JP2019176028A5 - - Google Patents

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Publication number
JP2019176028A5
JP2019176028A5 JP2018063188A JP2018063188A JP2019176028A5 JP 2019176028 A5 JP2019176028 A5 JP 2019176028A5 JP 2018063188 A JP2018063188 A JP 2018063188A JP 2018063188 A JP2018063188 A JP 2018063188A JP 2019176028 A5 JP2019176028 A5 JP 2019176028A5
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JP
Japan
Prior art keywords
electronic component
holding head
mounting
film
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018063188A
Other languages
English (en)
Japanese (ja)
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JP2019176028A (ja
JP7023154B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2018063188A priority Critical patent/JP7023154B2/ja
Priority claimed from JP2018063188A external-priority patent/JP7023154B2/ja
Priority to KR1020190032935A priority patent/KR102253289B1/ko
Priority to TW108110637A priority patent/TWI723362B/zh
Priority to CN201910237691.XA priority patent/CN110323146B/zh
Publication of JP2019176028A publication Critical patent/JP2019176028A/ja
Publication of JP2019176028A5 publication Critical patent/JP2019176028A5/ja
Application granted granted Critical
Publication of JP7023154B2 publication Critical patent/JP7023154B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018063188A 2018-03-28 2018-03-28 電子部品実装装置 Active JP7023154B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置
KR1020190032935A KR102253289B1 (ko) 2018-03-28 2019-03-22 전자 부품 실장 장치
TW108110637A TWI723362B (zh) 2018-03-28 2019-03-27 電子零件封裝裝置
CN201910237691.XA CN110323146B (zh) 2018-03-28 2019-03-27 电子零件封装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018063188A JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Publications (3)

Publication Number Publication Date
JP2019176028A JP2019176028A (ja) 2019-10-10
JP2019176028A5 true JP2019176028A5 (https=) 2021-04-22
JP7023154B2 JP7023154B2 (ja) 2022-02-21

Family

ID=68113034

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018063188A Active JP7023154B2 (ja) 2018-03-28 2018-03-28 電子部品実装装置

Country Status (4)

Country Link
JP (1) JP7023154B2 (https=)
KR (1) KR102253289B1 (https=)
CN (1) CN110323146B (https=)
TW (1) TWI723362B (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7497843B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497841B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497842B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497837B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497839B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7497838B2 (ja) * 2019-09-26 2024-06-11 株式会社大一商会 遊技機
JP7507396B2 (ja) * 2020-12-25 2024-06-28 パナソニックＩｐマネジメント株式会社 部品圧着装置および部品移送方法
JP7837178B2 (ja) * 2021-03-31 2026-03-30 芝浦メカトロニクス株式会社 電子部品実装装置
CN115148617A (zh) * 2021-03-31 2022-10-04 芝浦机械电子装置株式会社 电子零件安装装置
JP7812679B2 (ja) * 2021-03-31 2026-02-10 芝浦メカトロニクス株式会社 電子部品実装装置
CN115148616B (zh) * 2021-03-31 2025-09-23 芝浦机械电子装置株式会社 电子零件安装装置
JP7154449B1 (ja) * 2021-10-28 2022-10-17 芝浦メカトロニクス株式会社 電子部品実装装置
TW202438692A (zh) * 2021-11-19 2024-10-01 日商芝浦機械電子裝置股份有限公司 供給裝置及成膜裝置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2685561B1 (fr) * 1991-12-20 1994-02-04 Thomson Hybrides Procede de cablage d'une barrette de lasers et barrette cablee par ce procede.
JP4109905B2 (ja) * 2002-05-31 2008-07-02 松下電器産業株式会社 部品実装基板生産装置
TW200419686A (en) * 2002-12-02 2004-10-01 Matsushita Electric Industrial Co Ltd Component feeding head unit, component feeding unit, component mounting apparatus, and method for moving of mounting head
JP4627643B2 (ja) 2004-08-20 2011-02-09 芝浦メカトロニクス株式会社 実装用電子部品の供給装置
JP4323410B2 (ja) * 2004-10-22 2009-09-02 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
JP4518257B2 (ja) 2005-01-19 2010-08-04 株式会社日立ハイテクノロジーズ 半導体装置実装装置
JP4802003B2 (ja) * 2006-01-30 2011-10-26 芝浦メカトロニクス株式会社 電子部品の実装装置及び実装方法
US8328498B2 (en) * 2007-01-25 2012-12-11 Panasonic Corporation Component feeding unit and method, and component mounting apparatus and method
KR101166058B1 (ko) * 2007-02-22 2012-07-19 시바우라 메카트로닉스 가부시키가이샤 전자 부품의 실장 장치 및 실장 방법
CN100561696C (zh) * 2007-03-01 2009-11-18 全懋精密科技股份有限公司 嵌埋半导体芯片的结构及其制法
WO2009122711A1 (ja) * 2008-04-01 2009-10-08 パナソニック株式会社 部品実装装置および方法
JP4658235B2 (ja) * 2009-01-08 2011-03-23 パナソニック株式会社 部品実装装置及びその方法
JP2011040489A (ja) * 2009-08-07 2011-02-24 Shibaura Mechatronics Corp 電子部品の実装装置及び実装方法
KR101399973B1 (ko) 2012-12-21 2014-06-19 세광테크 주식회사 인라인 자동 ｏｌｂ 본딩장치

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