JP2019102803A5 - - Google Patents

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Publication number
JP2019102803A5
JP2019102803A5 JP2018200361A JP2018200361A JP2019102803A5 JP 2019102803 A5 JP2019102803 A5 JP 2019102803A5 JP 2018200361 A JP2018200361 A JP 2018200361A JP 2018200361 A JP2018200361 A JP 2018200361A JP 2019102803 A5 JP2019102803 A5 JP 2019102803A5
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Japan
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semiconductor package
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JP2018200361A
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English (en)
Japanese (ja)
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JP6826088B2 (ja
JP2019102803A (ja
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Priority to US16/202,665 priority Critical patent/US10790328B2/en
Publication of JP2019102803A publication Critical patent/JP2019102803A/ja
Priority to US17/001,738 priority patent/US11411038B2/en
Publication of JP2019102803A5 publication Critical patent/JP2019102803A5/ja
Application granted granted Critical
Publication of JP6826088B2 publication Critical patent/JP6826088B2/ja
Priority to US17/856,309 priority patent/US11862657B2/en
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JP2018200361A 2017-11-28 2018-10-24 半導体パッケージ及びカメラモジュール Active JP6826088B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US16/202,665 US10790328B2 (en) 2017-11-28 2018-11-28 Semiconductor package and camera module
US17/001,738 US11411038B2 (en) 2017-11-28 2020-08-25 Semiconductor package and camera module
US17/856,309 US11862657B2 (en) 2017-11-28 2022-07-01 Semiconductor package and camera module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017227584 2017-11-28
JP2017227584 2017-11-28

Publications (3)

Publication Number Publication Date
JP2019102803A JP2019102803A (ja) 2019-06-24
JP2019102803A5 true JP2019102803A5 (https=) 2020-08-27
JP6826088B2 JP6826088B2 (ja) 2021-02-03

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JP2018200361A Active JP6826088B2 (ja) 2017-11-28 2018-10-24 半導体パッケージ及びカメラモジュール

Country Status (2)

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JP (1) JP6826088B2 (https=)
CN (1) CN208954973U (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7737286B2 (ja) 2021-10-28 2025-09-10 富士フイルム株式会社 駆動装置及び撮像装置
JP7138261B1 (ja) 2022-06-30 2022-09-15 旭化成エレクトロニクス株式会社 半導体パッケージ、及び駆動装置
EP4648434A4 (en) * 2023-04-24 2026-03-25 Samsung Electronics Co Ltd CAMERA MODULE AND INCLUDING ELECTRONIC DEVICE

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846079A (ja) * 1994-07-28 1996-02-16 Matsushita Electric Ind Co Ltd 半導体装置
JPH10107083A (ja) * 1996-10-03 1998-04-24 Fujitsu Ltd 電気回路素子及びその実装体構造
JP3429718B2 (ja) * 1999-10-28 2003-07-22 新光電気工業株式会社 表面実装用基板及び表面実装構造
KR100541677B1 (ko) * 2003-05-24 2006-01-10 주식회사 하이닉스반도체 반도체 패키지장치 및 그 제조 방법
US20060006529A1 (en) * 2004-07-08 2006-01-12 Min-Jer Lin Semiconductor package and method for manufacturing the same
JP4251164B2 (ja) * 2005-08-03 2009-04-08 セイコーエプソン株式会社 半導体装置および半導体チップ
KR100881183B1 (ko) * 2006-11-21 2009-02-05 삼성전자주식회사 높이가 다른 범프를 갖는 반도체 칩 및 이를 포함하는반도체 패키지
JP6067408B2 (ja) * 2013-02-20 2017-01-25 スタンレー電気株式会社 フリップチップ型半導体発光素子、半導体装置及びその製造方法
JP6769696B2 (ja) * 2015-09-16 2020-10-14 旭化成エレクトロニクス株式会社 位置検出装置
US10276467B2 (en) * 2016-03-25 2019-04-30 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package

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