JP2019136810A - Cutting device and cut product manufacturing method - Google Patents

Abstract

To provide a cutting device that can keep strong holding force onto a table even after an object to be cut is cut off.SOLUTION: The cutting device includes a table 10, an air pressure maintaining mechanism and a cutting mechanism 30. An object 20 to be cut off is suctioned and held by the table 10, and air pressure outside the table 10 holding the object 20 to be cut off is maintained at air pressure higher than atmospheric pressure by the air pressure maintaining mechanism. The object 20 to be cut off held on the table 10 is cut off by the cutting mechanism 30.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a cutting apparatus and a method for manufacturing a cut product.

  For example, the semiconductor package is manufactured by cutting a package substrate. In the cutting of the package substrate, for example, the substrate is held on a table by suction and cut (Patent Document 1, etc.).

JP 2011-114145 A

  However, if the size of the semiconductor package (product) manufactured by cutting the package substrate is small, the holding force on the table by suction may be insufficient. Specifically, the product after cutting may come off the table, which may cause a decrease in yield, product failure, and the like.

  Then, an object of this invention is to provide the manufacturing method of the cutting device and cutting goods with strong holding | maintenance power on a table even after the cutting | disconnection target object is cut | disconnected.

In order to achieve the above object, the cutting device of the present invention comprises:
Including a table, a pressure holding mechanism, and a cutting mechanism;
The object to be cut is sucked and held by the table,
By the atmospheric pressure holding mechanism, the atmospheric pressure outside the table where the cutting object is held is held at an atmospheric pressure higher than atmospheric pressure,
The cutting object held on the table is cut by the cutting mechanism.

The manufacturing method of the cut product of the present invention is
A cutting object holding step for sucking and holding the cutting object by a table; and
An atmospheric pressure maintaining step of maintaining an atmospheric pressure outside the table where the cutting object is held at an atmospheric pressure higher than an atmospheric pressure;
A cutting step of cutting the cutting object held on the table;
It is characterized by including.

  ADVANTAGE OF THE INVENTION According to this invention, the cutting apparatus with a strong holding force on a table even after the cutting | disconnection target object is cut | disconnected and the manufacturing method of a cut article can be provided.

FIG. 1 is a process cross-sectional view schematically showing one process in an example of a method for manufacturing a cut product according to the present invention. FIG. 2 is a process cross-sectional view schematically showing another process in the manufacturing method of the same cut product as FIG. FIG. 3 is a process cross-sectional view schematically showing still another process in the manufacturing method of the same cut product as in FIG. FIG. 4 is a process cross-sectional view schematically showing still another process in the same method for manufacturing a cut product as in FIG. FIG. 5 is a process cross-sectional view schematically showing still another process in the manufacturing method of the same cut product as in FIG. FIG. 6 is a process cross-sectional view schematically showing still another process in the manufacturing method of the same cut product as FIG. FIG. 7 is a plan view schematically showing the configuration of an example of the cutting apparatus of the present invention. FIG. 8 is a plan view schematically showing the configuration of another example of the cutting apparatus of the present invention.

  Next, the present invention will be described in more detail with reference to examples. However, the present invention is not limited by the following description.

The cutting device of the present invention is, for example,
In addition, including a cutting chamber,
In the cutting chamber, the air pressure outside the table is maintained at a pressure higher than the atmospheric pressure by the air pressure holding mechanism, and the cutting object held on the table is cut by the cutting mechanism and cut. Products are manufactured,
A cutting device may be used.

The cutting device of the present invention is, for example,
Furthermore, including a cutting chamber, a pressurizing chamber, and a decompression chamber,
In the cutting chamber, the cutting object is cut to produce a cut product,
The pressurizing chamber is disposed on the cutting object carry-in side of the cutting chamber,
The decompression chamber is disposed on the cut product delivery side of the cutting chamber,
In the state where the pressurizing chamber and the cutting chamber are connected, and the pressurizing chamber and the cutting chamber are maintained at a pressure higher than atmospheric pressure, the cutting object is moved from the pressurizing chamber to the pressure chamber. Carried into the cutting room,
In a state where the decompression chamber and the cutting chamber are connected, the cut product is carried out from the cutting chamber to the decompression chamber, and then the connection between the decompression chamber and the cutting chamber is interrupted, and In a state where the decompression chamber is decompressed to a pressure lower than that at the time of cutting the cutting object, the cut product is carried out from the decompression chamber to the outside.
A cutting device may be used.

The cutting device of the present invention is, for example,
The atmospheric pressure holding mechanism includes a storage chamber and an operation unit,
The table and the cutting mechanism are stored in the storage chamber,
The operation unit maintains the pressure inside the storage chamber at a pressure higher than atmospheric pressure.
A cutting device may be used.

In the cutting apparatus of the present invention, for example, the air pressure outside the table on which the object to be cut is held may be held at 1.1 × 10 ⁵ Pa or more by the air pressure holding mechanism.

The manufacturing method of the cut product of the present invention is, for example,
Using a cutting chamber,
Performing the cutting step in the cutting chamber;
It may be a method of manufacturing a cut product.

