JP2019093670A - 液体吐出ヘッドの製造方法及び液体吐出ヘッド - Google Patents
液体吐出ヘッドの製造方法及び液体吐出ヘッド Download PDFInfo
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Abstract
Description
まず、本発明の実施形態にかかる液体吐出ヘッドの製造方法の説明に先立ち、本発明の実施形態にかかる液体吐出ヘッドの製造方法を適用することができる液体吐出ヘッドの構成について説明する。
接続端子506は、基板501の表面502の、吐出口508の配列方向に沿った両端に、複数並んで設けられている。接続端子506は基板501と外部の電力供給源とを接続する役割を果たし、外部から供給された電力によってエネルギー発生素子504が駆動される。基板501の表面502上にはさらに、エネルギー発生素子504及び電気配線層509を覆い保護する、SiNやSiO等で構成された保護膜512が設けられていてもよい。
・拡散防止層510を構成する金属を第一の金属、接続端子506を構成する金属を第二の金属とする。このとき、第一の金属は、第一の金属のH2O系の電位−pH図において、第一の金属と第二の金属との標準電極電位の差の電位において、pHが1以上14以下の範囲の領域で不動態域又は不感域にある
液体吐出ヘッドの製造工程においては、拡散防止層510とバンプ506とが重なった状態で、酸性からアルカリ性の幅広いpH領域の溶液に接触する可能性がある。これらの溶液に接触した場合でも拡散防止層510の異種金属接触腐食が生じないよう、拡散防止層510を構成する金属種として、電位−pH図において、幅広いpH領域において不動態を形成する又は不感である金属種を選択する。なお、不動態域とは電位−pH図において金属が不動態化する領域であり、不感域とは電位−pH図において金属が安定に存在し腐食がほとんど起きない領域である。
次に、本発明の実施形態にかかる液体吐出ヘッドの製造方法について図を参照して説明する。図3〜4は、本実施形態にかかる液体吐出ヘッドの製造方法を順に追って説明する図であり、各工程を示す図は、図1に示す液体吐出ヘッドの図2と同様の断面図である。
504 エネルギー発生素子
506 接続端子
509 電気配線層
510 拡散防止層
521 中間層
523 流路形成部材
Claims (9)
- 液体を吐出するために利用されるエネルギーを発生するエネルギー発生素子と、前記エネルギー発生素子と電気的に接続された電気配線層と、前記電気配線層上に設けられ、外部との電気的な接続を行うための接続端子と、前記接続端子と前記電気配線層との間の拡散防止層と、を備えた基板と、
前記基板上に設けられた、液体の流路を形成する樹脂を含む流路形成部材と、
前記流路形成部材と前記基板との間に設けられた中間層と、を有する液体吐出ヘッドの製造方法であって、
前記基板上に前記拡散防止層となる金属層を設ける工程と、
前記金属層上に前記接続端子を設ける工程と、
前記接続端子をマスクとして前記金属層を酸性溶液でエッチングし拡散防止層を形成する工程と、
前記接続端子と前記拡散防止層とが形成された基板上に中間層となる層を形成し、前記中間層となる層上にフォトレジストからなるパターンを設け、前記パターンをマスクとして中間層となる層をエッチングすることにより中間層を形成し、前記パターンをアルカリ性溶液で剥離する工程と、
前記中間層上に流路形成部材を形成する工程と、を有し、
前記拡散防止層となる金属層を構成する金属を第一の金属、前記接続端子を構成する金属を第二の金属としたとき、前記第一の金属は、前記第一の金属のH2O系の電位−pH図において、前記第一の金属と前記第二の金属との標準電極電位の差の電位において、pHが1以上14以下の範囲の領域で不動態域又は不感域であることを特徴とする液体吐出ヘッドの製造方法。 - 前記第二の金属が、Pd、Nb、Rh、Ta及びPtから選択されるいずれかの金属である請求項1に記載の液体吐出ヘッドの製造方法。
- 前記第二の金属が、Pd、Nb、及びRhから選択されるいずれかの金属である請求項1に記載の液体吐出ヘッドの製造方法。
- 前記第一の金属がAuである請求項1〜3のいずれか1項に記載の液体吐出ヘッドの製造方法。
- 前記酸性溶液がフッ硝酸である請求項1〜4のいずれか1項に記載の液体吐出ヘッドの製造方法。
- 液体を吐出するために利用されるエネルギーを発生するエネルギー発生素子と、前記エネルギー発生素子と電気的に接続された電気配線層と、前記電気配線層上に設けられ、外部との電気的な接続を行うための接続端子と、前記接続端子と前記電気配線層との間の拡散防止層と、を備えた基板と、
前記基板上に設けられた、液体の流路を形成する樹脂を含む流路形成部材と、
