JP2019049694A - Exposure method and exposure apparatus, method for manufacturing device, and method for manufacturing flat panel display - Google Patents

Abstract

To improve position controllability of a moving body and to reduce a production cost of an apparatus.SOLUTION: An exposure apparatus for exposing a substrate P includes: a fine movement stage having a substrate holder PH that holds a part of the substrate P while assuring flatness, and moving in an X-axis direction relative to an exposure position (exposure region IA); and a substrate Y step feed device 88 that drives the substrate P in a Y-axis direction within an XY plane. In this instance, the movement in the X-axis direction of the fine movement stage holding a part of the substrate P by the substrate holder PH while assuring flatness, relative to the exposure region IA is carried out before and after the movement of the substrate P in the Y-axis direction by the substrate Y step feed device 88, and thereby, a plurality of regions on the substrate P is exposed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an exposure method, an exposure apparatus, a device manufacturing method, and a flat panel display manufacturing method, and in particular, illumination light is applied to an object to move the object relative to the illumination light to make a plurality of regions of the object And a method of manufacturing a device and a method of manufacturing a flat panel display using the same.

  Conventionally, in a lithography process for manufacturing an electronic device (micro device) such as a liquid crystal display element or a semiconductor element (integrated circuit etc.), a step-and-repeat type projection exposure apparatus (so-called stepper) or a step A scan type projection exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  In this type of exposure apparatus, a glass plate coated with a sensitive agent on the surface, a wafer or the like (hereinafter collectively referred to as a substrate) is placed on a substrate stage device. Then, the circuit pattern formed on the mask (or reticle) is transferred onto the substrate by irradiation of exposure light through an optical system such as a projection lens.

  Here, in recent years, there has been a tendency for the size of the substrate to be exposed by the exposure apparatus, in particular, a substrate for a liquid crystal display element (rectangular glass substrate) to be further enlarged. As the size of the substrate table holding the substrate increases, the weight increase associated with this makes it difficult to control the position of the substrate. In order to solve such problems, the inventor previously proposed an exposure apparatus that supports the weight of the substrate table holding the substrate with a weight cancellation device (self weight canceller) called a center post made of columnar members For example, refer to Patent Document 1).

  The basic idea in the development of a substrate stage apparatus provided in a conventional exposure apparatus including the exposure apparatus described in Patent Document 1 is that the substrate stage can be achieved in order to achieve the purpose of positioning the substrate at high speed and with high accuracy. In order to reduce the weight as much as possible, and to eliminate the disturbance (vibration). Conventionally, a substrate, a substrate holder for planarly correcting the substrate flatly, a movable mirror for an interferometer for finding the position of the substrate, a table integrally supporting them, and a drive of the table On the fine adjustment stage such as VCM (voice coil motor), etc., which are necessary for performing high-precision positioning control, and other parts (such as electric boards and supply cables) on the coarse adjustment stage. Various stage devices have been developed.

  However, for example, the glass substrate for liquid crystal tends to be further enlarged such that one side becomes 3 meters or more in the latest 10th generation, and the fine movement stage on which the substrate holder for holding the entire large substrate by suction is mounted It has become larger and its weight has increased, and it is no longer lightweight. Further, the enlargement of the substrate holder and the substrate table for supporting the substrate holder and the like has been the cause of various disadvantages. For example, as the size of the substrate increases, the weight and the amount of movement of the substrate stage apparatus that moves the substrate two-dimensionally increase. For this reason, the exposure apparatus has become large, the manufacturing cost has increased, and it has taken time to manufacture and transport the apparatus. In addition, the movement of the substrate took time, and the tact time was long. Therefore, it has been desired to develop a stage apparatus capable of guiding the object to be exposed (substrate) with high accuracy and further achieving downsizing and weight reduction.

  In the exposure apparatus, substrate exchange in the substrate stage is realized by carrying out (retracting) the substrate from the substrate holder holding the substrate by suction and then carrying (loading) a new substrate on the substrate holder. However, in the conventional exposure apparatus, a substrate holder having a holding surface of the same size as the substrate has been used. Therefore, in the conventional exposure apparatus, the substrate can not be unloaded from the substrate holder unless the substrate is transported by the same distance as the size, and the substrate can not be loaded onto the substrate holder. .

  Also, as described above, for example, since the glass substrate for liquid crystal tends to be larger, substrate replacement requires a certain amount of time, and development of a new device capable of realizing further shortening of substrate replacement time Was desired.

  The shortening of the substrate exchange time seems to be a common problem in a substrate processing apparatus for processing a substrate such as a glass substrate as well as the exposure apparatus.

US Patent Application Publication No. 2010/0018950

  The inventor observed the stage apparatus again in order to realize a stage apparatus capable of guiding an object (substrate) at high speed and with high accuracy and further achieving size reduction and weight reduction. As a result, while the weight of a substrate having an area of 3 m square and a thickness of about 0.7 mm is less than 20 kg, the weight of the substrate holder for supporting the substrate is about 1 ton. For this reason, the table supporting the substrate holder also becomes heavy. If weight saving of the substrate holder located at the front end is possible, it will be recognized again that weight reduction can be achieved for all components connected below the holder, that is, the table, weight cancellation device (center pillar), guides and the like. did.

  The main role of the substrate holder is to flatten the substrate which is thin and prone to warping and / or bending. Therefore, the conventional substrate holder has substantially the same area as the substrate, and the substrate is made to copy the substrate holder surface (upper surface) by, for example, vacuum suction. For this reason, it is necessary to finish the surface of the substrate holder which becomes a plane reference extremely high in flatness, and in order to secure the rigidity, the thickness is increased and the weight is increased.

  On the other hand, in the step-and-scan type large projection exposure apparatus etc., the batch exposure area (also referred to as a shot area) which can be exposed at one time is set smaller than the area of the whole substrate, The entire surface of the substrate can not be exposed. Therefore, exposure is performed on the entire surface of the substrate while repeating scan exposure and step movement without exposure. However, the substrate needs to be flat only in the scan range (shot area) of the collective exposure, and more strictly always only in the fixed illumination range by the projection optical system. It is not necessary to care about the flatness of the substrate during the step movement other than the above and without exposure.

  Therefore, the inventor made the substrate holder for correcting the substrate flat the width in the cross scan direction (approximately a little wider than the exposure field) almost equal to that of the exposure field, and the batch direction even if the length in the scan direction is small The scan length that can be exposed with. When the batch exposure by scanning is completed, the scan exposure area (shot area) on the substrate to be exposed next is moved relative to the substrate holder to perform plane correction and alignment of the substrate each time to perform scan exposure. I thought it would be better if As a result, the area of the substrate holder is reduced, and the table supporting the substrate holder is also reduced in size, so that the entire fine movement stage is compact and lightweight.

  The present invention has been made based on the idea of the inventor, and adopts the following configuration.

