JP2018094855A - Apparatus for resin molding and method for resin molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique for reducing molding time.SOLUTION: A resin molding apparatus (10) includes: a fixed platen (11) and a movable platen (12) arranged facing each other; an upper mold (15) and a lower mold (16) facing each other between the fixed platen (11) and the movable platen (12), provided so that they are capable of mold opening/closing; a vent passage (33) for venting inside the mold between the upper mold (15) and the lower mold (16); a platen passage (34) provided in the fixed platen (11) so as to pass through in the mold opening/closing direction, communicating with the vent passage (33); and a vent pipe (35) provided outside the mold, communicating with the platen passage (34); and a vent device (36) communicating with the vent pipe (35).SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin molding technique.

  In JP-A-2006-128222 (Patent Document 1), the mold is closed via a plurality of communication paths in which one end opens around the opening of the cavity recess and the other end communicates with the pressure adjusting unit. A resin molding apparatus is described in which the gas inside the mold is sucked to reduce the pressure inside the mold.

JP-A-2006-128222 (Claim 1)

  In the technique described in Patent Document 1, a plurality of communication paths (deaeration paths) are provided so as to open at the side surface (surface intersecting the mold surface) of a mold (clamper), and communicate with each of the plurality of communication paths. A plurality of pipes (pipe lines) are provided outside the mold, and the inside of the mold is degassed (gas is sucked) through the communication path and the pipe to reduce the pressure. In order to shorten the deaeration time, it is considered effective to provide a plurality of communication passages and pipes (increase the cross-sectional area through which gas passes) in this way.

  However, in the technique described in Patent Document 1, the communication path must be provided within the side surface of the mold (the range of the thickness of the mold), and the limit of the number of pipes communicated with the communication path (pipe breakage). There is a limit of increasing the area). Moreover, even if many pipes communicated with the communication path can be provided, the resistance of the pipes against deaeration increases. Therefore, in such a method of degassing (depressurizing) from the communication path opened on the side surface of the mold, there is a limit to increasing the degassing speed (that is, depressurizing speed), and it is difficult to reduce the molding time. is there.

  An object of the present invention is to provide a technique capable of reducing the molding time. One and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A resin molding apparatus according to one solution of the present invention is provided so that a first platen and a second platen that are arranged to face each other, and a mold that can be opened and closed between the first platen and the second platen. The first mold and the second mold, the deaeration passage for degassing the inside of the mold between the first mold and the second mold, and the first mold so as to penetrate in the mold opening / closing direction. A first platen path provided in the platen and communicated with the deaeration path, a deaeration pipe provided outside the mold and communicated with the first platen path, and a deaeration device communicated with the deaeration pipe And. According to this, the deaeration time inside a metal mold | die can be shortened by deaerating via the 1st platen path which can be made into predetermined magnitude | size (cross-sectional area), and a molding time can be shortened.

  Here, the degassing path is provided in the first mold, the first mold is assembled at the center of the first platen, and the first platen path is provided at the center of the first platen. It is more preferable. According to this, the deaeration path can be branched at an equal length from the center of the first mold.

  More preferably, the resin molding apparatus further includes a deaeration valve provided in the middle of the deaeration pipe and on the first platen path side. According to this, the deaeration amount of the first platen path and the deaeration pipe between the first platen path and the deaeration valve can be reduced, and the deaeration time can be further shortened.

  The resin molding apparatus further includes a control unit that controls the deaeration device and the deaeration valve, and the control unit includes the deaeration distribution between the closed deaeration valve and the deaeration device. More preferably, the inside of the mold is evacuated by opening the deaeration valve in a state where the inside of the tube is decompressed by the deaeration device. According to this, the deaeration pipe between the deaeration valve and the deaeration device can function as a vacuum tank, and the deaeration time can be further shortened without providing a separate vacuum tank.

  In addition, the capacity of the deaeration pipe between the deaeration valve and the deaeration device is the inside of the mold, the deaeration path, the first platen path, the first platen path, and the deaeration. It is more preferable that the capacity is equal to or greater than the combined capacity of the deaeration pipe between the air valves. According to this, the deaeration time can be further shortened by depressurizing the deaeration pipe between the deaeration valve and the deaeration device in advance and opening the deaeration valve (deaeration start).

  The resin molding apparatus is provided in at least one of the first mold and the second mold, and has one end opened on the mold surface and the other end opened on a side surface intersecting the mold surface. An adsorption path that adsorbs an object to be adsorbed on the mold surface, an adsorption pipe that is provided outside the mold and communicates with the adsorption path, and an adsorption device that communicates with the adsorption pipe. More preferably, the diameter of the first platen path is larger than the diameter of the suction path. According to this, the deaeration time can be further shortened by increasing (thickening) the diameter of the first platen path in accordance with the difference in the capacities of the adsorption system and the deaeration system.

  More preferably, the resin molding apparatus further includes a second platen path that is provided in the second platen so as to penetrate in the mold opening / closing direction and communicates with the deaeration path. According to this, the inside of a metal mold | die can be deaerated as a structure which assemble | attaches the 1st metal mold | die provided with the deaeration path to a 2nd platen, and assembles a 2nd metal mold | die to a 1st platen.

  A resin molding method according to one solution of the present invention includes a step of preparing a first platen having a first path and a second platen having a second path, which are arranged to face each other, and the first platen and the first platen After the first mold having the third path is assembled to the first platen and the second mold having the cavity is assembled to the second platen so that the mold can be opened and closed between the two platens, the mold is closed. Degassing the inside of the mold between the first mold and the second mold through the first path and the third path, and molding the resin in the cavity; and the first platen The first mold is assembled to the second platen so that the mold can be opened and closed between the second platen, the second mold is assembled to the first platen, and then the mold is closed. Between one mold and the second mold Internal mold was degassed via the second path and the third path, characterized in that it comprises a and a step of molding the resin in the cavity. According to this, the deaeration time inside a metal mold | die can be shortened by deaerating via the 1st path | route and 2nd path | pass which can be made into predetermined magnitude | size (cross-sectional area), and molding time is shortened. Can do.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows. According to the resin molding apparatus according to the solving means of the present invention, the molding time can be shortened.

