CN110137101A - Disconnecting device and the manufacturing method for cutting off product - Google Patents
Disconnecting device and the manufacturing method for cutting off product Download PDFInfo
- Publication number
- CN110137101A CN110137101A CN201811442664.8A CN201811442664A CN110137101A CN 110137101 A CN110137101 A CN 110137101A CN 201811442664 A CN201811442664 A CN 201811442664A CN 110137101 A CN110137101 A CN 110137101A
- Authority
- CN
- China
- Prior art keywords
- cutting
- room
- air pressure
- pressure
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Abstract
Even if the present invention provides a kind of after cutting object cutting, the also powerful disconnecting device of retentivity on the table.In order to reach the purpose, disconnecting device of the invention is characterized in that: including workbench (10), air pressure holding mechanism and cutting mechanism (30), attracted by workbench (10) and keeps cutting object (20), the air pressure on the outside of the workbench (10) for maintaining cutting object (20) is remained into the air pressure higher than atmospheric pressure by the air pressure holding mechanism, the cutting object (20) of workbench (10) is held in by cutting mechanism (30) cutting.
Description
Technical field
The present invention relates to the manufacturing methods of a kind of disconnecting device and cutting product.
Background technique
The Production Example of semiconductor packages can such as be manufactured by cutting off package substrate.In the cutting of package substrate,
Such as substrate on the table and can be cut off (patent document 1 etc.) by attracting holding.
Existing technical literature
Patent document
Patent document 1: special open 2011-114145 bulletin
Summary of the invention
Subject to be solved by the invention
But it if the size of semiconductor packages (product) manufactured by cutting package substrate is smaller, is kept by attraction
Power on to workbench is possible to can be insufficient.Specifically, the product after cutting is possible to fall off and cause from workbench
Decrease in yield, product are bad etc..
It then, also can be on the table even if the object of the present invention is to provide one kind after object is cut off in cutting
The disconnecting device of powerful retentivity and the manufacturing method for cutting off product.
The method to solve the problem
In order to reach the purpose, disconnecting device of the invention is characterized in that:
Comprising workbench, air pressure holding mechanism, cutting mechanism,
Attract and keep cutting object by the workbench,
The air pressure on the outside of the workbench for maintaining the cutting object is kept by the air pressure holding mechanism
For the air pressure higher than atmospheric pressure,
The cutting object on the workbench is kept by cutting mechanism cutting.
The manufacturing method of cutting product of the invention is characterized in that:
It cuts off object and keeps step, attracted by workbench and keep cutting object；
Air pressure keeps step, and the air pressure on the outside of the workbench for maintaining the cutting object is remained and compares atmosphere
Press high air pressure；
Step is cut off, cutting keeps the cutting object on the workbench.
The effect of invention
Even if being capable of providing one kind according to the present invention after object is cut off in cutting, can also have on the table powerful
The disconnecting device of retentivity and the manufacturing method for cutting off product.
Detailed description of the invention
Fig. 1 is the step sectional view for schematically showing a step in cutting product manufacturing method an example of the present invention.
Fig. 2 is the step sectional view for schematically showing another step in cutting product manufacturing method identical with Fig. 1.
Fig. 3 is the step sectional view for schematically showing another step in cutting product manufacturing method identical with Fig. 1.
Fig. 4 is the step sectional view for schematically showing another step in cutting product manufacturing method identical with Fig. 1.
Fig. 5 is the step sectional view for schematically showing another step in cutting product manufacturing method identical with Fig. 1.
Fig. 6 is the step sectional view for schematically showing another step in cutting product manufacturing method identical with Fig. 1.
Fig. 7 is the plan view for schematically showing the structure of an example of disconnecting device of the present invention.
Fig. 8 is the plan view for schematically showing another structure of disconnecting device of the present invention.
Specific embodiment
Then, the present invention is described in more detail by way of example.But the present invention is not limited to following explanations.
Disconnecting device of the invention may be, for example,
Cutting room is further included,
In the cutting room, by the air pressure holding mechanism, the air pressure on the outside of the workbench is remained than big
The state of the high air pressure of air pressure keeps the cutting object on the workbench to be cut off and manufactured by the cutting mechanism
The disconnecting device of cutting product.
Disconnecting device of the invention may be, for example,
Cutting room, compression chamber, pressure-reducing chamber are further included,
Indoor in the cutting, the cutting object is cut off and manufactures cutting product,
Cutting object of the compression chamber's configuration in the cutting room moves in side,
Cutting product of the pressure-reducing chamber configuration in the cutting room move out side,
The compression chamber is connected with the cutting room, and remains ratio in the compression chamber and the cutting chamber interior
In the state of the high air pressure of atmospheric pressure, the cutting object is moved in from the compression chamber to the cutting room,
In the state that the pressure-reducing chamber is connected with the cutting room, the cutting product are moved out from the cutting room to described
Then pressure-reducing chamber disconnects the connection in the pressure-reducing chamber and the cutting room, and in the pressure-reducing chamber inner pressure relief to than described
It cuts off when object cutting in the state of lower air pressure, the cutting product is moved out from the inside in the pressure-reducing chamber to outside
Disconnecting device.
Disconnecting device of the invention may be, for example,
The air pressure holding mechanism includes storage room, operation portion,
There are the workbench and the cutting mechanism in the storage room internal reservoir,
By the operation portion, the air pressure inside the storage room is remained to the cutting dress of the air pressure higher than atmospheric pressure
It sets.
Disconnecting device of the invention for example can will maintain the cutting object by the air pressure holding mechanism
The workbench on the outside of air pressure be maintained at 1.1 × 105Pa or more.
The manufacturing method of cutting product of the invention may be, for example,
Using cutting room,
The manufacturing method of the cutting product of the cutting step is carried out in the cutting room.
