JP2019522381A - 複数の積層圧電素子を製造する方法 - Google Patents
複数の積層圧電素子を製造する方法 Download PDFInfo
- Publication number
- JP2019522381A JP2019522381A JP2019516066A JP2019516066A JP2019522381A JP 2019522381 A JP2019522381 A JP 2019522381A JP 2019516066 A JP2019516066 A JP 2019516066A JP 2019516066 A JP2019516066 A JP 2019516066A JP 2019522381 A JP2019522381 A JP 2019522381A
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- Prior art keywords
- piezoelectric element
- laminated piezoelectric
- laminated
- polishing
- abrasive
- Prior art date
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 48
- 239000000463 material Substances 0.000 claims abstract description 43
- 238000005498 polishing Methods 0.000 claims description 36
- 238000005496 tempering Methods 0.000 claims description 21
- 239000011230 binding agent Substances 0.000 claims description 11
- 239000002904 solvent Substances 0.000 claims description 4
- 239000012736 aqueous medium Substances 0.000 claims description 2
- 230000005684 electric field Effects 0.000 description 10
- 238000007517 polishing process Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 239000007788 liquid Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 239000003082 abrasive agent Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000004902 Softening Agent Substances 0.000 description 2
- 239000002609 medium Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
- H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
- H10N30/505—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view the cross-section being annular
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
- H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Compositions Of Oxide Ceramics (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
2 入力領域
3 出力領域
4 電極
5 圧電材料
6 第1側面
7 第2側面
8 第1外部電極
9 圧電材料
10 出力側端面
20 第3側面
21 第4側面
22 入力側端面
23 稜線
24 研磨粒子
x 積層方向
y y方向
z 長手方向
Claims (9)
- 研磨剤を添加せずに積層圧電素子(1)を研磨し、前記積層圧電素子(1)同士の摩擦により、前記積層圧電素子(1)からの材料の研磨除去を行う複数の積層圧電素子(1)を製造する方法。
- 前記積層圧電素子(1)をグリーン体として研磨し、研磨後に前記積層圧電素子(1)を焼結する
請求項1に記載の方法。 - 前記積層圧電素子(1)を研磨する前に、前記積層圧電素子(1)に上昇した温度を与える焼戻しプロセスを実施する
請求項1又は2に記載の方法。 - 前記焼戻しプロセスにおいて、前記積層圧電素子(1)の硬度を高める
請求項3に記載の方法。 - 前記焼戻しプロセスにおいて、有機結合剤の溶剤及び/又は軟化剤を少なくとも部分的に前記積層圧電素子(1)から除去する
請求項3又は4のいずれか1項に記載の方法。 - 前記焼戻しプロセスにおいて、前記積層圧電素子(1)に100℃〜150℃の温度を与える
請求項3〜5のいずれか1項に記載の方法。 - 複数の前記積層圧電素子(1)を入れたドラムにおいて研磨を実施し、研磨操作の実行時間、前記ドラム内の積層圧電素子の数、及び前記ドラムの回転速度のうちの少なくとも一つを調節することにより、前記材料の研磨除去を所望のように調節する
請求項1〜6のいずれか1項に記載の方法。 - 前記積層圧電素子(1)は、研磨時に水媒体によって包まれる
請求項1〜7のいずれか1項に記載の方法。 - 前記積層圧電素子(1)は圧電トランスである
請求項1〜8のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102016110216.4 | 2016-06-02 | ||
DE102016110216.4A DE102016110216B4 (de) | 2016-06-02 | 2016-06-02 | Verfahren zur Herstellung einer Vielzahl von piezoelektrischen Vielschichtbauelementen |
PCT/EP2017/063196 WO2017207654A2 (de) | 2016-06-02 | 2017-05-31 | Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019522381A true JP2019522381A (ja) | 2019-08-08 |
JP6735418B2 JP6735418B2 (ja) | 2020-08-05 |
Family
ID=59014595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019516066A Active JP6735418B2 (ja) | 2016-06-02 | 2017-05-31 | 複数の積層圧電素子を製造する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US11024794B2 (ja) |
EP (1) | EP3465789A2 (ja) |
JP (1) | JP6735418B2 (ja) |
CN (1) | CN109643753A (ja) |
DE (1) | DE102016110216B4 (ja) |
WO (1) | WO2017207654A2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102019107238A1 (de) * | 2019-03-21 | 2020-09-24 | Relyon Plasma Gmbh | Vorrichtung und Bauelement zur Erzeugung einer hohen Spannung oder hohen Feldstärke |