The manufacturing method of the cut product of the present invention is, for example,
Using a cutting chamber, a pressurizing chamber, and a decompression chamber,
Performing the cutting step in the cutting chamber;
Furthermore, a cutting object carrying-in process and a cut product carrying-out process are included,
In the cutting object carrying-in step, the cutting object is connected in a state where the pressurizing chamber and the cutting chamber are connected and the inside of the pressurizing chamber and the cutting chamber is maintained at a pressure higher than atmospheric pressure. Is carried into the cutting chamber from the pressurizing chamber,
The cut product unloading step carries out the cut product in which the object to be cut is cut in the cutting step from the cutting chamber to the decompression chamber in a state where the decompression chamber and the cutting chamber are connected, and then After cutting off the connection between the decompression chamber and the cutting chamber, the cut product is removed from the decompression chamber to the outside while the decompression chamber is decompressed to a pressure lower than that at the time of cutting the object to be cut. It is a process to carry out,
It may be a method of manufacturing a cut product.

In the present invention, “atmospheric pressure higher than atmospheric pressure” may be, for example, higher than 1 atm (1.01325 × 10 ⁵ Pa). The “atmospheric pressure higher than the atmospheric pressure” may be, for example, an atmospheric pressure higher than the ambient atmospheric pressure (atmospheric pressure) when using the cutting apparatus of the present invention, or manufacture of the cut product of the present invention. The atmospheric pressure may be higher than the ambient atmospheric pressure (atmospheric pressure) when the method is used. The “atmospheric pressure higher than atmospheric pressure” can achieve the effect of the present invention as long as it is slightly higher than atmospheric pressure. For example, 1.1 × 10 ⁵ Pa or more, 1.2 × 10 ⁵ Pa or more, 1.3 × 10 ⁵ Pa or more, 1.4 × 10 ⁵ Pa or more, 1.5 × 10 ⁵ Pa or more, 2.0 × 10 ⁵ Pa or more, 3.0 × 10 ⁵ Pa or more, Alternatively, it may be 4.0 × 10 ⁵ Pa or more, for example, 1.0 × 10 ⁶ Pa (1.0 MPa) or less, 9.0 × 10 ⁵ Pa or less, 8.0 × 10 ⁵ Pa or less, 7 It may be 0.0 × 10 ⁵ Pa or less, 6.0 × 10 ⁵ Pa or less, or 5.0 × 10 ⁵ Pa or less.

  In the present invention, the cutting object is not particularly limited. For example, the cutting object may be a package substrate or the like, but is not limited thereto and is arbitrary.

  In the present invention, the cut product is not particularly limited, but may be a resin molded product, for example. The resin molded product is not particularly limited, and may be, for example, a resin molded product obtained by simply molding a resin, or a resin molded product obtained by resin-sealing a component such as a chip. In the present invention, the resin molded product may be, for example, an electronic component. In the present invention, the cut product may be, for example, a finished product or an unfinished semi-finished product.

  In the present invention, the resin is not particularly limited, and may be a thermosetting resin such as an epoxy resin or a silicone resin, or may be a thermoplastic resin. Further, it may be a composite material partially including a thermosetting resin or a thermoplastic resin.

  In general, the term “electronic component” refers to a chip before resin-sealing and a state in which the chip is resin-sealed, but in the present invention, simply referred to as “electronic component” Unless otherwise specified, it means an electronic component (an electronic component as a finished product) in which the chip is sealed with a resin. In the present invention, “chip” refers to a chip before resin sealing, and specifically includes chips such as ICs, semiconductor chips, and semiconductor elements for power control. In the present invention, the chip before resin sealing is referred to as “chip” for convenience in order to distinguish it from the electronic component after resin sealing. However, the “chip” in the present invention is not particularly limited as long as it is a chip before resin sealing, and may not be in a chip shape.

  In the present invention, for example, a semiconductor wafer (semiconductor wafer) in which a functional element such as a circuit element or MEMS (Micro Electro Mechanical Systems) is arranged on a substrate such as silicon or a compound semiconductor is used as an object to be cut. It may be cut into pieces and cut into pieces. Further, in the present invention, for example, a ceramic substrate including a functional element such as a resistor, a capacitor, a sensor, and a surface acoustic wave device, a glass substrate or the like is an object to be cut, and it is cut (divided) into a chip resistor, A product (cut product) such as a chip capacitor, a chip-type sensor, or a surface acoustic wave device may be manufactured. Further, in the present invention, for example, a resin molded product may be a cutting object, and may be cut (divided) into an optical component (cut product) such as a lens, an optical module, or a light guide plate. In the present invention, for example, a resin molded product may be a cutting object, and the product (cut product) may be cut (separated). Further, in the present invention, for example, a glass plate may be used as an object to be cut, and the glass plate (cut product) used as a cover or the like for various electronic devices may be manufactured by cutting (dividing into pieces). Further, in the present invention, the object to be cut is not limited to these, and is arbitrary as described above, and the cut product is also not particularly limited and arbitrary as described above.