The manufacturing method of cutting product of the invention may be, for example,
Using cutting room, compression chamber, pressure-reducing chamber,
The cutting step is carried out in the cutting room,
It further includes cutting object moved step, cutting product and moves out step,
The cutting object moved step be the compression chamber connected with the cutting room and the compression chamber and
The cutting chamber interior remains under the atmospheric pressure state higher than atmospheric pressure, by the cutting object from the compression chamber move in
The step of cutting room,
The cutting product move out step be in the state that the pressure-reducing chamber is connected with the cutting room, will be in the cutting
In step, cutting product made of the cutting object is cut off are moved out to the pressure-reducing chamber from the cutting room and are then disconnected
It is low when the pressure-reducing chamber inner pressure relief is to than cutting object cutting after the connection of the pressure-reducing chamber and the cutting room
Air pressure in the state of, the cutting product are moved out inside the pressure-reducing chamber to the manufacturer of the cutting product of external step
Method.
In the present invention, " air pressure higher than atmospheric pressure " for example can be higher than 1atm (1.01325 × 105Pa gas)
Pressure.Also, the environment gas around when " air pressure higher than atmospheric pressure " for example can be the disconnecting device more of the invention than using
Press (atmospheric pressure) high air pressure, or when than manufacturing method using cutting product of the invention around ambient pressure (atmospheric pressure) height
Air pressure.Also, " air pressure higher than atmospheric pressure " as long as the air pressure more slightly higher than atmospheric pressure can be obtained effect of the invention
Fruit, such as can be 1.1 × 105Pa or more, 1.2 × 105Pa or more, 1.3 × 105Pa or more, 1.4 × 105Pa or more, 1.5 ×
105Pa or more, 2.0 × 105Pa or more, 3.0 × 105Pa or more or 4.0 × 105Pa or more, such as it is also possible to 1.0 × 106Pa
(10MPa) below, 9.0 × 105Pa or less, 8.0 × 105Pa or less, 7.0 × 105Pa or less, 6.0 × 105Pa or less or 5.0 ×
105Pa or less.
In the present invention, cutting object is not specifically limited.Such as though the cutting object can be package substrate,
But not limited to this, it can be any.
In the present invention, cutting product are not specifically limited, such as can be synthetic resin.The synthetic resin not by
It is particularly limited to, such as can be and resin is only subjected to molding synthetic resin, be also possible to the components such as chip carrying out resin
The synthetic resin of encapsulation.In the present invention, synthetic resin is for example also possible to electronic component etc..Also, in the present invention,
Cutting product for example can be the product as finished product, be also possible to unfinished semi-finished product.
In the present invention, it is not particularly restricted as resin, such as can be the thermosetting properties such as epoxy resin and silicone resin
Resin is also possible to thermoplastic resin.Also, it is also possible to composite wood of the part comprising thermosetting resin or thermoplastic resin
Material.
Also, in general, " electronic component " include the case where carry out resin-encapsulated before chip and chip is carried out
The case where state of resin-encapsulated, but in the present invention, in the case where only claiming " electronic component ", unless otherwise specified,
Refer to the electronic component (electronic component as finished product) that the chip is carried out resin-encapsulated.In the present invention, " chip " refers to
Chip before carrying out resin-encapsulated, specifically, the integrated circuit (IC) that can for example illustrate, semiconductor chip, Electric control are with partly
The chips such as conductor element.In the present invention, the ministry of electronics industry after resin-encapsulated is different from order to make to carry out the chip before resin-encapsulated
Part is known as " chip " for the sake of convenient.But " chip " of the invention as long as carry out the chip before resin-encapsulated, then it is not special
It does not limit, may not be shaped like chips.
In the present invention, such as circuit element, microelectronics machine will can be configured on the substrates such as silicon, compound semiconductor
The semiconductor wafer of the function element such as tool system (Micro Electro Mechanical Systems, MEMS)
(semiconductor wafer) is as cutting object, and being cut off (singualtion) is cutting product.Also, in the present invention
In, it can be such as by the ceramic substrate comprising function element resistance, capacitor, sensor, surface acoustic wave device, glass substrate etc.
As cutting object, and is cut off (singualtion) and manufacture chip-resistance, chip capacity, chip-shaped sensor, surface sound
The products such as wave apparatus (cutting product).And, in the present invention it is possible to for example using synthetic resin as cutting object, and will
It cuts off (singualtion) and manufactures the optical components such as camera lens, optical module, light guide plate (cutting product).Also, in the present invention, may be used
Using for example by synthetic resin as cutting object, and cut off (slice) and manufacture product (cut off product).Also, at this
, can be for example using glass plate as cutting object in invention, and cut off (singualtion) and manufacture and be used as various electronic machines
The glass plate (cutting product) of device cover board.Further, in the present invention, cutting object is without being limited thereto, as described above can be to appoint
Meaning, it can be any that cutting product are not specifically limited also as described above.
Also, the shape in the present invention, cutting off object and cutting product is also not specifically limited, and can be any.
For example, the shape of cutting object can be the rectangle with length direction and width direction, it is also possible to square, circle
Deng.
Also, in the present invention, " mounting ", " configuration " or " setting " includes " fixation ".
Hereinafter, Detailed description of the invention specific embodiments of the present invention will be based on.Each attached drawing for convenience of explanation, by suitably saving
Slightly, exaggeration etc. and schematically describe.
[embodiment 1]
In the present embodiment, the manufacture of an example to shaping mould and resin molding apparatus and the synthetic resin using it
An example of method is illustrated.
In an example for schematically showing disconnecting device of the present invention in the step sectional view of Fig. 1~6 a part of structure and
Use each step in the manufacturing method of the cutting product of the disconnecting device.
Firstly, as shown in Figure 1, preparation platform (fixture) 10.Herein, though the actually structure of fixture 10 that Fig. 1 to Fig. 6 is illustrated
At a part of workbench, but in the explanation referring to figs. 1 to Fig. 6, " workbench 10 " is recorded as the sake of convenient.About include folder
The entire workbench of tool 10, illustration omitted.As shown, 10 top of workbench has slot 11, it is provided simultaneously with from upper surface (cutting
Object retaining surface) it penetrates through to the through hole 12 of lower surface.Slot 11 is as described later, for for passing through cutting blade inside it
Slot.Also, through hole 12 is as described later, attracts simultaneously for the cutting product for that will cut off object and be cut off and manufactured
It is maintained at the through hole of the upper surface of workbench 10.