  According to a first aspect of the present invention, there is provided an exposure apparatus which irradiates illumination light from an optical system to an object, moves the object relative to the illumination light, and scans and exposes a plurality of regions of the object. A first support portion supporting a portion of the object including at least one of the plurality of regions; a second support portion supporting the other portion of the object; and There is provided an exposure apparatus comprising: a drive unit for relatively moving the first and second support units supporting the light source in a scanning direction intersecting the optical axis direction of the optical system.

  According to a second aspect of the present invention, there is provided a flat including exposing a substrate used for a flat panel display as an object using the exposure apparatus according to the first aspect and developing the exposed substrate. A method of manufacturing a panel display is provided.

  According to a third aspect of the present invention, exposing an object using the exposure apparatus according to the first aspect, further comprising a pattern forming apparatus for forming a predetermined pattern on the object using an energy beam. And B. developing the exposed object.

  According to a fourth aspect of the present invention, there is provided an exposure method of irradiating illumination light onto an object, moving the object relative to the illumination light, and scanningly exposing a plurality of regions of the object. Supporting a part of the object including at least one of a plurality of areas on a first support, supporting the other part of the object on a second support, and in the scanning exposure Moving the first and second supporting parts supporting the light source in a scanning direction that intersects with the direction in which the illumination light is irradiated.

  According to a fifth aspect of the present invention, there is provided a method of manufacturing a flat panel display comprising developing an object exposed by the exposure method according to the fourth aspect.

  According to a sixth aspect of the present invention, there is provided a device manufacturing method comprising developing an object exposed by the exposure method according to the fourth aspect.

FIG. 1 schematically shows a configuration of an exposure apparatus according to a first embodiment. FIG. 1 is a partially omitted plan view showing an exposure apparatus according to a first embodiment. FIG. 2 is a schematic side view showing the exposure apparatus according to the first embodiment with a part thereof being omitted as seen from the + X direction of FIG. 1; It is a block diagram which shows the input-output relationship of the main control apparatus which centrally comprises the control system of the exposure apparatus which concerns on 1st Embodiment. FIG. 6 is a diagram (part 1) for describing a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment. FIG. 7 is a diagram (part 2) for describing a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment. FIG. 7 is a diagram (part 3) for describing a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment. FIG. 13 is a fourth diagram to explain a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment; FIG. 13 is a fifth diagram to explain a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment; FIG. 13 is a diagram (part 6) for describing a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment. FIG. 13 is a diagram (No. 7) for describing a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment. FIG. 13 is a diagram (No. 8) for describing a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment. FIG. 16 is a diagram (No. 9) for explaining a series of operations for substrate processing performed in the exposure apparatus according to the first embodiment. It is a figure showing roughly the composition of the exposure device concerning a 2nd embodiment. It is the top view which partially abbreviate | omitted the exposure apparatus which concerns on 2nd Embodiment. It is a schematic side view which abbreviate | omits and shows an exposure apparatus which concerns on 2nd Embodiment seeing partially from + X direction of FIG. It is a top view which shows the substrate stage apparatus with which the exposure apparatus which concerns on 3rd Embodiment is provided. FIG. 18 is a schematic side view partially showing the exposure apparatus according to the third embodiment as seen in the + X direction of FIG. 17; It is a figure for demonstrating the modification of 3rd Embodiment. It is a top view which shows the substrate stage apparatus with which the exposure apparatus which concerns on 4th Embodiment is provided. FIG. 21 is a schematic side view partially showing the exposure apparatus according to the fourth embodiment as seen in the + X direction of FIG. It is a figure which shows roughly the structure of the exposure apparatus which concerns on 5th Embodiment. It is the top view which partially abbreviate | omitted which shows the exposure apparatus which concerns on 5th Embodiment. FIG. 23 is a schematic side view showing an exposure apparatus according to a fifth embodiment, with a part thereof being omitted as seen from the + X direction of FIG. It is the partially omitted top view which shows the exposure apparatus concerning 6th Embodiment. It is a figure which partially omits and shows XZ sectional drawing of the exposure apparatus which concerns on 6th Embodiment, and a figure for demonstrating a series of operation | movement at the time of processing a board | substrate with this exposure apparatus (the 1). It is a figure (2) for demonstrating a series of operation | movement at the time of processing a board | substrate with the exposure apparatus which concerns on 6th Embodiment. It is a figure (the 3) for demonstrating a series of operation | movement at the time of processing a board | substrate with the exposure apparatus which concerns on 6th Embodiment. FIG. 21 is a fourth diagram to explain a series of operations when processing a substrate with the exposure apparatus according to the sixth embodiment; It is a figure showing roughly the composition of the exposure device concerning a 7th embodiment. It is the partially omitted top view which shows the exposure apparatus which concerns on 7th Embodiment. FIG. 31 is a side view (partially omitted, a partially sectional view) of the exposure apparatus according to the seventh embodiment as viewed in the + X direction of FIG. It is a block diagram which shows the input-output relationship of the main control apparatus which mainly comprises the control system of the exposure apparatus which concerns on 7th Embodiment. It is a figure (1) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (2) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 3) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 4) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 5) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 6) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 7) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 8) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 9) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 10) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 11) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 12) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 13) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 14) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 15) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure (the 16) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 7th Embodiment. It is a figure which shows roughly the structure of the exposure apparatus which concerns on 8th Embodiment. It is the partially omitted top view which shows the exposure apparatus which concerns on 8th Embodiment. It is a figure (1) for explaining a series of operations for substrate processing performed with an exposure apparatus concerning an 8th embodiment. It is a figure (2) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 3) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. FIG. 21 is a diagram (fourth) for explaining a series of operations for substrate processing performed in the exposure apparatus according to the eighth embodiment. It is a figure (the 5) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 6) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (7) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 8) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 9) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 10) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 11) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 12) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. It is a figure (the 13) for demonstrating a series of operation | movement for the board | substrate process performed with the exposure apparatus which concerns on 8th Embodiment. FIG. 21 is a diagram (No. 14) for describing a series of operations for substrate processing performed in the exposure apparatus according to the eighth embodiment. It is a figure for demonstrating the modification using a board | substrate support member. It is a figure which shows roughly the structure of the exposure apparatus which concerns on 9th Embodiment. It is the partially omitted top view which shows the exposure apparatus which concerns on 9th Embodiment. FIG. 67 is a schematic side view showing an exposure apparatus according to a ninth embodiment, partially omitted, as viewed in the + X direction of FIG. 67. It is a figure which takes out a part of the top view of FIG. 68, and expands it. It is a block diagram which shows the input-output relationship of the main control apparatus which mainly comprises the control system of the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 1) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 2) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 3) performed with the exposure apparatus which concerns on 9th Embodiment. FIGS. 75A to 75D are diagrams for explaining parallel processing of the exposure of the shot area SA1 of the substrate P2 and the Y step operation of the substrate P1. It is exposure procedure explanatory drawing (the 4) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 5) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 6) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 7) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 8) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 9) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 10) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 11) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 12) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 13) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 14) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 15) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 16) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 17) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 18) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 19) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 20) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 21) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 22) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 23) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 24) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 25) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 26) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 27) performed with the exposure apparatus which concerns on 9th Embodiment. It is exposure procedure explanatory drawing (the 1) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 2) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 3) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 4) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 5) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 6) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 7) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 8) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 9) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 10) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 11) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 12) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 13) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 14) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is exposure procedure explanatory drawing (the 15) performed with the exposure apparatus which concerns on the modification of 9th Embodiment. It is the top view which partially abbreviate | omitted the exposure apparatus which concerns on 10th Embodiment. FIG. 116 is a schematic side view showing the exposure apparatus according to the tenth embodiment, with a part thereof being omitted as seen from the + X direction of FIG. It is a figure for demonstrating the effect of the exposure apparatus which concerns on 10th Embodiment. It is a schematic side view which shows the exposure apparatus concerning the modification of 10th Embodiment. It is the partially omitted top view which shows the exposure apparatus which concerns on the modification of 10th Embodiment. It is a figure which shows roughly the structure of the exposure apparatus which concerns on 11th Embodiment.

