JP2019527468A5 - - Google Patents
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- Publication number
- JP2019527468A5 JP2019527468A5 JP2018567886A JP2018567886A JP2019527468A5 JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5 JP 2018567886 A JP2018567886 A JP 2018567886A JP 2018567886 A JP2018567886 A JP 2018567886A JP 2019527468 A5 JP2019527468 A5 JP 2019527468A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing composition
- compounds
- cobalt
- oxidizing agent
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 44
- 239000000203 mixture Substances 0.000 claims 39
- -1 hydroxylamine compound Chemical class 0.000 claims 22
- 238000000034 method Methods 0.000 claims 19
- 229910017052 cobalt Inorganic materials 0.000 claims 16
- 239000010941 cobalt Substances 0.000 claims 16
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 16
- 239000007800 oxidant agent Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 8
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 claims 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 150000001412 amines Chemical class 0.000 claims 4
- 238000005260 corrosion Methods 0.000 claims 4
- 230000007797 corrosion Effects 0.000 claims 4
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 claims 4
- 125000000623 heterocyclic group Chemical group 0.000 claims 4
- 239000003112 inhibitor Substances 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- 239000006061 abrasive grain Substances 0.000 claims 3
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 claims 2
- QZTKDVCDBIDYMD-UHFFFAOYSA-N 2,2'-[(2-amino-2-oxoethyl)imino]diacetic acid Chemical compound NC(=O)CN(CC(O)=O)CC(O)=O QZTKDVCDBIDYMD-UHFFFAOYSA-N 0.000 claims 2
- JKMHFZQWWAIEOD-UHFFFAOYSA-N 2-[4-(2-hydroxyethyl)piperazin-1-yl]ethanesulfonic acid Chemical compound OCC[NH+]1CCN(CCS([O-])(=O)=O)CC1 JKMHFZQWWAIEOD-UHFFFAOYSA-N 0.000 claims 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 claims 2
- 239000004471 Glycine Substances 0.000 claims 2
- FSVCELGFZIQNCK-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)glycine Chemical compound OCCN(CCO)CC(O)=O FSVCELGFZIQNCK-UHFFFAOYSA-N 0.000 claims 2
- 150000003973 alkyl amines Chemical class 0.000 claims 2
- 150000001413 amino acids Chemical class 0.000 claims 2
- 125000004408 aryl N-oxide group Chemical group 0.000 claims 2
- 239000007998 bicine buffer Substances 0.000 claims 2
- 150000001735 carboxylic acids Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 150000001991 dicarboxylic acids Chemical class 0.000 claims 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical group OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M nitrite group Chemical group N(=O)[O-] IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 claims 2
- 150000002826 nitrites Chemical class 0.000 claims 2
- 150000002828 nitro derivatives Chemical class 0.000 claims 2
- 150000002832 nitroso derivatives Chemical class 0.000 claims 2
- 229940081066 picolinic acid Drugs 0.000 claims 2
- KZVLNAGYSAKYMG-UHFFFAOYSA-N pyridine-2-sulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=N1 KZVLNAGYSAKYMG-UHFFFAOYSA-N 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 150000003628 tricarboxylic acids Chemical class 0.000 claims 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022064299A JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662362222P | 2016-07-14 | 2016-07-14 | |
| US62/362,222 | 2016-07-14 | ||
| PCT/US2017/041988 WO2018013847A1 (en) | 2016-07-14 | 2017-07-13 | Alternative oxidizing agents for cobalt cmp |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Division JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019527468A JP2019527468A (ja) | 2019-09-26 |
| JP2019527468A5 true JP2019527468A5 (https=) | 2020-08-06 |
| JP7253924B2 JP7253924B2 (ja) | 2023-04-07 |
Family
ID=60942463
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018567886A Active JP7253924B2 (ja) | 2016-07-14 | 2017-07-13 | コバルトｃｍｐ用の代替的な酸化剤 |
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064299A Withdrawn JP2022097502A (ja) | 2016-07-14 | 2022-04-08 | コバルトｃｍｐ用の代替的な酸化剤 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11851584B2 (https=) |
