JP2019534245A - 5族金属化合物、その製造方法、それを含む膜蒸着用前駆体組成物、及びそれを用いる膜の蒸着方法 - Google Patents
5族金属化合物、その製造方法、それを含む膜蒸着用前駆体組成物、及びそれを用いる膜の蒸着方法 Download PDFInfo
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- JP2019534245A JP2019534245A JP2019511918A JP2019511918A JP2019534245A JP 2019534245 A JP2019534245 A JP 2019534245A JP 2019511918 A JP2019511918 A JP 2019511918A JP 2019511918 A JP2019511918 A JP 2019511918A JP 2019534245 A JP2019534245 A JP 2019534245A
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- 150000002736 metal compounds Chemical class 0.000 title claims abstract description 42
- 238000000151 deposition Methods 0.000 title claims abstract description 32
- 239000002243 precursor Substances 0.000 title claims abstract description 32
- 239000000203 mixture Substances 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 230000008021 deposition Effects 0.000 title abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 53
- 239000002184 metal Substances 0.000 claims abstract description 53
- 238000000034 method Methods 0.000 claims abstract description 29
- 150000001875 compounds Chemical class 0.000 claims description 40
- 125000004432 carbon atom Chemical group C* 0.000 claims description 30
- 238000000231 atomic layer deposition Methods 0.000 claims description 29
- 125000000217 alkyl group Chemical group 0.000 claims description 24
- 229910052715 tantalum Inorganic materials 0.000 claims description 23
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 21
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 18
- 229910052739 hydrogen Inorganic materials 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 17
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 16
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 16
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 claims description 15
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 15
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 15
- 229910052758 niobium Inorganic materials 0.000 claims description 15
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 15
- 238000005229 chemical vapour deposition Methods 0.000 claims description 14
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 11
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 claims description 7
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 7
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 7
- 125000003538 pentan-3-yl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])[H] 0.000 claims description 7