First Embodiment
Hereinafter, a first embodiment will be described based on FIGS. 1 to 13.

  FIG. 1 schematically shows the configuration of an exposure apparatus 100 according to the first embodiment, and FIG. 2 shows a plan view in which the exposure apparatus 100 is partially omitted. FIG. 2 corresponds to a plan view of a portion below the projection optical system PL in FIG. 1 (a portion below the lens barrel surface plate described later). The exposure apparatus 100 is used, for example, for manufacturing a flat panel display, a liquid crystal display (liquid crystal panel), and the like. The exposure apparatus 100 is a projection exposure apparatus in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used for a display panel of a liquid crystal display device or the like is an exposure target.

  The exposure apparatus 100 includes an illumination system IOP, a mask stage MST for holding a mask M, a projection optical system PL, a mask stage MST, a projection optical system PL, etc. A body BD (only a part of which is shown in FIG. , A substrate stage apparatus PST including a fine adjustment stage 26 (substrate table) for holding the substrate P, and a control system of these. In the following description, the direction in which the mask M and the substrate P are scanned relative to the projection optical system PL at the time of exposure is referred to as the X axis direction (X direction), and the direction orthogonal to this in the horizontal plane is the Y axis direction (Y The direction orthogonal to the X axis and Y axis is the Z axis direction (Z direction), and the rotation (inclination) directions around the X axis, Y axis and Z axis are the θx, θy, and θz directions, respectively. Do.

  The illumination system IOP is configured in the same manner as the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP includes illumination light for exposure (not illustrated) through a reflecting mirror, a dichroic mirror, a shutter, a wavelength selection filter, various lenses, and the like. The mask M is illuminated as illumination light IL. As the illumination light IL, for example, light such as i-ray (wavelength 365 nm), g-ray (wavelength 436 nm), h-ray (wavelength 405 nm) or the like (or combined light of the i-ray, g-ray and h-ray) is used. Further, the wavelength of the illumination light IL can be appropriately switched by the wavelength selection filter, for example, according to the required resolution.

  On the mask stage MST, a mask M having a circuit pattern or the like formed on its pattern surface (the lower surface in FIG. 1) is fixed, for example, by vacuum suction (or electrostatic suction). The mask stage MST is supported in a non-contact manner on an unshown mask base plate forming a part of the body BD, for example, via an unshown air bearing fixed to the bottom surface thereof. The mask stage MST is driven with a predetermined stroke in the scanning direction (X-axis direction) by a mask stage drive system 12 (not shown in FIG. 1, see FIG. 4) including a linear motor, for example, And in the .theta.z direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane includes a plurality of laser interferometers that irradiate a measurement beam to a reflection surface provided (or formed) on the mask stage MST. It is measured by a mask laser interferometer system (hereinafter referred to as "mask interferometer system") 14.

  The projection optical system PL is supported below the mask stage MST in FIG. 1 by the barrel surface plate 16 which is a part of the body BD. The projection optical system PL is configured in the same manner as, for example, the projection optical system disclosed in US Pat. No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which projection areas of the pattern image of the mask M are arranged in a zigzag, for example, and has a single Y axis direction as the longitudinal direction. It works the same as a projection optical system with a rectangular (band-like) image field. In this embodiment, as each of the plurality of projection optical systems, for example, one that forms an erecting correct image by a both-side telecentric equal-magnification system is used. Further, hereinafter, a plurality of projection areas arranged in a zigzag form of the projection optical system PL are collectively referred to as an exposure area IA.

  Therefore, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL passing through the mask M causes the circuit of the mask M in the illumination area via the projection optical system PL. Irradiation of the illumination light IL conjugate to the illumination area on the substrate P, on the surface of which the resist (sensitive agent) is applied, the projection image (partial erect image) of the pattern is disposed on the image plane side of the projection optical system PL The area (exposure area) IA is formed. The mask M is moved relative to the illumination area (illumination light IL) in the scanning direction (X-axis direction) by synchronous driving of the mask stage MST and the substrate holder PH (fine movement stage 26) described later holding the substrate P. At the same time, the substrate P is moved relative to the exposure area IA (illumination light IL) in the scanning direction (X-axis direction), whereby scanning exposure of one shot area (sectioned area) on the substrate P is performed. The pattern of the mask M is transferred to the shot area. That is, in exposure apparatus 100, a pattern of mask M is generated on substrate P by illumination system IOP and projection optical system PL, and exposure of the sensitive layer (resist layer) on substrate P by illumination light IL is performed on substrate P. A pattern is formed.

  As shown in FIG. 2 and FIG. 3 partially showing a schematic side view of the exposure apparatus 100 in the + X direction, the body BD is separated from each other by a predetermined distance in the X axis direction on the floor surface F. A pair of (two) substrate stage mounts (hereinafter referred to as mounts) 18 consisting of rectangular members arranged in parallel and having the longitudinal direction as the Y-axis direction, and a pair of side frames 20 on the pair of mounts 18. A lens barrel surface plate 16 supported horizontally and a mask surface plate (not shown) are provided. The number of mounts 18 is not limited to two, and may be one or three or more.

  Each gantry 18 is installed on the floor surface F via a plurality of vibration isolation devices 22 (see FIGS. 1 and 3). As shown in FIGS. 2 and 3, the lower ends of the pair of side frames 20 are connected to one end and the other end in the Y-axis direction of the upper surface of the pair of pedestals 18. The lens barrel surface plate 16 is formed of a rectangular parallelepiped member whose longitudinal direction is in the Y-axis direction disposed in parallel to the XY plane, and both ends in the Y-axis direction on the pair of pedestals 18 are downward by the pair of side frames 20. It is supported by

  As shown in FIG. 1, the substrate stage device PST has a coarse movement stage portion 24, a fine movement stage 26, a weight cancellation device 28, and the like. The weight cancellation device 28 is disposed on the upper surface parallel to the XY plane of the X guide 82 disposed on the pair of mounts 18 as shown in FIGS. 1 and 3.

  As shown in FIG. 3, the coarse movement stage unit 24 includes two (pairs) X beams 30A and 30B, two (pairs) coarse movement tables 32A and 32B, and two X beams 30A and 30B. And a plurality of legs 34 for supporting each on the floor surface F.

