JP2019189864A - エポキシ樹脂組成物およびその硬化物 - Google Patents
エポキシ樹脂組成物およびその硬化物 Download PDFInfo
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- JP2019189864A JP2019189864A JP2019079727A JP2019079727A JP2019189864A JP 2019189864 A JP2019189864 A JP 2019189864A JP 2019079727 A JP2019079727 A JP 2019079727A JP 2019079727 A JP2019079727 A JP 2019079727A JP 2019189864 A JP2019189864 A JP 2019189864A
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- epoxy resin
- resin composition
- epoxy
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- epoxy compound
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- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 109
- 239000000203 mixture Substances 0.000 title claims abstract description 41
- 239000004593 Epoxy Substances 0.000 claims abstract description 44
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 43
- 150000001875 compounds Chemical class 0.000 claims abstract description 42
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 4
- 125000006273 (C1-C3) alkyl group Chemical group 0.000 claims abstract description 3
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 3
- 125000001118 alkylidene group Chemical group 0.000 claims abstract description 3
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 3
- 125000005843 halogen group Chemical group 0.000 claims abstract description 3
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 3
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 claims abstract description 3
- 239000003505 polymerization initiator Substances 0.000 claims description 16
- 238000010538 cationic polymerization reaction Methods 0.000 claims description 14
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- 235000013824 polyphenols Nutrition 0.000 claims description 8
- 239000007870 radical polymerization initiator Substances 0.000 claims description 8
- 150000008065 acid anhydrides Chemical class 0.000 claims description 7
- 150000001412 amines Chemical class 0.000 claims description 6
- 150000008442 polyphenolic compounds Chemical class 0.000 claims description 5
- 239000011342 resin composition Substances 0.000 claims description 4
- -1 phenol compound Chemical class 0.000 description 68
- 239000000047 product Substances 0.000 description 33
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 31
- 230000000052 comparative effect Effects 0.000 description 15
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 12
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- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 9
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 8
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- 238000011156 evaluation Methods 0.000 description 7
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- 238000005452 bending Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
