JP2019207997A - 導電性部材の製造方法 - Google Patents
導電性部材の製造方法 Download PDFInfo
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- JP2019207997A JP2019207997A JP2018161856A JP2018161856A JP2019207997A JP 2019207997 A JP2019207997 A JP 2019207997A JP 2018161856 A JP2018161856 A JP 2018161856A JP 2018161856 A JP2018161856 A JP 2018161856A JP 2019207997 A JP2019207997 A JP 2019207997A
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Abstract
Description
支持体上に少なくとも多孔質層と該多孔質層上に解離層を有する転写用基材の解離層の上に導電性パターンを形成する工程、前記工程で得られた導電性パターンを常温で粘着性を有する被転写体に転写する工程、および導電性パターンが転写された被転写体を加熱硬化する工程を少なくとも具備する導電性部材の製造方法。
水に、カウンターイオンに塩素イオンを持つジアリルジメチルアンモニウムクロライド−重合物としてシャロール(登録商標)DC902P(第一工業製薬(株)製)8質量部と、無機微粒子として気相法シリカ(平均一次粒子径7nm、比表面積300m2/g)100質量部を添加し、のこぎり歯状ブレード型分散機(ブレード周速30m/秒)を使用して予備分散液を作製した。次に得られた予備分散物を高圧ホモジナイザーで処理して、固形分濃度が20質量%の無機微粒子分散液1を製造した。気相法シリカの平均二次粒子径は130nmであった。
無機微粒子分散液1 (シリカ固形分として)100質量部
ポリビニルアルコール 25質量部
(ケン化度88%、平均重合度3500)
ホウ酸 4質量部
ノニオン性界面活性剤 0.3質量部
(ポリオキシエチレンアルキルエーテル)
水以外の成分濃度が13質量%になるように水で調整した。
塩化ナトリウム 0.3質量部
水 99.7質量部
コロイダルシリカ20質量%スラリー 15質量部
(扶桑化学工業(株)製、クォートロンPL−3L、平均一次粒子径35nm)
水 85質量部
転写用基材1に対し、銀ナノインク(三菱製紙(株)製NBSIJ−MU01、銀濃度15質量%)を入れたピエゾタイプのインクジェットプリンタを用い、50mm×50mmのベタパターン(面状パターン)で印刷を行い、導電性パターンを形成した。銀ナノインクの吐出量は23ml/m2であり、導電性パターンの厚みは0.8μmであった。
水に硝酸2.5質量部とアルミナ水和物(平均一次粒子径15nm)100質量部を添加し、のこぎり歯状ブレード型分散機を用いて、固形分濃度30質量%の無機微粒子分散液2を得た。無機微粒子分散液2中に分散しているアルミナ水和物の平均二次粒子径は160nmであった。
無機微粒子分散液2 (アルミナ水和物固形分として)100質量部
ポリビニルアルコール 9質量部
(ケン化度88%、平均重合度3,500、分子量約150,000)
ホウ酸 0.4質量部
ノニオン性界面活性剤 0.3質量部
(ポリオキシエチレンアルキルエーテル)
水以外の成分濃度が16質量%になるように水で調整した。
コロイダルシリカ40質量%スラリー 5質量部
(日産化学工業(株)製、スノーテックスZL、平均一次粒子径80nm)
水 95質量部
実施例2の解離層塗布液2を下記組成の解離層塗布液3へ変更した以外は実施例2と同様にして、実施例3の導電性部材を得た。なお、多孔質層上に形成された解離層の固形分塗布量は0.6g/m2であった。
酸化ジルコニウム20質量%ゾル 15質量部
(ナイヤコール社製、Zr100/20、平均一次粒子径100nm)
水 85質量部
実施例3の被転写体2を被転写体1に変更し、加熱硬化処理を140℃で30分間行った以外は実施例3と同様にして、実施例4の導電性部材を得た。
実施例2の解離層塗布液2を下記組成の解離層塗布液4へ変更した以外は実施例2と同様にして、実施例5の導電性部材を得た。なお、多孔質層上に形成された解離層の固形分塗布量は0.2g/m2であった。