  Each of the X beams 30A and 30B is a hollow member having a rectangular frame in the YZ cross section extending in the X axis direction and having a rib inside, and is arranged in parallel to each other at a predetermined interval in the Y axis direction (FIGS. 3). Each of the X beams 30A and 30B, as shown for the X beam 30A in FIG. 1, has three legs 34 in the vicinity of the longitudinal direction (X-axis direction) both end portions and the central portion, and three legs 34 from below. It is supported on the surface F in a non-contact manner with respect to the pair of mounts 18. Thus, the coarse movement stage unit 24 is vibrationally separated from the pair of racks 18. The arrangement and number of the legs 34 may be arbitrary. The X beams 30A and 30B are not limited to hollow members, but may be solid members, or may be rod members having an I-shaped YZ cross section.

  On each upper surface of the X beams 30A and 30B, a plurality of X linear guides 36 extending in the X axis direction are fixed in parallel with each other (for example, two (one pair)) at predetermined intervals in the Y axis direction. Further, X stators 38A and 38B extending in the X-axis direction are fixed to the upper surfaces of the X beams 30A and 30B and in the region between the pair of X linear guides 36. Each of the X stators 38A and 38B has a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction, for example. In the present embodiment, as shown in FIGS. 2 and 3, the cross-sectional shape of the X beams 30A and 30B is such that the X beam 30A on the + Y side is wider than the X beam 30B on the −Y side, that is, the Y axis direction Although the length of is longer, the same shape may be used.

  The coarse movement tables 32A, 32B are individually disposed above the X beams 30A, 30B as shown in FIG. The coarse movement table 32B located on the -Y side is made of a plate member having a rectangular shape in a plan view, and the coarse movement table 32A located on the + Y side is a plate having a U shape in a plan view having a recess at an end portion on the Consisting of In FIG. 3, the coarse movement table 32A is partially shown in a cross-sectional view together with a weight cancellation device 28 described later. As shown in FIG. 3, X stators 38A and 38B fixed to X beams 30A and 30B are provided on the lower surfaces of coarse movement tables 32A and 32B via predetermined gaps (gaps, clearances). The opposing X movers 40A and 40B are fixed. Each of X movers 40A, 40B includes, for example, a coil unit (not shown), and X linear motor 42A, which drives coarse movement table 32A, 32B with X stator 38A, 38B with a predetermined stroke in the X axis direction, 42B are respectively configured.

  In addition, as shown in FIG. 3, the lower surfaces of the coarse movement tables 32A and 32B include rolling elements (for example, a plurality of balls, etc.) (not shown) and can slide relative to the respective X linear guides 36. A plurality of engaging sliders 44 are fixed. For example, four sliders 44 are provided at predetermined intervals in the X-axis direction with respect to each X linear guide 36 (see FIG. 1), for example, a total of eight on each lower surface of coarse movement tables 32A and 32B. The sliders 44 are fixed. Each of the coarse movement tables 32A and 32B is linearly guided in the X-axis direction by a plurality of X linear guide devices including an X linear guide 36 and a slider 44.

  Although not shown in FIGS. 1 to 3, an X scale in which the X axis direction is a periodic direction is fixed to each of the X beams 30A and 30B, and X is applied to each of the coarse movement tables 32A and 32B. The encoder heads constituting the X linear encoder systems 46A and 46B (see FIG. 4) for determining positional information of the coarse movement tables 32A and 32B in the X-axis direction using a scale are fixed.

  The position of the coarse movement table 32A, 32B in the X-axis direction is controlled by the main controller 50 (see FIG. 4) based on the output of the encoder head. Similarly, although not shown in FIGS. 1 to 3, relative movement amounts of the fine moving stage 26 in the X-axis and Y-axis directions with respect to the coarse movement tables 32A and 32B are not Gap sensors 48A and 48B (see FIG. 4) for measuring displacement amount are attached. Main controller 50 immediately stops fine movement stage 26 and coarse movement table 32A, 32B when the relative movement amount measured by gap sensors 48A, 48B reaches a predetermined limit value. Instead of or in addition to the gap sensors 48A and 48B, a mechanical stopper member may be provided which mechanically restricts the movable amount of the fine movement stage 26 with respect to the coarse movement table 32A or 32B.

  Here, although the description will be made before and after, fine movement stage 26 will be described. As can be seen from FIGS. 1 and 3, fine movement stage 26 is formed of a plate-like (or box-like) member having a rectangular shape in a plan view, and substrate holder PH is mounted on the upper surface thereof. The substrate holder PH has a length in the X-axis direction equal to that of the substrate P, and a width (length) in the Y-axis direction is about half that of the substrate P (see FIG. 2). The substrate holder PH adsorbs and holds a part of the substrate P (here, about a half of the substrate P in the Y-axis direction) by, for example, vacuum adsorption (or electrostatic adsorption), and also a pressurized gas (for example, High pressure air can be blown upward to support a portion (about 1/2 of the substrate P) of the substrate P in a noncontact (floating) manner from below by the jetting pressure. The switching between the ejection of high pressure air to the substrate P by the substrate holder PH and the vacuum adsorption is performed via a holder air suction switching device 51 (see FIG. 4) for switching and connecting the substrate holder PH to a vacuum pump and a high pressure air source (not shown). Is performed by the main controller 50.

  Fine movement stage 26 has six degrees of freedom (X-axis, Y-axis, Z-axis, θx) on coarse movement table 32A by fine movement stage drive system 52 (see FIG. 4) including a plurality of voice coil motors (or linear motors). , Θy and θz).

  More specifically, as shown in FIG. 1, a stator 56 is provided on the upper surface of the + X side end of the coarse movement table 32A via the support member 33, and opposed to this, the fine adjustment stage 26 is A mover 58 constituting an X voice coil motor 54X together with the stator 56 is fixed to the side surface on the + X side. Here, in practice, a pair of X voice coil motors 54X having the same configuration are provided at predetermined intervals in the Y-axis direction.

  Further, as shown in FIG. 3, a stator 60 is provided at a substantially central position of the upper surface of the coarse movement table 32A in the Y-axis direction, and a stator 60 is provided via a support member 35. The mover 62 constituting the Y voice coil motor 54Y is fixed together with the stator 60 on the side surface on the + Y side. Here, in practice, a pair of Y voice coil motors 54Y having the same configuration are provided at a predetermined distance in the X axis direction.

  Fine movement stage 26 is supported by weight cancellation device 28 described later by main controller 50 using a pair of X voice coil motors 54X, and is synchronously driven to coarse movement table 32A (at the same speed in the same direction as coarse movement table 32A By being driven, it moves in the X axis direction along with the coarse movement table 32A with a predetermined stroke, and is driven using the pair of Y voice coil motors 54Y in the Y axis direction with respect to the coarse movement table 32A. Also move with a very small stroke.

  Further, fine movement stage 26 performs coarse movement by the main controller 50 generating driving forces in opposite directions to each other of each of a pair of X voice coil motors 54X or each of a pair of Y voice coil motors 54Y. It moves in the θz direction with respect to the table 32A.

