WO2017207654A3 - Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen - Google Patents

Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen Download PDF

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Publication number
WO2017207654A3
WO2017207654A3 PCT/EP2017/063196 EP2017063196W WO2017207654A3 WO 2017207654 A3 WO2017207654 A3 WO 2017207654A3 EP 2017063196 W EP2017063196 W EP 2017063196W WO 2017207654 A3 WO2017207654 A3 WO 2017207654A3
Authority
WO
WIPO (PCT)
Prior art keywords
piezoelectric multilayer
multilayer components
producing
components
piezoelectric
Prior art date
Application number
PCT/EP2017/063196
Other languages
English (en)
French (fr)
Other versions
WO2017207654A2 (de
Inventor
Bernhard Doellgast
Markus Puff
Original Assignee
Epcos Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag filed Critical Epcos Ag
Priority to JP2019516066A priority Critical patent/JP6735418B2/ja
Priority to US16/306,512 priority patent/US11024794B2/en
Priority to EP17728135.9A priority patent/EP3465789A2/de
Priority to CN201780045723.5A priority patent/CN109643753A/zh
Publication of WO2017207654A2 publication Critical patent/WO2017207654A2/de
Publication of WO2017207654A3 publication Critical patent/WO2017207654A3/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view
    • H10N30/505—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view the cross-section being annular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/05—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
    • H10N30/053—Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes by integrally sintering piezoelectric or electrostrictive bodies and electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
    • H10N30/086—Shaping or machining of piezoelectric or electrostrictive bodies by machining by polishing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/40—Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung einer Vielzahl von piezoelektrischen Vielschichtbauelementen (1), wobei die piezoelektrischen Vielschichtbauelemente ohne den Zusatz eines Schleifmittels (24) geschliffen werden, wobei ein Materialabrieb von den piezoelektrischen Vielschichtbauelementen durch das Reiben der piezoelektrischen Vielschichtbauelemente aneinander erfolgt.
PCT/EP2017/063196 2016-06-02 2017-05-31 Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen WO2017207654A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019516066A JP6735418B2 (ja) 2016-06-02 2017-05-31 複数の積層圧電素子を製造する方法
US16/306,512 US11024794B2 (en) 2016-06-02 2017-05-31 Method for producing a plurality of piezoelectric multilayer components
EP17728135.9A EP3465789A2 (de) 2016-06-02 2017-05-31 Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen
CN201780045723.5A CN109643753A (zh) 2016-06-02 2017-05-31 用于制造多个压电多层器件的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016110216.4A DE102016110216B4 (de) 2016-06-02 2016-06-02 Verfahren zur Herstellung einer Vielzahl von piezoelektrischen Vielschichtbauelementen
DE102016110216.4 2016-06-02

Publications (2)

Publication Number Publication Date
WO2017207654A2 WO2017207654A2 (de) 2017-12-07
WO2017207654A3 true WO2017207654A3 (de) 2018-01-25

Family

ID=59014595

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2017/063196 WO2017207654A2 (de) 2016-06-02 2017-05-31 Verfahren zur herstellung einer vielzahl von piezoelektrischen vielschichtbauelementen

Country Status (6)

Country Link
US (1) US11024794B2 (de)
EP (1) EP3465789A2 (de)
JP (1) JP6735418B2 (de)
CN (1) CN109643753A (de)
DE (1) DE102016110216B4 (de)
WO (1) WO2017207654A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019107238A1 (de) * 2019-03-21 2020-09-24 Relyon Plasma Gmbh Vorrichtung und Bauelement zur Erzeugung einer hohen Spannung oder hohen Feldstärke
DE102019135497B4 (de) * 2019-12-20 2021-11-11 Nova Plasma Ltd Piezoelektrischer Plasmagenerator und Verfahren zum Betrieb eines piezoelektrischen Plasmagenerators

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316088A (ja) * 1995-05-12 1996-11-29 Murata Mfg Co Ltd セラミック電子部品の製造方法
DE10205928A1 (de) * 2001-02-21 2002-08-22 Ceramtec Ag Verfahren zur Herstellung piezokeramischer Vielschichtaktoren
JP2005183477A (ja) * 2003-12-16 2005-07-07 Murata Mfg Co Ltd セラミック電子部品およびその製造方法
JP2008227314A (ja) * 2007-03-14 2008-09-25 Tdk Corp 積層型セラミック電子部品の製造方法
JP2010010424A (ja) * 2008-06-27 2010-01-14 Tdk Corp チップ部品の製造方法
US20130342080A1 (en) * 2011-04-05 2013-12-26 Honda Motor Co., Ltd. Laminated piezoelectric body

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE691672C (de) 1936-03-07 1940-06-03 Fraembs & Freudenberg Antrieb von Polierbehaeltern fuer Massengueter
JP3053962B2 (ja) * 1992-06-03 2000-06-19 イビデン株式会社 セラミックス多層基板の製造方法
JPH07335481A (ja) * 1994-06-10 1995-12-22 Murata Mfg Co Ltd セラミック電子部品及びその製造方法
US5801073A (en) * 1995-05-25 1998-09-01 Charles Stark Draper Laboratory Net-shape ceramic processing for electronic devices and packages
JP2005038904A (ja) * 2003-07-15 2005-02-10 Murata Mfg Co Ltd 積層セラミック電子部品およびその製造方法
DE102007019316A1 (de) 2007-04-24 2008-11-06 Rösler Holding GmbH & Co. KG Gleitschliffanlage
JP5177452B2 (ja) * 2010-01-20 2013-04-03 Ｔｄｋ株式会社 積層型電子部品の製造方法
JP5246215B2 (ja) * 2010-07-21 2013-07-24 株式会社村田製作所 セラミック電子部品及び配線基板
WO2014077213A1 (ja) * 2012-11-14 2014-05-22 日本碍子株式会社 複合基板
JP6442881B2 (ja) * 2014-06-17 2018-12-26 株式会社村田製作所 セラミック電子部品の製造方法
DE102014110405A1 (de) * 2014-07-23 2016-01-28 Epcos Ag Piezoelektrischer Transformator

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316088A (ja) * 1995-05-12 1996-11-29 Murata Mfg Co Ltd セラミック電子部品の製造方法
DE10205928A1 (de) * 2001-02-21 2002-08-22 Ceramtec Ag Verfahren zur Herstellung piezokeramischer Vielschichtaktoren
JP2005183477A (ja) * 2003-12-16 2005-07-07 Murata Mfg Co Ltd セラミック電子部品およびその製造方法
JP2008227314A (ja) * 2007-03-14 2008-09-25 Tdk Corp 積層型セラミック電子部品の製造方法
JP2010010424A (ja) * 2008-06-27 2010-01-14 Tdk Corp チップ部品の製造方法
US20130342080A1 (en) * 2011-04-05 2013-12-26 Honda Motor Co., Ltd. Laminated piezoelectric body

Also Published As

Publication number Publication date
CN109643753A (zh) 2019-04-16
DE102016110216B4 (de) 2018-10-11
JP2019522381A (ja) 2019-08-08
JP6735418B2 (ja) 2020-08-05
US11024794B2 (en) 2021-06-01
US20190252598A1 (en) 2019-08-15
WO2017207654A2 (de) 2017-12-07
EP3465789A2 (de) 2019-04-10
DE102016110216A1 (de) 2017-12-07

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