It is explanatory drawing of the state which opened the mold of the resin molding apparatus which concerns on Embodiment 1 of this invention. It is explanatory drawing of the state which closed the mold of the resin molding apparatus shown in FIG. It is explanatory drawing of the resin molding apparatus which concerns on Embodiment 2 of this invention. It is explanatory drawing of an example (the lower mold | type has a cavity) of the resin molding apparatus which concerns on Embodiment 3 of this invention. It is explanatory drawing of the other example (when an upper mold | type has a cavity) of the resin molding apparatus which concerns on Embodiment 3 of this invention.

  In the following embodiments of the present invention, the description will be divided into a plurality of sections when necessary. However, in principle, they are not irrelevant to each other, and one of them is related to some or all of the other modifications, details, etc. It is in. For this reason, the same code | symbol is attached | subjected to the member which has the same function in all the figures, and the repeated description is abbreviate | omitted. In addition, the number of components (including the number, numerical value, quantity, range, etc.) is limited to that specific number unless otherwise specified or in principle limited to a specific number in principle. It may be more than a specific number or less. In addition, when referring to the shape of a component, etc., it shall include substantially the same or similar to the shape, etc., unless explicitly stated or in principle otherwise considered otherwise .

(Embodiment 1)
A resin molding apparatus 10 that performs compression molding according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 and FIG. 2 are explanatory views of the resin molding apparatus 10 in a state where the mold is opened and a state where the mold is closed, respectively, and a part thereof is hatched and shown as a cross section. In the present embodiment, the resin molding apparatus 10 that molds a resin molded portion (resin R) on the workpiece W will be described. The workpiece W is, for example, a substrate (for example, various carrier plates such as glass or metal, a wafer, or a wiring substrate) on which a plurality of electronic components (not shown) are arranged in a matrix. The electronic component is sealed with the resin molding part. Moreover, as shown in the figure, not only a single workpiece W may be arranged, but a plurality of workpieces W may be sealed together in a state where a plurality of workpieces W are arranged side by side.

  The resin molding apparatus 10 includes a first platen 11 and a second platen 12 (corresponding to the fixed platen 11 and the movable platen 12 in the present embodiment) disposed opposite to each other, and a known press drive mechanism. In other words, the resin molding apparatus 10 is configured as a single pressing apparatus that appropriately drives the platen, but may include a plurality of pressing apparatuses. The press drive mechanism is configured to open and close the mold by driving the second platen 12 by a known mechanism such as a drive source (for example, a servo motor) and a drive transmission mechanism (for example, a ball screw, a toggle link mechanism, etc.) not shown. A plurality of (for example, four corresponding to the four corners) tie bars 13 are provided through the outer peripheral portions (for example, four corners of the opposing surface) of the fixed platen 11 and the movable platen 12, and the movable platen 12 is moved by a press drive mechanism. It is guided by the tie bar 13 and raised and lowered with respect to the stationary platen 11.

  Moreover, the resin molding apparatus 10 includes a control unit 14 that controls each unit such as a press drive mechanism. The control unit 14 includes a CPU (Central Processing Unit) and a storage unit such as a ROM and a RAM, and the CPU reads and executes various control programs recorded in the storage unit, thereby configuring the resin molding apparatus 10. Control the operation of each part. The operation of each part is the operation of the resin molding apparatus 10. The resin molding apparatus 10 displays an input unit (not shown) configured to allow an operator to input a predetermined condition set for the control unit 14, and displays the predetermined condition or executes the control unit 14. And a display unit (not shown) for displaying the result.

  The resin molding apparatus 10 is provided between the fixed platen 11 and the movable platen 12 so as to be openable and closable with each other, and includes a first mold 15 and a second mold 16 (this embodiment) constituting the molding mold. Then, it corresponds to the upper mold | type 15 and the lower mold | type 16). That is, the mold surface 15a (also referred to as a clamping surface or parting surface) of the upper mold 15 and the mold surface 16a of the lower mold 16 are arranged to face each other. The upper mold 15 is assembled to the central portion of the fixed platen 11, and the lower mold 16 is assembled to the central portion of the movable platen 12. Thus, the upper mold 15 and the lower mold 16 are configured to be openable and closable, the lower mold 16 is close to the upper mold 15 and the mold is closed, and the lower mold 16 is separated from the upper mold 15 and the mold is opened. The In the present embodiment, a cavity 17 (a recess when the mold is opened as shown in FIG. 1) is provided on the mold surface 16a of the lower mold 16. Each of the upper mold 15 and the lower mold 16 includes a heater (not shown) controlled by the control unit 14, and the upper mold 15 and the lower mold 16 are heated to a predetermined temperature (for example, 180 ° C.). It is configured to be possible.

  In addition, the resin molding apparatus 10 includes a workpiece suction path 20, a workpiece suction pipe 21, a workpiece suction device 22, and a workpiece suction valve 23 (open / close valve), and a workpiece W (on the mold surface 15 a of the upper mold 15. The workpiece adsorption system is configured such that the object to be adsorbed) is adsorbed and set (held). The workpiece suction path 20 has one end opened to the mold surface 15a of the upper mold 15 and the other end opened to the side surface in a direction intersecting with the mold surface 15a of the upper mold 15 so that the mold surface 15a of the upper mold 15 is opened. The upper die 15 is provided so as to attract the workpiece W. Further, the work suction pipe 21 communicates (connects) with the work suction path 20 and is provided outside the mold. The workpiece suction device 22 (for example, a vacuum pump) communicates (connects) with the workpiece suction pipe 21 and is provided outside the mold, and its operation is controlled by the control unit 14. The workpiece suction valve 23 is provided in the workpiece suction pipe 21 in the middle of the workpiece suction pipe 21, and its opening / closing is controlled by the control unit 14.

  In a state where the work suction valve 23 is opened, the work W is sucked and set on the mold surface 15 a of the upper mold 15 by the work suction device 22 through the work suction pipe 21 and the work suction path 20. On the other hand, when the workpiece suction valve 23 is closed, the workpiece W is released without being attracted to the mold surface 15 a of the upper mold 15.