| EP (1) | EP3484971B1 (https=) |
| JP (2) | JP7253924B2 (https=) |
| KR (3) | KR20190018751A (https=) |
| CN (1) | CN109415599B (https=) |
| TW (1) | TWI660017B (https=) |
| WO (1) | WO2018013847A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020066786A1 (ja) * | 2018-09-28 | 2020-04-02 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| JP7326048B2 (ja) * | 2018-09-28 | 2023-08-15 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| EP4045226B1 (en) * | 2019-10-15 | 2024-01-03 | FUJIFILM Electronic Materials U.S.A., Inc. | Polishing compositions and methods of use thereof |
| JP7803675B2 (ja) * | 2020-10-05 | 2026-01-21 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| JP3507628B2 (ja) * | 1996-08-06 | 2004-03-15 | 昭和電工株式会社 | 化学的機械研磨用研磨組成物 |
| MY144587A (en) * | 2001-06-21 | 2011-10-14 | Kao Corp | Polishing composition |
| US7029373B2 (en) | 2001-08-14 | 2006-04-18 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| US6692546B2 (en) | 2001-08-14 | 2004-02-17 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for metal and associated materials and method of using same |
| IL154782A0 (en) * | 2003-03-06 | 2003-10-31 | J G Systems Inc | Chemical-mechanical polishing composition containing organic nitro compounds |
| US7736405B2 (en) | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
| JP2005056879A (ja) | 2003-08-01 | 2005-03-03 | Tosoh Corp | 銅系金属用研磨液及び研磨方法 |
| KR101332302B1 (ko) | 2005-06-06 | 2013-11-25 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 단일 플래튼 처리를 위한 방법 및 일체형 화학적 기계적연마 조성물 |
| KR20080033514A (ko) | 2005-08-05 | 2008-04-16 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 금속막 평탄화를 위한 고 처리량의 화학적 기계적 연마조성물 |
| WO2007044446A1 (en) * | 2005-10-05 | 2007-04-19 | Advanced Technology Materials, Inc. | Oxidizing aqueous cleaner for the removal of post-etch residues |
| US7732393B2 (en) | 2006-03-20 | 2010-06-08 | Cabot Microelectronics Corporation | Oxidation-stabilized CMP compositions and methods |
| JP5646996B2 (ja) | 2007-09-21 | 2014-12-24 | キャボット マイクロエレクトロニクス コーポレイション | 研磨組成物およびアミノシランを用いて処理された研削剤粒子の使用方法 |
| KR102105381B1 (ko) | 2012-02-15 | 2020-04-29 | 엔테그리스, 아이엔씨. | 조성물을 이용한 cmp-후 제거 방법 및 그의 이용 방법 |
| US8999193B2 (en) * | 2012-05-10 | 2015-04-07 | Air Products And Chemicals, Inc. | Chemical mechanical polishing composition having chemical additives and methods for using same |
| US10217645B2 (en) | 2014-07-25 | 2019-02-26 | Versum Materials Us, Llc | Chemical mechanical polishing (CMP) of cobalt-containing substrate |
| US9735030B2 (en) * | 2014-09-05 | 2017-08-15 | Fujifilm Planar Solutions, LLC | Polishing compositions and methods for polishing cobalt films |
| US9688885B2 (en) | 2014-10-21 | 2017-06-27 | Cabot Microelectronics Corporation | Cobalt polishing accelerators |
| US9944828B2 (en) * | 2014-10-21 | 2018-04-17 | Cabot Microelectronics Corporation | Slurry for chemical mechanical polishing of cobalt |
| CN107075310B (zh) | 2014-10-21 | 2019-04-02 | 嘉柏微电子材料股份公司 | 钴凹陷控制剂 |
| WO2016065057A1 (en) | 2014-10-21 | 2016-04-28 | Cabot Microelectronics Corporation | Corrosion inhibitors and related compositions and methods |
| US9978609B2 (en) * | 2015-04-27 | 2018-05-22 | Versum Materials Us, Llc | Low dishing copper chemical mechanical planarization |
| US9528030B1 (en) * | 2015-10-21 | 2016-12-27 | Cabot Microelectronics Corporation | Cobalt inhibitor combination for improved dishing |
-
2017
- 2017-07-12 TW TW106123275A patent/TWI660017B/zh active
- 2017-07-13 KR KR1020197004126A patent/KR20190018751A/ko not_active Ceased
- 2017-07-13 US US15/649,378 patent/US11851584B2/en active Active
- 2017-07-13 WO PCT/US2017/041988 patent/WO2018013847A1/en not_active Ceased
- 2017-07-13 EP EP17828487.3A patent/EP3484971B1/en active Active
- 2017-07-13 KR KR1020237002200A patent/KR20230014887A/ko not_active Ceased
- 2017-07-13 CN CN201780041554.8A patent/CN109415599B/zh active Active
- 2017-07-13 JP JP2018567886A patent/JP7253924B2/ja active Active
- 2017-07-13 KR KR1020247040827A patent/KR20250005498A/ko active Pending
-
2022
- 2022-04-08 JP JP2022064299A patent/JP2022097502A/ja not_active Withdrawn
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