JP2019062190A5 - - Google Patents

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Publication number
JP2019062190A5
JP2019062190A5 JP2018154364A JP2018154364A JP2019062190A5 JP 2019062190 A5 JP2019062190 A5 JP 2019062190A5 JP 2018154364 A JP2018154364 A JP 2018154364A JP 2018154364 A JP2018154364 A JP 2018154364A JP 2019062190 A5 JP2019062190 A5 JP 2019062190A5
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JP
Japan
Prior art keywords
layer
copper
ruthenium
titanium
substrate
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JP2018154364A
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English (en)
Japanese (ja)
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JP2019062190A (ja
JP7634930B2 (ja
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Publication of JP2019062190A5 publication Critical patent/JP2019062190A5/ja
Priority to JP2023159999A priority Critical patent/JP2023182638A/ja
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Publication of JP7634930B2 publication Critical patent/JP7634930B2/ja
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JP2018154364A 2017-08-22 2018-08-21 銅配線のためのシード層 Active JP7634930B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023159999A JP2023182638A (ja) 2017-08-22 2023-09-25 銅配線のためのシード層

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201762548604P 2017-08-22 2017-08-22
US62/548,604 2017-08-22

Related Child Applications (1)

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JP2023159999A Division JP2023182638A (ja) 2017-08-22 2023-09-25 銅配線のためのシード層

Publications (3)

Publication Number Publication Date
JP2019062190A JP2019062190A (ja) 2019-04-18
JP2019062190A5 true JP2019062190A5 (enExample) 2021-09-30
JP7634930B2 JP7634930B2 (ja) 2025-02-25

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ID=63350353

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JP2018154364A Active JP7634930B2 (ja) 2017-08-22 2018-08-21 銅配線のためのシード層
JP2023159999A Pending JP2023182638A (ja) 2017-08-22 2023-09-25 銅配線のためのシード層

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JP2023159999A Pending JP2023182638A (ja) 2017-08-22 2023-09-25 銅配線のためのシード層

Country Status (6)

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US (1) US10847463B2 (enExample)
EP (1) EP3447793B1 (enExample)
JP (2) JP7634930B2 (enExample)
KR (1) KR20190021184A (enExample)
CN (1) CN109461698B (enExample)
TW (1) TWI803510B (enExample)

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CN114664656A (zh) * 2020-05-22 2022-06-24 北京屹唐半导体科技股份有限公司 使用臭氧气体和氢自由基的工件加工
US11410881B2 (en) * 2020-06-28 2022-08-09 Applied Materials, Inc. Impurity removal in doped ALD tantalum nitride
US11764157B2 (en) * 2020-07-23 2023-09-19 Applied Materials, Inc. Ruthenium liner and cap for back-end-of-line applications
WO2025005521A1 (ko) * 2023-06-30 2025-01-02 주성엔지니어링(주) 전극 형성 방법

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CN105355620B (zh) * 2015-12-17 2018-06-22 上海集成电路研发中心有限公司 一种铜互连结构及其制造方法

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