JP2019117909A5 - - Google Patents

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Publication number
JP2019117909A5
JP2019117909A5 JP2017252357A JP2017252357A JP2019117909A5 JP 2019117909 A5 JP2019117909 A5 JP 2019117909A5 JP 2017252357 A JP2017252357 A JP 2017252357A JP 2017252357 A JP2017252357 A JP 2017252357A JP 2019117909 A5 JP2019117909 A5 JP 2019117909A5
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JP
Japan
Prior art keywords
mounting portions
wiring
semiconductor chip
semiconductor device
mounting
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JP2017252357A
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English (en)
Japanese (ja)
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JP7015691B2 (ja
JP2019117909A (ja
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Priority to JP2017252357A priority Critical patent/JP7015691B2/ja
Priority claimed from JP2017252357A external-priority patent/JP7015691B2/ja
Priority to US16/214,284 priority patent/US11309224B2/en
Publication of JP2019117909A publication Critical patent/JP2019117909A/ja
Publication of JP2019117909A5 publication Critical patent/JP2019117909A5/ja
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Publication of JP7015691B2 publication Critical patent/JP7015691B2/ja
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JP2017252357A 2017-12-27 2017-12-27 半導体装置 Active JP7015691B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017252357A JP7015691B2 (ja) 2017-12-27 2017-12-27 半導体装置
US16/214,284 US11309224B2 (en) 2017-12-27 2018-12-10 Folded substrate for stacked integrated circuit devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017252357A JP7015691B2 (ja) 2017-12-27 2017-12-27 半導体装置

Publications (3)

Publication Number Publication Date
JP2019117909A JP2019117909A (ja) 2019-07-18
JP2019117909A5 true JP2019117909A5 (enExample) 2020-09-17
JP7015691B2 JP7015691B2 (ja) 2022-02-03

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Family Applications (1)

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JP2017252357A Active JP7015691B2 (ja) 2017-12-27 2017-12-27 半導体装置

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US (1) US11309224B2 (enExample)
JP (1) JP7015691B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11201096B2 (en) * 2019-07-09 2021-12-14 Texas Instruments Incorporated Packaged device with die wrapped by a substrate
JP7539820B2 (ja) * 2020-11-16 2024-08-26 新光電気工業株式会社 配線基板及び半導体装置
US11710722B2 (en) * 2021-04-16 2023-07-25 Micron Technology, Inc. Semiconductor assemblies with systems and methods for managing high die stack structures
CN113851451B (zh) * 2021-11-30 2022-08-02 江苏长晶科技有限公司 一种基于可塑性基板的芯片3d堆叠的封装结构及其制造方法
US20230176108A1 (en) * 2021-12-06 2023-06-08 Samsung Electronics Co.,Ltd. Semiconductor package and method of testing the same
CN116660999A (zh) * 2022-02-21 2023-08-29 北京字跳网络技术有限公司 佩戴检测方法、装置、设备、存储介质及计算机程序产品

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128831A (en) * 1991-10-31 1992-07-07 Micron Technology, Inc. High-density electronic package comprising stacked sub-modules which are electrically interconnected by solder-filled vias
JP3110922B2 (ja) * 1993-08-12 2000-11-20 富士通株式会社 マルチチップ・モジュール
US5646446A (en) * 1995-12-22 1997-07-08 Fairchild Space And Defense Corporation Three-dimensional flexible assembly of integrated circuits
US6444921B1 (en) * 2000-02-03 2002-09-03 Fujitsu Limited Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like
JP2002171071A (ja) 2000-12-04 2002-06-14 Ibiden Co Ltd 多層配線基板、及びその製造方法
JP2004228344A (ja) 2003-01-23 2004-08-12 Oki Electric Cable Co Ltd 多層ｆｐｃ
US6940158B2 (en) 2003-05-30 2005-09-06 Tessera, Inc. Assemblies having stacked semiconductor chips and methods of making same
US7358444B2 (en) * 2004-10-13 2008-04-15 Intel Corporation Folded substrate with interposer package for integrated circuit devices
CN101138089B (zh) 2005-01-31 2011-02-09 斯班逊有限公司 层叠型半导体装置及层叠型半导体装置的制造方法
DE102006053461A1 (de) 2006-11-09 2008-05-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mikroelektronische Baugruppe und Verfahren zum Herstellen einer mikroelektronischen Baugruppe
TWI365524B (en) * 2007-10-04 2012-06-01 Unimicron Technology Corp Stackable semiconductor device and fabrication method thereof
US8278141B2 (en) * 2008-06-11 2012-10-02 Stats Chippac Ltd. Integrated circuit package system with internal stacking module
US8241964B2 (en) 2010-05-13 2012-08-14 Stats Chippac, Ltd. Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
CN102254898A (zh) 2011-07-01 2011-11-23 中国科学院微电子研究所 一种基于柔性基板封装的屏蔽结构及其制作工艺
US10192810B2 (en) * 2013-06-28 2019-01-29 Intel Corporation Underfill material flow control for reduced die-to-die spacing in semiconductor packages
CN104637927B (zh) * 2013-11-12 2019-01-22 中国科学院微电子研究所 一种基于柔性基板的三维封装结构及工艺方法

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