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 claims description 7
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 7
- 238000007740 vapor deposition Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 239000012528 membrane Substances 0.000 claims description 3
- 150000002431 hydrogen Chemical class 0.000 claims 2
- 239000010408 film Substances 0.000 description 74
- 239000010955 niobium Substances 0.000 description 29
- 238000002411 thermogravimetry Methods 0.000 description 25
- 239000010409 thin film Substances 0.000 description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 239000007788 liquid Substances 0.000 description 18
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 15
- 238000000113 differential scanning calorimetry Methods 0.000 description 14
- 239000007789 gas Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 239000007787 solid Substances 0.000 description 11
- 229910001936 tantalum oxide Inorganic materials 0.000 description 10
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 239000007983 Tris buffer Substances 0.000 description 8
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 7
- 238000004458 analytical method Methods 0.000 description 7
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 7
- 238000005160 1H NMR spectroscopy Methods 0.000 description 6
- TXKGXBLVMXQSFO-UHFFFAOYSA-N 2-cyclopenta-2,4-dien-1-yl-n-methylethanamine Chemical compound CNCCC1C=CC=C1 TXKGXBLVMXQSFO-UHFFFAOYSA-N 0.000 description 6
- 238000009835 boiling Methods 0.000 description 6
- 238000000921 elemental analysis Methods 0.000 description 6
- 239000012495 reaction gas Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- UZBQIPPOMKBLAS-UHFFFAOYSA-N diethylazanide Chemical compound CC[N-]CC UZBQIPPOMKBLAS-UHFFFAOYSA-N 0.000 description 5
- JWZZKOKVBUJMES-UHFFFAOYSA-N (+-)-Isoprenaline Chemical compound CC(C)NCC(O)C1=CC=C(O)C(O)=C1 JWZZKOKVBUJMES-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910000484 niobium oxide Inorganic materials 0.000 description 3
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- -1 4,4-dimethylpentyl group Chemical group 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- CFJRGWXELQQLSA-UHFFFAOYSA-N azanylidyneniobium Chemical compound [Nb]#N CFJRGWXELQQLSA-UHFFFAOYSA-N 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 229940126214 compound 3 Drugs 0.000 description 2
