JP2019119086A5 - - Google Patents
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- Publication number
- JP2019119086A5 JP2019119086A5 JP2017254137A JP2017254137A JP2019119086A5 JP 2019119086 A5 JP2019119086 A5 JP 2019119086A5 JP 2017254137 A JP2017254137 A JP 2017254137A JP 2017254137 A JP2017254137 A JP 2017254137A JP 2019119086 A5 JP2019119086 A5 JP 2019119086A5
- Authority
- JP
- Japan
- Prior art keywords
- joining
- substrate
- substrates
- thin film
- metal oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims 27
- 238000000034 method Methods 0.000 claims 14
- 229910044991 metal oxide Inorganic materials 0.000 claims 9
- 150000004706 metal oxides Chemical class 0.000 claims 9
- 239000010409 thin film Substances 0.000 claims 9
- 230000001678 irradiating effect Effects 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 239000007789 gas Substances 0.000 claims 3
- 239000011261 inert gas Substances 0.000 claims 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 239000010408 film Substances 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims 1
- 229910001882 dioxygen Inorganic materials 0.000 claims 1
- 238000001659 ion-beam spectroscopy Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 238000004544 sputter deposition Methods 0.000 claims 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017254137A JP7045186B2 (ja) | 2017-12-28 | 2017-12-28 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
| US16/958,955 US12351511B2 (en) | 2017-12-28 | 2018-12-21 | Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate |
| KR1020207021853A KR102690513B1 (ko) | 2017-12-28 | 2018-12-21 | 기판의 접합 방법, 투명기판 적층체 및 기판 적층체를 구비하는 디바이스 |
| PCT/JP2018/047204 WO2019131490A1 (ja) | 2017-12-28 | 2018-12-21 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
| CN201880087846.XA CN111655490B (zh) | 2017-12-28 | 2018-12-21 | 基板的接合方法、基板层叠体和具备基板层叠体的器件 |
| EP18897427.3A EP3736134B1 (en) | 2017-12-28 | 2018-12-21 | Method for bonding substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017254137A JP7045186B2 (ja) | 2017-12-28 | 2017-12-28 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019119086A JP2019119086A (ja) | 2019-07-22 |
| JP2019119086A5 true JP2019119086A5 (enExample) | 2020-11-26 |
| JP7045186B2 JP7045186B2 (ja) | 2022-03-31 |
Family
ID=67067315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017254137A Active JP7045186B2 (ja) | 2017-12-28 | 2017-12-28 | 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12351511B2 (enExample) |
| EP (1) | EP3736134B1 (enExample) |
| JP (1) | JP7045186B2 (enExample) |
| KR (1) | KR102690513B1 (enExample) |
| CN (1) | CN111655490B (enExample) |
| WO (1) | WO2019131490A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7287772B2 (ja) | 2018-11-26 | 2023-06-06 | ランテクニカルサービス株式会社 | 透明基板の接合方法及び積層体 |
| CN114207781A (zh) | 2019-09-05 | 2022-03-18 | 国立大学法人东北大学 | 化学键合法及接合结构体 |
| GB2599393B (en) * | 2020-09-30 | 2024-12-18 | Dyson Technology Ltd | Method and apparatus for sputter deposition |
| JP2022071958A (ja) * | 2020-10-29 | 2022-05-17 | コミヤマエレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法 |
| CN112897899B (zh) * | 2021-01-21 | 2022-06-14 | 杭州中科神光科技有限公司 | 一种玻璃组件键合的方法 |
| CN112919815B (zh) * | 2021-01-21 | 2022-06-03 | 杭州中科神光科技有限公司 | 一种玻璃组件键合的方法 |
| US20220336405A1 (en) * | 2021-04-15 | 2022-10-20 | Apple Inc. | Method of Fine Pitch Hybrid Bonding with Dissimilar CTE Wafers and Resulting Structures |
| WO2022242879A1 (en) * | 2021-05-21 | 2022-11-24 | Applied Materials, Inc. | Apparatus and method for manufacturing a composite film |
| KR20240151785A (ko) | 2022-03-25 | 2024-10-18 | 후지필름 가부시키가이샤 | 적층체 및 적층체의 제조 방법 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3848989B2 (ja) | 2003-05-15 | 2006-11-22 | 唯知 須賀 | 基板接合方法および基板接合装置 |
| JP2008094063A (ja) * | 2006-10-16 | 2008-04-24 | Asahi Kasei Chemicals Corp | 金属酸化物積層体 |
| JP5070557B2 (ja) | 2007-02-27 | 2012-11-14 | 武仁 島津 | 常温接合方法 |
| JP2009199902A (ja) | 2008-02-21 | 2009-09-03 | Seiko Epson Corp | 有機発光装置および電子機器 |
| WO2013154107A1 (ja) | 2012-04-10 | 2013-10-17 | ランテクニカルサービス株式会社 | 高分子フィルムと高分子フィルムとを接合する方法、高分子フィルムと無機材料基板とを接合する方法、高分子フィルム積層体及び高分子フィルムと無機材料基板との積層体 |
| WO2013179881A1 (ja) * | 2012-05-29 | 2013-12-05 | 旭硝子株式会社 | ガラス積層体および電子デバイスの製造方法 |
| CN104412706B (zh) * | 2012-06-15 | 2017-05-31 | 须贺唯知 | 电子元件的封装方法以及基板接合体 |
| CN102941712B (zh) * | 2012-10-23 | 2015-07-22 | 江南大学 | 一种高分子材料-金属氧化物薄膜复合材料及其制备方法 |
| JP2014123514A (ja) | 2012-12-21 | 2014-07-03 | Ran Technical Service Kk | 電子素子の封止方法及び封止構造 |
| US9703011B2 (en) * | 2013-05-07 | 2017-07-11 | Corning Incorporated | Scratch-resistant articles with a gradient layer |
| JP6387780B2 (ja) | 2013-10-28 | 2018-09-12 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| JP6282142B2 (ja) | 2014-03-03 | 2018-02-21 | 日東電工株式会社 | 赤外線反射基板およびその製造方法 |
| JP6349904B2 (ja) | 2014-04-18 | 2018-07-04 | 日亜化学工業株式会社 | 半導体発光装置およびその製造方法 |
| KR102202977B1 (ko) * | 2014-08-22 | 2021-01-14 | 동우 화인켐 주식회사 | 터치 센서의 제조 방법 |
| WO2016174970A1 (ja) * | 2015-04-28 | 2016-11-03 | 三井金属鉱業株式会社 | 表面処理銅箔及びその製造方法、プリント配線板用銅張積層板、並びにプリント配線板 |
| WO2017145417A1 (ja) * | 2016-02-26 | 2017-08-31 | コニカミノルタ株式会社 | 透明電極及びこれを備えた有機電子デバイス |
| JP6414104B2 (ja) | 2016-02-29 | 2018-10-31 | 日亜化学工業株式会社 | 発光装置の製造方法 |
-
2017
- 2017-12-28 JP JP2017254137A patent/JP7045186B2/ja active Active
-
2018
- 2018-12-21 CN CN201880087846.XA patent/CN111655490B/zh active Active
- 2018-12-21 US US16/958,955 patent/US12351511B2/en active Active
- 2018-12-21 WO PCT/JP2018/047204 patent/WO2019131490A1/ja not_active Ceased
- 2018-12-21 KR KR1020207021853A patent/KR102690513B1/ko active Active
- 2018-12-21 EP EP18897427.3A patent/EP3736134B1/en active Active