JP2019109103A - 検査治具 - Google Patents
検査治具 Download PDFInfo
- Publication number
- JP2019109103A JP2019109103A JP2017241392A JP2017241392A JP2019109103A JP 2019109103 A JP2019109103 A JP 2019109103A JP 2017241392 A JP2017241392 A JP 2017241392A JP 2017241392 A JP2017241392 A JP 2017241392A JP 2019109103 A JP2019109103 A JP 2019109103A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- flexible substrate
- substrate
- inspection jig
- rigid substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007689 inspection Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 80
- 239000000523 sample Substances 0.000 claims abstract description 19
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract description 14
- 238000003825 pressing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Abstract
Description
リジッド基板と、
前記リジッド基板に接続されたフレキシブル基板と、
前記フレキシブル基板の一部を前記リジッド基板に対して第1方向に突出した状態で支持する支持体と、
前記支持体を前記リジッド基板に対して前記第1方向に付勢する付勢手段と、
前記フレキシブル基板の前記リジッド基板に対して突出した突出部に設けられたコンタクタと、を備え、
前記コンタクタは、
コンタクトハウジングと、
前記コンタクトハウジングに支持され、一端が前記突出部上の接点部に接触するプローブと、を有する。
10 リジッド基板、11 貫通穴、12 高周波ライン(高周波用導電パターン)、19 ネジ、
20 フレキシブル基板、21 突出部、22 傾斜部、23 コンタクトパッド(接点部)、25 高周波ライン(高周波用導電パターン)、26 グランドライン(グランド用導電パターン)、28 電子部品、29 コンタクトバンプ、
30 台座ブロック(支持体)、
40 コンタクタ、41 コンタクトハウジング、42 プローブ、47 ネジ、
50 押さえブロック、51 弾性体、55 スプリング(付勢手段)、
60 取付機構、
90 被測定ウェハ(検査対象物)、91 バンプ
Claims (3)
- リジッド基板と、
前記リジッド基板に接続されたフレキシブル基板と、
前記フレキシブル基板の一部を前記リジッド基板に対して第1方向に突出した状態で支持する支持体と、
前記支持体を前記リジッド基板に対して前記第1方向に付勢する付勢手段と、
前記フレキシブル基板の前記リジッド基板に対して突出した突出部に設けられたコンタクタと、を備え、
前記コンタクタは、
コンタクトハウジングと、
前記コンタクトハウジングに支持され、一端が前記突出部上の接点部に接触するプローブと、を有する、検査治具。 - 前記プローブは、1本ごとに交換可能な状態で前記コンタクトハウジングに設けられている、請求項1に記載の検査治具。
- 前記コンタクトハウジングは、前記支持体に対して着脱可能に固定されている、請求項1又は2に記載の検査治具。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017241392A JP2019109103A (ja) | 2017-12-18 | 2017-12-18 | 検査治具 |
TW107142252A TWI811265B (zh) | 2017-12-18 | 2018-11-27 | 檢查輔助具 |
US16/202,304 US10712383B2 (en) | 2017-12-18 | 2018-11-28 | Inspection jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017241392A JP2019109103A (ja) | 2017-12-18 | 2017-12-18 | 検査治具 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2019109103A true JP2019109103A (ja) | 2019-07-04 |
Family
ID=66815926
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017241392A Pending JP2019109103A (ja) | 2017-12-18 | 2017-12-18 | 検査治具 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10712383B2 (ja) |
JP (1) | JP2019109103A (ja) |
TW (1) | TWI811265B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023008227A1 (ja) * | 2021-07-28 | 2023-02-02 | 株式会社ヨコオ | プローブカード |
WO2023047962A1 (ja) * | 2021-09-27 | 2023-03-30 | 株式会社ヨコオ | コンタクトユニット及び検査治具 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT201800005444A1 (it) * | 2018-05-16 | 2019-11-16 | Scheda di misura avente elevate prestazioni in alta frequenza |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998058266A1 (fr) * | 1997-06-17 | 1998-12-23 | Advantest Corporation | Carte d'essai |
JP2005024377A (ja) * | 2003-07-02 | 2005-01-27 | Hitachi Ltd | プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法 |
US20120313659A1 (en) * | 2011-06-10 | 2012-12-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe Card for Probing Integrated Circuits |
JP2013120070A (ja) * | 2011-12-06 | 2013-06-17 | Shinko Electric Ind Co Ltd | プローブカード |
JP2014001997A (ja) * | 2012-06-18 | 2014-01-09 | Micronics Japan Co Ltd | 垂直動作式プローブカード |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4906920A (en) * | 1988-10-11 | 1990-03-06 | Hewlett-Packard Company | Self-leveling membrane probe |
US5395253A (en) * | 1993-04-29 | 1995-03-07 | Hughes Aircraft Company | Membrane connector with stretch induced micro scrub |
TW300954B (en) * | 1995-07-14 | 1997-03-21 | Tokyo Electron Co Ltd | The probe card used in prober |
US7733106B2 (en) * | 2005-09-19 | 2010-06-08 | Formfactor, Inc. | Apparatus and method of testing singulated dies |
JP6525831B2 (ja) | 2015-09-15 | 2019-06-05 | 株式会社ヨコオ | コンタクトユニット及び検査治具 |
US9784763B1 (en) * | 2016-04-08 | 2017-10-10 | Cascade Microtech, Inc. | Shielded probe systems with controlled testing environments |
-
2017
- 2017-12-18 JP JP2017241392A patent/JP2019109103A/ja active Pending
-
2018
- 2018-11-27 TW TW107142252A patent/TWI811265B/zh active
- 2018-11-28 US US16/202,304 patent/US10712383B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998058266A1 (fr) * | 1997-06-17 | 1998-12-23 | Advantest Corporation | Carte d'essai |
JP2005024377A (ja) * | 2003-07-02 | 2005-01-27 | Hitachi Ltd | プローブシート、プローブカード、半導体検査装置および半導体装置の製造方法 |
US20120313659A1 (en) * | 2011-06-10 | 2012-12-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Probe Card for Probing Integrated Circuits |
JP2013120070A (ja) * | 2011-12-06 | 2013-06-17 | Shinko Electric Ind Co Ltd | プローブカード |
JP2014001997A (ja) * | 2012-06-18 | 2014-01-09 | Micronics Japan Co Ltd | 垂直動作式プローブカード |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023008227A1 (ja) * | 2021-07-28 | 2023-02-02 | 株式会社ヨコオ | プローブカード |
WO2023047962A1 (ja) * | 2021-09-27 | 2023-03-30 | 株式会社ヨコオ | コンタクトユニット及び検査治具 |
Also Published As
Publication number | Publication date |
---|---|
US20190187205A1 (en) | 2019-06-20 |
US10712383B2 (en) | 2020-07-14 |
TWI811265B (zh) | 2023-08-11 |
TW201928363A (zh) | 2019-07-16 |
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