  In the present invention, the shapes of the object to be cut and the cut product are not particularly limited and are arbitrary. For example, the shape of the object to be cut may be a rectangle having a longitudinal direction and a short direction, or may be a square, a circle, or the like.

  In the present invention, “placement”, “arrangement” or “installation” includes “fixed”.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings. For convenience of explanation, each drawing is schematically drawn with appropriate omission, exaggeration, and the like.

  In the present embodiment, an example of a mold and a resin molding apparatus and an example of a method for producing a resin molded product using the same will be described.

  1 to 6 schematically show a partial configuration of an example of the cutting apparatus of the present invention and each process in a method for manufacturing a cut product using the cutting apparatus.

  First, as shown in FIG. 1, a table (jig) 10 is prepared. Here, the jig 10 illustrated in FIGS. 1 to 6 actually constitutes a part of the table, but in the description referring to FIGS. 1 to 6, it is described as “table 10” for convenience. . The illustration of the entire table including the jig 10 is omitted. As shown in the figure, the table 10 has a groove 11 in the upper part thereof and a through hole 12 that penetrates from the upper surface (cutting object holding surface) to the lower surface. The groove | channel 11 is a groove | channel for letting the blade for cutting pass through the inside so that it may mention later. Moreover, the through-hole 12 is a through-hole for attracting | sucking and hold | maintaining the cut object and the cut goods manufactured by cut | disconnecting it on the upper surface of the table 10 so that it may mention later.

  Next, as shown in FIG. 2, the package substrate (cutting object) 20 is placed on the upper surface of the table 10. As illustrated, the package substrate 20 is formed by resin molding one surface of a substrate 21 with a resin (cured resin) 22. The package substrate 20 may be formed of only the substrate 21 and the resin 22, but may further include other members (components). The other member may be sealed (resin sealed) with the resin 22. Although it does not specifically limit as said other member, For example, the general member used for an electronic component, a semiconductor component, etc. may be sufficient, for example, a chip | tip, a wire, etc. are mention | raise | lifted specifically ,. Further, in the same figure, the package substrate 20 is placed so that the resin 22 side is in contact with the upper surface of the table 10.

  Next, as shown in FIG. 3, the air inside the table 10 is sucked in the direction of the arrow X <b> 1 (inside the table 10) by a suction mechanism (not shown), and the inside of the table 10 is decompressed. Thereby, the package substrate 20 is sucked and held on the upper surface of the table 10 (cutting object holding step). The suction mechanism is not particularly limited, and may be, for example, a suction pump or a vacuum ejector. Furthermore, as shown in the figure, the atmospheric pressure holding mechanism (not shown) holds the atmospheric pressure outside the table 10 on which the package substrate 20 is held at an atmospheric pressure higher than atmospheric pressure (atmospheric pressure holding step). As a result, pressure is applied to the package substrate 20 in the direction of the arrow Y1 (the direction of the table 10), and the package substrate 20 is pressed against the table 10. The holding force of the package substrate 20 on the table 10 is further increased by the pressure in the arrow Y1 direction.

  Next, as shown in FIG. 4, the rotary blade 30 is disposed above the package substrate 20 at a position corresponding to the groove 11. As illustrated, the rotary blade 30 is configured by sandwiching both surfaces of a blade body 31 between a pair of flanges (fixing members) 32. The rotary blade 30 is a part of the “cutting mechanism” in the cutting apparatus of the present embodiment. The rotary blade 30 is attached to the tip of a rotary shaft (not shown) provided in the cutting mechanism.

  Next, as shown in FIG. 5, the package substrate 20 (the substrate 21 and the resin 22) is cut by rotating the rotary blade 30 (cutting step). At this time, as shown in the figure, the package substrate 20 can be completely cut by allowing the blade body 31 to penetrate the groove substrate 11 through the package substrate 20.

  Then, as shown in FIG. 6, the package substrate 20 can be manufactured by cutting the package substrate 20 at all predetermined positions (positions of the grooves 11 in the drawing). In the cut product 20b, as shown in the drawing, one surface of the cut substrate 21b is resin-molded with a cut resin (cured resin) 22b. At this time, as shown in FIG. 6, the upper end of the through-hole 12 remains closed (sealed) with the cut product 20b. For this reason, the force by suction in the direction of the arrow X1 (inner direction of the table 10) is still applied to the cut product 20b. Furthermore, pressure in the direction of arrow Y1 (the direction of the table 10) is applied to the cut product 20b and is pressed against the table 10. Accordingly, the holding force of the cut product 20b on the table 10 is further increased, and it is possible to suppress or prevent the cut product 20b from being detached from the table 10.

  The cut product 20b may be a product that can be distributed as it is, or may be an unfinished semi-finished product. The said semi-finished product is good also as a product by further processing, for example. Although the said product is not specifically limited, For example, as above-mentioned, an electronic component, a semiconductor component, etc. are mention | raise | lifted.