Then, as shown in Fig. 2, in the upper surface of workbench 10 mounting package substrate (cutting object) 20.As shown,
For package substrate 20, a face of substrate 21 is molded with resin using resin (solidified resin) 22.20 energy of package substrate
It is enough only to be formed by substrate 21 and resin 22, but also can further include other components (component).In addition, other described structures
Part can be packaged (resin-encapsulated) by resin 22.It is not specifically limited as other described components, such as can be use
In the usual component of electronic component, semiconductor component etc., specifically, such as that can illustrate chip, lead.Also, in same figure
In, package substrate 20 is loaded in a manner of the upper surface of a side contacts workbench 10 of resin 22.
Then, as shown in figure 3, by attracting mechanism (not shown) by the air inside workbench 10 to the direction arrow X1
(internal direction of workbench 10) attracts, and the inside of workbench 10 is depressurized.Package substrate 20 is attracted and protected as a result,
It is held in 10 upper surface of workbench (cutting object keeps step).In addition, the attracting mechanism is not specifically limited, such as it can be suction
Pump priming or vacuum ejector etc..Further as shown, package substrate 20 will be maintained by air pressure holding mechanism (not shown)
The air pressure in the outside of workbench 10 remain the air pressure higher than atmospheric pressure (air pressure holding step).Thereby, it is possible to package substrate
20 apply the pressure in the direction arrow Y1 (direction of workbench 10) and are pressed on workbench 10.Pass through the direction arrow Y1
Pressure, the retentivity that package substrate 20 is maintained on workbench 10 further enhance.
Then, as shown in figure 4, rotating knife 30 is configured above package substrate 20, corresponding groove 11 position.As schemed
Show, rotating knife 30 is constituted in such a way that two faces of knife main body 31 are clamped by a pair of of flange (fixing component) 32.Rotating knife 30 is
The a part of " cutting mechanism " in the disconnecting device of the present embodiment.Rotating knife 30 is installed on the rotation that the cutting mechanism is arranged in
The front end of axis (not shown).
Then, as shown in figure 5, cutting off package substrate 20 (substrate 21 and substrate 22) and rotating rotating knife 30
(cutting step).At this point, as shown, can be completely cut through and making knife main body 31 through package substrate 20 and falling into slot 11
Package substrate 20.
It then, as shown in fig. 6, can be by the way that package substrate 20 be cut off in all specified positions (position of figure bracket groove 11)
And manufacture package parts (cutting product) 20b.Be switched off for product 20b, as shown, a face of cut-off substrate 21b by
Cut-off resin (solidified resin) 22b is molded with resin.At this point, as shown in fig. 6, the upper end of through hole 12 is still cut off
Product 20b blocks (sealing).Therefore, still apply on cutting product 20b and come from the direction arrow X1 (the inside side of workbench 10
To) attraction power.Further, the pressure in the direction arrow Y1 (direction of workbench 10) is applied on cutting product 20b, and will
It presses on workbench 10.Thereby, it is possible to further enhance cutting product 20b in the retentivity on workbench 10, and inhibit or
Prevent cutting product 20b from falling off from workbench 10.
In addition, cutting product 20b can be the product that can directly circulate, it is also possible to unfinished semi-finished product.Described half
Finished product for example can become product by further processing.The product is not specifically limited, such as can be illustrated as described above
Electronic component, semiconductor component etc..
In the cutting-off method (patent document 1 etc.) of previous package substrate, if cutting product (component) size after cutting
Smaller (such as the length on 1 side is 2mm or less), then the retentivity (adsorption capacity) that workbench (fixture) generates is possible to not fill
Point, cutting product fall off from workbench leads to yield rate reduces, product is bad etc..Specifically, for example there is the splashing of cutting product
(dispersing), in defect (notch) of corner of package substrate etc., and these are likely to become yield rate reduces, product is bad etc.
The reason of.In particular, being thus possible to make to attract the work of the cutting product if there is 1 cutting product to fall off from workbench
The hole made on platform is opened.Then, in the case that the space in workbench connects into 1, due to the opening in the hole, work
The decompression in the space in platform is released from, and is possible to other retentivities of all cutting product on the workbench and is become smaller.
That is, even if only 1 cutting product falls off from workbench, therefore other all cutting product are also possible to from the workbench
On fall off.
In this regard, according to the present invention, maintain the air pressure on the outside of the workbench of cutting object be maintained as it is higher than atmospheric pressure
Air pressure.The retentivity of cutting product on the workbench is reinforced as a result, and the cutting product of even small size also can be secured
Ground keeps (fixation).According to the invention it is thus possible to inhibit or prevent the problems such as yield rate reduces, product is bad, and energy
Enough productivities for improving cutting product.
More than, it is illustrated to disconnecting device of the invention and using an example of the manufacturing method of its cutting product.
But the present invention is not limited only to the present embodiment.For example, in the present embodiment, manufacturing electronic component to cutting package substrate, partly leading
The example of the products such as body component or its semi-finished product is illustrated.But in the present invention, for the cutting object,
As described above, being not limited to package substrate, it is applicable to arbitrarily cut off object.Also, the cutting product are also as described above, no
It is limited to electronic component, semiconductor component etc., can be any.Also, such as disconnecting device of the invention is except through the gas
Air pressure on the outside of the workbench for maintaining the cutting object is remained the air pressure higher than atmospheric pressure by pressure holding mechanism
It in addition, can be identical with common disconnecting device or be the structure on the basis of it.Manufacturer's rule of cutting product of the invention
The air pressure on the outside of the workbench in addition to cutting off object as described in will maintain remains the air pressure higher than atmospheric pressure
" the air pressure holding step " other than, can with package substrate etc. usually switch off method it is identical or according to its progress.As envelope
Dress substrate etc. usually switches off method, may be, for example, or root identical as method documented by special open 2016-143861 bulletin etc.
According to its method.It is higher than atmospheric pressure for remaining the air pressure on the outside of the workbench for maintaining the cutting object
Structure, the method for the specific device of air pressure are also not specifically limited, such as can be as be described hereinafter described in embodiment 2 or 3.
The present invention for example can be the manufacture that the such as the following small size of 2mm or less or 1mm cuts off product suitable for one side.But
It is that the invention is not limited thereto, in the manufacture that can be used for any size cutting product.
