KR102210994B1 - Cutting apparatus and manufacturing method of cut product - Google Patents

Abstract

A cutting device having a strong holding force on the table even after cutting an object to be cut is provided. In order to achieve the above object, the cutting device of the present invention includes a table 10, an air pressure maintaining mechanism and a cutting mechanism 30, and the object to be cut 20 is sucked and maintained by the table 10, and the atmospheric pressure The air pressure outside the table 10 where the object to be cut 20 is held by the holding mechanism is maintained at an atmospheric pressure higher than atmospheric pressure, and the object to be cut 20 held on the table 10 is cut by the cutting mechanism 30 It features.

Description

Cutting device and manufacturing method of cut product {CUTTING APPARATUS AND MANUFACTURING METHOD OF CUT PRODUCT}

The present invention relates to a cutting device and a method of manufacturing a cut product.

The semiconductor package is manufactured by cutting the package substrate, for example. In cutting of the package substrate, for example, the substrate is held and cut on a table by sucking the substrate (Patent Document 1, etc.).

Japanese Patent Publication No. 2011-114145

However, if the size of the semiconductor package (product) manufactured by cutting the package substrate is small, there is a fear that the holding force on the table by suction may become insufficient. Specifically, there is a concern that the product after cutting may come off the table, resulting in a decrease in yield and product defects.

Accordingly, an object of the present invention is to provide a cutting device and a method of manufacturing a cut product having a strong holding force on a table even after cutting an object to be cut.

In order to achieve the above object, the cutting device of the present invention,

Including a table, an air pressure maintaining mechanism and a cutting mechanism,

The object to be cut is sucked and held by the table,

The air pressure outside the table where the object to be cut is held by the atmospheric pressure maintaining mechanism is maintained at an atmospheric pressure higher than atmospheric pressure,

It is characterized in that the cutting object held on the table is cut by the cutting mechanism.

The manufacturing method of the cut product of the present invention,

A cutting object holding step of suctioning and holding the cutting object by the table;

An atmospheric pressure maintaining process of maintaining an atmospheric pressure outside the table where the object to be cut is maintained at a pressure higher than atmospheric pressure; And

And a cutting process of cutting the object to be cut held on the table.

Advantageous Effects of Invention According to the present invention, it is possible to provide a cutting device having a strong holding force on a table even after cutting an object to be cut and a method of manufacturing a cut product.

1 is a cross-sectional view schematically showing one step in an example of a method for manufacturing a cut product of the present invention.
FIG. 2 is a cross-sectional view schematically showing another step in the method for manufacturing a cut product in the same manner as in FIG. 1.
3 is a cross-sectional view schematically illustrating another step in the method for manufacturing a cut product in the same manner as in FIG. 1.
4 is a cross-sectional view schematically illustrating another step in the method for manufacturing a cut product in the same manner as in FIG. 1.
5 is a cross-sectional view schematically illustrating another step in the method for manufacturing a cut product in the same manner as in FIG. 1.
6 is a cross-sectional view schematically illustrating another step in the method for manufacturing a cut product in the same manner as in FIG. 1.
7 is a plan view schematically showing a configuration of an example of the cutting device of the present invention.
8 is a plan view schematically showing the configuration of another example of the cutting device of the present invention.

Next, the present invention will be described in more detail by way of example. However, the present invention is not limited by the following description.

The cutting device of the present invention, for example,

Further comprising a cutting thread,

In the cutting chamber, the air pressure outside the table is maintained at an atmospheric pressure higher than atmospheric pressure by the atmospheric pressure maintaining mechanism, and the cutting object held in the table is cut by the cutting mechanism to produce a cut product. It can be a device.

The cutting device of the present invention, for example,

Further comprising a cutting chamber, a pressure chamber and a decompression chamber,

The cutting object is cut in the cutting chamber to produce a cut product,

The pressurization chamber is disposed on the cutting object carrying side of the cutting chamber,

The decompression chamber is disposed on the cutting product carrying side of the cutting chamber,

In a state in which the pressurization chamber and the cutting chamber are connected and the pressurization chamber and the inside of the cutting chamber are maintained at an atmospheric pressure higher than atmospheric pressure, the cutting object is carried from the pressurization chamber to the cutting chamber,

When the decompression chamber and the cutting chamber are connected, the cut product is carried out from the cutting chamber to the decompression chamber, after which the connection between the decompression chamber and the cutting chamber is blocked, and the inside of the decompression chamber is lower than when the cutting object is cut. It may be a cutting device in which the cut product is carried out from the inside of the decompression chamber while being depressurized by atmospheric pressure.

The cutting device of the present invention, for example,

The air pressure maintaining mechanism includes a containment chamber and an operation unit,

The table and the cutting mechanism are stored in the storage room,

It may be a cutting device in which the atmospheric pressure inside the containment chamber is maintained at an atmospheric pressure higher than atmospheric pressure by the operation unit.

In the cutting apparatus of the present invention, for example, by the air pressure maintaining mechanism, the air pressure outside the table where the object to be cut is held can be maintained at 1.1×10 ⁵ Pa or more.