  The resin molding apparatus 10 includes film suction paths 24 and 25, film suction pipes 26 and 27, a film suction apparatus 30 (for example, a vacuum pump), and film suction valves 31 and 32 (open / close valves), and a cavity. The film adsorption system is configured such that the release film F (adsorbed object) is adsorbed and set (held) on the mold surface 16 a of the lower mold 16 including the inner surface of 17. As the release film F, a film material having heat resistance that can withstand the heating temperature of the molding die and easily peeling from the die surface 16a of the lower die 16 and having flexibility and extensibility is used. . Specifically, as the release film F, for example, PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, or the like is used. Further, as the release film F, a rectangular or round sheet-like film cut out outside the press mechanism may be carried and used, and provided on both sides of the upper mold 15 and the lower mold 16. Alternatively, a roll-shaped one installed on the loader hand may be unwound and used.

  The film adsorption paths 24 and 25 are provided in the lower mold 16 so that the release film F is adsorbed by the mold surface 16a of the lower mold 16, and one end thereof opens to the mold surface 16a of the lower mold 16 and the other end thereof. An opening is formed on the side surface of the lower mold 16 that intersects the mold surface 16a. The film suction pipes 26 and 27 communicate with (connect to) the film suction paths 24 and 25, respectively, and are provided outside the mold. The work suction device 22 communicates (connects) with the film suction pipes 26 and 27 and is provided outside the mold, and the drive is controlled by the control unit 14. The film suction valves 31 and 32 are provided in the middle of the film suction pipes 26 and 27 and on the film suction device 30 side, and the opening and closing are controlled by the control unit 14.

  In a state where the film adsorption valve 31 is opened, the release film F is adsorbed to the outer peripheral portion of the mold surface 16 a of the lower mold 16 by the film adsorption device 30 via the film adsorption pipe 26 and the film adsorption path 24. When the film suction valve 32 is opened, the film suction device 30 causes the release film F to pass through the film suction pipe 27 and the film suction path 25 to the inner peripheral portion (the cavity 17 of the cavity 17). Adsorbed on the inner surface). On the other hand, in a state where the film suction valves 31 and 32 are closed, the release film F is released without being attracted to the mold surface 16a of the lower mold 16.

  The resin molding apparatus 10 includes a deaeration path 33, a first platen path 34 (corresponding to the platen path 34 in the present embodiment), a deaeration pipe 35, and a deaeration device 36, and an upper mold. A degassing system is configured to degas the inside of the mold (including the cavity 17) between 15 and the lower mold 16. The deaeration path 33 is provided in the upper mold 15 so as to deaerate the inside of the mold between the upper mold 15 and the lower mold 16, one end is opened in the mold surface 15 a of the upper mold 15, and the other end is Opening is made on the surface on the fixed platen 11 side (upper surface in FIG. 1). The platen path 34 is provided in the fixed platen 11 so as to penetrate in the mold opening / closing direction, and one end side is communicated (connected) to the mold side deaeration path 33. The deaeration pipe 35 communicates (connects) with the other end of the platen path 34 and is provided outside the mold. In addition, the leakage of the air in the connection part between different members is prevented by providing seal rings, such as an O-ring, suitably in the connection location of these pipe lines. The deaeration device 36 (for example, a vacuum pump) communicates (connects) with the deaeration pipe 35 and is provided outside the mold, and the suction operation (negative pressure operation) is controlled by the control unit 14. Note that, for example, a compressor may be added to the deaeration device 36 to control the compressed air operation (positive pressure operation).

  In the present embodiment, the fixed platen 11 can be provided with a platen passage 34 having a predetermined size corresponding to a required deaeration speed (decompression speed). For this reason, the deaeration pipe 35 communicated with the platen passage 34 having a predetermined size (cross-sectional area) can be concentrated to be unified, the pipe diameter (cross-sectional area) can be increased, and the pipe resistance can be reduced. Can be reduced. Therefore, the degassing time inside the mold can be shortened, and the molding time can be shortened (productivity can be improved). In addition, by unifying the diameter of the deaeration pipe 35, the pipe resistance can be reduced and the efficiency of the deaeration device 36 can be improved. This is because by integrating a plurality of pipes together, the outer peripheral distance in the cross section of the pipe can be relatively shortened while expanding the cross sectional area of the pipe.

  In addition, the diameter of the platen path 34 connected to the deaeration pipe 35 is larger (thicker) than the diameter of the work adsorption path 20 in accordance with the difference in the capacities of the adsorption system and the deaeration system. The feeling time can be further shortened. That is, in the adsorption system, the purpose is to apply a force so as to attract the workpiece W or the release film F to the mold surface. In the deaeration system, the mold between the upper mold 15 and the lower mold 16 is used. It is necessary to exhaust the internal air or the like until a predetermined pressure reduction degree (vacuum degree) is reached. In this case, as the size of the workpiece W to be formed becomes larger, the size of the mold surface also becomes relatively larger, so that the volume of space that must be discharged (in other words, the amount of air) also increases. For this reason, being able to relatively increase the diameter of the platen passage 34 connected to the deaeration pipe 35 is highly effective in order to reach the degree of vacuum required for the large-sized workpiece W at an early stage. In the present embodiment, the upper mold 15 is provided with a deaeration path 33, the upper mold 15 is assembled at the center of the fixed platen 11, and the platen path 34 is provided at the center of the fixed platen 11. According to this, the deaeration path 33 can be branched from the center part of the upper mold | type 15 by equal length.

  The resin molding apparatus 10 includes a deaeration valve 37 (open / close valve) provided in the middle of the deaeration pipe 35 and on the platen path 34 side (deaeration path 33 side). The opening and closing of the deaeration valve 37 is controlled by the control unit 14. By providing the deaeration valve 37 on the platen path 34 side, the length of the deaeration pipe 35 from the deaeration valve 37 to the platen path 34 can be shortened. Thereby, the deaeration amount of the deaeration pipe 35 between the platen path 34 and the deaeration valve 37 can be reduced, and the deaeration time inside the mold can be further shortened. Thus, the deaeration valve 37 is preferably installed in the vicinity of the upper mold 15. In FIG. 1 and the like, the deaeration valve 37 is shown separated from the fixed platen 11 for clarity, but is fixed to the fixed platen 11.

