)4によって加工される板状の被加工物11を搬送するための搬送通路6を含んでいる。
本実施形態では、被加工物11とともに切削ブレード82等を搬送の対象とする搬送システムについて説明する。なお、本実施形態に係る搬送システムの基本的な構成は、実施形態1に係る搬送システム2の基本的な構成と同じである。よって、実施形態1の搬送システム2と共通する構成要素には同じ符号を付して詳細な説明を省略する。
本実施形態では、切削装置に対してカセット28(被加工物11)を搬送するための搬送機構が搬送通路に取り付けられている例を説明する。なお、切削装置や搬送通路の基本的な構成は、実施形態1,2と同じである。よって、共通する構成要素には同じ符号を付して詳細な説明を省略する。
4,4a,4b,204,204a,204b,304 切削装置(加工装置)
6 搬送通路
6a,6b,6c 通路モジュール
8,208 ストックユニット
10,10a,10b,10c 被加工物自動搬送車
12 制御ユニット
14 筐体
14a 天井
14b 開口
16 第1カセット支持台
18 カセット(被加工物ストッカー)
20 プッシュプルアーム
22 ガイドレール
24 第2昇降機構
26 第2カセット支持台
28 カセット(搬送用カセット)
30 カセット搬送アーム(被加工物搬送部)
32 制御装置
34 受信機
36 送信機
38 シャシ(被加工物支持部)
38a 凹部
40 車輪(走行機構)
42 制御装置
44a 受信機
44b 送信機
46a 振動検出ユニット
46b カメラユニット
48 基台
48a,48b 開口
48c 配管接続部
50 カセット支持台
80 切削ユニット
82 切削ブレード
92 カバー
92a 天井
92b 開口
92c 扉
96 制御装置
98 受信機
100 送信機
102 通路部
104 ガイド部
106 待機部
108 アングル(ブラケット)
110 連結具
112 ボルト
114 脚部材
114a 基部
114b 柱部
114c 吸着部
114d 開口
132 制御部(制御信号生成部)
134 受信機
136 送信機
206 ブレード自動搬送車
210 ブレードストッカー
212 ブレード搬送アーム(ブレード搬送部)
214 シャシ(ブレード支持部)
214a 凹部
216 ブレードケース
218 車輪(走行機構)
220 制御装置
222a 受信機
222b 送信機
224a 振動検出ユニット
224b カメラユニット
11 被加工物
13 テープ(ダイシングテープ)
15 フレーム
21 配管
Claims (4)
- 複数の加工装置のそれぞれに対して被加工物を搬送する搬送システムに含まれる被加工物自動搬送車であって、
該被加工物を支持する被加工物支持部と、
該被加工物支持部に設けられた走行機構と、
該被加工物支持部の振動を検出して振動データとして記録する振動検出ユニットと、
該搬送システムに含まれる制御ユニットから送信され該加工装置への該被加工物の搬送を指示する制御信号を受信する受信機と、を備えることを特徴とする被加工物自動搬送車。 - 該搬送システムは、複数の該加工装置に渡って該加工装置の真上の空間に設置される搬送通路を備え、該被加工物自動搬送車は、該搬送通路を走行する際の振動を該振動検出ユニットによって検出して振動データとして記録することを特徴とする請求項1に記載の被加工物自動搬送車。
- 周囲の環境又は該搬送通路を撮影して撮影画像を記録するカメラユニットを更に備えることを特徴とする請求項2に記載の被加工物自動搬送車。
- 該振動データ又は該撮影画像を該制御ユニットへ送信する送信機を更に備えることを特徴とする請求項3に記載の被加工物自動搬送車。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018135227A JP7305258B2 (ja) | 2018-07-18 | 2018-07-18 | 搬送システム |
SG10201906210XA SG10201906210XA (en) | 2018-07-18 | 2019-07-03 | Automated workpiece conveying vehicle |
CN201910613908.2A CN110733588B (zh) | 2018-07-18 | 2019-07-09 | 搬运系统 |
TW108124490A TWI816833B (zh) | 2018-07-18 | 2019-07-11 | 搬送系統 |
US16/509,781 US10974359B2 (en) | 2018-07-18 | 2019-07-12 | Automated workpiece conveying vehicle |
KR1020190084494A KR20200010064A (ko) | 2018-07-18 | 2019-07-12 | 피가공물 자동 반송차 |
DE102019210621.8A DE102019210621A1 (de) | 2018-07-18 | 2019-07-18 | Automatisiertes werkstücktransportfahrzeug |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018135227A JP7305258B2 (ja) | 2018-07-18 | 2018-07-18 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020013892A true JP2020013892A (ja) | 2020-01-23 |
JP7305258B2 JP7305258B2 (ja) | 2023-07-10 |
Family
ID=69148432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018135227A Active JP7305258B2 (ja) | 2018-07-18 | 2018-07-18 | 搬送システム |
Country Status (7)
Country | Link |
---|---|
US (1) | US10974359B2 (ja) |
JP (1) | JP7305258B2 (ja) |
KR (1) | KR20200010064A (ja) |
CN (1) | CN110733588B (ja) |
DE (1) | DE102019210621A1 (ja) |
SG (1) | SG10201906210XA (ja) |
TW (1) | TWI816833B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2021166278A (ja) * | 2020-04-08 | 2021-10-14 | 株式会社ディスコ | 切削装置、トレー、及び搬送システム |
JP7438630B2 (ja) | 2020-06-04 | 2024-02-27 | 株式会社ディスコ | 搬送車 |
JP7483311B2 (ja) | 2020-04-02 | 2024-05-15 | 株式会社ディスコ | 搬送システム |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH713047A1 (de) * | 2016-10-14 | 2018-04-30 | K Tron Tech Inc | Verfahren zur Regelung der Vibrationsbewegung eines Vibrationsförderers und einen Vibrationsförderer. |
JP7109863B2 (ja) * | 2018-11-30 | 2022-08-01 | 株式会社ディスコ | 搬送システム |
KR102558590B1 (ko) * | 2020-07-14 | 2023-07-24 | (주)금강오토텍 | 가변 홀더가 구비된 자동 안내 운반차 |
CN113460196B (zh) * | 2021-07-14 | 2022-09-02 | 中国水利水电第十四工程局有限公司 | 一种巡检机器人 |
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JP2006331110A (ja) * | 2005-05-26 | 2006-12-07 | Murata Mach Ltd | 搬送車システム |
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JP2017105586A (ja) * | 2015-12-09 | 2017-06-15 | 株式会社ダイフク | 物品搬送設備 |
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KR940009860B1 (ko) * | 1989-12-08 | 1994-10-18 | 가부시끼가이샤 히다찌세이사꾸쇼 | 자주식 수송기구 |
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DE102019210621A1 (de) | 2020-01-23 |
CN110733588A (zh) | 2020-01-31 |
US10974359B2 (en) | 2021-04-13 |
JP7305258B2 (ja) | 2023-07-10 |
TW202005742A (zh) | 2020-02-01 |
CN110733588B (zh) | 2023-09-19 |
TWI816833B (zh) | 2023-10-01 |
SG10201906210XA (en) | 2020-02-27 |
US20200023484A1 (en) | 2020-01-23 |
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