  In a conventional package substrate cutting method (Patent Document 1 or the like), if the size of a cut product (component) after cutting is small (for example, the length of one side is 2 mm or less), a table (jig) is used. The holding force (adsorption force) is insufficient, and the cut product is detached from the table, which may cause a decrease in yield, product defects, and the like. Specifically, for example, a cut product may fly (scatter), chipping (chips) at a corner portion of the package substrate, and the like may cause a decrease in yield and a product defect. In particular, if one cut product comes off the table, there is a risk that a hole on the table sucking the cut product may be opened. And when the space in a table is connected to one, the decompression of the space in the table is released by opening the hole, and the holding force on the table in all other cut products may be reduced. There is. That is, even if one cut product is removed from the table, all other cut products may be removed from the table.

  On the other hand, according to the present invention, the air pressure outside the table on which the object to be cut is held is held at a pressure higher than the atmospheric pressure. Thereby, the holding force of the cut product on the table is strengthened, and even a small-sized cut product can be firmly held (fixed). Therefore, according to the present invention, it is possible to suppress or prevent the above-described problems such as yield reduction and product failure, and it is possible to improve the productivity of cut products.

  Heretofore, an example of the cutting apparatus of the present invention and a method for manufacturing a cut product using the same has been described. However, the present invention is not limited only to the present embodiment. For example, in the present embodiment, an example has been described in which a package substrate is cut to manufacture a product such as an electronic component or a semiconductor component or a semi-finished product thereof. However, in the present invention, the cutting object is not limited to the package substrate as described above, and can be applied to any cutting object. Further, as described above, the cut product is not limited to an electronic component, a semiconductor component, etc., and is arbitrary. Further, for example, the cutting apparatus of the present invention is general except that the air pressure outside the table where the object to be cut is held is held at a pressure higher than the atmospheric pressure by the air pressure holding mechanism. The configuration may be the same as or similar to the cutting device. The method for manufacturing a cut product according to the present invention includes, for example, a package substrate except that the “atmospheric pressure holding step” is performed to hold the air pressure outside the table on which the object to be cut is held at a pressure higher than the atmospheric pressure. It may be performed in the same manner or in accordance with a general cutting method such as. As a general method for cutting a package substrate or the like, for example, a method similar to or equivalent to the method described in JP-A-2006-143861 may be used. There is no particular limitation on the configuration, method, and the like of a specific apparatus for holding the pressure outside the table on which the cutting object is held at a pressure higher than the atmospheric pressure. Or it may be as 3.

  The present invention can be suitably used for manufacturing a small cut product having a side of 2 mm or less or 1 mm or less, for example. However, the present invention is not limited to this, and may be used for manufacturing a cut product of any size.

  Next, another embodiment of the present invention will be described.

  In the present embodiment, an example different from the first embodiment of the cutting device and the method for manufacturing a cut product according to the present invention will be described.

  The plan view of FIG. 7 schematically shows the configuration of the cutting apparatus of the present embodiment. As illustrated, the cutting apparatus 1000 includes three areas (areas), an A area, a B area, and a C area. The A area includes a pressurizing chamber 1100. The B area includes a cutting chamber 1200. The C area includes a decompression chamber 1300. The pressurizing chamber 1100 is arranged on the cutting object carrying-in side of the cutting chamber 1200. The decompression chamber 1300 is disposed on the cut product delivery side of the cutting chamber 1200. Then, as will be described later, in the cutting chamber 1200, the cutting object is cut to produce a cut product. Further, in the state where the pressurizing chamber 1200 and the cutting chamber 1100 are connected and the inside of the pressurizing chamber 1200 and the cutting chamber 1100 is maintained at a pressure higher than the atmospheric pressure, the object to be cut is removed from the pressurizing chamber 1100. It is carried into the cutting chamber 1200. Further, in a state where the decompression chamber 1300 and the cutting chamber 1200 are connected, the cut object to be cut (cut product) is carried out from the cutting chamber to the decompression chamber. After that, after the connection between the decompression chamber and the cutting chamber is cut off, the cut object to be cut (in the state where the inside of the decompression chamber 1300 is decompressed to a pressure lower than that at the time of cutting the cutting object ( The cut product) is carried out from the inside of the decompression chamber 1300 to the outside. Note that the atmospheric pressure when the cut product is carried out from the decompression chamber 1300 to the outside may be, for example, substantially the same as the atmospheric pressure. Details will be described later. For the cutting chamber 1200, the pressurizing chamber 1100, and the decompression chamber 1300, for example, the same structure as the vacuum chamber, the loading-side load lock chamber, and the unloading-side load lock chamber of a film forming apparatus such as a sputtering apparatus can be used. However, the cutting chamber, the pressurizing chamber, and the decompression chamber are designed so that the internal space can be maintained at a pressure higher than the atmospheric pressure.