  Regarding the deaeration system, the control unit 14 controls the deaeration valve 37 in a state where the deaeration pipe 36 between the closed deaeration valve 37 and the deaeration device 36 is decompressed by the deaeration device 36. It can be controlled to open and degas inside the mold. In this case, the deaeration pipe 35 between the deaeration valve 37 and the deaeration device 36 is caused to function as a vacuum tank (chamber). According to this, by depressurizing the deaeration pipe 35 in advance, the deaeration pipe 35, the deaeration path 33 and the platen path 34 can be connected by opening the deaeration valve 37. The pressure reduction can be started without depending on the operation of the deaerator 36. In addition, the required degree of vacuum can be reached at an early stage by continuing the deaeration with the deaeration device 36 to the required degree of vacuum. Moreover, since what functions as a vacuum tank is the deaeration piping 35, the freedom degree of installation in the housing | casing of the resin molding apparatus 10 is high. In addition, as described above, the deaeration valve 37 is installed in the vicinity of the upper die 15 (fixed platen 11), which makes the deaeration pipe 35 that can be depressurized in advance between the deaeration valve 37 and the deaeration device 36 longer. This is preferable for shortening the deaeration time. In addition, the deaeration time inside the mold can be further shortened without providing a separate vacuum tank space inside the housing of the resin molding apparatus 10. Of course, a separate vacuum tank may be used together.

  For example, in the resin molding apparatus 10 according to the present embodiment, the capacity of the deaeration pipe 35 between the deaeration valve 37 and the deaeration apparatus 36 is such that the inside of the mold between the upper mold 15 and the lower mold 16 is removed. The air path 33, the platen path 34, and the deaeration pipe 35 (between the platen path 34 and the deaeration valve 37) are configured to have a combined capacity or more. According to this, the deaeration pipe 35 between the deaeration valve 37 and the deaeration device 36 is depressurized in advance, and the deaeration pipe 37 is opened (starting the deaeration). Due to the function as a vacuum tank (chamber), the degassing time inside the mold can be further shortened. Further, in the work adsorption system using the work adsorption device 22 and the film adsorption system using the film adsorption device 30 and the deaeration system using the deaeration device 36, the deaeration system has a higher apparatus capacity (suction capacity). Thus, the deaeration time inside the mold can be shortened.

  By the way, the upper die 15 constituting the molding die for compression molding is configured to include a base 40 and a chase 41 to be assembled in the concave portion of the base 40. The upper mold 15 is assembled to the fixed platen 11 by the base 40. The upper die 15 includes a seal portion 42 (for example, an O-ring) provided so as to surround the central portion of the mold surface 15a. A cavity 17 is provided at the center of the mold surface 16a of the lower mold 16 facing the center of the mold surface 15a of the upper mold 15. For this reason, according to the sealing part 42, the mold 15 including the cavity 17 can be sealed (form a chamber) by sealing between the upper mold 15 and the lower mold 16 in a closed state.

  Further, on the mold surface 15 a of the upper mold 15, a deaeration path 33 is opened inside the seal portion 42, and the work suction path 20 is opened inside the deaeration path 33. In addition, a deaeration path 33 is provided between the base 40 and the chase 41 so as to communicate with each other at a central portion until the diameter increases, and a work suction path 20 is provided in the chase 41. In the base 40, a part of the deaeration path 33 is provided so as to penetrate in the mold opening / closing direction (thickness direction). The base 40 is assembled to the fixed platen 11 so that a part of the air path 117 communicates with the platen path 34. The chase 41 is also provided with the other part of the deaeration path 33 that extends in the mold opening / closing direction (thickness direction) and then branches in a direction intersecting with the mold opening / closing direction and opens at the mold surface 15a. The chase 41 is assembled to the base 40 so that the other part of the deaeration path 33 communicates with a part of the deaeration path 33 of the base 40.

  Further, the lower mold 16 constituting the molding die for compression molding includes a base 50, a chase 51 assembled to the concave portion of the base 50, a cavity piece 52 assembled to the chase 51, and the chase 51 inserted therein. 51 and a clamper 53 assembled to 51. In the present embodiment, the lower mold 16 is provided with a cavity 17 (a concave portion when the mold is opened), but the bottom (back) of the cavity 17 is formed by the upper surface of the cavity piece 52, and the side of the cavity 17 is the clamper 53. It is comprised by the inner surface (inner wall surface of a through-hole). On the mold surface 16 a of the lower mold 16 (the upper surface of the clamper 53), the film suction path 24 is opened, and the film suction path 25 is opened at the bottom corner of the cavity 17. By the suction operation of the work suction device 22, the release film F is sucked and set (held) on the mold surface 16 a following the shape of the cavity 17.

  The clamper 53 surrounds the cavity piece 52 and is assembled to the chase 51 through an elastic portion 54 (for example, a spring) so as to be movable up and down (advance and retreat). In the lower mold 16, the cavity piece 52 and the clamper 53 are relatively movable, and the depth from the opening of the cavity 17 (that is, the volume of the cavity 17) is variable. A gap is formed between the outer side surface of the cavity piece 52 and the inner side surface of the clamper 53, but the lower mold 16 has a seal portion 55 (for example, a seal portion 55) that seals the gap to form a chamber (sealed space). O-ring).

  Next, an operation method of the resin molding apparatus 10 (control method of the control unit 14) will be described, and a manufacturing method (molding method) of the molded product will be described.

  First, as shown in FIG. 1, in a state where the upper mold 15 and the lower mold 16 are spaced apart and opened, the work W carried into the mold by a loader (not shown) is used as the mold of the upper mold 15. It is adsorbed and set (held) on the mold surface 15a. Specifically, the workpiece suction device 22 is operated by the control unit 14, the workpiece suction valve 23 is opened, and the workpiece W is sucked and set on the mold surface 15 a through the workpiece suction pipe 21 and the workpiece suction path 20. . In addition, it is good also as a structure which can hold | maintain and set the outer periphery of the workpiece | work W with a nail | claw-shaped holding member instead of workpiece | work adsorption | suction, and these may be used together.

  Further, the release film F carried into the mold by a film transport unit (not shown) is attracted to the mold surface 16 a of the lower mold 16 including the cavity 17 and set (held). Specifically, the film adsorption device 30 is operated by the control unit 14, the film adsorption valve 31 is first opened, and the release film F is adsorbed to the outer peripheral portion of the mold surface 16a through the film adsorption pipe 26 and the film adsorption path 24. The Subsequently, the film adsorption valve 32 is opened, and the release film F is adsorbed and set on the central portion of the mold surface 16a (the inner surface of the cavity 17) through the film adsorption pipe 27 and the film adsorption path 25.