The manufacturing method of the cut product of the present invention, for example,

Using the cutting thread,

It may be a method of manufacturing a cut product in which the cutting process is performed in the cutting chamber.

The manufacturing method of the cut product of the present invention, for example,

Using the cutting chamber, pressurization chamber and decompression chamber,

Performing the cutting process in the cutting chamber,

It further includes the process of bringing in the cutting object and the process of taking out the cut product,

The cutting object carrying process is a process of carrying the cutting object from the pressurizing chamber into the cutting chamber while the pressurizing chamber and the cutting chamber are connected and the pressurizing chamber and the inside of the cutting chamber are maintained at an atmospheric pressure higher than atmospheric pressure,

In the cutting-out step, the cut-off product from which the object to be cut is cut in the cutting process is carried out from the cutting chamber to the decompression chamber while the decompression chamber and the cutting chamber are connected, and thereafter, the decompression chamber and the cutting chamber are It may be a method of manufacturing a cut product, which is a process of removing the cut product from the inside of the decompression chamber to the outside while the inside of the decompression chamber is decompressed to a lower atmospheric pressure than when the cutting object is cut after the connection is blocked.

In the present invention, "atmospheric pressure higher than atmospheric pressure" may be, for example, atmospheric pressure higher than 1 atm (1.01325×10 ⁵ Pa). In addition, the ``atmospheric pressure higher than atmospheric pressure'' may be, for example, an atmospheric pressure higher than the surrounding atmospheric pressure (atmospheric pressure) when using the cutting device of the present invention, or the ambient atmospheric pressure (atmospheric pressure) when using the cutting product manufacturing method of the present invention. ) May be higher than the air pressure. In addition, the ``atmospheric pressure higher than atmospheric pressure'' can obtain the effect of the present invention if the atmospheric pressure is slightly higher than atmospheric pressure, but for example, 1.1 × 10 ⁵ Pa or more, 1.2 × 10 ⁵ Pa or more, 1.3 × 10 ⁵ Pa or more , 1.4×10 ⁵ Pa or more, 1.5×10 ⁵ Pa or more, 2.0×10 ⁵ Pa or more, 3.0×10 ⁵ Pa or more, or 4.0×10 ⁵ a or more, for example, 1.0×10 ⁶ Pa (1.0 MPa) or less, 9.0×10 ⁵ Pa or less, 8.0×10 ⁵ Pa or less, 7.0×10 ⁵ Pa or less, 6.0×10 ⁵ Pa or less, or 5.0×10 ⁵ Pa or less.

In the present invention, the object to be cut is not particularly limited. For example, the cutting object may be a package substrate or the like, but is not limited thereto and is arbitrary.

In the present invention, the cut product is not particularly limited, but may be, for example, a resin molded product. The resin molded article is not particularly limited, and may be, for example, a resin molded article obtained by simply molding a resin, or may be a resin molded article in which parts such as chips are resin-sealed. In the present invention, the resin molded article may be, for example, an electronic component. In addition, in the present invention, the cut product may be, for example, a finished product, but may be an unfinished semi-finished product.

In the present invention, the resin is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. In addition, it may be a composite material including a thermosetting resin or a thermoplastic resin in part.

In general, the term "electronic component" may refer to a chip before resin sealing or a state in which the chip is resin-sealed. However, in the present invention, unless otherwise specified, the above It refers to an electronic component (electronic component as a finished product) in which the chip is resin-sealed. In the present invention, "chip" refers to a chip before resin sealing, and specifically, a chip such as an IC (Integrated Circuit), a semiconductor chip, and a power control semiconductor element may be mentioned. In the present invention, a chip before resin sealing is referred to as a "chip" for convenience in order to distinguish it from an electronic component after resin sealing. However, in the present invention, the "chip" is not particularly limited as long as it is a chip before resin sealing, and may not have a chip shape.

In the present invention, for example, a semiconductor wafer in which functional elements such as circuit elements and MEMS (Micro Electromechanical Systems) are disposed on a substrate such as silicon or compound semiconductor as an object to be cut is cut (individualized). ) To make it into a cut product. In the present invention, for example, ceramic substrates, glass substrates, etc. including functional elements such as resistors, capacitors, sensors, and surface acoustic wave devices are used as cutting targets, and they are cut (individualized) to provide chip resistance and chip capacitors. , Products (cutting products) such as chip-shaped sensors and surface acoustic wave devices can be manufactured. In addition, in the present invention, for example, a resin molded article can be used as a cutting object, and it can be cut (individualized) to produce optical components (cutting products) such as lenses, optical modules, and light guide plates. Further, in the present invention, for example, a resin molded product can be used as a cutting object, and it can be cut (individualized) to form a product (cut product). Further, in the present invention, for example, a glass plate can be used as a cutting object, and it can be cut (individualized) to produce a glass plate (cut product) used as a cover for various electronic devices or the like. In addition, in the present invention, the object to be cut is not limited thereto and is arbitrary as described above, and the cut product is not particularly limited as described above, and is arbitrary.

