JP6826088B2 - 半導体パッケージ及びカメラモジュール - Google Patents

半導体パッケージ及びカメラモジュール Download PDF

Info

Publication number
JP6826088B2
JP6826088B2 JP2018200361A JP2018200361A JP6826088B2 JP 6826088 B2 JP6826088 B2 JP 6826088B2 JP 2018200361 A JP2018200361 A JP 2018200361A JP 2018200361 A JP2018200361 A JP 2018200361A JP 6826088 B2 JP6826088 B2 JP 6826088B2
Authority
JP
Japan
Prior art keywords
semiconductor package
terminals
terminal
width direction
width
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018200361A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019102803A5 (https=
JP2019102803A (ja
Inventor
修 白田
修 白田
勇介 日高
勇介 日高
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Microdevices Corp
Original Assignee
Asahi Kasei EMD Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei EMD Corp filed Critical Asahi Kasei EMD Corp
Priority to US16/202,665 priority Critical patent/US10790328B2/en
Publication of JP2019102803A publication Critical patent/JP2019102803A/ja
Priority to US17/001,738 priority patent/US11411038B2/en
Publication of JP2019102803A5 publication Critical patent/JP2019102803A5/ja
Application granted granted Critical
Publication of JP6826088B2 publication Critical patent/JP6826088B2/ja
Priority to US17/856,309 priority patent/US11862657B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Lens Barrels (AREA)
  • Adjustment Of Camera Lenses (AREA)
  • Studio Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2018200361A 2017-11-28 2018-10-24 半導体パッケージ及びカメラモジュール Active JP6826088B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US16/202,665 US10790328B2 (en) 2017-11-28 2018-11-28 Semiconductor package and camera module
US17/001,738 US11411038B2 (en) 2017-11-28 2020-08-25 Semiconductor package and camera module
US17/856,309 US11862657B2 (en) 2017-11-28 2022-07-01 Semiconductor package and camera module

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017227584 2017-11-28
JP2017227584 2017-11-28

Publications (3)

Publication Number Publication Date
JP2019102803A JP2019102803A (ja) 2019-06-24
JP2019102803A5 JP2019102803A5 (https=) 2020-08-27
JP6826088B2 true JP6826088B2 (ja) 2021-02-03

Family

ID=66745205

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018200361A Active JP6826088B2 (ja) 2017-11-28 2018-10-24 半導体パッケージ及びカメラモジュール

Country Status (2)

Country Link
JP (1) JP6826088B2 (https=)
CN (1) CN208954973U (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240002896A (ko) 2022-06-30 2024-01-08 아사히 가세이 일렉트로닉스 가부시끼가이샤 반도체 패키지 및 구동 장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7737286B2 (ja) 2021-10-28 2025-09-10 富士フイルム株式会社 駆動装置及び撮像装置
EP4648434A4 (en) * 2023-04-24 2026-03-25 Samsung Electronics Co Ltd CAMERA MODULE AND INCLUDING ELECTRONIC DEVICE

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0846079A (ja) * 1994-07-28 1996-02-16 Matsushita Electric Ind Co Ltd 半導体装置
JPH10107083A (ja) * 1996-10-03 1998-04-24 Fujitsu Ltd 電気回路素子及びその実装体構造
JP3429718B2 (ja) * 1999-10-28 2003-07-22 新光電気工業株式会社 表面実装用基板及び表面実装構造
KR100541677B1 (ko) * 2003-05-24 2006-01-10 주식회사 하이닉스반도체 반도체 패키지장치 및 그 제조 방법
US20060006529A1 (en) * 2004-07-08 2006-01-12 Min-Jer Lin Semiconductor package and method for manufacturing the same
JP4251164B2 (ja) * 2005-08-03 2009-04-08 セイコーエプソン株式会社 半導体装置および半導体チップ
KR100881183B1 (ko) * 2006-11-21 2009-02-05 삼성전자주식회사 높이가 다른 범프를 갖는 반도체 칩 및 이를 포함하는반도체 패키지
JP6067408B2 (ja) * 2013-02-20 2017-01-25 スタンレー電気株式会社 フリップチップ型半導体発光素子、半導体装置及びその製造方法
JP6769696B2 (ja) * 2015-09-16 2020-10-14 旭化成エレクトロニクス株式会社 位置検出装置
US10276467B2 (en) * 2016-03-25 2019-04-30 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240002896A (ko) 2022-06-30 2024-01-08 아사히 가세이 일렉트로닉스 가부시끼가이샤 반도체 패키지 및 구동 장치
US12543510B2 (en) 2022-06-30 2026-02-03 Asahi Kasei Microdevices Corporation Semiconductor package and drive apparatus

Also Published As

Publication number Publication date
JP2019102803A (ja) 2019-06-24
CN208954973U (zh) 2019-06-07

Similar Documents

Publication Publication Date Title
US11862657B2 (en) Semiconductor package and camera module
JP6826088B2 (ja) 半導体パッケージ及びカメラモジュール
US7675566B2 (en) Camera module
CN209928110U (zh) 光学组件驱动机构及光学组件驱动系统
US9575331B2 (en) Optical image stabilizer with improved magnetic sensitivity
US9857556B1 (en) Apparatus for auto focus
JP6658823B2 (ja) 磁気センサおよび磁気センサシステム
US10827104B2 (en) Multi-lens camera module
US11506954B2 (en) Image blur correction apparatus; camera device and electronic device
JP2017198988A (ja) デュアルレンズカメラシステム
JP2013228610A (ja) カメラモジュール
US10168545B2 (en) Optical image stabilizer with improved magnetic disposition
EP3876016A1 (en) Optical element driving mechanism
JP6787054B2 (ja) レンズ駆動装置
JP6322267B2 (ja) レンズ駆動モジュール
US11681118B2 (en) Optical element driving mechanism
CN113966606A (zh) 相机装置
WO2020189478A1 (ja) コイルモジュール、およびこれを備えたアクチュエータ
JP2019102803A5 (https=)
CN106199895B (zh) 多层线圈、透镜驱动装置、摄像头装置和电子设备
KR20120110436A (ko) 카메라 모듈
KR102439210B1 (ko) 고체 촬상 장치
JP5632062B2 (ja) 半導体素子
JP5598349B2 (ja) 発光素子
TWI608266B (zh) 鏡頭驅動模組

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200715

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20200715

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20200715

A975 Report on accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A971005

Effective date: 20201013

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20201020

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20201211

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201222

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20210114

R150 Certificate of patent or registration of utility model

Ref document number: 6826088

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150