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- 238000009864 tensile test Methods 0.000 description 6
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- 239000010959 steel Substances 0.000 description 4
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- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PFHLXMMCWCWAMA-UHFFFAOYSA-N [4-(4-diphenylsulfoniophenyl)sulfanylphenyl]-diphenylsulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC(C=C1)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 PFHLXMMCWCWAMA-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
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- 125000003700 epoxy group Chemical group 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical compound CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 3
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- VESRBMGDECAMNH-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]-2,3,5,6-tetramethylphenol Chemical compound CC1=C(C(=C(C(=C1O)C)C)C(C)(C)C1=CC=C(C=C1)O)C VESRBMGDECAMNH-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- 150000008062 acetophenones Chemical class 0.000 description 2
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- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
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- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 2
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- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
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- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
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- RKHXQBLJXBGEKF-UHFFFAOYSA-M tetrabutylphosphanium;bromide Chemical compound [Br-].CCCC[P+](CCCC)(CCCC)CCCC RKHXQBLJXBGEKF-UHFFFAOYSA-M 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- 125000005591 trimellitate group Chemical group 0.000 description 2
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- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 2
- RXZLRDRZSMKIOR-UHFFFAOYSA-N (1-ethoxy-1-oxopropan-2-yl)-methyl-naphthalen-2-ylsulfanium Chemical compound C1=CC=CC2=CC([S+](C)C(C)C(=O)OCC)=CC=C21 RXZLRDRZSMKIOR-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Epoxy Resins (AREA)
Abstract
Description
下記式(1)で表されるエポキシ化合物と単官能エポキシ化合物を含有するエポキシ樹脂(A)と、
酸無水物系硬化剤、アミン系硬化剤、カチオン重合開始剤、ラジカル重合開始剤、ポリフェノール系硬化剤、潜在性硬化剤から成る群より選ばれる1種以上の硬化剤(B)を配合したエポキシ樹脂組成物。
(GPC法)
システム:1515アイソクラティックHPLCポンプ(Waters社製)
検出器:2414示差屈折率(RI)検出器(Waters社製)
カラム:KF−801、KF−802、KF−G(何れも昭和電工社製)
移動相:THF
流速:1.0ml/min
カラム温度:40℃
注入量:100μL
攪拌機、温度計、冷却管、窒素導入管を備えた1L容四つ口フラスコにネオペンチルグリコールジグリシジルエーテル576gとビスフェノールA228g、テトラブチルホスホニウムブロミド0.2gを仕込み、窒素ガスパージを施しながら150℃で5時間反応させ、エポキシ化合物(a)を得た。エポキシ化合物(a)のエポキシ当量は438g/当量、数平均分子量580、多分散度3.10、粘度48,000mPa・sであった。