  In the cutting apparatus 1000 of FIG. 7, the A area further includes a substrate supply mechanism (cutting object supply mechanism) 1010, a control unit 1020, and a gate valve 1030. A package substrate (cutting object) 20 is stored in the substrate supply mechanism 1010, and the package substrate 20 can be supplied to the pressurizing chamber 1100. The package substrate 20 may be the same as the package substrate 20 described in the first embodiment. The control unit 1020 can control the operation of the entire cutting apparatus 1000. Although the control method by the control part 1020 is not specifically limited, For example, you may use a computer program etc. The gate valve 1030 is disposed so as to connect the pressurizing chamber 1100 and the cutting chamber 1200. By opening the gate valve 1030, the space in the pressurizing chamber 1100 and the space in the cutting chamber 1200 can be connected. By closing the gate valve 1030, the connection between the space in the pressurizing chamber 1100 and the space in the cutting chamber 1200 can be cut off and separated.

  The B area further includes a table 10, a pressure regulator 1210, a drain pressure reducer 1220, a spindle 1230, bellows 1241 and 1242, a receiving plate 1250, a drainage flow part 1260 and a discharge port 1270. The table 10 is the same as the table 10 described in the first embodiment (FIGS. 1 to 6), and is connected to the aforementioned suction mechanism (not shown). The atmospheric pressure regulator 1210 includes, for example, an adjustment valve that can adjust the inflow amount of compressed air connected to a pipe from an external air compression system, and an on-off valve that is used for decompression. The compression system, piping, regulating valve, and on-off valve are not shown. The atmospheric pressure regulator 1210 adjusts the atmospheric pressure inside the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300. As will be described later, the atmospheric pressure regulator 1210 can maintain the atmospheric pressure outside the table 10 on which the package substrate (cutting object) 20 is held (the atmospheric pressure inside the cutting chamber 1200) at an atmospheric pressure higher than the atmospheric pressure. it can. That is, the atmospheric pressure regulator 1210 and the cutting chamber 1200 correspond to the “atmospheric pressure holding mechanism” in the cutting apparatus 1000. Further, for example, at the time of decompression, the decompression on-off valve may be opened to exhaust air from an exhaust duct provided in a facility where the cutting device 1000 is installed. The rotary blade 30 (not shown in FIG. 7) described in the first embodiment (FIGS. 1 to 6) is attached to the spindle 1230. The spindle 1230 is movable together with the rotary blade 30 in the front and rear, right and left, and up and down. With the spindle 1230, the rotary blade 30 can be rotated to cut the package substrate 20. That is, the spindle 1230 and the rotary blade 30 constitute a “cutting mechanism” in the cutting apparatus 1000. Moreover, in order to take the frictional heat by the rotary blade 30, the cutting process mentioned later can be performed, cooling a cooling water on the rotary blade 30 with a nozzle (not shown). The nozzle may be provided on the spindle 1230, for example. The cooling water may be, for example, room temperature (normal temperature) water. The cooling water can be discharged out of the cutting chamber 1200 as drainage after use. At that time, the pressure of the waste water is reduced by the drain pressure reducer 1220. The left end of the bellows 1241 and the right end of 1242 are fixed inside the cutting chamber 1200, respectively. The right end of the bellows 1241 and the left end of 1242 are connected to the receiving plate 1250, respectively. The receiving plate 1250 can place and transport the package substrate 20 and the cut product 20b. In addition, by extending and contracting the bellows 1241 and 1242, the receiving plate 1250 can be moved in the left-right direction (a direction perpendicular to the cutting object carrying-in direction and the cut product carrying-out direction). The drainage flow part 1260 is a part through which the drainage flows. From the discharge port 1270, the drainage can be discharged out of the cutting chamber 1200.

  The C area further includes a gate valve 1330, an inspection table 1400, and a tray 1500. Gate valve 1330 is arranged to connect decompression chamber 1300 and cutting chamber 1200. By opening the gate valve 1330, the space in the decompression chamber 1300 and the space in the cutting chamber 1200 can be connected. By closing the gate valve 1330, the connection between the space in the decompression chamber 1300 and the space in the cutting chamber 1200 can be cut off and separated. In the inspection table 1400, the package component (cut product) 20b is inspected and separated into a non-defective product and a defective product. In the tray 1500, non-defective products among the cut products 20b are stored and stored (stocked).

  The method for manufacturing a cut product using the cutting apparatus of FIG. 7 can be performed, for example, as follows. First, compressed air is supplied into the cutting chamber 1200 using the atmospheric pressure regulator 1210, and the inside of the cutting chamber 1200 is made higher than atmospheric pressure. Thereafter, the inside of the cutting chamber 1200 is maintained at a pressure higher than the atmospheric pressure until a cutting step described later is completed (atmospheric pressure holding step).

  On the other hand, the package substrate 20 is carried into the pressurizing chamber 1100 by the substrate supply mechanism 1010. At this time, since the pressurization chamber 1100 is opened and the inside and the outside are connected, the pressure inside the pressurization chamber 1100 remains the same as the atmospheric pressure.