前記流路形成部材と前記基板との間に設けられた中間層と、を有する液体吐出ヘッドであって、
前記拡散防止層を構成する金属を第一の金属、前記接続端子を構成する金属を第二の金属としたとき、前記第一の金属は、前記第一の金属のH2O系の電位−pH図において、前記第一の金属と前記第二の金属との標準電極電位の差の電位において、pHが1以上14以下の範囲の領域で不動態域又は不感域であることを特徴とする液体吐出ヘッド。 - 前記第二の金属が、Pd、Nb、Rh、Ta及びPtから選択されるいずれかの金属である請求項6に記載の液体吐出ヘッド。
- 前記第二の金属が、Pd、Nb、及びRhから選択されるいずれかの金属である請求項2に記載の液体吐出ヘッド。
- 前記第一の金属がAuである請求項6〜8のいずれか1項に記載の液体吐出ヘッド。
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US16/177,907 US11123989B2 (en) | 2017-11-27 | 2018-11-01 | Method for producing liquid discharge head |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050190232A1 (en) * | 2004-02-27 | 2005-09-01 | Jae-Chang Lee | Piezoelectric ink-jet printhead and method of manufacturing a nozzle plate of the same |
JP2007251158A (ja) * | 2006-03-13 | 2007-09-27 | Samsung Electronics Co Ltd | バンプ形成方法及びバンプを含むコネクタ構造 |
JP2008265164A (ja) * | 2007-04-20 | 2008-11-06 | Canon Inc | インクジェット記録ヘッド用の基板およびその製造方法 |
JP2009190351A (ja) * | 2008-02-18 | 2009-08-27 | Seiko Epson Corp | 液体噴射ヘッドの製造方法及び圧電素子の製造方法 |
JP2011104898A (ja) * | 2009-11-18 | 2011-06-02 | Canon Inc | 液体吐出ヘッド用基板の製造方法及び液体吐出ヘッドの製造方法 |
JP2013091264A (ja) * | 2011-10-26 | 2013-05-16 | Canon Inc | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
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US7541275B2 (en) * | 2004-04-21 | 2009-06-02 | Texas Instruments Incorporated | Method for manufacturing an interconnect |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2007251158A (ja) * | 2006-03-13 | 2007-09-27 | Samsung Electronics Co Ltd | バンプ形成方法及びバンプを含むコネクタ構造 |
JP2008265164A (ja) * | 2007-04-20 | 2008-11-06 | Canon Inc | インクジェット記録ヘッド用の基板およびその製造方法 |
JP2009190351A (ja) * | 2008-02-18 | 2009-08-27 | Seiko Epson Corp | 液体噴射ヘッドの製造方法及び圧電素子の製造方法 |
JP2011104898A (ja) * | 2009-11-18 | 2011-06-02 | Canon Inc | 液体吐出ヘッド用基板の製造方法及び液体吐出ヘッドの製造方法 |
JP2013091264A (ja) * | 2011-10-26 | 2013-05-16 | Canon Inc | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
JP2014226917A (ja) * | 2013-05-27 | 2014-12-08 | キヤノン株式会社 | 液体吐出ヘッド及びその製造方法 |
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