- 229940125898 compound 5 Drugs 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- DIIIISSCIXVANO-UHFFFAOYSA-N 1,2-Dimethylhydrazine Chemical compound CNNC DIIIISSCIXVANO-UHFFFAOYSA-N 0.000 description 1
- YZHQWZURESVKOE-UHFFFAOYSA-N CCN(CC)[Ta](N(CC)CC)N(CC)CC Chemical compound CCN(CC)[Ta](N(CC)CC)N(CC)CC YZHQWZURESVKOE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 229940125904 compound 1 Drugs 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004491 isohexyl group Chemical group C(CCC(C)C)* 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 238000005092 sublimation method Methods 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic System
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F17/00—Metallocenes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45553—Atomic layer deposition [ALD] characterized by the use of precursors specially adapted for ALD
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02183—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing tantalum, e.g. Ta2O5
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
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Abstract
Description
(Cp(CH2)2N(CH3))(tBuN)Ta(NEt2)の製造
火炎乾燥した500mLのシュレンクフラスコにおいて、トリス(ジエチルアミド)(tert−ブチルイミド)タンタル[(tBuN)Ta(NEt2)3)]29g(0.062mol、1当量)とトルエン(toluene)150mLを入れた後、室温で攪拌した。前記フラスコにシクロペンタジエニルエチルメチルアミン[Cp(CH2)2NH(CH3)]7.6g(0.062mol、1当量)を室温で滴加した後、反応溶液を60℃まで昇温させて4時間攪拌した。反応溶液を、減圧下において溶媒を除去し、減圧下において蒸溜することにより下記化合物1で表される浅黄色の液体化合物19g(収率69%)を収得した。下記化合物1で表される化合物の熱重量分析(TGA)及び示差走査熱量測定(DSC)結果は、それぞれ図1及び図2に示した。
元素分析(elemental analysis)計算値(C16H30N3Ta):C43.15、H6.79、N9.43;
実測値C42.99、H6.81、N9.49;
1H−NMR(400MHz、C6D6、25℃)δ5.967、5.839、5.702、5.654(m、4H、C5H4(CH2)2N(CH3))、δ4.275、3.687、2.434、2.361(m、4H、C5H4(CH2)2N(CH3))、δ3.536(m、4H、N(CH2CH3)2)、δ3.389(s、3HC5H4(CH2)2N(CH3))、δ1.312(s、9H、NC(CH3)3)、δ1.126(t、6H、N(CH2CH3)2)
(Cp(CH2)2N(CH3))(tBuN)Ta(NEtMe)の製造
火炎乾燥した1Lのシュレンクフラスコにおいて、トリス(エチルメチルアミド)(tert−ブチルイミド)タンタル[(tBuN)Ta(NEtMe)3)]100g(0.235mol、1当量)とトルエン(toluene)300mLを入れた後、室温で攪拌した。前記フラスコにシクロペンタジエニルエチルメチルアミン[Cp(CH2)2NH(CH3)]28.7g(0.235mol、1当量)を室温で滴加した後、反応溶液を60℃まで昇温させて4時間攪拌した。反応溶液を、減圧下において溶媒を除去し、減圧下において蒸溜することにより下記化合物2で表される浅黄色の液体化合物66g(収率65%)を収得した。下記化合物2で表される化合物の熱重量分析(TGA)及び示差走査熱量測定(DSC)結果は、それぞれ図3及び図4に示した。
元素分析(elemental analysis)計算値(C15H28N3Ta):C41.77、H6.54、N9.74;
実測値C41.39、H6.61、N9.69;
1H−NMR(400MHz、C6D6、25℃)δ5.977、5.832、5.734、5.632(m、4H、C5H4(CH2)2N(CH3))、δ4.249、3.704、2.441、2.358(m、4H、C5H4(CH2)2N(CH3))、δ3.645(m、2H、N(CH2CH3)(CH3))、δ3.407(s、3H、C5H4(CH2)2N(CH3))、δ3.260(s、3H、N(CH2CH3)(CH3))、δ1.315(s、9H、NC(CH3)3)、δ1.156(t、3H、N(CH2CH3)(CH3))