  Next, the pressurizing chamber 1100 is sealed. Thereafter, compressed air is supplied into the pressurizing chamber 1100 using the atmospheric pressure regulator 1210 and pressurized. Thereby, the atmospheric pressure inside the pressurizing chamber 1100 is made substantially the same as the atmospheric pressure inside the cutting chamber 1200. When the pressure inside the pressurizing chamber 1100 becomes substantially the same as the pressure inside the cutting chamber 1200, the supply of compressed air by the pressure regulator 1210 is stopped. In this state, the gate valve 1030 between the pressurizing chamber 1100 and the cutting chamber 1200 is opened, and the package substrate 20 is carried into the cutting chamber 1200 (cutting object carrying step). Thereafter, the gate valve 1030 is closed, and the connection between the pressurizing chamber 1100 and the cutting chamber 1200 is cut off to separate them.

  Next, the package substrate (cutting object) 20 carried into the cutting chamber 1200 is sucked and held by the table (jig) 10 (cutting object holding process). Thereafter, the package substrate 20 is cut by the spindle 1230 and the rotary blade 30 (cutting mechanism) (cutting step). Thereby, the package component (cut product) 20b obtained by cutting the package substrate (cut object) 20 into individual pieces can be manufactured. These cutting object holding step and cutting step may be performed, for example, in the same manner as in Example 1 (FIGS. 1 to 6), or may be performed in the same manner or in accordance with a general method for cutting a package substrate. .

  The cutting step can be performed, for example, while cooling the rotating blade 30 with cooling water using a nozzle (not shown) as described above. After use, as described above, the cooling water can flow through the drainage flow part 1260 as drainage and be discharged out of the cutting chamber 1200 from the discharge port 1270.

  On the other hand, compressed air is supplied into the decompression chamber 1300 using the atmospheric pressure regulator 1210 and pressurized. When the pressure inside the decompression chamber 1300 becomes substantially the same as the pressure inside the cutting chamber 1200, the supply of compressed air by the pressure regulator 1210 is stopped. This operation can be performed after the cutting step (cutting the package substrate 20) is completed, but it is efficient if performed before the cutting step is completed (for example, in parallel with the cutting step).

  Then, the gate valve 1330 is opened in a state where the cutting step (cutting the package substrate 20) is finished and the pressure inside the decompression chamber 1300 is substantially the same as the pressure inside the cutting chamber 1200. In this state, the package component (cut product) 20 b is carried out from the cutting chamber 1200 and stored in the decompression chamber 1300. Thereafter, the gate valve 1330 is closed to disconnect the space in the decompression chamber 1300 and the space in the cutting chamber 1200 to separate them. Further, the air in the decompression chamber 1300 is discharged to the outside using the atmospheric pressure regulator 1210 to reduce the pressure. When the pressure in the decompression chamber 1300 becomes substantially the same as the atmospheric pressure, the package component (cut product) 20b is carried out of the decompression chamber 1300 (cut product delivery step). Thereafter, the package component (cut product) 20 b is inspected by the inspection table 1400 and stored in the tray 1500.

  As a modification of the present embodiment (embodiment 2), for example, a configuration in which the pressurizing chamber 1100 and the decompression chamber 1300 are omitted from the cutting apparatus 1000 of FIG. In this case, for example, the internal space and the external space of the cutting chamber 1200 may be connected (connected) or separated by opening and closing the gate valve 1030 and the gate valve 1330. In this case, the package substrate (cutting object) 20 is carried into the cutting chamber 1200 from the substrate supply mechanism (cutting object supply mechanism) 1010 without passing through the pressurizing chamber 1100, and the pressure is reduced from the cutting chamber 1200. The package component (cut product) 20b is carried outside without passing through the chamber 1300. Therefore, in the cutting object carrying-in process, the package substrate (cutting object) 20 is carried in from the carrying-in portion provided in the cutting chamber 1200 while the inside of the cutting chamber 1200 is at atmospheric pressure. Thereafter, the cutting chamber 1200 is hermetically sealed, and compressed air is supplied into the cutting chamber 1200 using the atmospheric pressure regulator 1210 so that the atmospheric pressure in the cutting chamber 1200 is higher than the atmospheric pressure. The cutting step is performed in a state where the atmospheric pressure in the cutting chamber 1200 is higher than the atmospheric pressure. In the cut product unloading process, after the cutting process, the air in the cutting chamber 1200 is discharged to the outside using the atmospheric pressure regulator 1210 to reduce the pressure, and when the atmospheric pressure in the cutting chamber 1200 becomes substantially the same as the atmospheric pressure, The package component (cut product) 20b is carried out from the carry-out section provided in the cutting chamber 1200. Except for these, the manufacturing method of the cut product in the modification in which the pressurizing chamber 1100 and the decompression chamber 1300 are omitted from the cutting device 1000 of FIG. 7 is performed in the same manner as the manufacturing method of the cut product using the cutting device 1000 of FIG. be able to.

  Next, still another embodiment of the present invention will be described.

  In the present embodiment, an example different from the first and second embodiments of the cutting device and the method for manufacturing a cut product according to the present invention will be described.