Further, in the present invention, the shape of the object to be cut and the cut product is not particularly limited and is arbitrary. For example, the shape of the object to be cut may be a rectangle having a length direction and a width direction, and may be a square or a circle.

In addition, in the present invention, "mounting", "placement" or "installation" includes "fixation".

Hereinafter, specific embodiments of the present invention will be described based on the drawings. Each drawing is schematically omitted and exaggerated as appropriate for convenience of description.

<Example 1>

In this embodiment, an example of a molding mold and a resin molding apparatus and an example of a method of manufacturing a resin molded article using the same will be described.

In the process cross-sectional views of Figs. 1 to 6, a partial configuration of an example of the cutting device of the present invention and each step in the method of manufacturing a cut product using the cutting device are schematically shown.

First, as shown in Fig. 1, a table (jig) 10 is prepared. Here, the jig 10 shown in Figs. 1 to 6 actually constitutes a part of the table, but in the description referring to Figs. 1 to 6, it is described as "table 10" for convenience. The illustration of the entire table including the jig 10 is omitted. As shown, the table 10 has a groove 11 in its upper portion and a through hole 12 penetrating from the upper surface (the cutting object holding surface) to the lower surface. The groove 11 is a groove through which a cutting blade passes through, as described later. In addition, the through hole 12 is a through hole for suctioning the object to be cut and the cut product manufactured by cutting the object to be cut and holding it on the upper surface of the table 10 as described later.

Next, as shown in FIG. 2, the package substrate (cutting object) 20 is mounted on the upper surface of the table 10. As illustrated, in the package substrate 20, one surface of the substrate 21 is resin-molded with a resin (cured resin) 22. The package substrate 20 may be formed of only the substrate 21 and the resin 22, but may further include other members (parts). Further, the other member may be sealed (resin sealed) by the resin 22. Although it does not specifically limit as said other member, For example, it may be a general member used for an electronic component, a semiconductor component, etc. Specifically, a chip, a wire, etc. are mentioned. In addition, in FIG. 2, the package substrate 20 is mounted so that the resin 22 side contacts the upper surface of the table 10.

Next, as shown in Fig. 3, the air inside the table 10 is sucked in the direction of the arrow X1 (inner direction of the table 10) by a suction mechanism (not shown), and the table 10 is Decompress the inside. Accordingly, the package substrate 20 is sucked and held on the upper surface of the table 10 (cutting object holding process). Meanwhile, the suction mechanism is not particularly limited, but may be, for example, a suction pump or a vacuum ejector. In addition, as shown, the atmospheric pressure outside the table 10 on which the package substrate 20 is held is maintained at a higher atmospheric pressure than the atmospheric pressure by an atmospheric pressure holding mechanism (not shown) (atmospheric pressure maintaining step). Accordingly, pressure in the direction of the arrow Y1 (the direction of the table 10) is applied to the package substrate 20 and is pressed against the table 10. The holding force of the package substrate 20 on the table 10 is further strengthened by the pressure in the direction of the arrow Y1.

Next, as shown in FIG. 4, the rotating blade 30 is disposed at a position corresponding to the groove 11 above the package substrate 20. As shown, the rotary blade 30 is configured such that both surfaces of the blade body 31 are fitted by a pair of flanges (fixing members) 32. The rotary blade 30 is a part of the "cutting mechanism" in the cutting device of this embodiment. The rotating blade 30 is mounted on the tip of a rotating shaft (not shown) provided in the cutting mechanism.

Next, as shown in FIG. 5, the package substrate 20 (substrate 21 and resin 22) is cut by rotating the rotary blade 30 (cutting process). At this time, as shown, by allowing the blade body 31 to penetrate the package substrate 20 and enter the groove 11, the package substrate 20 can be completely cut.

And, as shown in Fig. 6, by cutting the package substrate 20 at all predetermined positions (positions of the grooves 11 in the drawing), a package component (cut-off product) 20b can be manufactured. As for the cut product 20b, as illustrated, one surface of the cut substrate 21b is resin-molded from the cut resin (cured resin) 22b. At this time, as shown in FIG. 6, the upper end of the through hole 12 is closed (closed) with the cut product 20b. For this reason, the force by suction in the direction of the arrow X1 (inner direction of the table 10) is applied to the cut product 20b. Further, pressure in the direction of the arrow Y1 (the direction of the table 10) is applied to the cut product 20b, and is pressed against the table 10. Thereby, the holding force of the cut product 20b on the table 10 becomes stronger, and it is possible to suppress or prevent the cut product 20b from escaping from the table 10.

Meanwhile, the cut product 20b may be a product that can be distributed as it is, but may be an unfinished semi-finished product. The semi-finished product can also be made into a product by further processing, for example. Although the said product is not specifically limited, For example, as mentioned above, an electronic component, a semiconductor component, etc. are mentioned.

In the conventional method of cutting a package substrate (Patent Document 1, etc.), if the size of the cut product (part) after cutting is small (for example, if the length of one side is 2 mm or less), the holding force (adsorption force) by the table (jig) ) Was insufficient, and the cut product could come off the table, resulting in a decrease in yield and product defects. Specifically, for example, there is a concern that a cut product spatters (scatters) or chipping (breaks) at a corner portion of the package substrate, which may cause yield reduction and product defects. In particular, when one cut product is removed from the table, there is a possibility that the hole on the table that sucks the cut product may be opened. In addition, when the space in the table is connected to one, there is a fear that the decompression of the space in the table is released by the opening of the hole, so that the holding force of all other cut products on the table decreases. That is, even if one cut product only deviates from the table, there is a fear that all other cut products may escape from the table.

On the other hand, according to the present invention, the air pressure outside the table where the object to be cut is held is maintained at a higher atmospheric pressure than atmospheric pressure. Accordingly, the holding force of the cut product on the table is strengthened, so that even a cut product of a small size can be firmly held (fixed). Accordingly, according to the present invention, it is possible to suppress or prevent the above-described problems such as a decrease in yield and product defects, and thus productivity of a cut product can be improved.

In the above, an example of the cutting device of the present invention and a method of manufacturing a cut product using the same has been described. However, the present invention is not limited to this embodiment. For example, in this embodiment, an example has been described in which a package substrate is cut to manufacture a product such as an electronic component or a semiconductor component, or a semi-finished product thereof. However, in the present invention, the cutting object is not limited to the package substrate as described above, and can be applied to any cutting object. In addition, the cut product is not limited to an electronic component, a semiconductor component, or the like as described above, and is arbitrary. In addition, for example, the cutting device of the present invention is the same as or similar to a general cutting device, except that the air pressure outside the table where the object to be cut is held by the air pressure maintaining mechanism is maintained at an atmospheric pressure higher than atmospheric pressure. Can be The method of manufacturing a cut product of the present invention includes, for example, a general cutting method such as a package substrate, except for performing the ``barometric pressure holding step'' of maintaining the atmospheric pressure outside the table where the cut object is held at an atmospheric pressure higher than atmospheric pressure. The same as or may be performed according to it. As a general cutting method of a package substrate or the like, for example, the method described in Japanese Patent Laid-Open No. 2016-143861 or the like may be the same or a method similar thereto. The configuration, method, etc. of a specific device for maintaining the air pressure outside the table in which the object to be cut is maintained at a pressure higher than atmospheric pressure is not particularly limited, but may be, for example, the same as in Embodiment 2 or Embodiment 3 described later.

The present invention can be suitably used for the production of small cut products, such as 2 mm or less or 1 mm or less on one side. However, the present invention is not limited thereto, and may be used for manufacturing cut products of any size.

<Example 2>

Next, another embodiment of the present invention will be described.

In this example, an example different from that in Example 1 of the cutting device and the method of manufacturing a cut product of the present invention will be described.

7 schematically shows the configuration of the cutting device of this embodiment. As shown, this cutting device 1000 includes three zones (areas) of zone A, zone B and zone C. Zone A contains the pressurization chamber 1100. Zone B includes a cutting chamber 1200. Zone C includes a decompression chamber 1300. The pressurization chamber 1100 is disposed on the cutting object carrying side of the cutting chamber 1200. The decompression chamber 1300 is disposed on the side of the cutting chamber 1200 with which the cut product is carried out. And, as described later, the cutting object is cut in the cutting chamber 1200 to manufacture the cut product. In addition, while the pressurization chamber 1100 and the cutting chamber 1200 are connected, and the inside of the pressurization chamber 1100 and the cutting chamber 1200 is maintained at an atmospheric pressure higher than atmospheric pressure, the object to be cut is removed from the pressurization chamber 1100. It is imported as (1200). In addition, while the decompression chamber 1300 and the cutting chamber 1200 are connected, the cut object (cutting product) is carried out from the cutting chamber 1200 to the decompression chamber 1300. And, after that, after the connection between the decompression chamber 1300 and the cutting chamber 1200 is cut off, the inside of the decompression chamber 1300 is reduced to a lower atmospheric pressure than when the cutting object is cut, and the cut object ( The cut product) is carried out from the inside of the decompression chamber 1300. Meanwhile, when the cut product is carried out from the inside of the decompression chamber 1300, the atmospheric pressure may be substantially the same as the atmospheric pressure. Details will be described later. The cutting chamber 1200, the pressurizing chamber 1100, and the decompression chamber 1300 may use the same structure as the vacuum chamber, the load lock chamber on the carry-in side, and the load lock chamber on the carry-out side, for example, of a film forming apparatus such as a sputtering device. have. However, the cutting chamber 1200, the pressure chamber 1100, and the decompression chamber 1300 are designed so that the internal space can be maintained at an atmospheric pressure higher than atmospheric pressure.

In the cutting apparatus 1000 of FIG. 7, the A region further includes a substrate supply mechanism (cutting object supply mechanism) 1010, a control unit 1020, and a gate valve 1030. A package substrate (object to be cut) 20 is stored in the substrate supply mechanism 1010, and the package substrate 20 can be supplied to the pressurization chamber 1100. Meanwhile, the package substrate 20 may be the same as the package substrate 20 described in the first embodiment. The controller 1020 may control the overall operation of the cutting device 1000. The control method by the control unit 1020 is not particularly limited, but, for example, a computer program or the like can be used. The gate valve 1030 is disposed so as to connect the pressurization chamber 1100 and the cutting chamber 1200. By opening the gate valve 1030, the space in the pressurization chamber 1100 and the space in the cutting chamber 1200 can be connected. By closing the gate valve 1030, the connection between the space in the pressurization chamber 1100 and the space in the cutting chamber 1200 can be cut off and separated.

In Zone B, the table 10, the air pressure regulator 1210, the drain pressure reducer 1220, the spindle 1230, the bellows 1241 and 1242, the receiving plate 1250, the drain flow part 1260, and the outlet 1270 ) Is further included. The table 10 is the same as the table 10 described in the first embodiment (Figs. 1 to 6), and is connected to the above-described suction mechanism (not shown). The atmospheric pressure regulator 1210 includes, for example, an adjustment valve capable of adjusting the inflow amount of compressed air connected to a pipe from an external air compression system, and an on/off valve used at the time of pressure reduction. Meanwhile, the compression system, piping, control valve, and opening/closing valve are not shown. By the air pressure regulator 1210, the internal air pressure of the pressurization chamber 1100, the cutting chamber 1200, and the decompression chamber 1300 is adjusted. By the air pressure regulator 1210, as described later, the air pressure outside the table 10 where the package substrate (cutting object) 20 is held (the air pressure inside the cutting chamber 1200) can be maintained at an atmospheric pressure higher than atmospheric pressure. have. That is, the air pressure regulator 1210 and the cutting chamber 1200 correspond to the "barometric pressure holding mechanism" in the cutting device 1000. In addition, for example, during depressurization, the decompression opening/closing valve may be opened to exhaust the air from an exhaust duct provided in a facility in which the cutting device 1000 is installed. The spindle 1230 is equipped with a rotating blade 30 (not shown in Fig. 7) described in the first embodiment (Figs. 1 to 6). The spindle 1230 is movable back and forth, left and right, and up and down together with the rotary blade 30. The package substrate 20 may be cut by rotating the rotary blade 30 by the spindle 1230. That is, the spindle 1230 constitutes a "cutting mechanism" in the cutting device 1000 together with the rotary blade 30. Further, in order to remove the frictional heat caused by the rotating blade 30, cooling water is sprayed onto the rotating blade 30 by a nozzle (not shown) to cool it, and a cutting process described later can be performed. The nozzle may be provided on the spindle 1230, for example. The cooling water may be, for example, room temperature (room temperature) water. The cooling water may be discharged out of the cutting chamber 1200 as drainage after use. At that time, the pressure of the drainage is reduced by the drainage pressure reducer 1220. The left end of the bellows 1241 and the right end of the bellows 1242 are fixed inside the cutting chamber 1200, respectively. The right end of the bellows 1241 and the left end of the bellows 1242 are connected to the receiving plate 1250, respectively. The receiving plate 1250 can mount and transport the package substrate 20 and the cut product 20b. In addition, by expanding and contracting the bellows 1241 and the bellows 1242, the receiving plate 1250 can be moved in the left-right direction (a direction perpendicular to the carrying direction of the cutting object and the carrying direction of the cut product). The drainage flow unit 1260 is a portion through which the drainage flows. The drainage may be discharged out of the cutting chamber 1200 from the discharge port 1270.

In the C zone, a gate valve 1330, an inspection table 1400, and a tray 1500 are further included. The gate valve 1330 is disposed to connect the decompression chamber 1300 and the cutting chamber 1200. By opening the gate valve 1330, the space in the decompression chamber 1300 and the space in the cutting chamber 1200 may be connected. By closing the gate valve 1330, the connection between the space in the decompression chamber 1300 and the space in the cutting chamber 1200 can be blocked, and they can be separated. In the inspection table 1400, a package component (cut product) 20b is inspected and separated into a good product and a defective product. In the tray 1500, good products among the cut products 20b are received and stored (stock).

The manufacturing method of the cut product using the cutting device 1000 of FIG. 7 can be performed as follows, for example. First, compressed air is supplied into the cutting chamber 1200 using the air pressure regulator 1210 to make the inside of the cutting chamber 1200 a higher atmospheric pressure than atmospheric pressure. Thereafter, the inside of the cutting chamber 1200 is maintained at an atmospheric pressure higher than atmospheric pressure until the cutting process described later is completed (atmospheric pressure maintaining process).

On the other hand, the package substrate 20 is carried into the pressurization chamber 1100 by the substrate supply mechanism 1010. At this time, since the pressurization chamber 1100 is open to connect the inside and the outside, the pressure inside the pressurization chamber 1100 is the same as the atmospheric pressure.

Next, the pressurization chamber 1100 is made into a sealed state. After that, compressed air is supplied into the pressurization chamber 1100 using the air pressure regulator 1210 and pressurized. Accordingly, the pressure inside the pressurization chamber 1100 is made substantially equal to the pressure inside the cutting chamber 1200. When the air pressure inside the pressurization chamber 1100 becomes almost the same as the air pressure inside the cutting chamber 1200, the supply of compressed air by the air pressure regulator 1210 is stopped. In that state, the gate valve 1030 between the pressurization chamber 1100 and the cutting chamber 1200 is opened and the package substrate 20 is carried into the cutting chamber 1200 (the cutting object carrying process). After that, the gate valve 1030 is closed to cut off the connection between the inside of the pressurization chamber 1100 and the inside of the cutting chamber 1200 and separate them.

Next, the package substrate (object to be cut) 20 carried into the cutting chamber 1200 is sucked and held by the table (jig) 10 (the object holding step to be cut). After that, the package substrate 20 is cut with the spindle 1230 and the rotary blade 30 (cutting mechanism) (cutting process). Accordingly, the package substrate (cutting object) 20 can be cut to manufacture an individualized package component (cutting product) 20b. These cutting object holding processes and cutting processes can be performed in the same manner as in Example 1 (Fig. 1 to Fig. 6), for example, and can be performed in the same manner as or in accordance with a general method of cutting a package substrate.

Meanwhile, the cutting process may be performed while cooling by spraying cooling water onto the rotating blade 30 by means of a nozzle (not shown), as described above, for example. After use, the cooling water may flow the drainage flow unit 1260 as drainage as described above, and may be discharged out of the cutting chamber 1200 from the discharge port 1270 as described above.

Meanwhile, compressed air is supplied and pressurized into the decompression chamber 1300 using the air pressure regulator 1210. Then, when the air pressure inside the decompression chamber 1300 becomes almost the same as the air pressure inside the cutting chamber 1200, the supply of compressed air by the air pressure regulator 1210 is stopped. This operation may be performed after the end of the cutting step (cutting of the package substrate 20), but it is effective if it is performed before the end of the cutting step (for example, in parallel with the cutting step).

Then, the cutting process (cutting of the package substrate 20) is finished, and the air pressure inside the decompression chamber 1300 becomes almost the same as the air pressure inside the cutting chamber 1200, and the gate valve 1330 is opened. . In this state, the package component (cut product) 20b is taken out from the cutting chamber 1200 and stored in the decompression chamber 1300. After that, the gate valve 1330 is closed to cut off the connection between the space in the decompression chamber 1300 and the space in the cutting chamber 1200 and separate them. In addition, the air in the decompression chamber 1300 is discharged to the outside using the air pressure regulator 1210 to reduce the pressure. When the atmospheric pressure in the decompression chamber 1300 becomes almost the same as the atmospheric pressure, the package component (cutting product) 20b is carried out to the outside of the decompression chamber 1300 (cutting-out step). Then, the package component (cut-off product) 20b is inspected by the inspection table 1400, and is accommodated in the tray 1500.

On the other hand, as a modified example of the present embodiment (Embodiment 2), for example, the pressure chamber 1100 and the decompression chamber 1300 may be omitted from the cutting device 1000 of FIG. 7. In this case, for example, by opening and closing the gate valve 1030 and the gate valve 1330, the inner space and the outer space of the cutting chamber 1200 may be connected (connected) or separated. In this case, the package substrate (object to be cut) 20 is carried into the cutting chamber 1200 from the substrate supply mechanism (object supply mechanism) 1010 without passing through the pressurization chamber 1100, and the cutting chamber 1200 The package part (cut-off product) 20b is carried out from the outside through the decompression chamber 1300. Accordingly, in the cutting object carrying process, the package substrate (cutting object) 20 is carried in from the carrying portion provided in the cutting chamber 1200 while the inside of the cutting chamber 1200 is at atmospheric pressure. Thereafter, the cutting chamber 1200 is closed, and compressed air is supplied into the cutting chamber 1200 using an air pressure regulator 1210 to make the air pressure in the cutting chamber 1200 higher than atmospheric pressure. The cutting process is performed while the atmospheric pressure in the cutting chamber 1200 is higher than atmospheric pressure. In the cutting product take-out process, after the cutting process, air in the cutting chamber 1200 is discharged to the outside using an air pressure regulator 1210 to reduce pressure, and when the air pressure in the cutting chamber 1200 becomes almost the same as the atmospheric pressure, the package component The (cutting product) 20b is carried out from the carrying out portion provided in the cutting chamber 1200. Other than these, the manufacturing method of the cut product in the modified example in which the pressurization chamber 1100 and the decompression chamber 1300 are omitted from the cutting device 1000 of FIG. 7 is a method of manufacturing a cut product using the cutting device 1000 of FIG. 7. It can be done in the same way.

<Example 3>

Next, another embodiment of the present invention will be described.

In this embodiment, an example different from the first and second embodiments in the cutting device and the method for manufacturing a cut product of the present invention will be described.

In the plan view of Fig. 8, the configuration of the cutting device of the present embodiment is schematically shown. As shown, this cutting device 1000b includes three zones (areas) of zone A, zone B and zone C, like the cutting device of Example 2 (Fig. 7). This cutting device 1000b does not include the pressurization chamber 1100, the cutting chamber 1200, and the decompression chamber 1300, and three areas of the A, B, and C areas are connected into one. Accordingly, this cutting device 1000b does not include the gate valves 1030 and 1330. In addition, in this cutting device 1000b, all three areas of area A, area B, and area C are stored in the storage room 2000. The air pressure regulator 1210 and the drainage pressure reducer 1220 are disposed outside the containment chamber 2000. Further, an operation unit 2100 is disposed outside the storage room 2000. By the operation unit 2100, the atmospheric pressure inside the containment chamber 2000 is maintained at an atmospheric pressure higher than the atmospheric pressure. For this reason, the operation part 2100 and the storage room 2000 correspond to the "barometric pressure holding mechanism" in the cutting device 1000b. In addition, when the method of manufacturing the cut product is not carried out, the air pressure inside the containment chamber 2000 can be made substantially equal to the atmospheric pressure by, for example, the operation unit 2100. The storage room 2000 can be opened or closed. When carrying out the method of manufacturing a cut product, the containment chamber 2000 may be closed and the space inside the containment chamber 2000 and the space outside the containment chamber 2000 can be separated. On the other hand, when the method of manufacturing the cut product is not performed, the storage chamber 2000 may be opened and a space inside the storage chamber 2000 and an external space may be connected. Other than these, the cutting device 1000b of FIG. 8 is the same as the cutting device 1000 of FIG. 7 (Example 2).

The storage room 2000 may be of a size in which, for example, a space for internal maintenance work is secured. Specifically, for example, when a person enters the storage room 2000, maintenance work of the cutting device 1000b may be possible. The structure of the storage room 2000 is not particularly limited, and for example, a structure such as a refrigerator or freezer for business with high airtightness may be used. However, insulation materials that are not for maintaining airtightness can be omitted. In addition, the operation unit 2100 can operate the cutting device 1000b by, for example, communicating with the inside of the storage room 2000 by wireless or wired communication. Specifically, for example, the operation of the cutting device 1000b may be controlled by communicating the operation unit 2100 and the control unit 1020 wirelessly or by wire. In addition, the shape of the operation part 2100 is not particularly limited. For example, in FIG. 8, the operation part 2100 is shown as an operation panel provided outside the wall part of the containment chamber 2000. However, the operation unit 2100 is not limited thereto, and may be, for example, a tablet terminal.

In the method of manufacturing a cut product using the cutting device 1000b of FIG. 8, for example, all the steps described in the second embodiment can be performed while the inside of the containment chamber 2000 is maintained at an atmospheric pressure higher than atmospheric pressure. For example, compressed air may be supplied into the containment chamber 2000 by using an atmospheric pressure adjustment mechanism (not shown, for example, a compression pump, etc.) to maintain the inside of the containment chamber 2000 at an atmospheric pressure higher than atmospheric pressure. As described above, this cutting device 1000b does not include the pressurization chamber 1100, the cutting chamber 1200, and the decompression chamber 1300, and three areas of the A, B and C areas are connected into one. Has been. Therefore, when transporting the package substrate (object to be cut) 20 and the package component (cut product) 20b, the process of changing the atmospheric pressure in the pressurization chamber 1100, the cutting chamber 1200, and the decompression chamber 1300 is performed. Unnecessary. Other than this, the manufacturing method of the cut product using the cutting device 1000b of FIG. 8 can be performed in the same manner as the manufacturing method of the cut product using the cutting device 1000 of FIG. 7 (Example 2).

Meanwhile, the air pressure adjustment mechanism is not particularly limited, and for example, an existing air compression system provided in a facility (eg, a factory) in which the cutting device 1000b is provided may be used. In addition, for example, an air compression system including an air compressor and a receiver tank may be installed separately from the conventional air compression system. This is preferable because the interior of the containment chamber 2000 can be quickly made high pressure.

In addition, as described above, when the method of manufacturing the cut product is not carried out, the air pressure inside the storage chamber 2000 can be made substantially equal to the atmospheric pressure by the operation unit 2100, for example. For example, during maintenance of the cutting device 1000b, the air inside the containment chamber 2000 can be discharged to the outside by using the air pressure adjustment mechanism to reduce the atmospheric pressure inside the containment chamber 2000 to the same level as the atmospheric pressure. have. Accordingly, it is possible to avoid the maintenance worker working in the high pressure chamber.

As described above, the method of manufacturing a cut product using the cutting device 1000 of Example 2 (FIG. 7) changes the atmospheric pressure of the pressurization chamber 1100, the cutting chamber 1200, and the decompression chamber 1300 once every time, as described above. The process of letting you do is necessary. On the other hand, the method of manufacturing a cut product using the cutting device 1000b of this embodiment (FIG. 8), as described above, changes the atmospheric pressure of the pressure chamber 1100, the cutting chamber 1200, and the decompression chamber 1300. The process of making is unnecessary. For this reason, according to the cutting device 1000b of this embodiment (FIG. 8), the manufacturing method of a cut product can be performed more efficiently than the cutting apparatus 1000 of Example 2 (FIG. 7). On the other hand, the cutting device 1000b of the present embodiment (FIG. 8) requires a space for installing the containment chamber 2000.

