JP2019201199A5 - - Google Patents

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Publication number
JP2019201199A5
JP2019201199A5 JP2019032985A JP2019032985A JP2019201199A5 JP 2019201199 A5 JP2019201199 A5 JP 2019201199A5 JP 2019032985 A JP2019032985 A JP 2019032985A JP 2019032985 A JP2019032985 A JP 2019032985A JP 2019201199 A5 JP2019201199 A5 JP 2019201199A5
Authority
JP
Japan
Prior art keywords
layer
diamond semiconductor
type
semiconductor layer
laminate according
Prior art date
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Application number
JP2019032985A
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English (en)
Japanese (ja)
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JP7159080B2 (ja
JP2019201199A (ja
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Publication date
Application filed filed Critical
Priority to US16/290,442 priority Critical patent/US10847364B2/en
Publication of JP2019201199A publication Critical patent/JP2019201199A/ja
Publication of JP2019201199A5 publication Critical patent/JP2019201199A5/ja
Application granted granted Critical
Publication of JP7159080B2 publication Critical patent/JP7159080B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019032985A 2018-05-10 2019-02-26 積層体および半導体装置 Active JP7159080B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US16/290,442 US10847364B2 (en) 2018-05-10 2019-03-01 Laminated body and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018091273 2018-05-10
JP2018091273 2018-05-10

Publications (3)

Publication Number Publication Date
JP2019201199A JP2019201199A (ja) 2019-11-21
JP2019201199A5 true JP2019201199A5 (enExample) 2020-10-15
JP7159080B2 JP7159080B2 (ja) 2022-10-24

Family

ID=68612314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019032985A Active JP7159080B2 (ja) 2018-05-10 2019-02-26 積層体および半導体装置

Country Status (1)

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JP (1) JP7159080B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114038750B (zh) * 2021-11-05 2022-12-02 西安电子科技大学芜湖研究院 一种氮化镓功率器件的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4404265A (en) * 1969-10-01 1983-09-13 Rockwell International Corporation Epitaxial composite and method of making
JPH07245409A (ja) * 1994-03-07 1995-09-19 Mitsubishi Electric Corp 半導体装置
KR100933847B1 (ko) 2002-06-18 2009-12-24 스미토모덴키고교가부시키가이샤 n형 반도체 다이아몬드 제조 방법 및 반도체 다이아몬드
JP4683836B2 (ja) 2003-12-12 2011-05-18 株式会社神戸製鋼所 ダイヤモンド半導体素子及びその製造方法
JP4450719B2 (ja) 2004-10-22 2010-04-14 株式会社神戸製鋼所 半導体素子の製造方法
WO2006103853A1 (ja) 2005-03-25 2006-10-05 Japan Science And Technology Agency 二酸化チタンを活性層として用いる半導体装置およびその製造方法
US8653533B2 (en) 2009-09-07 2014-02-18 Rohm Co., Ltd. Semiconductor device and method of manufacturing the same
WO2011103558A1 (en) 2010-02-22 2011-08-25 Nantero, Inc. Logic elements comprising carbon nanotube field effect transistor (cntfet) devices and methods of making same
US8933462B2 (en) 2011-12-21 2015-01-13 Akhan Semiconductor, Inc. Method of fabricating diamond semiconductor and diamond semiconductor formed according to the method
CN102916039B (zh) 2012-10-19 2016-01-20 清华大学 具有氧化铍的半导体结构
JP6104575B2 (ja) 2012-11-28 2017-03-29 株式会社東芝 半導体装置
US20150001623A1 (en) 2013-06-26 2015-01-01 Tsinghua University Field effect transistor and method for forming the same

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