(Cp(CH2)2N(CH3))(tBuN)Ta(NMe2)の製造
火炎乾燥した500mLのシュレンクフラスコにおいて、トリス(ジエチルアミド)(tert−ブチルイミド)タンタル[(tBuN)Ta(NMe2)3)]100g(0.260mol、1当量)とトルエン(toluene)300mLを入れた後、室温で攪拌した。前記フラスコにシクロペンタジエニルエチルメチルアミン[Cp(CH2)2NH(CH3)]32.1g(0.260mol、1当量)を室温で滴加した後、反応溶液を60℃まで昇温させて4時間攪拌した。反応溶液を、減圧下において溶媒を除去し、減圧下において蒸溜することにより下記化合物3で表される浅黄色の液体化合物77g(収率71%)を収得した。下記化合物3で表される化合物の熱重量分析(TGA)及び示差走査熱量測定(DSC)結果は、それぞれ図5及び図6に示した。
元素分析(elemental analysis)計算値(C14H26N3Ta):C40.29、H6.28、N10.07;
実測値C40.39、H6.31、N10.03;
1H−NMR(400MHz、C6D6、25℃)δ5.958、5.826、5.739、5.598(m、4H、C5H4(CH2)2N(CH3))、δ4.273、3.695、2.450、2.350(m、4H、C5H4(CH2)2N(CH3))、δ3.429(s、3H、C5H4(CH2)2N(CH3))、δ3.390(s、6H、N(CH3)2)、δ1.331(s、9H、NC(CH3)3)
(Cp(CH2)2N(CH3))(tBuN)Nb(NEt2)の製造
火炎乾燥した500mLのシュレンクフラスコにおいて、トリス(ジエチルアミド)(tert−ブチルイミド)タンタル[(tBuN)Nb(NEt2)3)]100g(0.263mol、1当量)とトルエン(toluene)300mLを入れた後、室温で攪拌した。前記フラスコにシクロペンタジエニルエチルメチルアミン[Cp(CH2)2NH(CH3)]32.4g(0.263mol、1当量)を室温で滴加した後、反応溶液を60℃まで昇温させて4時間攪拌した。反応溶液を、減圧下において溶媒を除去し、減圧下において蒸溜することにより下記化合物4で表される浅黄色の液体化合物64g(収率68%)を収得した。下記化合物4で表される化合物の熱重量分析(TGA)及び示差走査熱量測定(DSC)結果は、それぞれ図7及び図8に示した。
元素分析(elemental analysis)計算値(C16H30N3Nb):C53.78、H8.46、N11.76;
実測値C53.65、H8.51、N11.81;
1H−NMR(400MHz、C6D6、25℃)δ5.981、5.813、5.728、5.698(m、4H、C5H4(CH2)2N(CH3))、δ4.134、3.594、2.508、2.389(m、4H、C5H4(CH2)2N(CH3))、δ3.530(m、4H、N(CH2CH3)2)、δ3.386(s、3H、C5H4(CH2)2N(CH3))、δ1.261(s、9H、NC(CH3)3)、δ1.133(t、6H、N(CH2CH3)2)
(Cp(CH2)2N(CH3))(tBuN)Nb(NEtMe)の製造
火炎乾燥した500mLのシュレンクフラスコにおいて、トリス(ジエチルアミド)(tert−ブチルイミド)タンタル[(tBuN)Nb(NEtMe)3)]100g(0.296mol、1当量)とトルエン(toluene)300mLを入れた後、室温で攪拌した。前記フラスコにシクロペンタジエニルエチルメチルアミン[Cp(CH2)2NH(CH3)]36.4g(0.296mol、1当量)を室温で滴加した後、反応溶液を60℃まで昇温させて4時間攪拌した。反応溶液を、減圧下において溶媒を除去し、減圧下において蒸溜することにより下記化合物5で表される浅黄色の液体化合物65g(収率64%)を収得した。下記化合物5で表される化合物の熱重量分析(TGA)及び示差走査熱量測定(DSC)結果は、それぞれ図9及び図10に示した。
元素分析(elemental analysis)計算値(C15H28N3Nb):C52.48、H8.22、N12.24;
実測値C52.39、H8.27、N12.21;
1H−NMR(400MHz、C6D6、25℃)δ5.980、5.812、5.719、5.708(m、4H、C5H4(CH2)2N(CH3))、δ4.149、3.632、2.515、2.404(m、4H、C5H4(CH2)2N(CH3))、δ3.588(m、2H、N(CH2CH3)(CH3))、δ3.405(s、3HC5H4(CH2)2N(CH3))、δ3.223(s、3H、N(CH2CH3)(CH3))、δ1.268(s、9H、NC(CH3)3)、δ1.157(t、3H、N(CH2CH3)(CH3))
(Cp(CH2)2N(CH3))(tBuN)Nb(NMe2)の製造
火炎乾燥した500mLのシュレンクフラスコにおいて、トリス(ジエチルアミド)(tert−ブチルイミド)タンタル[(tBuN)Nb(NMe2)3)]100g(0.337mol、1当量)とトルエン(toluene)300mLを入れた後、室温で攪拌した。前記フラスコにシクロペンタジエニルエチルメチルアミン[Cp(CH2)2NH(CH3)]41.6g(0.337mol、1当量)を室温で滴加した後、反応溶液を60℃まで昇温させて4時間攪拌した。反応溶液を、減圧下において溶媒を除去し、減圧下において蒸溜することにより下記化合物6で表される浅黄色の液体化合物70g(収率63%)を収得した。下記化合物6で表される化合物の熱重量分析(TGA)及び示差走査熱量測定(DSC)結果は、それぞれ図11及び図12に示した。