  Subsequently, the resin R is supplied into the cavity 17 through the release film F. Since the molding die is heated to a predetermined temperature, the resin R is melted on the inner surface of the cavity 17 (the upper surface of the cavity piece 52). As the resin R, for example, liquid, granule, powder, or sheet can be used. The resin R can be supplied into the cavity 17 by placing the resin R on the center of the release film F outside the mold and carrying it into the mold together with the release film F.

  Subsequently, the upper die 15 and the lower die 16 are brought close to each other by a press drive mechanism (the operation is indicated by a white arrow in FIG. 1), and the seal portion 42 provided on the mold surface 15a of the upper die 15 is provided. The lower mold 16 is brought into contact with the mold surface 16a (the upper surface of the clamper 53) (that is, a seal ring touch). Thereby, the inside of the mold including the cavity 17 is hermetically sealed and configured as a chamber (sealed space).

  For example, after the deaerator 36 is operated by the control unit 14 and the inside of the mold is configured as a chamber, the deaeration valve 37 is opened, and the inside of the mold is removed through the deaeration pipe 35, the platen path 34 and the deaeration path 33. The pressure is reduced. In the present embodiment, a platen passage 34 having a predetermined size corresponding to the deaeration speed (depressurization speed) is provided, and the deaeration pipe 35 communicating with the deaeration path 33 is concentrated on the platen path 34 to provide a single line. It has become. That is, the pipe diameter (cross-sectional area) of the deaeration pipe 35 is increased or the pipe resistance is reduced. Thereby, the deaeration time inside a metal mold | die can be shortened, and molding time can be shortened (productivity is improved).

  In the present embodiment, the deaeration pipe 35 between the deaeration device 36 and the deaeration valve 37 is depressurized by the deaeration device 36 before the deaeration valve 37 is opened. The deaeration valve 37 is opened to deaerate the inside of the mold. According to this, the deaeration pipe 35 between the deaeration device 36 and the deaeration valve 37 can function as a vacuum tank, and the deaeration time inside the mold can be further shortened without providing a separate vacuum tank. can do.

  Subsequently, the upper die 15 and the lower die 16 are brought closer to each other by a press drive mechanism (indicated by the white arrow in FIG. 2), and as shown in FIG. 2, the upper die 15 (chase 41) and the lower die 16 are moved downward. The workpiece W is clamped via the release film F with the mold 16 (clamper 53). As a result, the opening of the cavity 17 (concave portion) is closed by the workpiece W. In addition, by forming an air vent groove (not shown) on the upper surface of the clamper 53, the inside of the cavity 17 can be deaerated and depressurized even after the release film F is clamped.

  Subsequently, the control unit 14 closes the deaeration valve 37 to stop the deaeration (decompression) inside the mold, and brings the upper mold 15 and the lower mold 16 closer to each other (clamping). The resin R filling the cavity 17 is compressed. At this time, since the deaeration valve 37 is closed, the resin R is prevented from entering the deaeration path 33. Subsequently, the resin R filled in the cavity 17 is heat-cured for a predetermined time in a state where the resin R is held (in a molding position). Subsequently, an atmosphere valve (not shown) provided in a deaeration pipe 35 between the deaeration valve 37 and the platen passage 34 is opened to release the atmosphere, and the upper mold 15 and the lower mold 16 are separated from each other to form a mold. After opening, the workpiece W is taken out (conveyed) outside the mold. Furthermore, the molded product is completed by thermosetting (post-curing) the resin molded portion of the workpiece W taken out as post-processing for a predetermined time as required.

(Embodiment 2)
In the first embodiment, the resin molding apparatus 10 that performs compression molding has been described. In the present embodiment, a resin molding apparatus 10A that performs transfer molding will be described with reference to FIG. FIG. 3 is an explanatory view of the resin molding apparatus 10A in a state where the mold is opened, and a part thereof is hatched and shown as a cross section. The resin molding apparatus 10A is provided with a deaeration system without a work adsorption system and a film adsorption system. Of course, in the resin molding apparatus 10A for performing transfer molding, a workpiece suction system and a film suction system (not shown) may be provided.

  Similarly to the first embodiment, the resin molding apparatus 10A includes a fixed platen 11 and a movable platen 12, a known press drive mechanism, an upper mold 15 and a lower mold 16, and a space between the fixed platen 11 and the movable platen 12. Thus, the upper die 15 and the lower die 16 are provided so as to face each other so that the die can be opened and closed by a press drive mechanism. Moreover, the resin molding apparatus 10A includes a control unit 14 that controls each unit such as a press drive mechanism.

  In the resin molding apparatus 10A that performs transfer molding, the upper mold 15 is configured such that a cull 60, a gate runner 61, and a cavity 62 (mold opened) are provided so as to communicate with the mold surface 15a of the upper mold 15 (the lower surface of the chase 41). Then, a recess) is provided. On the other hand, the lower die 16 includes a pot 63 that passes through the lower die 16 and is opposed to the cull 60, a plunger 64 provided in the pot 63, and a known transfer mechanism 65 that raises and lowers the plunger 64. In the resin molding apparatus 10 </ b> A, the workpiece W is set on the mold surface 16 a of the lower mold 16 so as to face the cavity 62 of the upper mold 15.

  The resin molding apparatus 10 </ b> A includes a deaeration path 33 provided in the upper mold 15, a platen path 34 provided in the fixed platen 11, a deaeration pipe 35 and a deaeration apparatus 36 provided outside the mold. Yes. In the resin molding apparatus 10A, the deaeration path 33, the platen path 34, the deaeration pipe 35, and the deaeration apparatus are evacuated so that the inside of the mold (including the cavity 62) between the upper mold 15 and the lower mold 16 is deaerated. 36 is communicated to form a deaeration system. As in the first embodiment, the platen path 34 is provided in the fixed platen 11 with a predetermined size so as to penetrate in the mold opening / closing direction. For this reason, the deaeration pipe 35 communicated with the deaeration path 33 can be concentrated and integrated with the platen path 34, and the pipe diameter (cross-sectional area) can be increased, or the pipe resistance can be reduced. can do. Therefore, the deaeration time inside the mold can be shortened, and the molding time can be shortened.