  In this embodiment, the fine movement stage 26 is a projection optical system PL (see FIG. 1) by the X linear motors 42A and 42B described above and the pair of X voice coil motors 54X and Y voice coil motors 54Y of the fine movement stage drive system 52. 1) can be moved (coarse) by a long stroke in the X-axis direction, and can be finely moved (finely moved) in three degrees of freedom in the X-axis, Y-axis and θz directions.

  In addition, fine movement stage drive system 52 has a plurality of, for example, four, for finely driving fine movement stage 26 in the directions of the remaining three degrees of freedom (each direction of θx, θy, and Z axis), as shown in FIG. It has Z voice coil motor 54Z. Each of the plurality of Z voice coil motors 54 Z includes a stator 59 fixed to the upper surface of the coarse movement table 32 A and a mover 57 fixed to the lower surface of the fine movement stage 26. (In FIG. 1, only two of the four Z voice coil motors 54Z are shown in FIG. 1, and the other two are not shown. Also, in FIG. Only one is shown, the other three are not shown). The stators of the voice coil motors 54X, 54Y, 54Z are all mounted on the coarse movement table 32A. Each voice coil motor 54X, 54Y, 54Z may be either of moving magnet type or moving coil type. The position measurement system for measuring the position of fine movement stage 26 will be described later.

  As shown in FIGS. 2 and 3, four air floating units 84 having a support surface (upper surface) rectangular in plan view are disposed above the coarse movement tables 32A and 32B, respectively, and the support members 86 are respectively provided. It is being fixed to the upper surface of coarse movement table 32A, 32B via it.

  The support surface (upper surface) of each air floating unit 84 is a thrust type air bearing structure having a porous body or a plurality of mechanically small holes. Each air levitation unit 84 can levitate and support a part of the substrate P by supplying pressurized gas (for example, high pressure air) from the gas supply device 85 (see FIG. 4). The on / off of the supply of high pressure air to each air floating unit 84 is controlled by the main controller 50 shown in FIG. Here, in FIG. 4, for convenience of drawing, a single gas supply device 85 is illustrated, but the invention is not limited thereto, and an air levitation unit 84 for supplying high pressure air individually to each air levitation unit 84 and The same number of gas supply devices may be used, or two or more gas supply devices connected to the plurality of air levitation units 84 may be used. In FIG. 4, a single gas supply device 85 is shown to represent all of these. In any case, the main controller 50 individually controls on / off of the supply of high pressure air from the gas supply device 85 to the respective air levitation units 84.

  Each of the four air floating units 84 attached to each of the coarse movement tables 32A and 32B is disposed on both sides in the Y-axis direction of the substrate holder PH. The upper surface of each air floating unit 84 is set to be equal to or somewhat lower than the upper surface of the substrate holder PH.

  As shown in FIG. 2, each of the four air floating units 84 arranged on one side and the other side of the substrate holder PH in the Y-axis direction has substantially the same area as the substrate holder PH in plan view (that is, about In a rectangular area of 1/2), they are arranged in two rows and two columns at a predetermined interval in the X-axis direction and at a slight gap in the Y-axis direction. In this case, each of the four air levitation units 84 can levitate and support about one half of the substrate P.

  As apparent from the above description, in the present embodiment, the entire substrate P can be floated and supported by the substrate holder PH and the two air floating units 84 adjacent to both sides (± Y side) of the substrate holder PH. it can. Further, the entire substrate P can be floated and supported by the substrate holder PH and the four air floating units 84 on one side (+ Y side or −Y side) of the substrate holder PH.

  Each of the four air floating units 84 on both sides (± Y side) of the substrate holder PH described above may be replaced with one large air floating unit having substantially the same area as the substrate holder PH in plan view, or the Y axis direction Each of the two air levitation units 84 arranged in parallel may be replaced with one air levitation unit of substantially the same area. However, the air floating unit on the + Y side of the substrate holder PH as a whole has the same length in the Y-axis direction as the substrate holder PH in order to secure an appropriate arrangement space for the substrate Y step feeding device described later. It is desirable to have a rectangular support surface whose length in the X-axis direction is somewhat short, and at least divided in two with respect to the X-axis direction.

  The substrate Y step feeding device 88 is a device for holding the substrate P and moving it in the Y-axis direction, and among the four air floating units 84 on the + Y side of the substrate holder PH, each on the + X side and the −X side. It is disposed between the two air levitation units 84. The substrate Y step feeding device 88 is fixed to the coarse movement table 32A via the support member 89 (see FIG. 3).

  As shown in FIG. 3, the substrate Y step-feed device 88 includes a movable portion 88a that sucks the back surface of the substrate P and moves in the Y-axis direction and a fixed portion 88b fixed to the coarse movement table 32A. There is. The movable portion 88a is, for example, a drive device 90 (not shown in FIG. 3, see FIG. 4) constituted by a linear motor including a mover provided on the movable portion 88a and a stator provided on the fixed portion 88b. The coarse movement table 32A is driven in the Y-axis direction. The substrate Y step feeding device 88 is provided with a position reading device 92 (not shown in FIG. 3, see FIG. 4) such as an encoder for measuring the position of the movable portion 88a. The driving device 90 is not limited to a linear motor, and may be constituted by a driving mechanism using a rotating motor using a ball screw or a belt as a driving source.

  The moving stroke of the movable portion 88a of the substrate Y step feeding device 88 in the Y-axis direction is about 1/2 of the length of the substrate P in the Y-axis direction, and the back surface of the substrate P is adsorbed. Can be positioned on the substrate holder PH. Therefore, each time the substrate P is stepwise fed in the Y-axis direction, the substrate P held by the substrate holder PH is scanned in the X-axis direction with respect to the exposure area IA of the projection optical system PL. It becomes possible to expose the entire area of the exposure target area.

  In addition, the movable portion 88a (substrate suction surface) of the substrate Y step feeding device 88 needs to suck the back surface of the substrate P or release the suction to separate it from the substrate P. It is configured to be slightly drivable also in the direction.

  In the present embodiment, the substrate Y step feeding device 88 is attached to the coarse movement table 32A, but the present invention is not limited to this and may be attached to the fine movement stage 26. In the above description, the movable portion 88a of the substrate Y step-feed device 88 is movable in the Z-axis direction because it is necessary to separate and contact with the substrate P, but the invention is not limited thereto. The fine movement stage 26 may move in the Z-axis direction for suctioning the substrate P by the movable portion 88 a (substrate suction surface) and separation from the substrate P.

  The weight cancellation device 28 is formed of a columnar member extending in the Z-axis direction as shown in FIGS. 1 and 3 and is also referred to as a center pillar. The weight cancellation device 28 supports the fine movement stage 26 from below via a device called a leveling device described later. The weight cancellation device 28 is disposed in the recess of the coarse movement table 32A, the upper half of which is exposed above the coarse movement table 32A (and 32B), and the lower half of the coarse movement table 32A (and 32B). ) Is exposed below.