合成例で得られたエポキシ化合物(a)90重量部、単官能エポキシ化合物としてo−フェニルフェノールグリシジルエーテル10重量部、硬化剤としてポリアミノアミド23重量部、添加剤としてシリコーン系消泡剤0.1重量部を減圧下で2分間攪拌混合し、エポキシ樹脂組成物を得た。この組成物をシリコーン製の鋳型に注型し、23℃で20時間、次いで80℃で5時間硬化し、硬化物を得た。
エポキシ樹脂(A)、硬化剤(B)を表1に示すように変更した以外は、実施例1と同操作を行い、エポキシ樹脂組成物およびその硬化物を得た。
エポキシ樹脂(A)として、ビスフェノールA型エポキシ樹脂80重量部、ポリエチレングリコールジグリシジルエーテル20重量部を使用し、硬化剤の配合量を変更した以外は実施例1と同様の操作を行い、エポキシ樹脂組成物およびその硬化物を得た。
E型回転粘度計(HBDV−II+ProCp、ブルックフィールド社製)を用いて、エポキシ樹脂(A)の25℃における粘度を測定した。なお、スピンドルはCPE−42を用いた。
エポキシ樹脂硬化物の引張試験をJIS K7161に準じて測定した。測定機器には、オートグラフAG−IS 1kN 卓上型((株)島津製作所製)を用い、引張速度10mm/minにて破断点伸び率を測定した。破断点伸び率は、100%以上であることが好ましく、130%以上であることがより好ましい。
合成例で得られたエポキシ樹脂(a)90重量部、単官能エポキシ化合物としてo−フェニルフェノールグリシジルエーテル10重量部、硬化剤としてメチルテトラヒドロ無水フタル酸37重量部、硬化促進剤として1−ベンジル−2−メチルイミダゾール0.5重量部を2分間均一になるまで撹拌混合し、エポキシ樹脂組成物を得た。この組成物を減圧下で脱泡した後、ダイス鋼製の鋳型に注型し、23℃で20時間、次いで80℃で5時間硬化し、硬化物を得た。
主剤のエポキシ樹脂をビスフェノールA型エポキシ樹脂やポリエチレングリコールジグリシジルエーテルを併用系に変更した以外は、実施例13と同操作を行い、エポキシ樹脂組成物およびその硬化物を得た。
E型回転粘度計(HBDV−II+ProCp、ブルックフィールド社製)を用いて、エポキシ樹脂(A)の25℃における粘度を測定した。なお、スピンドルはCPE−42を用いた。
実施例13、比較例2で作製したエポキシ樹脂硬化物の曲げ試験をJIS K7171に準じて、引張速度2mm/minにて曲げ歪みを測定した。
合成例で得られたエポキシ化合物(a)90重量部、単官能エポキシ化合物としてo−フェニルフェノールグリシジルエーテル10重量部、光カチオン重合開始剤としてジフェニルヨードニウムヘキサフルオロホスフェート6重量部、ラジカル重合開始剤として1−ヒドロキシシクロヘキシルフェニルケトン1重量部を4分間均一になるまで撹拌混合し、エポキシ樹脂組成物を得た。この組成物を減圧下で脱泡した後、ダイス鋼製の鋳型に膜厚が2mmになるように注型した。光源に高圧水銀灯(大気下)を用いて3000mJ/cm2の照射、80℃で1時間の熱処理で硬化し、硬化物を得た。
エポキシ樹脂(A)を表3に示すように変更した以外は、実施例14と同操作を行い、エポキシ組成物およびその硬化物を得た。
エポキシ樹脂(A)として、ビスフェノールA型エポキシ樹脂80重量部、ポリエチレングリコールジグリシジルエーテル20重量部を使用した以外は実施例14と同様の操作を行い、エポキシ樹脂組成物およびその硬化物を得た。
E型回転粘度計(HBDV−II+ProCp、ブルックフィールド社製)を用いて、エポキシ樹脂(A)の25℃における粘度を測定した。なお、スピンドルはCPE−42を用いた。
実施例14〜20、比較例3で作製したエポキシ樹脂硬化物の引張試験をJIS K6251に準じた採寸になるように裁断機にて打ち抜き、引張速度500mm/minにて破断点伸び率を測定した。
合成例で得られたエポキシ化合物(a)90重量部、単官能エポキシ化合物としてo−フェニルフェノールグリシジルエーテル10重量部、光カチオン重合開始剤としてトリフェニルスルホニウムヘキサフルオロアンチモネート1重量部を4分間均一になるまで撹拌混合し、エポキシ樹脂組成物を得た。この組成物を減圧下で脱泡した後、ダイス鋼製の鋳型に膜厚が2mmになるように注型した。光源に高圧水銀灯(大気下)を用いて1000mJ/cm2の照射、80℃で1時間の熱処理で硬化し、硬化物を得た。
エポキシ樹脂(A)を表4に示すように変更した以外は、実施例21と同操作を行い、エポキシ組成物およびその硬化物を得た。
合成例で得られたエポキシ化合物(a)90重量部、単官能エポキシ化合物としてo−フェニルフェノールグリシジルエーテル10重量部、熱カチオン重合開始剤としてベンジルメチル−p−ヒドロキシフェニルスルホニウムヘキサフルオロアンチモネート1重量部を4分間均一になるまで撹拌混合し、エポキシ樹脂組成物を得た。この組成物を減圧下で脱泡した後、ダイス鋼製の鋳型に膜厚が2mmになるように注型し、120℃で2時間、次いで180℃で2時間加熱し、硬化物を得た。
エポキシ樹脂(A)を表4に示すように変更した以外は、実施例24と同操作を行い、エポキシ組成物およびその硬化物を得た。
E型回転粘度計(HBDV−II+ProCp、ブルックフィールド社製)を用いて、エポキシ樹脂(A)の25℃における粘度を測定した。なお、スピンドルはCPE−42を用いた。
実施例21〜26で作製したエポキシ樹脂硬化物の引張試験をJIS K6251に準じた採寸になるように裁断機にて打ち抜き、引張速度500mm/minにて破断点伸び率を測定した。
Claims (5)
- 単官能エポキシ化合物がフェノール系単官能エポキシ化合物であることを特徴とする請求項1記載のエポキシ樹脂組成物。
- エポキシ樹脂(A)として、さらに多官能エポキシ化合物を含有することを特徴とする請求項1から請求項2のいずれかに記載のエポキシ樹脂組成物。
- エポキシ樹脂(A)の25℃における粘度が2,000〜100,000mPa・sであることを特徴とする請求項1から請求項3のいずれかに記載のエポキシ樹脂組成物。
- 請求項1から請求項4のいずれかに記載のエポキシ樹脂組成物を硬化させたエポキシ樹脂硬化物。
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JPS60110775A (ja) * | 1983-11-21 | 1985-06-17 | Nippon Telegr & Teleph Corp <Ntt> | 接着性組成物 |
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