[embodiment 2]
Then, the other embodiment of the present invention is illustrated.
In the present embodiment, to the different from embodiment 1 of disconnecting device of the invention and the manufacturing method for cutting off product
An example is illustrated.
The plan view of Fig. 7 schematically shows the structure of the present embodiment disconnecting device.As shown, the disconnecting device 1000
Include a-quadrant, B area and 3, the region C region (field).A-quadrant includes compression chamber 1100.B area includes cutting room
1200.The region C includes pressure-reducing chamber 1300.Cutting object of the configuration of compression chamber 1100 in cutting room 1200 moves in side.Pressure-reducing chamber
Cutting product of 1300 configurations in cutting room 1200 move out side.Then, as described later, the cutting cutting object in cutting room 1200
And manufacture cutting product.Also, inside compression chamber 1100 and the connection of cutting room 1200 and compression chamber 1100 and cutting room 1200
In the state of remaining the air pressure higher than atmospheric pressure, cutting object is moved in from compression chamber 1100 to cutting room 1200.Further,
In the state that pressure-reducing chamber 1300 and cutting room 1200 connect, the cutting object (cutting product) that is cut off is from cutting room
1200 move out to pressure-reducing chamber 1300.Then, thereafter, after disconnecting pressure-reducing chamber 1300 and cutting off the connection of room 1200, pressure-reducing chamber
When 1300 inner pressure relieves are to than the cutting object cutting in the state of low air pressure, the cutting object that is cut off
(cutting product) are moved out inside pressure-reducing chamber 1300 to outside.In addition, the cutting product are moved out inside pressure-reducing chamber 1300 to outside
When air pressure for example can be roughly the same with atmospheric pressure.Details will be aftermentioned.Cut off room 1200, compression chamber 1100 and pressure-reducing chamber 1300
Such as be able to use with the vacuum chamber of the film formation devices such as sputtering equipment, move in lateral load lock chamber and move out lateral load lock chamber
Identical structure.But cutting room 1200, compression chamber 1100 and pressure-reducing chamber 1300 be designed as inner space be able to maintain for than
The form of the high air pressure of atmospheric pressure.
In the disconnecting device 1000 of Fig. 7, a-quadrant further includes substrate feed mechanism (cutting object feed mechanism)
1010, control unit 1020 and gate valve 1030.There are package substrate (cutting object) 20, and energy on substrate feed mechanism 1010
It is enough to supply package substrate 20 to compression chamber 1100.In addition, package substrate 20 can be with 20 phase of package substrate illustrated in embodiment 1
Together.Control unit 1020 can control the running of entire disconnecting device 1000.The control method that control unit 1020 is carried out is not special
Do not limit, such as computer program can be used etc..Gate valve 1030 is configured in a manner of connecting compression chamber 1100 and cutting room 1200.It is logical
The space in compression chamber 1100 can be connected and cut off the space in room 1200 by crossing opening gate valve 1030.Pass through closing gate valve 1030
The space in compression chamber 1100 and the space in cutting room 1200 can be disconnected and be isolated.
Workbench 10, air pressure regulator 1210, Reduction by Drainage depressor 1220, shaft 1230, ripple are further included in B area
Pipe 1241 and 1242, receiver board 1250, drain flow portion 1260 and outlet 1270.1 (Fig. 1 of workbench 10 and embodiment
~6) workbench 10 illustrated in is identical, is connected to the attracting mechanism (not shown).Air pressure regulator 1210 for example has
Make when adjustment valve that be connected to the piping from outside air compressibility, that the influx of compressed air can be adjusted and decompression
Switch valve.In addition, the diagram of the compressibility, piping, adjustment valve and switch valve is omitted.Pass through air pressure regulator
Air pressure inside 1210 adjustment compression chambers 1100, cutting room 1200 and pressure-reducing chamber 1300.Through air pressure regulator 1210, as after
Air pressure (the gas inside cutting room 1200 in 10 outside of workbench that can will maintain package substrate (cutting object) 20
Pressure) remain the air pressure higher than atmospheric pressure.That is, air pressure regulator 1210 and cutting room 1200 are equivalent to disconnecting device
1000 " air pressure holding mechanism ".Also, such as in decompression, the decompression switch valve can be opened, and is being pacified from setting
Exhaust pipe on facility equipped with disconnecting device 1000 is exhausted.It is equipped in shaft 1230 in embodiment 1 (Fig. 1~6)
The rotating knife 30 (not shown in Fig. 7) of explanation.Shaft 1230 can with rotating knife 30 together forwards, backwards left and right and on move down
It is dynamic.Rotating knife 30 can be made to rotate by shaft 1230 and cut off package substrate 20.That is, shaft 1230 and rotating knife 30
" cutting mechanism " of disconnecting device 1000 is constituted together.Also, in order to remove frictional heat caused by rotating knife 30, it is able to use spray
Cooling water is sprayed on rotating knife 30 while cooling and carries out aftermentioned cutting step by mouth (not shown).The nozzle can for example be installed
In shaft 1230.The cooling water for example can be the water of room temperature (room temperature).The cooling water is used as draining after being able to use
It is expelled to except cutting room 1200.At this point, depressurizing the pressure of the draining by Reduction by Drainage depressor 1220.A left side for bellows 1241
It holds and 1242 right end is separately fixed inside cutting room 1200.The right end of bellows 1241 and 1242 left end connect respectively
It connects on receiver board 1250.Receiver board 1250 can load and carry package substrate 20 and cutting product 20b.Further, it is possible to logical
Cross keep bellows 1241 and 1242 flexible and make receiver board 1250 in the lateral direction (with cutting object move in direction and
Cutting product move out the vertical direction in direction) it is mobile.Drain flow portion 1260 is the part of the drain flow.It can be from discharge
Mouth 1270 is expelled to described except cutting room 1200.