  Further, the resin molding apparatus 10A includes a deaeration valve 37 (open / close valve) provided in the middle of the deaeration pipe 35 and on the deaeration path 33 side (platen path 34 side). The opening and closing of the deaeration valve 37 is controlled by the control unit 14. By providing the deaeration valve 37 on the platen path 34 side (the deaeration path 33 side), the length of the deaeration pipe 35 from the deaeration valve 37 to the platen path 34 can be shortened. Thereby, the deaeration amount of the deaeration path 33 and the deaeration pipe 35 between this and the deaeration valve 37 can be reduced, and the deaeration time inside the mold can be further shortened.

  Next, an operation method of the resin molding apparatus 10A (control method of the control unit 14) will be described, and a method of manufacturing a molded product (molding method) will be described. First, in a state where the upper mold 15 and the lower mold 16 are spaced apart and opened, the work W carried into the mold by a loader (not shown) is set (arranged) on the mold surface 16a of the lower mold 16. ) Further, the resin R is supplied into the pot 63 in which the plunger 64 is retracted from the mold surface. At this time, since the molding die is heated to a predetermined temperature, the resin R supplied into the pot 63 is melted.

  Subsequently, the upper die 15 and the lower die 16 are brought close to each other by a press drive mechanism (the operation is indicated by a white arrow in FIG. 3), and the seal portion 42 provided on the mold surface 15a of the upper die 15 is provided. The lower die 16 is brought into contact with the mold surface 16a (ie, seal ring touch). Thereby, the inside of the mold including the cavity 62 is hermetically sealed and configured as a chamber (sealed space).

  After the inside of the mold is configured as a chamber, the deaeration pipe 35, the platen path 34, and the deaeration path with the deaeration valve 37 opened by the operation (suction) of the deaeration device 36 controlled by the control unit 14 The inside of the mold is deaerated through 33 to reduce the pressure. As described above, the deaeration pipe 35 communicating with the deaeration path 33 is concentrated on the platen path 34 so as to be unified, so that the deaeration time inside the mold can be shortened and the molding time is reduced. Can be shortened (productivity can be improved).

  In the present embodiment, the deaeration pipe 35 between the deaeration device 36 and the deaeration valve 37 is depressurized by the deaeration device 36 before the deaeration valve 37 is opened. The deaeration valve 37 is opened to deaerate the inside of the mold. According to this, the deaeration pipe 35 between the deaeration device 36 and the deaeration valve 37 can function as a vacuum tank, and the deaeration time inside the mold can be further shortened without providing a separate vacuum tank. can do.

  Subsequently, the upper die 15 and the lower die 16 are brought closer to each other by the press drive mechanism, the workpiece W is clamped by the upper die 15 and the lower die 16 and the die is closed. As a result, the opening of the cavity 62 (concave portion) is closed by the workpiece W. Moreover, the seal part 42 is compressed by the upper mold | type 15 and the lower mold | type 16, and the airtightness inside a metal mold | die improves.

  Subsequently, the control unit 14 closes the deaeration valve 37 to stop the deaeration (decompression) inside the mold, advances the plunger 64 in the pot 63 to push out the resin R, and the cal 60 and the gate runner 61. The resin R is pumped to the cavity 62 through the, and the cavity 62 is filled with the resin R. At this time, since the deaeration valve 37 is closed, the resin R is prevented from entering the deaeration path 33.

  Subsequently, the resin R filled in the cavity 62 is thermally cured for a predetermined time in a state where the pressure is maintained. Subsequently, an atmosphere valve (not shown) provided in a deaeration pipe 35 between the deaeration valve 37 and the platen passage 34 is opened to release the atmosphere, and the upper mold 15 and the lower mold 16 are separated from each other to form a mold. After opening, the workpiece W is taken out (conveyed) outside the mold. Further, as a post-processing, the resin molded portion of the workpiece W is thermally cured (post-cured) for a predetermined time to complete a molded product.

(Embodiment 3)
In the first embodiment, the resin molding apparatus 10 in which the first platen path 34 is provided so as to penetrate only the first platen 11 in the mold opening / closing direction has been described. In the present embodiment, a configuration example having the same configuration in both platens will be described. Specifically, referring to FIGS. 4 and 5, a resin molding apparatus 10 </ b> B in which a second platen path 34 </ b> A (corresponding to the platen path 34 </ b> A) is provided so as to penetrate the second platen 12 in the mold opening / closing direction as well. I will explain. 4 and 5 are explanatory views of the resin molding apparatus 10B in a state where the mold is opened, and a part thereof is hatched and shown as a cross section. In this resin molding apparatus 10B, the first mold 15 and the second mold 16 can be assembled upside down. In FIG. 4, a cavity 17 is provided in the lower mold (second mold 16). FIG. 5 shows a case of performing “upper cavity molding” in which a cavity 17 is provided in the upper mold (second mold 16).

  Similarly to the first embodiment, the resin molding apparatus 10B includes a fixed platen 11 and a movable platen 12, a known press drive mechanism, a first mold 15 and a second mold 16, and the fixed platen 11 and the movable platen 11 are movable. A first mold 15 and a second mold 16 are provided between the platens 12 so as to face each other so that the mold can be opened and closed by a press drive mechanism. In FIG. 4, the first mold 15 is assembled to the fixed platen 11 and the second mold 16 is assembled to the movable platen 12. In FIG. 5, the first mold 15 is the movable platen 12 and the second mold 16 is the fixed platen 11. Assembled into. In addition, the resin molding apparatus 10B includes a control unit 14 that controls each unit such as a press drive mechanism.

  Further, in the resin molding apparatus 10B, the mold interior (including the cavity 17) between the first mold 15 and the second mold 16 is removed in both of the lower cavity molding and the upper cavity molding. The deaeration path 33, the platen paths 34 and 34A, the deaeration pipes 35 and 35A, and the deaeration device 36 are communicated with each other so that a deaeration system is configured. In addition to the above-described deaeration path 33, platen path 34, deaeration pipe 35, and deaeration device 36, the platen path 34A is provided on the movable platen 12 with a predetermined size so as to penetrate in the mold opening and closing direction. A pipe 35A communicates (connects) with the platen path 34A and is provided outside the mold. For this reason, the deaeration pipe | tube 35 connected with the deaeration path 33 in an upper mold | type (FIG. 4) can be concentrated with respect to the platen path 34, and can be unified. Further, the deaeration pipe 35A communicating with the deaeration path 33 in the lower mold (FIG. 5) can be concentrated to the platen path 34A to be unified. Thereby, the piping diameter (cross-sectional area) of deaeration piping 35 and 35A can be enlarged, or piping resistance can be reduced. Therefore, the deaeration time inside the mold can be shortened, and the molding time can be shortened.