DE102019135497B4 (de) * | 2019-12-20 | 2021-11-11 | Nova Plasma Ltd | Piezoelektrischer Plasmagenerator und Verfahren zum Betrieb eines piezoelektrischen Plasmagenerators |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335481A (ja) * | 1994-06-10 | 1995-12-22 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JPH08316088A (ja) * | 1995-05-12 | 1996-11-29 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
JP2010010424A (ja) * | 2008-06-27 | 2010-01-14 | Tdk Corp | チップ部品の製造方法 |
JP2011151148A (ja) * | 2010-01-20 | 2011-08-04 | Tdk Corp | 積層型電子部品の製造方法 |
JP2012028457A (ja) * | 2010-07-21 | 2012-02-09 | Murata Mfg Co Ltd | セラミック電子部品及び配線基板 |
JP2016004885A (ja) * | 2014-06-17 | 2016-01-12 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
WO2016012282A1 (de) * | 2014-07-23 | 2016-01-28 | Epcos Ag | Piezoelektrischer transformator |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE691672C (de) * | 1936-03-07 | 1940-06-03 | Fraembs & Freudenberg | Antrieb von Polierbehaeltern fuer Massengueter |
JP3053962B2 (ja) * | 1992-06-03 | 2000-06-19 | イビデン株式会社 | セラミックス多層基板の製造方法 |
US5801073A (en) * | 1995-05-25 | 1998-09-01 | Charles Stark Draper Laboratory | Net-shape ceramic processing for electronic devices and packages |
DE10205928A1 (de) | 2001-02-21 | 2002-08-22 | Ceramtec Ag | Verfahren zur Herstellung piezokeramischer Vielschichtaktoren |
JP2005038904A (ja) * | 2003-07-15 | 2005-02-10 | Murata Mfg Co Ltd | 積層セラミック電子部品およびその製造方法 |
JP2005183477A (ja) | 2003-12-16 | 2005-07-07 | Murata Mfg Co Ltd | セラミック電子部品およびその製造方法 |
JP4687670B2 (ja) | 2007-03-14 | 2011-05-25 | Tdk株式会社 | 積層型セラミック電子部品の製造方法 |
DE102007019316A1 (de) * | 2007-04-24 | 2008-11-06 | Rösler Holding GmbH & Co. KG | Gleitschliffanlage |
EP2696382B1 (en) * | 2011-04-05 | 2015-10-07 | Honda Motor Co., Ltd. | Laminated piezoelectric body |
JP5583876B1 (ja) * | 2012-11-14 | 2014-09-03 | 日本碍子株式会社 | 複合基板 |
-
2016
- 2016-06-02 DE DE102016110216.4A patent/DE102016110216B4/de active Active
-
2017
- 2017-05-31 JP JP2019516066A patent/JP6735418B2/ja active Active
- 2017-05-31 CN CN201780045723.5A patent/CN109643753A/zh active Pending
- 2017-05-31 EP EP17728135.9A patent/EP3465789A2/de active Pending
- 2017-05-31 US US16/306,512 patent/US11024794B2/en active Active
- 2017-05-31 WO PCT/EP2017/063196 patent/WO2017207654A2/de unknown
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07335481A (ja) * | 1994-06-10 | 1995-12-22 | Murata Mfg Co Ltd | セラミック電子部品及びその製造方法 |
JPH08316088A (ja) * | 1995-05-12 | 1996-11-29 | Murata Mfg Co Ltd | セラミック電子部品の製造方法 |
JP2010010424A (ja) * | 2008-06-27 | 2010-01-14 | Tdk Corp | チップ部品の製造方法 |
JP2011151148A (ja) * | 2010-01-20 | 2011-08-04 | Tdk Corp | 積層型電子部品の製造方法 |
JP2012028457A (ja) * | 2010-07-21 | 2012-02-09 | Murata Mfg Co Ltd | セラミック電子部品及び配線基板 |
JP2016004885A (ja) * | 2014-06-17 | 2016-01-12 | 株式会社村田製作所 | セラミック電子部品の製造方法 |
WO2016012282A1 (de) * | 2014-07-23 | 2016-01-28 | Epcos Ag | Piezoelektrischer transformator |
US20170208675A1 (en) * | 2014-07-23 | 2017-07-20 | Epcos Ag | Piezoelectric transformer |
JP2017529687A (ja) * | 2014-07-23 | 2017-10-05 | エプコス アクチエンゲゼルシャフトEpcos Ag | 圧電トランス |
Also Published As
Publication number | Publication date |
---|---|
US11024794B2 (en) | 2021-06-01 |
DE102016110216B4 (de) | 2018-10-11 |
CN109643753A (zh) | 2019-04-16 |
WO2017207654A3 (de) | 2018-01-25 |
DE102016110216A1 (de) | 2017-12-07 |
JP6735418B2 (ja) | 2020-08-05 |
US20190252598A1 (en) | 2019-08-15 |
WO2017207654A2 (de) | 2017-12-07 |
EP3465789A2 (de) | 2019-04-10 |
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