JP2019140217A - 搬送システム - Google Patents
搬送システム Download PDFInfo
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- JP2019140217A JP2019140217A JP2018021599A JP2018021599A JP2019140217A JP 2019140217 A JP2019140217 A JP 2019140217A JP 2018021599 A JP2018021599 A JP 2018021599A JP 2018021599 A JP2018021599 A JP 2018021599A JP 2019140217 A JP2019140217 A JP 2019140217A
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- 230000007246 mechanism Effects 0.000 claims abstract description 28
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- 238000004891 communication Methods 0.000 claims description 44
- 230000007723 transport mechanism Effects 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 18
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- 230000003028 elevating effect Effects 0.000 description 14
- 239000000758 substrate Substances 0.000 description 11
- 238000003860 storage Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 7
- 238000000227 grinding Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
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- 229910010272 inorganic material Inorganic materials 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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- 239000011521 glass Substances 0.000 description 1
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- 238000005498 polishing Methods 0.000 description 1
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
11 自動搬送機構
12 加工装置
21 搬送経路
22 保持部
23 制御部
24 通信部
40 カセット載置手段
41 カセット収容キャビネット
44 天板(上段載置テーブル、載置テーブル)
46 側板
47 下段載置テーブル
52 制御手段
C カセット
W ウエーハ(被加工物)
Claims (1)
- 生産設備内の天井又は床に配設された搬送経路に沿って走行自在で且つカセットを保持する保持部と、該保持部を制御する制御部と、被加工物を加工する加工装置の制御手段と通信する通信部とを備えた自動搬送機構により、該加工装置内のカセット載置手段の載置テーブルに複数の被加工物が収容された該カセットの搬出入を行う搬送システムであって、
該加工装置の該カセット載置手段は、側板及び天板で形成されたカセット収容キャビネットの内部に配設されたカセットを載置する下段載置テーブルと、該天板上に配設されカセットを上部に載置する上段載置テーブルとを備え、
少なくとも該下段載置テーブルは、該自動搬送機構の該搬送経路に沿って、又は該搬送経路上に該加工装置の外側に引き出し可能に構成され、
該自動搬送機構の該保持部により該下段載置テーブルに載置されるカセットを搬出入する際には、該カセット収容キャビネット内の該下段載置テーブルが該加工装置の外側に引き出された状態で該保持部がカセットにアクセスすること、を特徴とする搬送システム。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018021599A JP7126833B2 (ja) | 2018-02-09 | 2018-02-09 | 搬送システム |
Applications Claiming Priority (1)
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JP2018021599A JP7126833B2 (ja) | 2018-02-09 | 2018-02-09 | 搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019140217A true JP2019140217A (ja) | 2019-08-22 |
JP7126833B2 JP7126833B2 (ja) | 2022-08-29 |
Family
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Family Applications (1)
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JP2018021599A Active JP7126833B2 (ja) | 2018-02-09 | 2018-02-09 | 搬送システム |
Country Status (1)
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JP (1) | JP7126833B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102021214707A1 (de) | 2020-12-28 | 2022-06-30 | Disco Corporation | Bandanbringer |
JP7458760B2 (ja) | 2019-12-03 | 2024-04-01 | 株式会社ディスコ | 加工装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010192855A (ja) * | 2009-02-20 | 2010-09-02 | Tokyo Electron Ltd | 基板処理装置 |
JP2012064799A (ja) * | 2010-09-16 | 2012-03-29 | Daifuku Co Ltd | 搬送装置 |
JP2014116464A (ja) * | 2012-12-10 | 2014-06-26 | Tokyo Electron Ltd | 基板処理装置、基板処理システム及び搬送容器の異常検出方法 |
JP2015138856A (ja) * | 2014-01-22 | 2015-07-30 | 株式会社ディスコ | 切削装置 |
-
2018
- 2018-02-09 JP JP2018021599A patent/JP7126833B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010192855A (ja) * | 2009-02-20 | 2010-09-02 | Tokyo Electron Ltd | 基板処理装置 |
JP2012064799A (ja) * | 2010-09-16 | 2012-03-29 | Daifuku Co Ltd | 搬送装置 |
JP2014116464A (ja) * | 2012-12-10 | 2014-06-26 | Tokyo Electron Ltd | 基板処理装置、基板処理システム及び搬送容器の異常検出方法 |
JP2015138856A (ja) * | 2014-01-22 | 2015-07-30 | 株式会社ディスコ | 切削装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7458760B2 (ja) | 2019-12-03 | 2024-04-01 | 株式会社ディスコ | 加工装置 |
DE102021214707A1 (de) | 2020-12-28 | 2022-06-30 | Disco Corporation | Bandanbringer |
KR20220094120A (ko) | 2020-12-28 | 2022-07-05 | 가부시기가이샤 디스코 | 테이프 마운터 |
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JP7126833B2 (ja) | 2022-08-29 |
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