JP2019057537A - 半導体装置 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 78
- 239000010410 layer Substances 0.000 claims description 184
- 229910052751 metal Inorganic materials 0.000 claims description 120
- 239000002184 metal Substances 0.000 claims description 120
- 239000011229 interlayer Substances 0.000 claims description 15
- 239000012212 insulator Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 85
- 239000012535 impurity Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 8
- 229920005591 polysilicon Polymers 0.000 description 8
- 238000005229 chemical vapour deposition Methods 0.000 description 7
- 238000001020 plasma etching Methods 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 238000001312 dry etching Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910021332 silicide Inorganic materials 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910015900 BF3 Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UGACIEPFGXRWCH-UHFFFAOYSA-N [Si].[Ti] Chemical compound [Si].[Ti] UGACIEPFGXRWCH-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
Description
まず、本実施形態に係る半導体装置の概略的な構成を示す平面図を用いて、ゲート領域、ソース領域等の平面視における位置について説明する。図1は、本実施形態に係る半導体装置1を模式的に示す平面図である。この半導体装置1は、例えば、n型のパワーMOSFETである。なお、この図1においては、半導体装置1のドレイン層及びドリフト層は、図示を省略しており、また、ゲート領域、ソース領域及びフィールドプレート領域へと電圧を印加する各メタル層は、破線又は実線により示している。
以下、本実施形態に係る半導体装置1の製造過程について説明する。以下、図5乃至図14において、(a)は、A−A断面、(b)は、B−B断面、(c)は、C−C断面、(d)は、D−D断面を示す断面図である。
以下、トレンチ50の配置等について変形例を示す。
Claims (8)
- 第1方向及びこれに交差する第2方向に拡がる第1導電型のドレイン層と、
前記ドレイン層の前記第1方向及び前記第2方向に交差する第3方向における一方の面である表面に形成される、第1導電型のドリフト層と、
前記ドリフト層の表面に形成される、第2導電型のベース領域と、
前記ベース領域の表面に形成される、第1導電型のソース領域と、
前記第1方向及び前記第2方向にアレイ状に形成されるトレンチであって、前記ソース領域の表面から前記第3方向に沿って前記ベース領域を貫通して前記ドリフト層に到達する、複数のトレンチと、
前記第2方向に沿って連続的に前記トレンチが存在しない領域において、前記第2方向に沿って形成されるベースコンタクト領域であって、前記ソース領域内に前記トレンチと隣接せずに、前記ソース領域の表面から前記ベース領域へと接続するように形成される、第2導電型のベースコンタクト領域と、
それぞれの前記トレンチの内壁に沿って、当該内壁と絶縁膜を介して前記トレンチ内にその表面から形成される、複数のゲート領域と、
それぞれの前記ゲート領域の内側に前記ゲート領域と絶縁膜を介して前記トレンチ内にその表面から前記第3方向に沿って形成され、前記第3方向において前記ゲート領域よりも長く形成される、複数のフィールドプレート電極と、
を備える半導体装置。 - 前記ドリフト層、前記トレンチ、前記ソース領域及び前記ベースコンタクト領域と層間絶縁膜を介して前記第3方向に積層されて形成される、第1メタル層及び第2メタル層であって、
前記ベースコンタクト領域及び前記ソース領域と第1ソースコンタクトを介して接続され、それぞれの前記フィールドプレート電極と第2ソースコンタクトを介して接続される、第1メタル層と、
前記第1メタル層と絶縁膜を介して形成され、それぞれの前記ゲート領域とゲートコンタクトを介して接続される、第2メタル層と、
前記第1メタル層とは接続され、かつ、前記第2メタル層とは絶縁膜を介して絶縁されるように、前記第1メタル層及び前記第2メタル層の前記第3方向に積層されて形成される、第3メタル層と、
をさらに備える請求項1に記載の半導体装置。 - 前記トレンチは、矩形格子状又は斜方格子状に配置されている、請求項1又は請求項2に記載の半導体装置。
- 前記第1方向及び前記第2方向と、前記第3方向は、略直交する、請求項1乃至請求項3のいずれかに記載の半導体装置。
- 前記ベースコンタクト領域は、前記第1方向に沿ったトレンチ同士の間に、前記第2方向に延伸するように形成される、請求項1乃至請求項4のいずれかに記載の半導体装置。
- 前記第1方向と、前記第2方向とは、略直交し、
前記トレンチは、前記第1方向及び前記第2方向に辺を有し、前記第2方向に延びた辺が前記第1方向に延びた辺よりも長い、矩形状のトレンチであり、
前記フィールドプレート電極は、前記トレンチにおいて、前記第2方向に沿って形成されている、請求項1乃至請求項5のいずれかに記載の半導体装置。 - 前記トレンチは、六角形状、円状、楕円状、又は、矩形若しくは六角形を面取りした形状である、請求項1乃至請求項5のいずれかに記載の半導体装置。
- 第1方向及びこれに交差する第2方向に拡がる第1導電型のドレイン層と、
前記ドレイン層の前記第1方向及び前記第2方向に交差する第3方向における一方の面である表面に形成される、第1導電型のドリフト層と、
前記ドリフト層の表面に形成される、第2導電型のベース領域と、
前記ベース領域の表面に形成される、第1導電型のソース領域と、
前記ドリフト層、前記ベース領域及び前記ソース領域と、前記第1方向及び前記第2方向において絶縁体を介して他の領域とは分離されて独立に形成されるトレンチであって、前記ソース領域の表面から前記第3方向に沿って前記ベース領域を貫通して前記ドリフト層に到達する、トレンチと、