The region C further includes gate valve 1330, inspection desk 1400 and pallet 1500.Gate valve 1330 is to connect pressure-reducing chamber
1300 configure with the mode for cutting off room 1200.The space and cutting room in pressure-reducing chamber 1300 can be connected by opening gate valve 1330
Space in 1200.The space in space and cutting room 1200 in pressure-reducing chamber 1300 can be disconnected simultaneously by closing gate valve 1330
It is isolated.On inspection desk 1400, package parts (cutting product) 20b is checked, and separate non-defective unit and substandard products.On pallet 1500
It stores and saves the non-defective unit in (keeping) cutting product 20b.
It can for example be carried out as follows using the manufacturing method of the cutting product of the disconnecting device 1000 of Fig. 7.Firstly, using air pressure
Adjuster supplies compressed air in 1210 pairs of cutting rooms 1200, makes to cut off inside room 1200 for the air pressure higher than atmospheric pressure.Thereafter,
Until aftermentioned cutting step terminates, keep inside cutting room 1200 as air pressure (the air pressure holding step higher than atmospheric pressure
Suddenly).
On the other hand, by substrate feed mechanism 1010 to moving in package substrate 20 inside compression chamber 1100.At this point, due to
The open and inside and outside connection in compression chamber 1100, therefore the pressure inside compression chamber 1100 is identical with atmospheric pressure.
Then, compression chamber 1100 is made to become air-tight state.Later, using air pressure regulator 1210 to being supplied in compression chamber 1100
To compressed air and pressurize.Make the air pressure inside compression chamber 1100 roughly the same with the air pressure inside cutting room 1200 as a result,.When
Air pressure inside compression chamber 1100 is roughly the same with the air pressure inside cutting room 1200, then stops supplying by air pressure regulator 1210
To compressed air.In this state, it opens compression chamber 1100 and cuts off the gate valve 1030 between room 1200, and by package substrate 20
(cutting object moved step) is moved in into cutting room 1200.Thereafter, closing gate valve 1030, disconnect the inside of compression chamber 1100 and
It cuts off the connection inside room 1200 and is isolated.
Then, the package substrate moved in into cutting room 1200 (cutting object) 20 is inhaled by workbench (fixture) 10
Draw and keeps (cutting object keeps step).Thereafter, package substrate 20 is passed through into 30 (cutting machine of shaft 1230 and rotating knife
Structure) cut off (cutting step).Thereby, it is possible to manufacture package substrate (cutting object) 20 to be cut off and the encapsulation of singualtion
Component (cutting product) 20b.These cutting objects keep step and cutting step for example can be same with embodiment 1 (Fig. 1~6)
It carries out, it also can be identical with the cutting-off method of common package substrate or according to its progress.
In addition, cooling water is for example sprayed on rotating knife as described above, being able to use nozzle (not shown) by the cutting step
30 carry out while cooling.The cooling water after use as described above, can as drain flow in drain flow portion 1260, and
It is expelled to except cutting room 1200 from outlet 1270.
On the other hand, it supplies compressed air into pressure-reducing chamber 1300 and pressurizes using air pressure regulator 1210.Then, when
Air pressure inside pressure-reducing chamber 1300 is roughly the same with the air pressure inside cutting room 1200, then stops supplying by air pressure regulator 1210
To compressed air.The operation can carry out after the cutting step (cutting of package substrate 20) terminates, if but in institute
State cutting step terminate before (for example, parallel with the cutting step) progress, then it is high-efficient.
Then, the cutting step (cutting of package substrate 20) terminates, and the air pressure pressure-reducing chamber 1300 inside with
Cut off room 1200 inside air pressure it is roughly the same in the state of, opening gate valve 1330.In this state, it is moved out from cutting room 1200
Package parts (cutting product) 20b, and be accommodated in pressure-reducing chamber 1300.Thereafter, closing gate valve 1330, by the sky in pressure-reducing chamber 1300
Between and cutting room 1200 in the connection in space disconnect and be isolated.Air pressure regulator 1210 is further used by pressure-reducing chamber
Air in 1300 is expelled to external and is depressurized.When the air pressure in pressure-reducing chamber 1300 is roughly the same with atmospheric pressure, will just seal
Dress component (cutting product) 20b is moved out to the outside in pressure-reducing chamber 1300 (cutting product move out step).Thereafter, it is examined using inspection desk 1400
It looks into package parts (cutting product) 20b and is accommodated in pallet 1500.
In addition, the variation as the present embodiment (embodiment 2), such as can be to be omitted by the disconnecting device 1000 of Fig. 7
The structure of compression chamber 1100 and pressure-reducing chamber 1300.In this case, such as by the folding of gate valve 1030 and gate valve 1330,
(connection) or 1200 inner space of separation cut room and exterior space can be connected to.Also, machine in this case, is supplied from substrate
Structure (cutting object feed mechanism) 1010 is obstructed to be overpressurized room 1100 and moves in package substrate (cutting object) 20 to cutting
Disconnected room 1200, and do not moved out package parts (cutting product) 20b to outside by pressure-reducing chamber 1300 from cutting room 1200.Cause
This, in cutting object moved step, in the state that cutting off the inside of room 1200 is atmospheric pressure, from setting in cutting room
1200 loading unit moves in package substrate (cutting object) 20.Thereafter make to cut off 1200 air-tight state of room, and use air pressure
Adjuster 1210 supplies compressed air into cutting room 1200, the shape for keeping the air pressure in cutting room 1200 higher than atmospheric pressure
State.In the state that air pressure in the cutting room 1200 is higher than atmospheric pressure, the cutting step is carried out.The product of being switched off move out step
For, after the cutting step, the air cut off in room 1200 is expelled to external progress using air pressure regulator 1210
Decompression, when the air pressure in cutting room 1200 is roughly the same with atmospheric pressure, by package parts (cutting product) 20b from setting in cutting room
1200 moving section is moved out to outside.In addition to this, compression chamber 1100 and pressure-reducing chamber are omitted by the disconnecting device of Fig. 7 1000
The manufacturing method of cutting product in 1300 variation can be with the manufacturing method of the cutting product for the disconnecting device 1000 for using Fig. 7
It is carried out similarly.
[embodiment 3]
Then, other different embodiments of the invention are illustrated.
In the present embodiment, to disconnecting device of the invention and the manufacturing method for cutting off product, with embodiment 1 and 2
Different an examples are illustrated.