  The plan view of FIG. 8 schematically shows the configuration of the cutting apparatus of the present embodiment. As illustrated, the cutting apparatus 1000b includes three areas (regions), an A area, a B area, and a C area, as in the cutting apparatus of the second embodiment (FIG. 7). This cutting apparatus 1000b does not include the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300, and the three areas A area, B area, and C area are connected to one. Therefore, the cutting apparatus 1000b does not include the gate valves 1030 and 1330. In the cutting apparatus 1000b, the entire three areas of the A area, the B area, and the C area are stored in the storage chamber 2000. The pressure regulator 1210 and the drain pressure reducer 1220 are disposed outside the storage chamber 2000. Furthermore, an operation unit 2100 is disposed outside the storage chamber 2000. The operation unit 2100 maintains the pressure inside the storage chamber 2000 at a pressure higher than the atmospheric pressure. For this reason, the operation unit 2100 and the storage chamber 2000 correspond to the “atmospheric pressure holding mechanism” in the cutting apparatus 1000b. Further, when the method for manufacturing a cut product is not performed, the pressure inside the storage chamber 2000 can be made substantially the same as the atmospheric pressure by the operation unit 2100, for example. The storage chamber 2000 can be opened and closed. When the manufacturing method of the cut product is performed, the storage chamber 2000 can be closed to separate the space inside the storage chamber 2000 from the space outside. On the other hand, when the manufacturing method of the cut product is not performed, the storage chamber 2000 can be opened to connect the space inside the storage chamber 2000 and the outside space. Except for these, the cutting device 1000b in FIG. 8 is the same as the cutting device 1000 in FIG. 7 (Example 2).

  The storage chamber 2000 may be, for example, a size that secures a space where internal maintenance work can be performed. Specifically, for example, when a person enters the storage chamber 2000, the maintenance work of the cutting apparatus 1000b may be possible. Although the structure of the storage chamber 2000 is not specifically limited, For example, the structure similar to a highly airtight commercial refrigerator or freezer can be used. However, a heat insulating material or the like that is not for maintaining airtightness can be omitted. In addition, the operation unit 2100 can operate the cutting device 1000b by communicating with the inside of the storage room 2000 by wireless or wired, for example. Specifically, for example, the operation of the cutting device 1000b may be controlled by communicating the operation unit 2100 and the control unit 1020 wirelessly or by wire. Further, the form of the operation unit 2100 is not particularly limited. For example, in FIG. 8, the operation unit 2100 is illustrated as an operation panel attached to the outside of the wall portion of the storage chamber 2000. However, the operation unit 2100 is not limited to this. For example, it may be a tablet terminal.

  In the manufacturing method of a cut product using the cutting apparatus 1000b of FIG. 8, for example, all the steps described in the second embodiment can be performed in a state where the inside of the storage chamber 2000 is maintained at a pressure higher than the atmospheric pressure. For example, compressed air may be supplied to the inside of the storage chamber 2000 using an atmospheric pressure adjusting mechanism (not shown, for example, a compression pump), and the inside of the storage chamber 2000 may be held at atmospheric pressure rather than atmospheric pressure. As described above, the cutting apparatus 1000b does not include the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300, and the three areas A area, B area, and C area are connected to one. Therefore, when the package substrate (cutting object) 20 and the package component (cut product) 20b are transported, there is no need to change the pressure in the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300. Except this, the manufacturing method of the cut product using the cutting device 1000b of FIG. 8 can be performed in the same manner as the manufacturing method of the cut product using the cutting device 1000 of FIG. 7 (Example 2).

  The air pressure adjusting mechanism is not particularly limited, and for example, an existing air compression system provided in a facility (for example, a factory) where the cutting device 1000b is installed may be used. Further, for example, an air compression system including an air compressor and a receiver tank may be provided separately from the existing air compression system. This is preferable because the inside of the storage chamber 2000 can be quickly brought to a high pressure.

  Further, as described above, when the manufacturing method of the cut product is not performed, the pressure inside the storage chamber 2000 can be made substantially the same as the atmospheric pressure by the operation unit 2100, for example. For example, at the time of maintenance of the cutting apparatus 1000b, the air inside the storage chamber 2000 may be discharged to the outside using the air pressure adjusting mechanism, and the air pressure inside the storage chamber 2000 may be reduced to the same level as the atmospheric pressure. Thereby, it can avoid that a maintenance worker works in a high pressure room.

  As described above, the manufacturing method of the cut product using the cutting apparatus 1000 of Example 2 (FIG. 7) includes the step of changing the pressure in the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300 every time. is necessary. On the other hand, the manufacturing method of the cut product using the cutting apparatus 1000b of the present embodiment (FIG. 8) does not require a step of changing the pressure in the pressurizing chamber 1100, the cutting chamber 1200, and the decompression chamber 1300 as described above. It is. For this reason, according to the cutting apparatus 1000b of the present embodiment (FIG. 8), the method for manufacturing a cut product can be performed more efficiently than the cutting apparatus 1000 of the second embodiment (FIG. 7). On the other hand, the cutting apparatus 1000b of this embodiment (FIG. 8) requires a space for installing the storage chamber 2000.