フッ素樹脂60質量%水分散体 1.7質量部
(ダイキン工業(株)製PTFE D−210C、平均一次粒子径220nm)
水 98.2質量部
アニオン性界面活性剤 0.05質量部
(ポリオキシエチレンラウリルエーテル硫酸ナトリウム)
実施例5の被転写体2を被転写体1に変更し、加熱硬化処理を140℃で30分間行った以外は実施例5と同様にして、実施例6の導電性部材を得た。
実施例1に用いた被転写体1を140℃30分間の加熱硬化処理を行い、常温で粘着性を有さないシート状成型物とした後、スクリーン印刷機を用いて、銀ペースト(藤倉化成(株)製ドータイトFA−333)を50mm×50mmのベタパターンで印刷を行い、120℃10分間の銀ペースト加熱硬化処理を行い、比較例1の導電性部材を得た。
実施例2に用いた被転写体2を150℃60分間の加熱硬化処理を行い、常温で粘着性を有さないシート状成型物とした後、スクリーン印刷機を用いて、銀ペースト(藤倉化成(株)製ドータイトFA−333)を50mm×50mmのベタパターンで印刷を行い、120℃10分間の銀ペースト加熱硬化処理を行い、比較例2の導電性部材を得た。
実施例1に用いた被転写体1を140℃30分間の加熱硬化処理を行い、常温で粘着性を有さないシート状成型物とした後、実施例1において転写用基材1上に作製された導電性パターンを両面テープ(日東電工(株)製No.5600、25℃におけるJIS Z0237に準じ剥離角度180度にて測定された粘着力は7.5N/25mm)の片面に転写した後、導電性パターンが転写された両面テープの導電性パターンを有さない側の粘着面を被転写体1に貼り付け、比較例3の導電性部材を得た。
実施例2に用いた被転写体2を150℃60分間の加熱硬化処理を行い、常温で粘着性を有さないシート状成型物とした後、実施例2において転写用基材2上に作製された導電性パターンを両面テープ(日東電工(株)製No.5600)の片面に転写した後、導電性パターンが転写された両面テープの導電性パターンを有さない側の粘着面を被転写体2に貼り付け、比較例4の導電性部材を得た。
<導電性>
導電性部材上に転写されてなる面状パターンのシート抵抗値を測定器((株)ダイアインスツルメンツ製ロレスタ(登録商標)−GP)を用いて測定した。その結果を表1に示す。
導電性部材上に転写されてなる面状パターンをJIS K 5600−5−6に規定されるクロスカット法にて、被転写体に対する密着性を確認した。密着性はJIS K 5600−5−6における評価と同様に0〜5の6段階で評価した。(0:どの格子の目にもはがれがない。1:はがれの程度が5%以下である。2:はがれの程度が5%を超え15%以下である。3:はがれの程度が15%を超え35%以下である。4:はがれの程度が35%を超え65%以下である。5:はがれの程度が65%を超える。)この結果を表1に示す。
2 多孔質層
3 解離層
4 導電性パターン
5 被転写体
10 転写用基材
Claims (1)
- 支持体上に少なくとも多孔質層と該多孔質層上に解離層を有する転写用基材の解離層の上に導電性パターンを形成する工程、前記工程で得られた導電性パターンを常温で粘着性を有する被転写体に転写する工程、および導電性パターンが転写された被転写体を加熱硬化する工程を少なくとも具備する導電性部材の製造方法。
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JP2012019067A (ja) * | 2010-07-08 | 2012-01-26 | Afit Corp | 回路基板の製造方法及び製造装置 |
JP2014192275A (ja) * | 2013-03-27 | 2014-10-06 | Mitsubishi Paper Mills Ltd | 導電性パターン転写用基材および導電性パターン転写方法 |
JP2016127257A (ja) * | 2015-01-08 | 2016-07-11 | 東友ファインケム株式会社Dongwoo Fine−Chem Co., Ltd. | 柔軟基板の製造方法 |
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