The plan view of Fig. 8 schematically shows the structure of the disconnecting device of the present embodiment.As shown, the disconnecting device
1000b and the disconnecting device of embodiment 2 (Fig. 7) similarly include a-quadrant, B area and 3, the region C region (field).This is cut
Disconnected device 1000b does not include compression chamber 1100, cutting room 1200 and pressure-reducing chamber 1300, a-quadrant, B area and 3, the region C
Region connects into 1.Therefore, disconnecting device 1000b does not include gate valve 1030 and 1330.Also, with regard to the disconnecting device
For 1000b, a-quadrant, B area and 3, the region C region entirety are stored in inside storage room 2000.Air pressure regulator 1210
And the configuration of Reduction by Drainage depressor 1220 is in the outside of storage room 2000.Further operation portion is configured in the outside of storage room 2000
2100.By operation portion 2100, the air pressure inside storage room 2000 remains the air pressure higher than atmospheric pressure.Therefore, operation portion
2100 and storage room 2000 be equivalent to " air pressure holding mechanism " in disconnecting device 1000b.Also, cutting product ought not be implemented
When manufacturing method, such as the air pressure inside storage room 2000 can be made roughly the same with atmospheric pressure by operation portion 2100.Storage
Room 2000 can open and close.When implementing the manufacturing method of cutting product, storage room 2000 can be closed and separated in storage room 2000
The space in portion and external space.On the other hand, when not implementing the manufacturing method of cutting product, storage room 2000 can be opened and
Connect the space and external space inside storage room 2000.In addition to this, disconnecting device 1000b and Fig. 7 (embodiment of Fig. 8
2) disconnecting device 1000 is identical.
Storage room 2000 for example can be the size for guaranteeing to carry out the space of internal maintenance operation.Specifically, example
It such as can be and entered inside storage room 2000 by people, and be able to carry out the upkeep operation of disconnecting device 1000b.Storage room 2000
Structure be not specifically limited, such as be able to use the identical structure of the commercial refrigerator or refrigerator-freezer high with air-tightness.But it is possible to
It omits non-for maintaining the heat-barrier material etc. of air-tightness.Also, operation portion 2100 for example can by with inside storage room 2000
It is wirelessly or non-wirelessly communicated and operates disconnecting device 1000b.Specifically, for example can by by operation portion 2100 and control
Portion 1020 is wirelessly or non-wirelessly communicated and is controlled the running of entire disconnecting device 1000b.Also, the form of operation portion 2100
It is not specifically limited.For example, in fig. 8, operation portion 2100 is illustrated as being mounted on the operating surface on the outside of the wall portion of storage room 2000
Plate.But operation portion 2100 is without being limited thereto, such as can be tablet terminal etc..
It for example can be by the institute illustrated in embodiment 2 using the manufacturing method of the cutting product of the disconnecting device 1000b of Fig. 8
There is step to implement in the state of remaining the air pressure higher than atmospheric pressure inside by storage room 2000.For example, air pressure tune can be used
Complete machine structure (not shown, for example, compression pump etc.) will be protected to compressed air is supplied inside storage room 2000 inside storage room 2000
It holds as the air pressure higher than atmospheric pressure.As described above, disconnecting device 1000b do not include compression chamber 1100, cutting room 1200 and
Pressure-reducing chamber 1300, but a-quadrant, B area and 3, the region C region connect into 1 region.Therefore, when carrying package substrate
(cutting object) 20 and when package parts (cutting product) 20b, haves no need to change compression chamber 1100, cutting room 1200 and subtracts
The step of air pressure of pressure chamber 1300.It in addition to this, can be with using the manufacturing method of the cutting product of the disconnecting device 1000b of Fig. 8
It is carried out similarly using the manufacturing method of the cutting product of the disconnecting device 1000 of Fig. 7 (embodiment 2).
In addition, the air pressure adjustment mechanism is not specifically limited, such as it can be used to be mounted on and be provided with disconnecting device 1000b
Facility (such as factory etc.) existing air compression system etc..Also, such as in addition to the existing air compression system it
Outside, the air compression system comprising air compressor and holding vessel can also be set.In this way, due to can rapidly make
Become high pressure inside storage room 2000, therefore preferably.
Also, as described above, when not implementing the manufacturing method of cutting product, such as can make to store by operation portion 2100
Air pressure inside room 2000 is roughly the same with atmospheric pressure.For example, the air pressure tune can be used when safeguarding disconnecting device 1000b
Air inside storage room 2000 is expelled to outside and is decompressed to the air pressure inside storage room 2000 and atmospheric pressure by complete machine structure
Identical degree.Thereby, it is possible to avoid upkeep operation, person carries out operation in hyperbaric chamber.
Using the disconnecting device 1000 of embodiment 2 (Fig. 7) cutting product manufacturing method as described above, requiring each time
The step of changing compression chamber 1100, cutting room 1200 and 1300 air pressure of pressure-reducing chamber.In comparison, using the present embodiment (Fig. 8)
Disconnecting device 1000b cutting product manufacturing method have no need to change as described above compression chamber 1100, cutting room 1200 and
The step of 1300 air pressure of pressure-reducing chamber.It therefore, can be than embodiment 2 (Fig. 7) according to the disconnecting device 1000b of the present embodiment (Fig. 8)
Disconnecting device 1000 implement the manufacturing methods of cutting product more efficiently.On the other hand, the disconnecting device of the present embodiment (Fig. 8)
1000b needs the space for storage room 2000 to be arranged.
In addition, the storage room 2000 of Fig. 8 is as described above, to guaranteeing to carry out internal maintenance operation (for example, upkeep operation
Person's entrance) the size in space be illustrated, but not limited to this.That is, the deformation as the present embodiment (embodiment 3)
Example, such as can be setting and cover cover portion on the outside of entire disconnecting device main body, and using the cover portion as " storage room ", and energy
Enough make its internal structure for becoming air-tight state.
Further, the present invention is not limited to the above embodiments, without departing from the scope of the subject in the invention, can be as needed
Combination, change or selection any and appropriate is carried out to use.
This application claims the priority based on 2 months 2018 2018-21300 of Japanese publication Patent filed in 8 days,
Entire disclosure is included in herein.
