JP2019537745A5 - - Google Patents
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- JP2019537745A5 JP2019537745A5 JP2019521060A JP2019521060A JP2019537745A5 JP 2019537745 A5 JP2019537745 A5 JP 2019537745A5 JP 2019521060 A JP2019521060 A JP 2019521060A JP 2019521060 A JP2019521060 A JP 2019521060A JP 2019537745 A5 JP2019537745 A5 JP 2019537745A5
- Authority
- JP
- Japan
- Prior art keywords
- array pattern
- defect
- metrology
- pattern
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662410397P | 2016-10-20 | 2016-10-20 | |
| US62/410,397 | 2016-10-20 | ||
| US15/730,551 US10768533B2 (en) | 2016-10-20 | 2017-10-11 | Method and system for generating programmed defects for use in metrology measurements |
| US15/730,551 | 2017-10-11 | ||
| PCT/US2017/057453 WO2018075804A1 (en) | 2016-10-20 | 2017-10-19 | Method and system for generating programmed defects for use in metrology measurements |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019537745A JP2019537745A (ja) | 2019-12-26 |
| JP2019537745A5 true JP2019537745A5 (enExample) | 2020-11-26 |
| JP6906050B2 JP6906050B2 (ja) | 2021-07-21 |
Family
ID=61969578
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019521060A Active JP6906050B2 (ja) | 2016-10-20 | 2017-10-19 | メトロロジー測定に用いるためのプログラムされた欠陥を生成する方法およびシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10768533B2 (enExample) |
| JP (1) | JP6906050B2 (enExample) |
| KR (1) | KR102276923B1 (enExample) |
| CN (1) | CN109964177B (enExample) |
| TW (1) | TWI747973B (enExample) |
| WO (1) | WO2018075804A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3290911A1 (en) * | 2016-09-02 | 2018-03-07 | ASML Netherlands B.V. | Method and system to monitor a process apparatus |
| US10120973B2 (en) | 2017-03-15 | 2018-11-06 | Applied Materials Israel Ltd. | Method of performing metrology operations and system thereof |
| US10296702B2 (en) * | 2017-03-15 | 2019-05-21 | Applied Materials Israel Ltd. | Method of performing metrology operations and system thereof |
| KR102735498B1 (ko) | 2018-12-31 | 2024-11-29 | 에이에스엠엘 네델란즈 비.브이. | 프로세스 제어를 위한 인-다이 계측 방법 및 시스템 |
| CN113508338B (zh) | 2019-02-20 | 2024-08-27 | Asml荷兰有限公司 | 用于表征半导体器件的制造工艺的方法 |
| US11073768B2 (en) * | 2019-06-26 | 2021-07-27 | Kla Corporation | Metrology target for scanning metrology |
| US11914290B2 (en) * | 2019-07-24 | 2024-02-27 | Kla Corporation | Overlay measurement targets design |
| US11231376B2 (en) * | 2019-08-29 | 2022-01-25 | Taiwan Semiconductor Manufacturing Company Ltd. | Method for semiconductor wafer inspection and system thereof |
| EP3923078A1 (en) * | 2020-06-10 | 2021-12-15 | ASML Netherlands B.V. | Heigth measurement method and height measurement system |
| CN117581161A (zh) * | 2021-07-13 | 2024-02-20 | Asml控股股份有限公司 | 具有用于污染物检测和显微镜检查的相控阵列的量测系统 |
| EP4152096A1 (en) * | 2021-09-15 | 2023-03-22 | ASML Netherlands B.V. | System and method for inspection by failure mechanism classification and identification in a charged particle system |
| CN117153820A (zh) * | 2022-05-30 | 2023-12-01 | 三星电子株式会社 | 重叠测量方法及使用该方法制造的半导体器件 |
| KR102970602B1 (ko) * | 2024-03-27 | 2026-06-01 | (주) 오로스테크놀로지 | 오버레이 계측장치 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003315284A (ja) * | 2002-04-24 | 2003-11-06 | Mitsubishi Electric Corp | パターン検査装置の感度調整方法 |
| US7557910B2 (en) | 2004-12-19 | 2009-07-07 | Kla-Tencor Corporation | System and method for controlling a beam source in a workpiece surface inspection system |
| KR20060084922A (ko) * | 2005-01-21 | 2006-07-26 | 삼성전자주식회사 | 오버레이 측정 장치의 보정 방법 |
| US7916927B2 (en) | 2007-01-16 | 2011-03-29 | Asml Netherlands B.V. | Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method |
| WO2010020331A1 (en) | 2008-08-19 | 2010-02-25 | Asml Netherlands B.V. | A method of measuring overlay error and a device manufacturing method |
| CN101650534B (zh) * | 2009-07-24 | 2012-12-12 | 上海宏力半导体制造有限公司 | 测量曝光机台焦平面均匀度的方法 |
| CN102483582B (zh) * | 2009-08-24 | 2016-01-20 | Asml荷兰有限公司 | 量测方法和设备、光刻设备、光刻处理单元和包括量测目标的衬底 |
| KR101492205B1 (ko) * | 2010-11-12 | 2015-02-10 | 에이에스엠엘 네델란즈 비.브이. | 메트롤로지 방법 및 장치, 리소그래피 시스템, 및 디바이스 제조 방법 |
| US9709903B2 (en) * | 2011-11-01 | 2017-07-18 | Kla-Tencor Corporation | Overlay target geometry for measuring multiple pitches |
| NL2010717A (en) * | 2012-05-21 | 2013-11-25 | Asml Netherlands Bv | Determining a structural parameter and correcting an asymmetry property. |
| US9214317B2 (en) * | 2013-06-04 | 2015-12-15 | Kla-Tencor Corporation | System and method of SEM overlay metrology |
| US9347862B2 (en) * | 2013-08-06 | 2016-05-24 | Kla-Tencor Corp. | Setting up a wafer inspection process using programmed defects |
| US10267746B2 (en) * | 2014-10-22 | 2019-04-23 | Kla-Tencor Corp. | Automated pattern fidelity measurement plan generation |
-
2017
- 2017-10-11 US US15/730,551 patent/US10768533B2/en active Active
- 2017-10-19 WO PCT/US2017/057453 patent/WO2018075804A1/en not_active Ceased
- 2017-10-19 CN CN201780064585.5A patent/CN109964177B/zh active Active
- 2017-10-19 JP JP2019521060A patent/JP6906050B2/ja active Active
- 2017-10-19 KR KR1020197014227A patent/KR102276923B1/ko active Active
- 2017-10-20 TW TW106136028A patent/TWI747973B/zh active
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