JP2019153665A - 基板処理装置及び基板処理システム - Google Patents
基板処理装置及び基板処理システム Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 120
- 238000012545 processing Methods 0.000 title claims abstract description 75
- 238000010438 heat treatment Methods 0.000 claims abstract description 101
- 230000007246 mechanism Effects 0.000 claims abstract description 90
- 238000000926 separation method Methods 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 42
- 230000003028 elevating effect Effects 0.000 claims description 37
- 239000003507 refrigerant Substances 0.000 claims description 8
- 239000010453 quartz Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 238000012546 transfer Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 239000002826 coolant Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
すなわち、従来の装置は、筐体内にエアシリンダやモータなどの駆動機構を配置すると、熱処理プレートによる熱の影響で故障する恐れがあるので、筐体内に駆動機構を配置することが困難である。したがって、装置のフットプリントが大きくなるという問題がある。
すなわち、請求項1に記載の発明は、基板に対して熱処理を行う基板処理装置において、基板を載置し、基板を加熱する熱処理プレートと、基板を受け渡すための昇降ピンと、前記熱処理プレートの上面に対して前記昇降ピンを昇降させる昇降ピン駆動機構と、前記熱処理プレートの周囲を覆って、熱処理プレートによる熱処理雰囲気を形成する筐体と、前記熱処理プレートが上部に配置され、前記熱処理プレートの熱が下方へ伝わることを抑制する冷却ベースプレートと、を備え、前記昇降ピン駆動機構は、前記冷却ベースプレートの下方に配置されていることを特徴とするものである。
W … 基板
3 … 下部ベースプレート
5 … 水冷式ベースプレート
7 … 熱処理プレート
9 … 可動天板ユニット
11 … 昇降ピンユニット
13 … 筐体
15 … シャッタユニット
29 … 昇降機構
30,38,46 … 制御機器
33 … 可動天板
35 … 開口
37 … 駆動機構
41 … 昇降ピン
43 … 搬入出口
47 … シャッタ本体
51 … 排気管
61 … 制御部
71 … 取り付けプレート
81 … 基板処理システム
85 … 熱分離プレート
Claims (7)
- 基板に対して熱処理を行う基板処理装置において、
基板を載置し、基板を加熱する熱処理プレートと、
基板を受け渡すための昇降ピンと、
前記熱処理プレートの上面に対して前記昇降ピンを昇降させる昇降ピン駆動機構と、
前記熱処理プレートの周囲を覆って、熱処理プレートによる熱処理雰囲気を形成する筐体と、
前記熱処理プレートが上部に配置され、前記熱処理プレートの熱が下方へ伝わることを抑制する冷却ベースプレートと、
を備え、
前記昇降ピン駆動機構は、前記冷却ベースプレートの下方に配置されていることを特徴とする基板処理装置。 - 請求項1に記載の基板処理装置において、
前記筐体は、基板を搬入出する搬入出口を備えているとともに、
前記搬入出口を開閉するシャッタ本体と、
前記シャッタ本体を駆動するシャッタ本体駆動機構と、
をさらに備え、
前記シャッタ本体駆動機構は、前記冷却ベースプレートの下方に配置されていることを特徴とする基板処理装置。 - 請求項1に記載の基板処理装置において、
前記昇降ピン駆動機構は、前記冷却ベースプレートの下面に、前記冷却ベースプレートとの間で熱伝導する状態で取り付けられていることを特徴とする基板処理装置。 - 請求項2に記載の基板処理装置において、
前記シャッタ本体駆動機構は、前記冷却ベースプレートの下面に、前記冷却ベースプレートとの間で熱伝導する状態で取り付けられていることを特徴とする基板処理装置。 - 請求項1から4のいずれかに記載の基板処理装置において、
前記冷却ベースプレートは、冷媒が流通する冷媒流路が全体にわたって形成されていることを特徴とする基板処理装置。 - 請求項1から5のいずれかに記載の基板処理装置において、
前記熱処理プレートの下面と、前記冷却ベースプレートの上面との間に配置された複数本の支柱をさらに備え、
前記熱処理プレートは、前記複数本の支柱で前記冷却ベースプレートに取り付けられていることを特徴とする基板処理装置。 - 請求項1から6のいずれかに記載の基板処理装置が多段に積層配置されて構成された基板処理システムにおいて、
前記各基板処理装置は、その上部に、熱が上方へ伝わることを抑制する熱分離プレートを備えていることを特徴とする基板処理システム。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018037245A JP7116558B2 (ja) | 2018-03-02 | 2018-03-02 | 基板処理装置及び基板処理システム |
CN201910074196.1A CN110223933B (zh) | 2018-03-02 | 2019-01-25 | 基板处理装置及基板处理系统 |
US16/257,206 US11387121B2 (en) | 2018-03-02 | 2019-01-25 | Substrate treating apparatus and substrate treating system including pin lift mechanism below cooling base and heat plate |
CN202310851495.8A CN116845006A (zh) | 2018-03-02 | 2019-01-25 | 基板处理装置 |
TW108103037A TWI714955B (zh) | 2018-03-02 | 2019-01-28 | 基板處理裝置及基板處理系統 |
KR1020190011207A KR102164765B1 (ko) | 2018-03-02 | 2019-01-29 | 기판 처리 장치 및 기판 처리 시스템 |
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JP2018037245A JP7116558B2 (ja) | 2018-03-02 | 2018-03-02 | 基板処理装置及び基板処理システム |
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JP2019153665A true JP2019153665A (ja) | 2019-09-12 |
JP7116558B2 JP7116558B2 (ja) | 2022-08-10 |
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US (1) | US11387121B2 (ja) |
JP (1) | JP7116558B2 (ja) |
KR (1) | KR102164765B1 (ja) |
CN (2) | CN116845006A (ja) |
TW (1) | TWI714955B (ja) |
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JP7109211B2 (ja) * | 2018-03-06 | 2022-07-29 | 株式会社Screenホールディングス | 基板処理装置 |
US11710621B2 (en) | 2021-04-28 | 2023-07-25 | Applied Materials, Inc. | Direct lift cathode for lithography mask chamber |
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JPH11204428A (ja) * | 1998-01-16 | 1999-07-30 | Tokyo Electron Ltd | 熱処理装置 |
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KR100711729B1 (ko) * | 2005-10-25 | 2007-04-25 | 세메스 주식회사 | 냉각 플레이트 및 베이크 장치 |
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KR20190104877A (ko) | 2019-09-11 |
CN110223933A (zh) | 2019-09-10 |
CN116845006A (zh) | 2023-10-03 |
US20190273005A1 (en) | 2019-09-05 |
KR102164765B1 (ko) | 2020-10-13 |
CN110223933B (zh) | 2023-08-01 |
TWI714955B (zh) | 2021-01-01 |
US11387121B2 (en) | 2022-07-12 |
TW201939579A (zh) | 2019-10-01 |
JP7116558B2 (ja) | 2022-08-10 |
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