  The resin molding apparatus 10B includes a deaeration valve 37A (open / close valve) provided in the middle of the deaeration pipe 35A and on the platen path 34A side (the deaeration path 33 side in FIG. 5). As with the deaeration valve 37, the opening and closing of the deaeration valve 37A is controlled by the control unit 14, and is provided on the platen path 34A side, so that the length of the deaeration pipe 35A from the deaeration valve 37A to the platen path 34A is increased. The length can be shortened. Thereby, even when the cavity 17 is provided in the upper mold (FIG. 5), the deaeration amount of the deaeration pipe 35A between the platen path 34A and the deaeration valve 37A can be reduced, and the mold The internal deaeration time can be further shortened. Further, similarly to the case where the lower mold is provided with the cavity 17 (FIG. 4), even when the upper mold is provided with the cavity 17 (FIG. 5), the deaeration valve 37A and the deaeration device 36 closed by the control unit 14 are provided. The deaeration pipe 35A between the deaeration valve 37A and the deaeration device 36 can function as a vacuum tank by setting the inside of the deaeration pipe 35A between the deaeration and the deaeration device 36 to a reduced pressure. .

  Moreover, the resin molding apparatus 10B includes switching valves 38 and 38A provided on the deaeration device 36 side in the middle of the deaeration pipes 35 and 35A. The switching valves 38 and 38A are controlled to open and close by the control unit 14 and function as opening / closing valves. When the cavity 17 is provided in the lower mold (FIG. 4), the switching valve 38 is open and the switching valve 38A is closed. When the cavity 17 is provided in the upper mold (FIG. 5), the switching valve 38 is closed and the switching valve 38A is opened.

  Thus, although this embodiment demonstrates the case where the switching valves 38 and 38A are provided, the switching valves 38 and 38A do not need to be provided. For example, when a branch pipe (T-shaped or Y-shaped) for connecting the deaeration pipes 35 and 35A on the deaerator 36 side is provided and the cavity 17 is provided in the lower mold (FIG. 4), the deaeration valve 37A. Is always closed, and the deaeration valve 37 may be always closed when the cavity 17 is provided in the upper mold (FIG. 5). According to this, the whole branch piping which combined the capacity | capacitance of the deaeration piping 35 and the deaeration piping 35A can be functioned as a vacuum tank, and the deaeration time inside a metal mold | die can be shortened more.

  Further, the resin molding apparatus 10B includes a workpiece suction path 20, workpiece suction pipes 21 and 21A, a workpiece suction device 22, and workpiece suction valves 23 and 23A (open / close valves), and a lower cavity molding and an upper cavity. In any case of molding, the workpiece W can be adsorbed. Specifically, as shown in FIG. 4, the workpiece suction system is configured such that the workpiece W is sucked and set (held) on the mold surface 15 a of the first mold 15. In addition to the workpiece suction path 20, the workpiece suction pipe 21, the workpiece suction device 22, and the workpiece suction valve 23, the workpiece suction pipe 21A is provided outside the mold, and the workpiece suction valve 23A is in the middle of the workpiece suction pipe 21A. Provided on the workpiece suction device 22 side, and opening and closing is controlled by the control unit 14. And in the state which has the workpiece | work adsorption path 20 in an upper mold | type (FIG. 4), the workpiece | work adsorption path 20 and the workpiece | work adsorption | suction piping 21 are connected by a coupling. Further, in a state where the work suction path 20 is in the lower mold (FIG. 5), the work suction path 20 and the work suction pipe 21A are communicated by a joint. As described above, since the workpiece suction pipes 21 and 21A are provided in advance in the fixed platen 11 and the movable platen 12 so as to be selectively connected to the workpiece suction path 20 of the chase 41, the workpiece suction path 20 is simply connected. It is possible to perform the suction of the workpiece W corresponding to each case of the lower cavity molding and the upper cavity molding only by changing.

  In the resin molding apparatus 10B, the film suction paths 24 and 25, the film suction pipes 26, 27, 26A and 27A, the film suction apparatus 30, and the film suction valves 31, 32, 31A and 32A (open / close valves) are provided. The workpiece W can be adsorbed in both cases of lower cavity molding and upper cavity molding. Specifically, as shown in FIG. 4, the film adsorption system is configured so that the release film F is adsorbed and set (held) on the mold surface 16 a of the second mold 16 including the inner surface of the cavity 17. . In addition to the film suction paths 24 and 25, the film suction pipes 26 and 27, the film suction device 30, and the work suction valves 31 and 32, the film suction pipes 26A and 27A are provided outside the mold, 32A is provided in the middle of the film adsorption pipes 26A and 27A and is provided on the film adsorption device 30 side, and the control unit 14 controls the opening and closing. And in the state which has the film adsorption paths 24 and 25 in a lower mold | type (FIG. 4), the film adsorption path 24 and the film adsorption piping 26 are connected by the coupling, and the film adsorption path 25 and the film adsorption piping 27 are communicated by the coupling. Is done. In a state where the upper mold (FIG. 5) has the film suction paths 24, 25, the film suction path 24 and the film suction pipe 26A are communicated by a joint, and the film suction path 25 and the film suction pipe 27A are communicated by a joint. . As described above, the film suction pipes 26, 27, 26A, and 27A are provided in advance in the fixed platen 11 and the movable platen 12 so that they can be connected to the film suction paths 24 and 25 provided in the chase 51 (specifically, the clamper 53). Therefore, the release film F can be adsorbed corresponding to each of the lower cavity molding and the upper cavity molding simply by reconnecting the film adsorption paths 24 and 25.

  The operation method of the resin molding apparatus 10B (control method of the control unit 14) is the same as the case described in the first embodiment when the cavity 17 is provided in the lower mold (second mold 16) (FIG. 4). It is. Further, in the resin molding apparatus 10B, the case where the first mold 15 and the second mold 16 are turned upside down and the cavity 17 is provided in the upper mold (second mold 16) (FIG. 5) is basically the same. Become.