Description of symbols
10 workbench (fixture)
11 slots
12 through holes
20 package substrates (cutting object)
20b package parts (cutting product)
21 substrates
21b cut-off substrate
22 resins (solidified resin)
22b cut-off resin (solidified resin)
30 rotating knifes (cutting mechanism)
31 knife main bodys
32 flanges (fixing component)
1000,1000b disconnecting device
1010 substrate feed mechanisms (cutting object feed mechanism)
1020 control units
1030 gate valves
1100 compression chambers
1200 cuttings room (air pressure holding mechanism)
1210 air pressure regulators (air pressure holding mechanism)
1220 Reduction by Drainage depressors
1230 shafts (cutting mechanism)
1241,1242 bellows
1250 receiver boards
1260 drain flow portions
1270 outlets
1300 pressure-reducing chambers
1330 gate valves
1400 inspection desks
1500 pallets
2000 storage rooms (air pressure holding mechanism)
2100 operation portions (air pressure holding mechanism)
X1 indicates the arrow in the attraction direction that workbench 10 generates
Y1 indicates the arrow for being applied to the pressure direction of package substrate 20
Claims (8)
1. a kind of disconnecting device, it is characterised in that:
Comprising workbench, air pressure holding mechanism and cutting mechanism,
Attract and keep cutting object by the workbench,
The air pressure on the outside of the workbench for maintaining the cutting object is remained by the air pressure holding mechanism
The air pressure higher than atmospheric pressure,
The cutting object on the workbench is kept by cutting mechanism cutting.
2. disconnecting device according to claim 1 further includes cutting room,
And in the cutting room, by the air pressure holding mechanism, the air pressure on the outside of the workbench is remained than big
The high state of air pressure, the cutting object for being held in the workbench are cut off by the cutting mechanism and manufacture cutting product.
3. disconnecting device according to claim 2, further includes compression chamber and pressure-reducing chamber,
Cutting object of the compression chamber's configuration in the cutting room moves in side,
Cutting product of the pressure-reducing chamber configuration in the cutting room move out side,
It is connected in the compression chamber with the cutting room and the compression chamber and the cutting chamber interior remains and compare atmosphere
In the state of pressing high air pressure, the cutting object is moved in from the compression chamber to the cutting room,
In the state that the pressure-reducing chamber is connected with the cutting room, the cutting product are moved out from the cutting room to the decompression
Room disconnects the connection between the pressure-reducing chamber and the cutting room, and in the pressure-reducing chamber inner pressure relief to than described thereafter
Cut off object cutting when air pressure it is low in the state of, the cutting product are moved out from the inside in the pressure-reducing chamber to outside.
4. disconnecting device according to any one of claim 1 to 3, wherein the air pressure holding mechanism includes storage room
And operation portion,
The storage room internal reservoir has the workbench and the cutting mechanism,
By the operation portion, the air pressure inside the storage room is remained to the air pressure higher than atmospheric pressure.
5. disconnecting device according to any one of claim 1 to 3, wherein by the air pressure holding mechanism, will keep
There is the air pressure on the outside of the workbench of the cutting object to remain 1.1 × 105Pa or more.
6. a kind of manufacturing method of cutting product, it is characterised in that include:
It cuts off object and keeps step, attract and keep cutting object by workbench,
Air pressure keeps step, and the air pressure on the outside of the workbench for maintaining the cutting object is maintained above atmospheric pressure
Air pressure,
Step is cut off, will remain in the cutting object cutting on the workbench.
7. the manufacturing method of cutting product according to claim 6, wherein
Using cutting room,
And the cutting step carries out in the cutting room.
8. the manufacturing method of cutting product according to claim 7, wherein compression chamber and pressure-reducing chamber are further used,
And it further includes cutting object moved step and cutting product moves out step,
The cutting object moved step are as follows: connected with the cutting room and the compression chamber and institute in the compression chamber
State cutting chamber interior remain the air pressure higher than atmospheric pressure in the state of, by the cutting object from the compression chamber move in
The step of cutting room,
The cutting product move out step are as follows: in the state that the pressure-reducing chamber is connected with the cutting room, will walk in the cutting
Cutting product made of cutting object described in rapid is cut off move out to the pressure-reducing chamber from the cutting room and disconnect institute thereafter
Gas after the connection for stating pressure-reducing chamber and the cutting room, when the pressure-reducing chamber inner pressure relief is to than the cutting object cutting
In the state of forcing down, the cutting product are moved out inside the pressure-reducing chamber to external step.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-021300 | 2018-02-08 | ||
| JP2018021300A JP7102157B2 (en) | 2018-02-08 | 2018-02-08 | Cutting device and manufacturing method of cut products |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110137101A true CN110137101A (en) | 2019-08-16 |
| CN110137101B CN110137101B (en) | 2023-03-10 |
Family
ID=67568173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811442664.8A Active CN110137101B (en) | 2018-02-08 | 2018-11-29 | Cutting device and method for manufacturing cut product |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7102157B2 (en) |
| KR (1) | KR102210994B1 (en) |
| CN (1) | CN110137101B (en) |
| TW (1) | TWI704611B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114102718A (en) * | 2020-08-26 | 2022-03-01 | Ｔｏｗａ株式会社 | Cutting device and method for manufacturing cut product |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7222941B2 (en) * | 2020-02-10 | 2023-02-15 | Ｔｏｗａ株式会社 | processing equipment |