元素分析(elemental analysis)計算値(C14H26N3Nb):C51.07、H7.96、N12.76;
実測値C52.01、H7.92、N12.81;
1H−NMR(400MHz、C6D6、25℃)δ5.976、5.811、5.746、5.679(m、4H、C5H4(CH2)2N(CH3))、δ4.188、3.607、2.530、2.413(m、4H、C5H4(CH2)2N(CH3))、δ3.416(s、3HC5H4(CH2)2N(CH3))、δ3.325(s、6H、N(CH3)2)、δ1.275(s、9H、NC(CH3)3)
(Cp(CH2)2N(CH3))(tBuN)Ta(NEt2)、(Cp(CH2)2N(CH3))(tBuN)Ta(NEtMe)、及び(Cp(CH2)2N(CH3))(tBuN)Ta(NMe2)化合物とオゾン(O3)気体を使用した原子層蒸着法によるタンタル酸化膜の形成
実施例1〜3により製造した化合物を前駆体として使用し、オゾン(O3)気体を使用した原子層蒸着法(ALD)を用いてタンタル酸化膜を形成する実験を実施した。このとき、基材としてシリコン(Si)ウェハを使用した。前記基材は、300℃〜350℃に加熱した。また、ステンレス鋼材質の容器に入れた前駆体化合物は100℃の温度に加熱し、60sccm流速のアルゴン(Ar)ガスを前記容器に通過させることによって、前記前駆体化合物を原子層蒸着法を行うためのALD反応器に供給した。前記ALD反応器の内部圧力は3torrに維持された。前記ALD反応器に前記前駆体化合物気体を5秒間供給し、その後にアルゴン気体を5秒間供給し、その後にオゾン(O3)気体を5秒間供給し、その後に再びアルゴン気体を5秒間供給する原子層蒸着周期を200回繰り返した。前記工程により形成されたそれぞれのタンタル酸化物薄膜の1周期当たりの厚さを図13に示した。図13に示されたように、基材温度300℃〜350℃の範囲でALD原料供給周期当たりの膜成長が略一定であることが分かった。
tert−ブチルイミドトリ(ジエチルアミド)タンタル[(tBuN)Ta(NEt2)3、TBTDET]化合物とオゾン(O3)気体を使用した原子層蒸着法によるタンタル酸化膜の形成
TBTDET化合物を前駆体として使用し、ステンレス鋼材質の容器に入れた前駆体化合物は、70℃の温度に加熱したことを除いては実施例7と同じ条件で原子層蒸着法によりタンタル酸化膜を形成した。基材温度による原子層蒸着法の膜成長を図13に示した。実施例7の結果とは異なり、TBTDETを使用した原子層蒸着法においては、より高い基材温度で膜成長がより大きかった。これは、325℃又は350℃でTBTDETの熱分解によってより厚い膜が形成されるためであり、熱分解が起これば、325℃又は350℃で縦横比の非常に大きいパターンに所定厚さのタンタル酸化膜を形成することができない。
Claims (12)
- 下記化学式1で表される、5族金属化合物:
Mは、Ta又はNbであり、
R1、R2、R3、及びR4は、それぞれ独立に、水素又は炭素数1〜4の線状又は分枝状のアルキル基であり、
R5は、炭素数3〜6の線状又は分枝状のアルキル基であり、
R6、R7、及びR8は、それぞれ独立に、炭素数1〜4の線状又は分枝状のアルキル基であり、
nは、1〜4の整数である。 - 前記R1、R2、R3、及びR4は、それぞれ独立に、水素、メチル基、又はエチル基である、請求項1に記載の5族金属化合物。
- 前記R5は、n−プロピル基、iso−プロピル基、n−ブチル基、tert−ブチル基、iso−ブチル基、sec−ブチル基、n−ペンチル基、tert−ペンチル基、iso−ペンチル基、sec−ペンチル基、ネオペンチル基、又は3−ペンチル基である、請求項1に記載の5族金属化合物。
- 前記R6、R7、及びR8は、それぞれ独立に、メチル基又はエチル基である、請求項1に記載の5族金属化合物。
- 下記化学式2で表される(R5N=)M(NR6R7)3化合物に下記化学式3で表されるR1R2R3R4Cp(CH2)nNHR8化合物を添加して反応させることを含む、下記化学式1で表される5族金属化合物の製造方法。
Mは、Ta又はNbであり、
R1、R2、R3、及びR4は、それぞれ独立に、水素又は炭素数1〜4の線状又は分枝状のアルキル基であり、
R5は、炭素数3〜6の線状又は分枝状のアルキル基であり、
R6、R7、及びR8は、それぞれ独立に、炭素数1〜4の線状又は分枝状のアルキル基であり、
nは、1〜4の整数である。 - 前記R1、R2、R3、及びR4は、それぞれ独立に、水素、メチル基、又はエチル基である、請求項5に記載の5族金属化合物の製造方法。
- 前記R5は、n−プロピル基、iso−プロピル基、n−ブチル基、tert−ブチル基、iso−ブチル基、sec−ブチル基、n−ペンチル基、tert−ペンチル基、iso−ペンチル基、sec−ペンチル基、ネオペンチル基、又は3−ペンチル基である、請求項5に記載の5族金属化合物の製造方法。
- 前記R6、R7、及びR8は、それぞれ独立に、メチル基又はエチル基である、請求項5に記載の5族金属化合物の製造方法。
- 請求項1から4の何れか一項に記載の5族金属化合物を含む、5族金属含有膜蒸着用前駆体組成物。
- 請求項9に記載の5族金属含有膜蒸着用前駆体組成物を用いて基材上に5族金属含有膜を形成することを含む、5族金属含有膜の蒸着方法。
- 前記5族金属含有膜は、化学気相蒸着法又は原子層蒸着法によって蒸着される、請求項10に記載の5族金属含有膜の蒸着方法。
- 前記基材は、その表面に形成された凹凸を含む、請求項10に記載の5族金属含有膜の蒸着方法。
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