前記トレンチの内壁に沿って、当該内壁と絶縁膜を介して前記トレンチ内にその表面から形成される、ゲート領域と、
前記ゲート領域の内側に前記ゲート領域と絶縁膜を介して前記トレンチ内にその表面から前記第3方向に沿って形成され、前記第3方向において前記ゲート領域よりも長く形成される、フィールドプレート電極と、
を備える半導体装置。
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Application Number | Priority Date | Filing Date | Title |
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JP2017179484A JP6761389B2 (ja) | 2017-09-19 | 2017-09-19 | 半導体装置 |
CN201810160548.0A CN109524466B (zh) | 2017-09-19 | 2018-02-27 | 半导体装置 |
US15/918,387 US10340346B2 (en) | 2017-09-19 | 2018-03-12 | Semiconductor device |
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WO2023176118A1 (ja) * | 2022-03-14 | 2023-09-21 | ローム株式会社 | 半導体装置 |
JP7490597B2 (ja) | 2021-03-05 | 2024-05-27 | 株式会社東芝 | 半導体装置およびその製造方法 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002083963A (ja) * | 2000-06-30 | 2002-03-22 | Toshiba Corp | 半導体素子 |
JP2009038318A (ja) * | 2007-08-03 | 2009-02-19 | Toshiba Corp | 半導体装置 |
JP2013115158A (ja) * | 2011-11-28 | 2013-06-10 | Hitachi Ltd | 4h−SiC半導体素子及び半導体装置 |
JP2015103611A (ja) * | 2013-11-22 | 2015-06-04 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2015115611A (ja) * | 2013-12-13 | 2015-06-22 | パワー・インテグレーションズ・インコーポレーテッド | 円柱形領域をもつ縦型トランジスタ装置構造 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB0405325D0 (en) * | 2004-03-10 | 2004-04-21 | Koninkl Philips Electronics Nv | Trench-gate transistors and their manufacture |
KR20100067874A (ko) * | 2008-12-12 | 2010-06-22 | 주식회사 동부하이텍 | 모스펫 소자 |
JP2013062344A (ja) * | 2011-09-13 | 2013-04-04 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2013065774A (ja) * | 2011-09-20 | 2013-04-11 | Toshiba Corp | 半導体装置およびその製造方法 |
JP2014027182A (ja) | 2012-07-27 | 2014-02-06 | Toshiba Corp | 半導体装置 |
JP2014120656A (ja) | 2012-12-18 | 2014-06-30 | Toshiba Corp | 半導体装置 |
JP2015023166A (ja) | 2013-07-19 | 2015-02-02 | 株式会社東芝 | 半導体装置 |
US9530882B1 (en) * | 2015-11-17 | 2016-12-27 | Force Mos Technology Co., Ltd | Trench MOSFET with shielded gate and diffused drift region |
DE102015121497B4 (de) * | 2015-12-10 | 2022-01-27 | Infineon Technologies Austria Ag | Halbleitervorrichtung mit einem ersten gategraben und einem zweiten gategraben |
US10418452B2 (en) * | 2015-12-10 | 2019-09-17 | Infineon Technologies Austria Ag | Semiconductor device with different gate trenches |
JP6416142B2 (ja) * | 2016-03-11 | 2018-10-31 | 株式会社東芝 | 半導体装置 |
-
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002083963A (ja) * | 2000-06-30 | 2002-03-22 | Toshiba Corp | 半導体素子 |
JP2009038318A (ja) * | 2007-08-03 | 2009-02-19 | Toshiba Corp | 半導体装置 |
JP2013115158A (ja) * | 2011-11-28 | 2013-06-10 | Hitachi Ltd | 4h−SiC半導体素子及び半導体装置 |
JP2015103611A (ja) * | 2013-11-22 | 2015-06-04 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2015115611A (ja) * | 2013-12-13 | 2015-06-22 | パワー・インテグレーションズ・インコーポレーテッド | 円柱形領域をもつ縦型トランジスタ装置構造 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7490597B2 (ja) | 2021-03-05 | 2024-05-27 | 株式会社東芝 | 半導体装置およびその製造方法 |
WO2023176118A1 (ja) * | 2022-03-14 | 2023-09-21 | ローム株式会社 | 半導体装置 |
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US10340346B2 (en) | 2019-07-02 |
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