JP2019220587A - 基板保持装置 - Google Patents
基板保持装置 Download PDFInfo
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- JP2019220587A JP2019220587A JP2018117145A JP2018117145A JP2019220587A JP 2019220587 A JP2019220587 A JP 2019220587A JP 2018117145 A JP2018117145 A JP 2018117145A JP 2018117145 A JP2018117145 A JP 2018117145A JP 2019220587 A JP2019220587 A JP 2019220587A
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- 239000000758 substrate Substances 0.000 title claims abstract description 123
- 230000007246 mechanism Effects 0.000 claims abstract description 163
- 230000003028 elevating effect Effects 0.000 claims description 46
- 239000000463 material Substances 0.000 abstract description 6
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P11/00—Connecting or disconnecting metal parts or objects by metal-working techniques not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
HD 基板保持装置
S 基板
10 枠体
12a 貫通孔
100 クランプ機構
110 クランプ片
120 クランプ保持機構
121 磁石
122 磁性体
130 クランプ解除機構
130a 押上ピン進退機構
xp1 押上ピン昇降位置
yp1 押上ピン退避位置
130b 押上ピン昇降機構
131 押上ピン
20 基板受渡機構
20a 支持ピン進退機構
xp2 支持ピン待機位置
yp2 支持ピン退避位置
20b 支持ピン昇降機構
21 支持ピン
Claims (11)
- 搬送装置によって搬送される基板が載置される枠体と、
前記搬送装置によって前記枠体の上方に搬送された前記基板を当該枠体に受け渡す基板受渡機構とを備え、
前記基板受渡機構が、
前記枠体の下方に配置される支持ピンと、
前記支持ピンを、前記枠体の枠内下側に設定した支持ピン昇降位置と前記枠体の枠外に設定した支持ピン退避位置との間で進退させる支持ピン進退機構と、
前記支持ピン進退機構によって前記支持ピン昇降位置に配置された前記支持ピンを、前記枠体の枠内に通して前記基板を支持するように上昇させた後に下降させる支持ピン昇降機構とを備えることを特徴とする基板保持装置。 - 前記枠体が、複数であり、かつ、多段状に配置されており、
前記支持ピンが、それぞれの枠体の下方に配置されている請求項1記載の基板保持装置。 - 前記各枠体の下方に配置された支持ピンが、共通の前記支持ピン進退機構及び前記支持ピン昇降機構によって駆動される請求項2記載の基板保持装置。
- 前記基板が載置された各枠体を垂直に起立させる枠体起立機構をさらに備える請求項1乃至3のいずれかに記載の基板保持装置。
- 前記支持ピン進退機構が、前記支持ピンを水平方向に旋回させるものである請求項1乃至4のいずれかに記載の基板保持装置。
- 前記支持ピン進退機構及び前記支持ピン昇降機構が、共通の前記枠体の枠外に設置された支柱と前記支柱から少なくとも前記昇降位置まで延びる長さを有するアームとを介して前記支持ピンを駆動させるものであり、
前記支持ピン進退機構が、前記支柱を回転して前記支持ピンを旋回させ、
前記支持ピン昇降機構が、前記支柱を昇降して前記支持ピンを昇降させる請求項1乃至5のいずれかに記載の基板保持装置。 - 前記枠体が、当該枠体に載置された前記基板を当該枠体との間で挟んで保持するクランプ機構をさらに備える請求項1乃至6のいずれかに記載の基板保持装置。
- 前記クランプ機構が、
前記枠体に載置された前記基板を当該枠体との間で挟むように開閉するクランプ片と、
前記枠体に対して前記クランプ片を閉じた状態に保持するクランプ保持機構とを備える請求項7記載の基板保持装置。 - 前記クランプ保持機構が、前記枠体又は前記クランプ片のいずれか一方に設けられた磁石と他方に設けられた磁性体とを備える請求項8記載の基板保持装置。
- 前記クランプ機構が、前記枠体に対して前記クランプ片が閉じた状態を解除するクランプ解除機構をさらに備える請求項8又は9のいずれかに記載の基板保持装置。
- 前記枠体が、貫通孔を有しており、
前記クランプ解除機構が、
前記枠体の下方に配置される押上ピンと、
前記押上ピンを、前記枠体の貫通孔下側に設定した押上ピン昇降位置と前記枠体の枠外に設定した押上ピン退避位置との間で進退させる押上ピン進退機構と、
前記押上ピン進退機構によって前記押上ピン昇降位置に配置された前記押上ピンを、前記枠体の貫通孔に差し込んで前記クランプ片を押し上げるように上昇させた後に下降させる押上ピン昇降機構とをさらに備える請求項10記載の基板保持装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018117145A JP7172163B2 (ja) | 2018-06-20 | 2018-06-20 | 基板保持装置 |
US17/253,127 US20210292106A1 (en) | 2018-06-20 | 2019-06-18 | Substrate holding device |
PCT/JP2019/024073 WO2019244880A1 (ja) | 2018-06-20 | 2019-06-18 | 基板保持装置 |