  The weight cancellation device 28 has a housing 64, an air spring 66, a Z-slider 68 and the like as shown in FIG. The housing 64 is formed of a bottomed cylindrical member opened on the + Z side. On the lower surface of the housing 64, a plurality of air bearings (hereinafter referred to as base pads) 70 whose bearing surfaces face the -Z side are attached. The air spring 66 is housed inside the housing 64. The air spring 66 is supplied with pressurized gas (for example, high pressure air) from the outside. The Z-slider 68 is formed of, for example, a low-profile cylindrical member extending in the Z-axis direction, and is inserted into the housing 64 and mounted on the air spring 66. The Z slider 68 is provided with a guide (not shown) for restricting movement in directions other than the Z axis direction. For example, an air bearing or a parallel leaf spring may be used as the guide. A parallel leaf spring is comprised, for example using six leaf springs which consist of a thin spring steel plate etc. of thickness parallel to XY plane. Of the six plate springs, three plate springs are arranged radially at three locations around the upper end of the Z slider 68, and the remaining three plate springs are positioned at three locations around the lower end of the Z slider 68. Arranged radially so as to vertically overlap with the three leaf springs. Then, one end of each plate spring is attached to the outer peripheral surface of the Z slider 68, and the other end is attached to the housing 64. By using a parallel leaf spring, since the stroke is determined by the deflection amount of the leaf spring, the Z-slider 68 can be configured to be short in the Z-axis direction, that is, to have a low height (height). However, the Z-slider 68 can not cope with a long stroke as in the case of forming a guide by an air bearing. An air bearing (not shown) having a bearing surface facing the + Z side is attached to the upper portion (the end on the + Z side) of the Z slider 68 (referred to as a sealing pad). Further, as shown in FIGS. 1 and 3, a plurality of arms (referred to as a feeler) 71 are radially arranged and fixed around the housing 64. A target plate 72 used for each of a plurality of reflection type optical sensors (also called leveling sensors) 74 attached to the lower surface of the fine movement stage 26 is installed on the upper surface of the tip of each feeler 71. The reflection type light sensors 74 are actually arranged at three or more places which are not on a straight line. A Z-tilt measurement system 76 (see FIG. 4) configured to measure the position of the fine movement stage 26 in the Z-axis direction and the tilt amount (rotation amount in the θx and θy directions) is configured by the plurality of reflection type optical sensors 74. There is. In FIG. 3, only one reflective optical sensor 74 is shown in order to avoid the confusion of the drawing.

  The leveling device 78 is a device for supporting the fine movement stage 26 in a tiltable manner (pivotable in the θx and θy directions with respect to the XY plane). The leveling device 78 is a spherical bearing having a fixed portion 78a (shown schematically by a rectangular member in FIG. 3) and a movable portion 78b (shown schematically by a spherical member in FIG. 3), Alternatively, it is a pseudo spherical bearing structure, and the fixed portion 78a can tilt the movable portion 78b with a minute stroke about an axis (for example, X axis and Y axis) in a horizontal surface while supporting the movable portion 78b from below. It has become. In this case, for example, the upper surface of the fixed portion 78a may be formed with a recess that allows the tilt of the movable portion 78b in the θx direction and the θy direction.

  The upper surface (upper half of the spherical surface) of the movable part 78b is fixed to the fine movement stage 26, and the fine movement stage 26 can be tilted with respect to the fixed part 78a. The lower surface of the fixing portion 78a is finished to be a horizontal flat surface, and has a slightly larger area than the bearing surface of the entire sealing pad as a guiding surface of the above-described sealing pad of the weight cancellation device 28. The fixing portion 78a is noncontact supported from below by a sealing pad attached to the Z slider 68 of the weight cancellation device 28.

  The weight cancellation device 28 cancels (cancels) the weight (force in the direction of gravity) of the system including the fine movement stage 26 through the Z slider 68 and the leveling device 78 by the force in the direction of gravity generated by the air spring 66. ) To reduce the load on the plurality of Z voice coil motors 54Z described above.

  The weight cancellation device 28 is connected to the coarse movement table 32A via a pair of coupling devices 80 (see FIG. 1). The Z positions of the pair of coupling devices 80 substantially coincide with the center-of-gravity position of the weight cancellation device 28 in the Z-axis direction. Each connecting device 80 includes a thin steel plate or the like having a thickness parallel to the XY plane, and is also referred to as a flexure device. The pair of connecting devices 80 are disposed facing each other on the + X side and the −X side of the weight cancellation device 28. Each connecting device 80 is disposed between the housing 64 of the weight canceling device 28 and the coarse movement table 32A in parallel with the X axis, and connects the both. Therefore, the weight cancellation device 28 moves in the X-axis direction integrally with the coarse movement table 32A by being pulled by the coarse movement table 32A via any of the pair of coupling devices 80. In addition, the upper component (such as fine movement stage 26 and substrate holder PH) supported by weight cancellation device 28 via leveling device 78 in a non-contact manner is driven by a pair of X voice coil motors 54X to move coarse movement table 32A and It moves integrally in the X-axis direction. At this time, a traction force acts on the weight cancellation device 28 in a plane parallel to the XY plane including the position of the center of gravity in the Z-axis direction, so a moment about an axis (Y-axis) orthogonal to the moving direction (X-axis) (Pitching moment) does not work.

  As described above, in the present embodiment, the coarse movement tables 32A and 32B, the weight cancellation device 28, the fine movement stage 26, the substrate holder PH, and the like are integrated with the substrate P (a part of the substrate P is held) A movable body (hereinafter referred to as a substrate stage (26, 28, 32A, 32B, PH) as appropriate) moving in the X-axis direction is configured.

  The detailed configuration of the weight cancellation device 28 of the present embodiment including the leveling device 78 and the connection device 80 is disclosed in, for example, US Patent Application Publication No. 2010/0018950 (However, the present embodiment) Then, since the weight cancellation device 28 does not move in the Y-axis direction, the connection device in the Y-axis direction is unnecessary). Although not shown, the weight cancellation device 28 may be regulated by a connecting device or the like in the Y-axis direction so as not to move alone in the Y-axis direction.

