CN208954973U - 半导体封装体和照相机模块 - Google Patents
半导体封装体和照相机模块 Download PDFInfo
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- CN208954973U CN208954973U CN201821964627.9U CN201821964627U CN208954973U CN 208954973 U CN208954973 U CN 208954973U CN 201821964627 U CN201821964627 U CN 201821964627U CN 208954973 U CN208954973 U CN 208954973U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 229
- 230000005484 gravity Effects 0.000 claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims description 15
- 239000013078 crystal Substances 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000009434 installation Methods 0.000 abstract description 15
- 238000001514 detection method Methods 0.000 description 24
- 238000004804 winding Methods 0.000 description 9
- 230000004907 flux Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 230000003447 ipsilateral effect Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Lens Barrels (AREA)
- Adjustment Of Camera Lenses (AREA)
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017227584 | 2017-11-28 | ||
| JP2017-227584 | 2017-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208954973U true CN208954973U (zh) | 2019-06-07 |
Family
ID=66745205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821964627.9U Active CN208954973U (zh) | 2017-11-28 | 2018-11-27 | 半导体封装体和照相机模块 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6826088B2 (https=) |
| CN (1) | CN208954973U (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7737286B2 (ja) | 2021-10-28 | 2025-09-10 | 富士フイルム株式会社 | 駆動装置及び撮像装置 |
| JP7138261B1 (ja) | 2022-06-30 | 2022-09-15 | 旭化成エレクトロニクス株式会社 | 半導体パッケージ、及び駆動装置 |
| EP4648434A4 (en) * | 2023-04-24 | 2026-03-25 | Samsung Electronics Co Ltd | CAMERA MODULE AND INCLUDING ELECTRONIC DEVICE |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0846079A (ja) * | 1994-07-28 | 1996-02-16 | Matsushita Electric Ind Co Ltd | 半導体装置 |
| JPH10107083A (ja) * | 1996-10-03 | 1998-04-24 | Fujitsu Ltd | 電気回路素子及びその実装体構造 |
| JP3429718B2 (ja) * | 1999-10-28 | 2003-07-22 | 新光電気工業株式会社 | 表面実装用基板及び表面実装構造 |
| KR100541677B1 (ko) * | 2003-05-24 | 2006-01-10 | 주식회사 하이닉스반도체 | 반도체 패키지장치 및 그 제조 방법 |
| US20060006529A1 (en) * | 2004-07-08 | 2006-01-12 | Min-Jer Lin | Semiconductor package and method for manufacturing the same |
| JP4251164B2 (ja) * | 2005-08-03 | 2009-04-08 | セイコーエプソン株式会社 | 半導体装置および半導体チップ |
| KR100881183B1 (ko) * | 2006-11-21 | 2009-02-05 | 삼성전자주식회사 | 높이가 다른 범프를 갖는 반도체 칩 및 이를 포함하는반도체 패키지 |
| JP6067408B2 (ja) * | 2013-02-20 | 2017-01-25 | スタンレー電気株式会社 | フリップチップ型半導体発光素子、半導体装置及びその製造方法 |
| JP6769696B2 (ja) * | 2015-09-16 | 2020-10-14 | 旭化成エレクトロニクス株式会社 | 位置検出装置 |
| US10276467B2 (en) * | 2016-03-25 | 2019-04-30 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package |
-
2018
- 2018-10-24 JP JP2018200361A patent/JP6826088B2/ja active Active
- 2018-11-27 CN CN201821964627.9U patent/CN208954973U/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6826088B2 (ja) | 2021-02-03 |
| JP2019102803A (ja) | 2019-06-24 |
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| GR01 | Patent grant | ||
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