JP7045186B2 - 基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス - Google Patents

基板の接合方法、透明基板積層体及び基板積層体を備えるデバイス Download PDF

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JP7045186B2
JP7045186B2 JP2017254137A JP2017254137A JP7045186B2 JP 7045186 B2 JP7045186 B2 JP 7045186B2 JP 2017254137 A JP2017254137 A JP 2017254137A JP 2017254137 A JP2017254137 A JP 2017254137A JP 7045186 B2 JP7045186 B2 JP 7045186B2
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Prior art keywords
substrate
substrates
bonding
joining
metal oxide
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JP2019119086A (ja
JP2019119086A5 (enExample
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好家 松本
唯知 須賀
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Lan Technical Service Co Ltd
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Lan Technical Service Co Ltd
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Application filed by Lan Technical Service Co Ltd filed Critical Lan Technical Service Co Ltd
Priority to JP2017254137A priority Critical patent/JP7045186B2/ja
Priority to KR1020207021853A priority patent/KR102690513B1/ko
Priority to US16/958,955 priority patent/US12351511B2/en
Priority to EP18897427.3A priority patent/EP3736134B1/en
Priority to PCT/JP2018/047204 priority patent/WO2019131490A1/ja
Priority to CN201880087846.XA priority patent/CN111655490B/zh
Publication of JP2019119086A publication Critical patent/JP2019119086A/ja
Publication of JP2019119086A5 publication Critical patent/JP2019119086A5/ja
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    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
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