  As shown in FIGS. 1 and 2, the X guide 82 has a rectangular parallelepiped shape whose longitudinal direction is the X axis direction. The X guides 82 are disposed and fixed on the upper surfaces (+ Z side surfaces) of the pair of mounts 18 so as to cross the pair of mounts 18. The dimensions of the X guide 82 in the longitudinal direction (X axis direction) are the X axis direction dimensions of the pair of racks 18 arranged at predetermined intervals in the X axis direction and the X axis dimension of the gap between the pair of racks 18 It is set somewhat longer (approximately equal) than the sum of

  The upper surface (the surface on the + Z side) of the X guide 82 is parallel to the XY plane and finished with a very high degree of flatness. As shown in FIGS. 1 and 3, the weight cancellation device 28 is mounted on the X guide 82 and float-supported (supported in a non-contact state) via the base pad 70. The upper surface of the X guide 82 is adjusted to be substantially parallel to the horizontal plane (XY plane), and functions as a guide surface when the weight cancellation device 28 moves. The longitudinal dimension of the X guide 82 is set somewhat longer than the movable amount in the X axis direction of the weight cancellation device 28 (i.e., the coarse movement table 32A). The widthwise dimension (the dimension in the Y-axis direction) of the upper surface of the X guide 82 is set to a dimension capable of facing the bearing surface of all of the plurality of base pads 70 (see FIG. 3). The material and manufacturing method of the X guide 82 are not particularly limited. For example, when it is formed by casting cast iron or the like, when it is formed by a stone material (for example, gully rock), ceramics or CFRP (Carbon Fiver Reinforced Plastics) ) May be formed of materials. In addition, the X guide 82 is a solid member or a hollow member having a rib inside, and the shape of the X guide 82 is formed by a rectangular parallelepiped member. The X guide 82 is not limited to a rectangular member, and may be a rod member having an I-shaped YZ cross section.

From the plane mirror (or corner cube) having a reflection surface orthogonal to the X axis on the side surface on the -X side of the substrate holder PH, as shown in FIGS. 1 and 2, via a mirror holding part (not shown) A pair of X moving mirrors 94X ₁ and 94X ₂ are fixed. Here, the pair of X moving mirrors 94X ₁ and 94X ₂ may be fixed to the fine movement stage 26 via a bracket.

As shown in FIG. 3, a Y moving mirror 94 Y, which is a long flat mirror having a reflection surface orthogonal to the Y axis, is fixed to the side surface on the −Y side of fine movement stage 26 via mirror holding part 96 as shown in FIG. It is done. The position information in the XY plane of fine movement stage 26 (substrate holder PH) is a laser interferometer system using a pair of X moving mirrors 94X ₁ and 94X ₂ and Y moving mirror 94Y (hereinafter referred to as a substrate stage interferometer system) For example, it is always detected by the resolution 98 (see FIG. 4) at a resolution of about 0.5 to 1 nm. In actuality, as shown in FIGS. 2 and 4, substrate stage interferometer system 98 is an X laser interferometer corresponding to a pair of X movable mirrors 94X ₁ and 94X ₂ (hereinafter referred to simply as X interferometer). And a Y laser interferometer (hereinafter abbreviated as Y interferometer) 98Y corresponding to the Y movable mirror 94Y. The measurement results of the X interferometer 98X and the Y interferometer 98Y are supplied to the main controller 50 (see FIG. 4).

As shown in FIG. 1, the X interferometer 98X has a pair of X movable mirrors 94X at the upper end of an L-shaped interferometer column 102 whose one end is fixed to the X guide 82 (or the stand 18 on the −X side). _1, is mounted at a height facing the 94X _2. As X interferometer 98X, a pair of interferometer which irradiates an interferometer beam (measurement beam) separately to each of a pair of X movement mirrors 94X ₁ and 94X ₂ can also be used, or a pair of X movement mirrors 94X ₁ , it can also be used multi-axis interferometer that emits the two measurement beams are irradiated to the respective 94X ₂ (measurement beam). In the following, it is assumed that an X interferometer 98X is configured by a multi-axis interferometer.

  As shown in FIG. 3, the Y interferometer 98Y is disposed between the two coarse movement tables 32A and 32B, and faces the Y moving mirror 94Y on the upper surface of the support member 104 whose lower end is fixed to the gantry 18. It is fixed. As the Y interferometer 98Y, a pair of interferometers for irradiating the Y moving mirror 94Y with interferometer beams (measurement beams) can be used, or multi-axis interference in which the Y moving mirror 94Y is irradiated with two measurement beams A meter can also be used. In the following, it is assumed that the Y interferometer 98Y is configured by the multi-axis interferometer.

  In this case, the Y interferometer 98Y is the surface of the substrate P in the Z-axis direction (in exposure, focus / leveling control of the substrate P is performed so that this surface coincides with the image plane of the projection optical system PL) Since it is at a lower position than the above, the measurement result of the Y position includes an Abbe error due to a change in posture (rolling) of the fine movement stage 26 during movement in the X axis direction. In this case, although not shown, in addition to the two measurement beams separated in the X-axis direction as the Y interferometer 98Y, at least one measurement beam separated in the Z-axis direction with respect to the two measurement beams And a multi-axis interferometer that irradiates at least three interferometer beams (measurement beams) onto the Y moving mirror 94Y. Main controller 50 detects the rolling amount of fine movement stage 26 by the multi-axis interferometer, and corrects the Abbe error included in the measurement result of Y position by Y interferometer 98 Y based on the detection result. You may

  Further, the positional information on the θx, θy, and Z-axis directions of the fine movement stage 26 is the Z tilt measurement system 76 described above (three or more non-linear reflection type optical sensors 74 fixed on the lower surface of the fine movement stage 26) Thus, the target plate 72 at the tip of the feeler 71 described above is used. The configuration of the position measurement system of fine movement stage 26 described above including Z tilt measurement system 76 is disclosed, for example, in US Patent Application Publication No. 2010/0018950. Therefore, when using a type of interferometer that does not detect the rolling amount of fine movement stage 26 as Y interferometer 98 Y, main controller 50 relates to the θy direction of fine movement stage 26 determined by Z tilt measurement system 76. The above-mentioned Abbe error included in the measurement result of the Y position by the Y interferometer 98Y may be corrected based on the position information (rolling amount).

  In addition, the positional information on the θx, θy, and Z-axis directions of the fine movement stage 26 alone is not measured, and a member above the fine movement stage 26 that can be regarded as integral with the projection optical system PL (a part of the body BD, eg, a lens barrel surface plate The positional information of the substrate P in the θx, θy, and Z axis directions may be measured directly from the top by the oblique incidence multipoint focus position detection system (focus sensor) (not shown) fixed to 16). Of course, positional information of the substrate P and the fine movement stage 26 in the θx, θy, and Z axis directions may be measured.

  Although not shown, a plurality of alignment detection systems are provided at the lower end portion of the lens barrel surface plate 16 located above the substrate holder PH. A plurality of alignment detection systems are arranged at predetermined intervals in the X-axis and Y-axis directions. The substrate holder PH can pass under the plurality of alignment detection systems by the movement of the fine movement stage 26 in the X-axis direction. At least a part of the alignment detection system may be configured to be able to change the position in the XY direction according to the arrangement (the number of shots, the number of chamfers) of the pattern area on the substrate P.

  Each alignment detection system has, for example, a microscope provided with a CCD camera, and alignment measurement is performed by image processing when an alignment mark provided at a predetermined position of the substrate P in advance enters the field of view of the microscope. Position information (positional displacement information) of the mark is sent to the main controller 50 that controls the position of the movable portion of the substrate stage device PST.

  FIG. 4 is a block diagram showing the input / output relationship of the main control unit 50 that centrally configures the control system of the exposure apparatus 100 and performs overall control of each component. In FIG. 4, each component related to the substrate stage system is shown. Main controller 50 includes a work station (or a microcomputer) and the like, and generally controls each component of exposure apparatus 100.