| JP2022083118A (en) * | 2020-11-24 | 2022-06-03 | Ｔｏｗａ株式会社 | Cutting device and manufacturing method of cut product |
| JP2022083106A (en) * | 2020-11-24 | 2022-06-03 | Ｔｏｗａ株式会社 | Cutting device and manufacturing method of cut product |
| JP2023010304A (en) * | 2021-07-09 | 2023-01-20 | Ｔｏｗａ株式会社 | Processing device and method for manufacturing processed product |
| CN115339001B (en) * | 2022-08-30 | 2023-07-18 | 惠州市乐恩智能玻璃有限公司 | Pneumatic type glass apron punches processing and uses suction device |
| CN117300205B (en) * | 2023-11-28 | 2024-02-02 | 山西省定襄县龙门锻压有限公司 | Flowmeter flange hole machining device and use method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103648A (en) * | 2006-10-23 | 2008-05-01 | Matsushita Electric Ind Co Ltd | Apparatus for manufacturing semiconductor device, and method for manufacturing the semiconductor device |
| CN103620759A (en) * | 2011-07-01 | 2014-03-05 | 日本电气工程株式会社 | Tape application apparatus |
| CN105269705A (en) * | 2014-07-18 | 2016-01-27 | 株式会社迪思科 | Processing apparatus |
| CN105374710A (en) * | 2014-08-13 | 2016-03-02 | 株式会社迪思科 | Processing method of packaging substrate |
| CN105405805A (en) * | 2014-09-04 | 2016-03-16 | 东和株式会社 | Cutting apparatus, adsorption mechanism and apparatus equipped with adsorption mechanism |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001044143A (en) * | 1999-07-30 | 2001-02-16 | Sony Corp | Method of cutting substrate and manufacture of semiconductor device |
| JP2003007648A (en) | 2001-06-18 | 2003-01-10 | Disco Abrasive Syst Ltd | Semiconductor wafer dividing system |
| JP4257072B2 (en) * | 2002-05-21 | 2009-04-22 | Ｔｏｗａ株式会社 | Substrate fixing device and fixing method |
| JP5362480B2 (en) | 2009-08-19 | 2013-12-11 | 株式会社ディスコ | Hard wafer grinding method |
| JP5709370B2 (en) | 2009-11-26 | 2015-04-30 | 株式会社ディスコ | Cutting apparatus and cutting method |
| JP5878292B2 (en) * | 2010-12-24 | 2016-03-08 | 株式会社ディスコ | Processing method of optical device wafer |
| KR20140071680A (en) * | 2012-12-04 | 2014-06-12 | 서울바이오시스 주식회사 | Apparatus for separating substrate and method for separating substrate using the same |
| JP6483404B2 (en) * | 2014-11-04 | 2019-03-13 | 株式会社ディスコ | Laser processing equipment |
| JP6462414B2 (en) * | 2015-02-27 | 2019-01-30 | 株式会社ディスコ | Splitting device |
-
2018
- 2018-02-08 JP JP2018021300A patent/JP7102157B2/en active Active
- 2018-11-27 KR KR1020180148684A patent/KR102210994B1/en active IP Right Grant
- 2018-11-29 CN CN201811442664.8A patent/CN110137101B/en active Active
- 2018-12-07 TW TW107144012A patent/TWI704611B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103648A (en) * | 2006-10-23 | 2008-05-01 | Matsushita Electric Ind Co Ltd | Apparatus for manufacturing semiconductor device, and method for manufacturing the semiconductor device |
| CN103620759A (en) * | 2011-07-01 | 2014-03-05 | 日本电气工程株式会社 | Tape application apparatus |
| CN105269705A (en) * | 2014-07-18 | 2016-01-27 | 株式会社迪思科 | Processing apparatus |
| CN105374710A (en) * | 2014-08-13 | 2016-03-02 | 株式会社迪思科 | Processing method of packaging substrate |
| CN105405805A (en) * | 2014-09-04 | 2016-03-16 | 东和株式会社 | Cutting apparatus, adsorption mechanism and apparatus equipped with adsorption mechanism |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114102718A (en) * | 2020-08-26 | 2022-03-01 | Ｔｏｗａ株式会社 | Cutting device and method for manufacturing cut product |
| CN114102718B (en) * | 2020-08-26 | 2024-01-30 | Ｔｏｗａ株式会社 | Cutting device and method for manufacturing cut product |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102210994B1 (en) | 2021-02-01 |
| TW201935536A (en) | 2019-09-01 |
| JP2019136810A (en) | 2019-08-22 |
| KR20190096266A (en) | 2019-08-19 |
| CN110137101B (en) | 2023-03-10 |
| JP7102157B2 (en) | 2022-07-19 |
| TWI704611B (en) | 2020-09-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110137101A (en) | Disconnecting device and the manufacturing method for cutting off product | |
| US5015425A (en) | Manufacturing apparatus | |
| JP2007307766A (en) | Resin seal-molding method of electronic part | |
| CN105643840B (en) | Mechanograph manufacture system and mechanograph manufacturing method | |
| KR960032671A (en) | Method and apparatus for transferring lead frame using air, and in-line equipment using the same | |
| JP6580519B2 (en) | Compression molding apparatus, resin-encapsulated product manufacturing apparatus, compression molding method, and resin-encapsulated product manufacturing method | |
| JP4741592B2 (en) | Mold part and method for encapsulating electronic components | |
| JP2016101743A5 (en) | ||
| KR20140107982A (en) | Die ejector and Die separation method | |
| US20190109021A1 (en) | Resin-sealing device and resin-sealing method | |
| KR20190027706A (en) | Cutting apparatus and method of conveying a semiconductor package | |
| CN115483138A (en) | Film pressing structure, film pressing system and film pressing method | |
| TW201838043A (en) | Resin sealing device and resin sealing method | |
| KR102288168B1 (en) | Resin molding apparatus and manufacturing method of molded product | |
| WO2018139631A1 (en) | Resin sealing device and resin sealing method | |
| KR102192243B1 (en) | Molding die, resin molding device and method for preparing resin-molded product | |
| KR100363851B1 (en) | Vacuum Absorbtion Device For Transfering The Semiconductor Package | |
| CN111834276A (en) | Bare chip ejector and bare chip pickup device comprising same | |
| JP6994445B2 (en) | Resin molding equipment, release film peeling method, resin molded product manufacturing method | |
| JP6431871B2 (en) | Resin supply method and resin supply apparatus | |
| KR101662143B1 (en) | Equipment for sticking adhesive tape on semiconductor | |
| KR101703852B1 (en) | Compression type molding device for silicon resin and control method of the same | |
| JP2005236133A (en) | Method for resin seal molding | |
| KR102055669B1 (en) | Void free vacuum system for semiconductor package | |
| KR20150133973A (en) | Apparatus for picking up semiconductor packages |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |