JP2019126854A - ワーク切断方法及びワイヤソー - Google Patents
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- 150000001875 compounds Chemical class 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
- B24B27/0633—Grinders for cutting-off using a cutting wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
- B23D61/18—Sawing tools of special type, e.g. wire saw strands, saw blades or saw wire equipped with diamonds or other abrasive particles in selected individual positions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/06—Grinders for cutting-off
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/042—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with blades or wires mounted in a reciprocating frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
図3に示すように、このワイヤソー101は、主に、ワークWを切断するためのワイヤ102(高張力鋼線)、ワイヤ102を複数の溝付きローラ103、103’に巻掛けることで形成したワイヤ列104、ワイヤ102に張力を付与するための機構105、105’、切断されるワークWを下方へと送り出すワーク送り機構106、切断時にGC(炭化ケイ素)砥粒等を液体に分散させたスラリを供給する機構107で構成されている。
図1に示すような本発明のワイヤソーを用いて、本発明の切断方法に従い、ワークの切断が終了した後に、ワーク引き抜き時に供給するクーラントを変化させて、ワイヤ列からのワークの引き抜きを行った。複数のワークの切断を行い、ワーク引き抜き時の断線の発生頻度を評価した。なお、固定砥粒ワイヤは下記の表1に示すものを用い、ワークの切断条件及び引き抜き条件は下記の表2に示した。なお、各クーラントの25℃における粘度は、デジタル粘度計(東機産業(株)製 TVB−10型)を用いて測定した。結果を下記表3に示した。
ワーク引き抜き用クーラントとして、ワーク切断用クーラントと同じ粘度のクーラントを用いたこと以外は、実施例と同様にして複数のワークの切断を行い、ワーク引き抜き時の断線の発生頻度を評価した。結果を下記表3に示した。
4…ワイヤ列、 5、5’…張力付与機構、 6…ワーク送り機構、
7…クーラント供給機構、 8、8’…ワイヤリール、
9、9’…トラバーサ、 10、10’…低トルクモータ、
11…駆動用モータ、 W…ワーク。
Claims (5)
- 表面に砥粒が固着された固定砥粒ワイヤを複数の溝付ローラに巻掛けることによってワイヤ列を形成し、前記固定砥粒ワイヤを軸方向に往復走行させながら、前記ワイヤ列に対してワークを切り込み送りすることにより、前記ワークを軸方向に並ぶ複数の箇所で同時に切断するワイヤソーによるワークの切断方法であって、
前記固定砥粒ワイヤによるワーク切断中にはワーク切断用クーラントを前記ワイヤ列上に供給し、前記ワークの切断後に前記ワイヤ列から前記ワークを引き抜く際には、前記ワーク切断用クーラントとは異なる前記ワーク切断用クーラントよりも高粘度のワーク引き抜き用クーラントを前記ワイヤ列上に供給することを特徴とするワーク切断方法。 - 前記ワーク切断用クーラントとして、25℃における粘度が5mPas以下のものを使用し、前記ワーク引き抜き用クーラントとして、25℃における粘度が15mPas以上のものを使用することを特徴とする請求項1に記載のワーク切断方法。
- 前記ワーク切断用クーラントとして、水分の含有量が99質量%以上のものを使用し、前記ワーク引き抜き用クーラントとして、水分の含有量が90質量%以下のものを使用すること特徴とする請求項1又は請求項2に記載のワーク切断方法。
- 前記ワークとして、直径が300mm以上のものを切断することを特徴とする請求項1から請求項3のいずれか一項に記載のワーク切断方法。
- 表面に砥粒が固着された固定砥粒ワイヤが複数の溝付ローラに巻掛けされることによって形成されたワイヤ列と、ワークを保持しながら前記ワイヤ列に押し当てるワーク送り機構と、前記ワイヤ列上にクーラントを供給するクーラント供給機構とを具備し、前記固定砥粒ワイヤを軸方向に往復走行させながら、前記ワイヤ列に対して前記クーラント供給機構よりクーラントを供給しつつ、前記ワーク送り機構により前記ワークを切り込み送りすることにより、前記ワークを軸方向に並ぶ複数の箇所で同時に切断するワイヤソーであって、
前記クーラント供給機構は、前記固定砥粒ワイヤによるワーク切断中にはワーク切断用クーラントを前記ワイヤ列上に供給し、前記ワークの切断後に前記ワイヤ列から前記ワークを引き抜く際には、前記ワーク切断用クーラントとは異なる前記ワーク切断用クーラントよりも高粘度のワーク引き抜き用クーラントを前記ワイヤ列上に供給するものであることを特徴とするワイヤソー。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
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JP2018008110A JP6819619B2 (ja) | 2018-01-22 | 2018-01-22 | ワーク切断方法及びワイヤソー |
DE112018006291.0T DE112018006291T5 (de) | 2018-01-22 | 2018-11-26 | Verfahren zum Schneiden eines Werkstücks und Drahtsäge |
SG11202005519QA SG11202005519QA (en) | 2018-01-22 | 2018-11-26 | Method for slicing workpiece and wire saw |
US16/963,972 US11958160B2 (en) | 2018-01-22 | 2018-11-26 | Method for slicing workpiece and wire saw |
KR1020207019214A KR102650009B1 (ko) | 2018-01-22 | 2018-11-26 | 워크절단방법 및 와이어소 |
PCT/JP2018/043315 WO2019142494A1 (ja) | 2018-01-22 | 2018-11-26 | ワーク切断方法及びワイヤソー |
CN201880082498.7A CN111511504B (zh) | 2018-01-22 | 2018-11-26 | 工件切断方法及线锯 |
TW107142851A TWI784096B (zh) | 2018-01-22 | 2018-11-30 | 工件切斷方法及線鋸 |
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JP2018008110A JP6819619B2 (ja) | 2018-01-22 | 2018-01-22 | ワーク切断方法及びワイヤソー |
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JP6819619B2 JP6819619B2 (ja) | 2021-01-27 |
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US (1) | US11958160B2 (ja) |
JP (1) | JP6819619B2 (ja) |
KR (1) | KR102650009B1 (ja) |
CN (1) | CN111511504B (ja) |
DE (1) | DE112018006291T5 (ja) |
SG (1) | SG11202005519QA (ja) |
TW (1) | TWI784096B (ja) |
WO (1) | WO2019142494A1 (ja) |
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EP3764351A1 (en) | 2019-07-08 | 2021-01-13 | Konica Minolta, Inc. | Voice-operated system, controller, control program, and processing device |
CN114227499A (zh) * | 2021-12-18 | 2022-03-25 | 浙江大学湖州研究院 | 一种水处理膜元件金刚线切割设备 |
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JP2023095080A (ja) * | 2021-12-24 | 2023-07-06 | 株式会社Sumco | シリコンインゴットの切断方法 |
CN115351681A (zh) * | 2022-10-18 | 2022-11-18 | 江苏中畅精密科技有限公司 | 一种电镀金刚石切割线表面处理设备及其使用方法 |
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KR20200106889A (ko) | 2020-09-15 |
SG11202005519QA (en) | 2020-07-29 |
DE112018006291T5 (de) | 2020-10-08 |
CN111511504A (zh) | 2020-08-07 |
TWI784096B (zh) | 2022-11-21 |
US11958160B2 (en) | 2024-04-16 |
KR102650009B1 (ko) | 2024-03-22 |
US20210016413A1 (en) | 2021-01-21 |
TW201932240A (zh) | 2019-08-16 |
JP6819619B2 (ja) | 2021-01-27 |
CN111511504B (zh) | 2022-03-01 |
WO2019142494A1 (ja) | 2019-07-25 |
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