  Here, an example of a resin molding method will be outlined. First, a first platen 11 having a first platen path 34 (first path) and a second platen 12 having a second platen path 34A (second path) that are arranged to face each other are prepared. Next, when the lower cavity is formed, the first mold 15 having the deaeration path 33 (third path) is provided between the first platen 11 and the second platen 12 so that the mold can be opened and closed. The second die 16 having the cavity 17 is assembled to the platen 11 and assembled to the second platen 12 (FIG. 4). Thereafter, the inside of the mold between the closed first mold 15 and second mold 16 is deaerated through the first platen path 34 and the deaeration path 33, and the resin R is molded in the cavity 17.

  Further, when forming the upper cavity, the first mold 15 is assembled to the second platen 12 so that the mold can be opened and closed between the first platen 11 and the second platen 12, and the second mold 16 is mounted. It is assembled to the first platen 11 (FIG. 5). Thereafter, the inside of the mold between the closed first mold 15 and second mold 16 is deaerated through the second platen path 34 </ b> A and the deaeration path 33, and the resin R is molded in the cavity 17.

  With such a configuration, both the lower cavity molding and the upper cavity molding can be performed with only one set of molds constituted by the first mold 15 and the second mold 16. 4 and 5 is used to form a mold composed of a first mold 15 and a second mold 16 dedicated to lower cavity molding and upper cavity molding. One set may be used.

  Although the present invention has been specifically described above based on the embodiments, it is needless to say that the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

  In the first embodiment, the case where the work suction device and the film suction device are separately provided in each of the work suction system and the film suction system has been described. Not only this but a common adsorption | suction apparatus can also be provided with a workpiece | work adsorption system and a film adsorption system. Although it may be possible to use a common degassing system for the degassing system, the capacity of the degassing system becomes higher than the capacity of the adsorption system to shorten the degassing time. Are preferably distinct.

  In the first embodiment, the case where the first platen is used as the fixed platen and the second platen is used as the movable platen has been described. Not limited to this, the first platen can be a movable platen, and the second platen can be a fixed platen. Moreover, although the above-mentioned embodiment demonstrated the structure which guides these by the tie bar 13 penetrating the 1st platen 11 and the 2nd platen 12, this invention is not limited to this. For example, it is good also as a structure provided with a pair of side part holding member provided in the both sides | surfaces of the 1st platen 11 and the 2nd platen 12 instead of the tie bar 13. FIG. In this case, both ends of the first platen 11 may be fixed with a pair of side holding members, and the second platen 12 may be moved up and down within a frame configured with the pair of side holding members. Also in this case, the same effect as the above-described embodiment can be obtained.

  An automatic machine configuration that has a plurality of configurations of the resin molding apparatus 10 and the like shown in FIGS. 1 to 5 and has a function of supplying a workpiece W or resin R and a function of accommodating a molded product, and can automatically mold the workpiece. In the above, the work suction device 22 and the film suction device 30 may be shared among a plurality of devices. Thus, for example, when the workpiece adsorbing device 22 or the film adsorbing device 30 is operated and brought into a predetermined adsorbing state in workpiece adsorbing or film adsorbing and the corresponding valve can be closed and the adsorbing state can be maintained, the number of adsorbing devices can be shared. The cost can be reduced.

DESCRIPTION OF SYMBOLS 10 Resin molding apparatus 11 1st platen 12 2nd platen 15 1st metal mold | die 16 2nd metal mold 33 Deaeration path 34 Platen path 35 Deaeration piping 36 Deaeration apparatus

Claims (8)

A first platen and a second platen disposed opposite to each other;
A first mold and a second mold that are provided between the first platen and the second platen so as to be openable and closable with each other;
A degassing path for degassing the inside of the mold between the first mold and the second mold;
A first platen path provided in the first platen so as to penetrate in the mold opening and closing direction and communicated with the deaeration path;
A deaeration pipe which is provided outside the mold and communicates with the first platen path, and a deaeration device which communicates with the deaeration pipe;
A resin molding apparatus comprising: The resin molding apparatus according to claim 1,
The degassing path is provided in the first mold, the first mold is assembled to a central part of the first platen, and the first platen path is provided in the central part of the first platen. Resin molding equipment. The resin molding apparatus according to claim 1 or 2,
A resin molding apparatus further comprising a deaeration valve provided in the middle of the deaeration pipe and on the first platen path side. In the resin molding apparatus according to claim 3,
A control unit for controlling the deaeration device and the deaeration valve;
The control unit opens the degassing valve and degass the inside of the mold in a state where the degassing pipe is depressurized by the degassing device between the closed degassing valve and the degassing device. A resin molding apparatus. The resin molding apparatus according to claim 3 or 4,
The capacity of the deaeration pipe between the deaeration valve and the deaeration device is the interior of the mold, the deaeration path, the first platen path, the first platen path, and the deaeration valve. The resin molding apparatus characterized by having a capacity equal to or greater than the combined capacity of the deaeration pipe. In the resin molding apparatus as described in any one of Claims 1-5,
Provided in at least one of the first mold and the second mold, one end is opened in the mold surface, and the other end is opened in a side surface intersecting the mold surface, and is covered by the mold surface. An adsorption path for adsorbing adsorbate, and
An adsorption pipe provided outside the mold and communicated with the adsorption path and an adsorption device communicated with the adsorption pipe;
Further comprising
A resin molding apparatus, wherein a diameter of the first platen path is larger than a diameter of the suction path. In the resin molding apparatus as described in any one of Claims 1-6,
A resin molding apparatus, further comprising a second platen path provided in the second platen so as to penetrate in a mold opening / closing direction and communicating with the deaeration path. Providing a first platen having a first path and a second platen having a second path, disposed opposite each other;
A first mold having a third path is assembled to the first platen so that the mold can be opened and closed between the first platen and the second platen, and a second mold having a cavity is attached to the second platen. After the assembly, the inside of the mold between the closed first mold and the second mold is deaerated through the first path and the third path, and the resin is molded in the cavity. Process,
After the first mold is assembled to the second platen and the second mold is assembled to the first platen so that the mold can be opened and closed between the first platen and the second platen, the mold Degassing the inside of the mold between the closed first mold and the second mold through the second path and the third path, and molding a resin in the cavity;
A resin molding method comprising:

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