CN109415599B - 用于钴化学机械抛光的替代性氧化剂 - Google Patents

用于钴化学机械抛光的替代性氧化剂 Download PDF

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Publication number
CN109415599B
CN109415599B CN201780041554.8A CN201780041554A CN109415599B CN 109415599 B CN109415599 B CN 109415599B CN 201780041554 A CN201780041554 A CN 201780041554A CN 109415599 B CN109415599 B CN 109415599B
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CN
China
Prior art keywords
polishing composition
cobalt
polishing
substrate
oxidizing agent
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CN201780041554.8A
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English (en)
Chinese (zh)
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CN109415599A (zh
Inventor
S.克拉夫特
P.W.卡特
A.R.沃尔夫
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CMC Materials LLC
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Cabot Microelectronics Corp
CMC Materials LLC
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Publication of CN109415599A publication Critical patent/CN109415599A/zh
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/062—Manufacture or treatment of conductive parts of the interconnections by smoothing of conductive parts, e.g. by planarisation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201780041554.8A 2016-07-14 2017-07-13 用于钴化学机械抛光的替代性氧化剂 Active CN109415599B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662362222P 2016-07-14 2016-07-14
US62/362,222 2016-07-14
PCT/US2017/041988 WO2018013847A1 (en) 2016-07-14 2017-07-13 Alternative oxidizing agents for cobalt cmp

Publications (2)

Publication Number Publication Date
CN109415599A CN109415599A (zh) 2019-03-01
CN109415599B true CN109415599B (zh) 2022-09-27

Family

ID=60942463

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780041554.8A Active CN109415599B (zh) 2016-07-14 2017-07-13 用于钴化学机械抛光的替代性氧化剂

Country Status (7)

Country Link
US (1) US11851584B2 (https=)
EP (1) EP3484971B1 (https=)
JP (2) JP7253924B2 (https=)
KR (3) KR20190018751A (https=)
CN (1) CN109415599B (https=)
TW (1) TWI660017B (https=)
WO (1) WO2018013847A1 (https=)

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WO2020066786A1 (ja) * 2018-09-28 2020-04-02 花王株式会社 酸化珪素膜用研磨液組成物
JP7326048B2 (ja) * 2018-09-28 2023-08-15 花王株式会社 酸化珪素膜用研磨液組成物
EP4045226B1 (en) * 2019-10-15 2024-01-03 FUJIFILM Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof
JP7803675B2 (ja) * 2020-10-05 2026-01-21 花王株式会社 酸化珪素膜用研磨液組成物

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CN104508072A (zh) * 2012-02-15 2015-04-08 安格斯公司 用于cmp后去除的组合物及使用方法
WO2016065060A1 (en) * 2014-10-21 2016-04-28 Cabot Microelectronics Corporation Cobalt polishing accelerators

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US5872633A (en) 1996-07-26 1999-02-16 Speedfam Corporation Methods and apparatus for detecting removal of thin film layers during planarization
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CN104508072A (zh) * 2012-02-15 2015-04-08 安格斯公司 用于cmp后去除的组合物及使用方法
WO2016065060A1 (en) * 2014-10-21 2016-04-28 Cabot Microelectronics Corporation Cobalt polishing accelerators

Also Published As

Publication number Publication date
EP3484971A4 (en) 2020-02-26
TWI660017B (zh) 2019-05-21
KR20230014887A (ko) 2023-01-30
TW201807119A (zh) 2018-03-01
KR20250005498A (ko) 2025-01-09
JP7253924B2 (ja) 2023-04-07
US11851584B2 (en) 2023-12-26
US20180016469A1 (en) 2018-01-18
JP2022097502A (ja) 2022-06-30
EP3484971A1 (en) 2019-05-22
CN109415599A (zh) 2019-03-01
EP3484971B1 (en) 2025-08-27
WO2018013847A1 (en) 2018-01-18
KR20190018751A (ko) 2019-02-25
JP2019527468A (ja) 2019-09-26

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