  Although the storage chamber 2000 of FIG. 8 has been described as having a size that secures a space where internal maintenance work (for example, entry of maintenance workers) is possible, as described above, the present invention is not limited to this. That is, as a modification of the present embodiment (embodiment 3), for example, a cover portion that covers the entire outside of the cutting apparatus main body can be provided, the cover portion can be a “containment chamber”, and the inside can be sealed. It is good also as a simple structure.

  Furthermore, the present invention is not limited to the above-described embodiments, and can be arbitrarily combined, modified, or selected and adopted as necessary without departing from the spirit of the present invention. Is.

10 Table (Jig)
11 Groove 12 Through-hole 20 Package substrate (object to be cut)
20b Package parts (cut products)
21 Substrate 21b Cut substrate 22 Resin (cured resin)
22b Resin cut (cured resin)
30 rotary blade (cutting mechanism)
31 Blade body 32 Flange (fixing member)
1000, 1000b Cutting device 1010 Substrate supply mechanism (cutting object supply mechanism)
1020 Control unit 1030 Gate valve 1100 Pressurizing chamber 1200 Cutting chamber (atmospheric pressure holding mechanism)
1210 Barometric pressure regulator (barometric pressure holding mechanism)
1220 Drain pressure reducer 1230 Spindle (cutting mechanism)
1241, 1242 bellows 1250 receiving plate 1260 drainage flow part 1270 discharge port 1300 decompression chamber 1330 gate valve 1400 inspection table 1500 tray 2000 storage chamber (pressure holding mechanism)
2100 Operation unit (atmospheric pressure retention mechanism)
X1 Arrow representing the suction direction by the table 10 Y1 Arrow representing the direction in which pressure is applied to the package substrate 20

Claims (8)

Including a table, a pressure holding mechanism, and a cutting mechanism;
The object to be cut is sucked and held by the table,
By the atmospheric pressure holding mechanism, the atmospheric pressure outside the table where the cutting object is held is held at an atmospheric pressure higher than atmospheric pressure,
The cutting apparatus characterized in that the cutting object held on the table is cut by the cutting mechanism. In addition, including a cutting chamber,
In the cutting chamber, the pressure outside the table is maintained at a pressure higher than the atmospheric pressure by the pressure holding mechanism, and the cutting object held on the table is cut by the cutting mechanism and cut. Products are manufactured,
The cutting device according to claim 1. Furthermore, a pressurizing chamber and a decompression chamber are included,
The pressurizing chamber is disposed on the cutting object carry-in side of the cutting chamber,
The decompression chamber is disposed on the cut product delivery side of the cutting chamber,
In the state where the pressurizing chamber and the cutting chamber are connected, and the pressurizing chamber and the cutting chamber are maintained at a pressure higher than atmospheric pressure, the cutting object is moved from the pressurizing chamber to the pressure chamber. Carried into the cutting room,
In a state where the decompression chamber and the cutting chamber are connected, the cut product is carried out from the cutting chamber to the decompression chamber, and then the connection between the decompression chamber and the cutting chamber is interrupted, and In a state where the decompression chamber is decompressed to a pressure lower than that at the time of cutting the cutting object, the cut product is carried out from the decompression chamber to the outside.
The cutting device according to claim 2. The atmospheric pressure holding mechanism includes a storage chamber and an operation unit,
The table and the cutting mechanism are stored in the storage chamber,
The operation unit maintains the pressure inside the storage chamber at a pressure higher than atmospheric pressure.
The cutting device according to any one of claims 1 to 3. The cutting apparatus according to any one of claims 1 to 4, wherein an atmospheric pressure outside the table on which the cutting object is held is held at 1.1 x 10 ⁵ Pa or more by the atmospheric pressure holding mechanism. . A cutting object holding step for sucking and holding the cutting object by a table; and
An atmospheric pressure maintaining step of maintaining an atmospheric pressure outside the table where the cutting object is held at an atmospheric pressure higher than an atmospheric pressure;
A cutting step of cutting the cutting object held on the table;
The manufacturing method of the cut goods characterized by including. Using a cutting chamber,
Performing the cutting step in the cutting chamber;
The method for manufacturing a cut product according to claim 6. Furthermore, using a pressurizing chamber and a decompression chamber,
Furthermore, a cutting object carrying-in process and a cut product carrying-out process are included,
In the cutting object carrying-in step, the cutting object is connected in a state where the pressurizing chamber and the cutting chamber are connected and the inside of the pressurizing chamber and the cutting chamber is maintained at a pressure higher than atmospheric pressure. Is carried into the cutting chamber from the pressurizing chamber,
The cut product unloading step carries out the cut product in which the object to be cut is cut in the cutting step from the cutting chamber to the decompression chamber in a state where the decompression chamber and the cutting chamber are connected, and then After cutting off the connection between the decompression chamber and the cutting chamber, the cut product is removed from the decompression chamber to the outside while the decompression chamber is decompressed to a pressure lower than that at the time of cutting the object to be cut. It is a process to carry out,
The manufacturing method of the cut article of Claim 7.

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