JP2008066381A5 - - Google Patents

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Publication number
JP2008066381A5
JP2008066381A5 JP2006240324A JP2006240324A JP2008066381A5 JP 2008066381 A5 JP2008066381 A5 JP 2008066381A5 JP 2006240324 A JP2006240324 A JP 2006240324A JP 2006240324 A JP2006240324 A JP 2006240324A JP 2008066381 A5 JP2008066381 A5 JP 2008066381A5
Authority
JP
Japan
Prior art keywords
integrated circuit
semiconductor integrated
pattern
formation region
circuit formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006240324A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008066381A (ja
JP5076407B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006240324A priority Critical patent/JP5076407B2/ja
Priority claimed from JP2006240324A external-priority patent/JP5076407B2/ja
Priority to TW096128851A priority patent/TW200818292A/zh
Priority to US11/839,078 priority patent/US7781901B2/en
Priority to KR1020070085468A priority patent/KR100904197B1/ko
Publication of JP2008066381A publication Critical patent/JP2008066381A/ja
Publication of JP2008066381A5 publication Critical patent/JP2008066381A5/ja
Application granted granted Critical
Publication of JP5076407B2 publication Critical patent/JP5076407B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2006240324A 2006-09-05 2006-09-05 半導体装置及びその製造方法 Expired - Fee Related JP5076407B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2006240324A JP5076407B2 (ja) 2006-09-05 2006-09-05 半導体装置及びその製造方法
TW096128851A TW200818292A (en) 2006-09-05 2007-08-06 Semiconductor device and method for manufacturing the same
US11/839,078 US7781901B2 (en) 2006-09-05 2007-08-15 Semiconductor device and processing method of the same
KR1020070085468A KR100904197B1 (ko) 2006-09-05 2007-08-24 반도체 장치 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006240324A JP5076407B2 (ja) 2006-09-05 2006-09-05 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2008066381A JP2008066381A (ja) 2008-03-21
JP2008066381A5 true JP2008066381A5 (https=) 2009-04-30
JP5076407B2 JP5076407B2 (ja) 2012-11-21

Family

ID=39288840

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006240324A Expired - Fee Related JP5076407B2 (ja) 2006-09-05 2006-09-05 半導体装置及びその製造方法

Country Status (4)

Country Link
US (1) US7781901B2 (https=)
JP (1) JP5076407B2 (https=)
KR (1) KR100904197B1 (https=)
TW (1) TW200818292A (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006019911A1 (en) * 2004-07-26 2006-02-23 Sun Microsystems, Inc. Multi-chip module and single-chip module for chips and proximity connectors
JP5263918B2 (ja) * 2007-07-24 2013-08-14 日本電気株式会社 半導体装置及びその製造方法
JP5353035B2 (ja) * 2008-03-17 2013-11-27 富士電機株式会社 半導体装置およびその製造方法
JP5266857B2 (ja) * 2008-04-24 2013-08-21 ミツミ電機株式会社 チップのアライメント方法
JP2010074106A (ja) * 2008-09-22 2010-04-02 Nec Electronics Corp 半導体チップ、半導体ウェーハおよびそのダイシング方法
JP2013157385A (ja) * 2012-01-27 2013-08-15 Semiconductor Components Industries Llc 半導体装置及びその自動外観検査方法
WO2017027505A1 (en) * 2015-08-10 2017-02-16 Delta Design, Inc. Ic device-in-pocket detection with angular mounted lasers and a camera
KR102403730B1 (ko) 2018-01-22 2022-05-30 삼성전자주식회사 반도체 칩 및 이를 포함하는 반도체 패키지
CN113394193B (zh) * 2020-03-13 2022-03-22 长鑫存储技术有限公司 半导体结构及其形成方法、激光熔丝的熔断方法
KR102507592B1 (ko) * 2021-05-24 2023-03-09 한국과학기술원 Mems 소자의 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01243419A (ja) * 1988-03-25 1989-09-28 Hitachi Ltd 位置合わせ方法
JPH1012527A (ja) * 1996-06-26 1998-01-16 Hitachi Ltd 半導体チップおよび半導体製造用レチクル
KR100298193B1 (ko) * 1998-06-16 2001-11-15 박종섭 웨이퍼의수평정렬을위한레티클
KR20000026310A (ko) * 1998-10-20 2000-05-15 김영환 반도체장치
JP3566133B2 (ja) 1999-05-11 2004-09-15 セイコーインスツルメンツ株式会社 半導体装置の製造方法
US6441504B1 (en) * 2000-04-25 2002-08-27 Amkor Technology, Inc. Precision aligned and marked structure
US7053495B2 (en) * 2001-09-17 2006-05-30 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit device and method for fabricating the same
US6815838B2 (en) * 2002-02-20 2004-11-09 International Business Machines Corporation Laser alignment target and method
KR100463047B1 (ko) 2002-03-11 2004-12-23 삼성전자주식회사 반도체 장치의 퓨즈 박스 및 그 제조방법
JP2005109145A (ja) * 2003-09-30 2005-04-21 Toshiba Corp 半導体装置
JP4753170B2 (ja) * 2004-03-05 2011-08-24 三洋電機株式会社 半導体装置及びその製造方法
JP4673569B2 (ja) * 2004-03-31 2011-04-20 株式会社リコー 半導体装置

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