Meanwhile, as described above, the storage room 2000 of FIG. 8 has been described as having a size in which a space for internal maintenance work (eg, entry and exit of a maintenance worker) is secured, but is not limited thereto. That is, as a modified example of the present embodiment (Embodiment 3), for example, a cover part covering the entire outer side of the cutting device main body is provided to make the cover part a "containment chamber", and the interior thereof can be made sealed. You can also do it.

In addition, the present invention is not limited to the above-described embodiments, and can be arbitrarily or appropriately combined and changed or selected and adopted as necessary within the scope not departing from the spirit of the present invention.

This application claims priority based on Japanese Patent Application No. 2018-021300 for which it applied on February 8, 2018, and the whole disclosed is incorporated herein.

10: Table (Jig) 11: Home
12: through hole 20: package substrate (to be cut)
20b: package part (cut-off product) 21: board
21b: cut substrate 22: resin (cured resin)
22b: cut resin (cured resin) 30: rotating blade (cutting mechanism)
31: blade body 32: flange (fixing member)
1000, 1000b: cutting device
1010: substrate supply mechanism (cutting object supply mechanism)
1020: control unit
1030: gate valve 1100: pressurization chamber
1200: cutting chamber (barometric pressure holding mechanism)
1210: barometric pressure regulator (barometric pressure maintenance mechanism)
1220: drain pressure reducer 1230: spindle (cutting mechanism)
1241, 1242: bellows 1250: receiving plate
1260: drain flow unit 1270: outlet
1300: pressure reducing chamber 1330: gate valve
1400: examination table 1500: tray
2000: containment room (barometric pressure maintenance mechanism)
2100: operation part (barometric pressure maintenance mechanism)
X1: Arrow indicating the direction of suction by the table 10
Y1: Arrow indicating the direction in which pressure is applied to the package substrate 20

Claims (8)

Including a table, an air pressure maintaining mechanism and a cutting mechanism,
The object to be cut is sucked and held by the table,
The air pressure outside the table where the object to be cut is held by the atmospheric pressure maintaining mechanism is maintained at an atmospheric pressure higher than atmospheric pressure,
The cutting object held on the table is cut by the cutting mechanism,
Further comprising a cutting thread,
In the cutting chamber, the air pressure outside the table is maintained at an atmospheric pressure higher than atmospheric pressure by the air pressure maintaining mechanism, and the cutting object held in the table is cut by the cutting mechanism to produce a cut product,
Further comprising a pressure chamber and a decompression chamber,
The pressurization chamber is disposed on the cutting object carrying side of the cutting chamber,
The decompression chamber is disposed on the cutting product carrying side of the cutting chamber,
The pressurization chamber and the cutting chamber are connected, and the cutting object is carried from the pressurization chamber to the cutting chamber while the pressurization chamber and the cutting chamber are maintained at an atmospheric pressure higher than atmospheric pressure,
When the decompression chamber and the cutting chamber are connected, the cut product is carried out from the cutting chamber to the decompression chamber, after which the connection between the decompression chamber and the cutting chamber is blocked, and the inside of the decompression chamber is lower than when the cutting object is cut. A cutting device, characterized in that the cut product is carried out from the inside of the decompression chamber in a state of being depressurized by atmospheric pressure. delete delete The method of claim 1,
The air pressure maintaining mechanism includes a containment chamber and an operation unit,
The table and the cutting mechanism are stored inside the storage room,
The cutting device, wherein the air pressure inside the containment chamber is maintained at an atmospheric pressure higher than atmospheric pressure by the operation unit. The method of claim 1 or 4,
The cutting device, wherein the air pressure outside the table in which the object to be cut is held by the air pressure holding mechanism is maintained at 1.1×10 ⁵ Pa or more. A cutting object holding step of suctioning and holding the cutting object by the table;
An atmospheric pressure maintaining process of maintaining an atmospheric pressure outside the table in which the cutting object is maintained at an atmospheric pressure higher than atmospheric pressure; And
Including; a cutting process of cutting the cutting object held on the table,
Using a cutting chamber, the cutting process is performed in the cutting chamber,
Further comprising a cutting object carrying process and a cut product carrying process using a pressure chamber and a decompression chamber further,
The cutting object carrying process is a process of carrying the cutting object from the pressure chamber into the cutting chamber while the pressure chamber and the cutting chamber are connected and the pressure chamber and the inside of the cutting chamber are maintained at an atmospheric pressure higher than atmospheric pressure. ,
In the cutting-out step, the cut-off product from which the object to be cut is cut in the cutting process is carried out from the cutting chamber to the decompression chamber while the decompression chamber and the cutting chamber are connected, and thereafter, the decompression chamber and the cutting chamber are A method of manufacturing a cut product, characterized in that the step of removing the cut product from the inside of the decompression chamber to the outside while the inside of the decompression chamber is reduced to a lower atmospheric pressure than when the cutting object is cut after the connection is cut off.
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