JP2019119086A5 - - Google Patents
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- Publication number
- JP2019119086A5 JP2019119086A5 JP2017254137A JP2017254137A JP2019119086A5 JP 2019119086 A5 JP2019119086 A5 JP 2019119086A5 JP 2017254137 A JP2017254137 A JP 2017254137A JP 2017254137 A JP2017254137 A JP 2017254137A JP 2019119086 A5 JP2019119086 A5 JP 2019119086A5
- Authority
- JP
- Japan
- Prior art keywords
- joining
- substrate
- substrates
- thin film
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 27
- 238000000034 method Methods 0.000 claims 14
- 229910044991 metal oxide Inorganic materials 0.000 claims 9
- 150000004706 metal oxides Chemical class 0.000 claims 9
- 239000010409 thin film Substances 0.000 claims 9
- 230000001678 irradiating effect Effects 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 239000007789 gas Substances 0.000 claims 3
- 239000011261 inert gas Substances 0.000 claims 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910001882 dioxygen Inorganic materials 0.000 claims 1
- 238000001659 ion-beam spectroscopy Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017254137A JP7045186B2 (ja) | 2017-12-28 | 2017-12-28 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
| CN201880087846.XA CN111655490B (zh) | 2017-12-28 | 2018-12-21 | 基板的接合方法、基板层叠体和具备基板层叠体的器件 |
| EP18897427.3A EP3736134B1 (en) | 2017-12-28 | 2018-12-21 | Method for bonding substrate |
| PCT/JP2018/047204 WO2019131490A1 (ja) | 2017-12-28 | 2018-12-21 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
| KR1020207021853A KR102690513B1 (ko) | 2017-12-28 | 2018-12-21 | 기판의 접합 방법, 투명기판 적층체 및 기판 적층체를 구비하는 디바이스 |
| US16/958,955 US12351511B2 (en) | 2017-12-28 | 2018-12-21 | Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017254137A JP7045186B2 (ja) | 2017-12-28 | 2017-12-28 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019119086A JP2019119086A (ja) | 2019-07-22 |
| JP2019119086A5 true JP2019119086A5 (enExample) | 2020-11-26 |
| JP7045186B2 JP7045186B2 (ja) | 2022-03-31 |
Family
ID=67067315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017254137A Active JP7045186B2 (ja) | 2017-12-28 | 2017-12-28 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12351511B2 (enExample) |
| EP (1) | EP3736134B1 (enExample) |
| JP (1) | JP7045186B2 (enExample) |
| KR (1) | KR102690513B1 (enExample) |
| CN (1) | CN111655490B (enExample) |
| WO (1) | WO2019131490A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7287772B2 (ja) * | 2018-11-26 | 2023-06-06 | ランテクニカルサービス株式会社 | 透明基板の接合方法及び積層体 |
| CN114207781A (zh) * | 2019-09-05 | 2022-03-18 | 国立大学法人东北大学 | 化学键合法及接合结构体 |
| GB2599393B (en) * | 2020-09-30 | 2024-12-18 | Dyson Technology Ltd | Method and apparatus for sputter deposition |
| JP2022071958A (ja) * | 2020-10-29 | 2022-05-17 | コミヤマエレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| CN112897899B (zh) * | 2021-01-21 | 2022-06-14 | 杭州中科神光科技有限公司 | 一种玻璃组件键合的方法 |
| CN112919815B (zh) * | 2021-01-21 | 2022-06-03 | 杭州中科神光科技有限公司 | 一种玻璃组件键合的方法 |
| US20220336405A1 (en) * | 2021-04-15 | 2022-10-20 | Apple Inc. | Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and Resulting Structures |
| WO2022242879A1 (en) * | 2021-05-21 | 2022-11-24 | Applied Materials, Inc. | Apparatus and method for manufacturing a composite film |
| EP4501621A4 (en) | 2022-03-25 | 2025-07-16 | Fujifilm Corp | Laminate and method for producing laminate |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3848989B2 (ja) | 2003-05-15 | 2006-11-22 | 唯知 須賀 | 基板接合方法および基板接合装置 |
| JP2008094063A (ja) * | 2006-10-16 | 2008-04-24 | Asahi Kasei Chemicals Corp | 金属酸化物積層体 |
| JP5070557B2 (ja) | 2007-02-27 | 2012-11-14 | 武仁 島津 | 常温接合方法 |
| JP2009199902A (ja) | 2008-02-21 | 2009-09-03 | Seiko Epson Corp | 有機発光装置および電子機器 |
| KR102092737B1 (ko) | 2012-04-10 | 2020-05-27 | 랜 테크니컬 서비스 가부시키가이샤 | 고분자 필름과 고분자 필름을 접합하는 방법, 고분자 필름과 무기재료 기판을 접합하는 방법, 고분자 필름 적층체 및 고분자 필름과 무기재료 기판의 적층체 |
| KR20150023312A (ko) | 2012-05-29 | 2015-03-05 | 아사히 가라스 가부시키가이샤 | 유리 적층체 및 전자 디바이스의 제조 방법 |
| CN104412706B (zh) * | 2012-06-15 | 2017-05-31 | 须贺唯知 | 电子元件的封装方法以及基板接合体 |
| CN102941712B (zh) * | 2012-10-23 | 2015-07-22 | 江南大学 | 一种高分子材料-金属氧化物薄膜复合材料及其制备方法 |
| JP2014123514A (ja) | 2012-12-21 | 2014-07-03 | Ran Technical Service Kk | 電子素子の封止方法及び封止構造 |
| US9703011B2 (en) * | 2013-05-07 | 2017-07-11 | Corning Incorporated | Scratch-resistant articles with a gradient layer |
| JP6387780B2 (ja) | 2013-10-28 | 2018-09-12 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP6282142B2 (ja) | 2014-03-03 | 2018-02-21 | 日東電工株式会社 | 赤外線反射基板およびその製造方法 |
| JP6349904B2 (ja) | 2014-04-18 | 2018-07-04 | 日亜化学工業株式会社 | 半導体発光装置およびその製造方法 |
| KR102202977B1 (ko) | 2014-08-22 | 2021-01-14 | 동우 화인켐 주식회사 | 터치 센서의 제조 방법 |
| US10763002B2 (en) * | 2015-04-28 | 2020-09-01 | Mitsui Mining & Smelting Co., Ltd. | Surface-treated copper foil, manufacturing method therefor, printed circuit board copper-clad laminate, and printed circuit board |
| US10675842B2 (en) * | 2016-02-26 | 2020-06-09 | Konica Minolta, Inc. | Transparent electrode and organic electronic device including the same |
| JP6414104B2 (ja) | 2016-02-29 | 2018-10-31 | 日亜化学工業株式会社 | 発光装置の製造方法 |
-
2017
- 2017-12-28 JP JP2017254137A patent/JP7045186B2/ja active Active
-
2018
- 2018-12-21 WO PCT/JP2018/047204 patent/WO2019131490A1/ja not_active Ceased
- 2018-12-21 EP EP18897427.3A patent/EP3736134B1/en active Active
- 2018-12-21 KR KR1020207021853A patent/KR102690513B1/ko active Active
- 2018-12-21 CN CN201880087846.XA patent/CN111655490B/zh active Active
- 2018-12-21 US US16/958,955 patent/US12351511B2/en active Active