KR1020207036249A KR102484870B1 (ko) | 2018-06-20 | 2019-06-18 | 기판 유지 장치 |
CN201980040697.6A CN112313791A (zh) | 2018-06-20 | 2019-06-18 | 基板保持装置 |
TW108121214A TWI742388B (zh) | 2018-06-20 | 2019-06-19 | 基板保持裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018117145A JP7172163B2 (ja) | 2018-06-20 | 2018-06-20 | 基板保持装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019220587A true JP2019220587A (ja) | 2019-12-26 |
JP7172163B2 JP7172163B2 (ja) | 2022-11-16 |
Family
ID=68983836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018117145A Active JP7172163B2 (ja) | 2018-06-20 | 2018-06-20 | 基板保持装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210292106A1 (ja) |
JP (1) | JP7172163B2 (ja) |
KR (1) | KR102484870B1 (ja) |
CN (1) | CN112313791A (ja) |
TW (1) | TWI742388B (ja) |
WO (1) | WO2019244880A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113804626A (zh) * | 2021-10-12 | 2021-12-17 | 安徽像元光测科技有限公司 | 一种科学级ccd高精度拼接安装保护装置和方法 |
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JP2002334922A (ja) * | 2001-05-10 | 2002-11-22 | Mitsubishi Electric Corp | 半導体デバイスの製造装置及び半導体デバイスの製造方法 |
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-
2018
- 2018-06-20 JP JP2018117145A patent/JP7172163B2/ja active Active
-
2019
- 2019-06-18 US US17/253,127 patent/US20210292106A1/en active Pending
- 2019-06-18 KR KR1020207036249A patent/KR102484870B1/ko active IP Right Grant
- 2019-06-18 CN CN201980040697.6A patent/CN112313791A/zh active Pending
- 2019-06-18 WO PCT/JP2019/024073 patent/WO2019244880A1/ja active Application Filing
- 2019-06-19 TW TW108121214A patent/TWI742388B/zh active
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JP2002334922A (ja) * | 2001-05-10 | 2002-11-22 | Mitsubishi Electric Corp | 半導体デバイスの製造装置及び半導体デバイスの製造方法 |
JP2003270155A (ja) * | 2002-03-15 | 2003-09-25 | Olympus Optical Co Ltd | 基板保持装置及び検査装置 |
JP2008204996A (ja) * | 2007-02-16 | 2008-09-04 | Toppan Printing Co Ltd | バッファ装置 |
JP2010062317A (ja) * | 2008-09-03 | 2010-03-18 | Tokyo Electron Ltd | 基板載置用トレイ |
JP2009055046A (ja) * | 2008-09-26 | 2009-03-12 | Hitachi Kokusai Electric Inc | 半導体製造方法及びその装置 |
JP2010098048A (ja) * | 2008-10-15 | 2010-04-30 | Shin Etsu Handotai Co Ltd | ウェーハ移載装置及び縦型熱処理装置 |
JP2012204759A (ja) * | 2011-03-28 | 2012-10-22 | Toshiba Corp | 基板保持装置、基板洗浄装置および基板処理装置 |
JP2013171918A (ja) * | 2012-02-20 | 2013-09-02 | Toshiba Corp | 基板回転保持装置および基板処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN112313791A (zh) | 2021-02-02 |
KR102484870B1 (ko) | 2023-01-06 |
TW202017832A (zh) | 2020-05-16 |
US20210292106A1 (en) | 2021-09-23 |
TWI742388B (zh) | 2021-10-11 |
KR20210011960A (ko) | 2021-02-02 |
WO2019244880A1 (ja) | 2019-12-26 |
JP7172163B2 (ja) | 2022-11-16 |
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