  Next, a series of operations for substrate processing performed in the exposure apparatus 100 according to the present embodiment configured as described above will be described. Here, the case where the second and subsequent layers are exposed to the substrate P as an example will be described based on FIGS. 5 to 13. The exposure area IA shown in FIG. 5 to FIG. 13 is an illumination area where the illumination light IL is irradiated through the projection optical system PL at the time of exposure, and is not actually formed other than at the time of exposure However, in order to clarify the positional relationship between the substrate P and the projection optical system PL, it is always shown.

  First, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and substrate transfer device (not shown) transfers substrate stage device PST. Loading of the substrate P to the top (loading) is performed. In exposure before the previous layer on the substrate P, as shown in FIG. 5 as an example, a plurality of, for example, four shot areas SA1 to SA4 and a plurality of alignment marks transferred simultaneously with the pattern of each shot area (Not shown) is provided for each shot area.

  At the time of loading onto the substrate stage device PST, the substrate P is placed across the substrate holder PH and the four air floating units 84 on the + Y side of the substrate holder PH, as shown in FIG. The part of the substrate P (about 1/2 of the whole substrate P) is fixed by suction, and the four air levitation units 84 float and support the part of the substrate P (about half of the whole of the whole substrate P). At this time, the substrate P is the substrate holder PH and the substrate holder PH + Y so that at least two alignment marks on the substrate P fall within the field of view of one of the alignment detection systems and on the substrate holder PH. It is mounted straddling the four air levitation units 84 on the side.

  Thereafter, the position of fine movement stage 26 relative to projection optical system PL and the approximate position of substrate P relative to fine movement stage 26 are determined by main controller 50 by the same method of alignment measurement as in the prior art. The alignment measurement of the substrate P with respect to the fine movement stage 26 may be omitted.

Then, based on the measurement result described above, main controller 50 drives fine movement stage 26 via coarse movement table 32A to place at least two alignment marks on substrate P within the field of view of one of the alignment detection systems. The movement is performed, alignment measurement of the substrate P with respect to the projection optical system PL is performed, and a scan start position for exposure of the shot area SA1 on the substrate P is obtained based on the result. Here, since the scan for exposure includes an acceleration section and a deceleration section before and after the constant velocity movement section at the time of scan exposure, the scan start position is, strictly speaking, the acceleration start position. Then, main controller 50 drives coarse movement tables 32A and 32B and minutely drives fine movement stage 26 to position substrate P at the scan start position (acceleration start position). At this time, as indicated by a cross arrow in FIG. 5, the minute movement of fine movement stage 26 (substrate holder PH) relative to coarse movement table 32A is performed with a very small amount of precision in the X axis, Y axis and θz direction (or 6 degrees of freedom). Positioning drive is performed. FIG. 5 shows the state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P in this manner.
Thereafter, a step-and-scan exposure operation is performed.

In the step-and-scan exposure operation, a plurality of shot areas SA1 to SA4 on the substrate P are sequentially exposed. During the scan operation, the substrate P is accelerated for a predetermined acceleration time in the X-axis direction, and then driven at a constant velocity for a predetermined time (exposure (scan exposure) is performed during this constant velocity drive), and then the same time as the acceleration time (Hereinafter, a series of operations of the substrate P is referred to as X scan operation). In addition, the substrate is appropriately driven in the X-axis or Y-axis direction (hereinafter referred to as an X-step operation and a Y-step operation, respectively) at the time of step operation (at the time of movement between shot areas). In the present embodiment, the maximum exposure width (the width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4) is about half that of the substrate P.
Specifically, the exposure operation is performed as follows.

  From the state of FIG. 5, the substrate stage (26, 28, 32A, 32B, PH) is driven in the −X direction as shown by the outlined arrow in FIG. 5, and the X scan operation of the substrate P is performed. . At this time, mask M (mask stage MST) is driven in the −X direction in synchronization with substrate P (fine movement stage 26), and shot area SA1 is a projection area of the pattern of mask M by projection optical system PL. Since the light passes through the exposure area IA, scanning exposure for the shot area SA1 is performed at that time. The scanning exposure is performed by irradiating the substrate P with the illumination light IL through the mask M and the projection optical system PL during the constant velocity movement of the fine movement stage 26 (substrate holder PH) in the −X direction after acceleration. .

  During the above-described X scan operation, main controller 50 causes substrate holder PH mounted on fine movement stage 26 to adsorb and fix a part of substrate P (about 1/2 of the entire substrate P), and move it on coarse movement table 32A. The substrate stage (26, 28, 32A, 32B, PH) is driven in a state in which a part of the substrate P (about 1/2 of the entire substrate P) is floated and supported on certain four air floating units 84. At this time, main controller 50 drives coarse movement tables 32A and 32B in the X-axis direction via X linear motors 42A and 42B based on the measurement results of X linear encoder systems 46A and 46B, and causes substrate stage interference. Fine movement stage drive system 52 (each voice coil motor 54X, 54Y, 54Z) is driven based on the measurement result of measurement system 98 and / or Z tilt measurement system 76. Thus, the substrate P is pulled by the coarse movement table 32A and moved in the X-axis direction in a state where the substrate P is integrally supported on the weight cancellation device 28 integrally with the fine movement stage 26, and from the coarse movement table 32A The relative position control of X axis, Y axis, Z axis, .theta.x, .theta.y and .theta.z (six degrees of freedom) are precisely controlled. Further, main controller 50 synchronizes with fine movement stage 26 (substrate holder PH) during the X scan operation, and based on the measurement result of mask interferometer system 14, holds mask MST that holds mask M along the X axis. The scanning drive is performed in the direction, and the micro driving is performed in the Y-axis direction and the θz direction. FIG. 6 shows a state in which the scan stage for the shot area SA1 is finished and the substrate stage (26, 28, 32A, 32B, PH) holding a part of the substrate P is stopped.

  Next, in preparation for acceleration for the next exposure, main controller 50 performs an X step operation of substrate P, which drives substrate P slightly in the + X direction, as shown by the outlined arrow in FIG. Do. In the X step operation of the substrate P, the main controller 50 drives the substrate stage (26, 28, 32A, 32B, PH) in the same state as the X scan operation (however, the positional deviation during movement is the scan operation) Do not regulate as strictly FIG. 7 shows a state in which the substrate stage (26, 28, 32A, 32B, PH) has moved to the scan start position for exposure of the shot area SA2. In parallel with the X step operation of substrate P, main controller 50 returns mask stage MST to the acceleration start position.

  Next, main controller 50, as shown by the outlined arrows in FIG. 7, the substrate X (substrate stage (26, 28, 32A, 32B, PH)) and mask M (mask stage MST) of -X. Acceleration of the direction is started, and scan exposure is performed on the shot area SA2 in the same manner as described above. FIG. 8 shows a state in which the scanning exposure on the shot area SA2 is completed and the substrate stages (26, 28, 32A, 32B, PH) are stopped.

  Next, a Y step operation is performed to move the unexposed area of the substrate P onto the substrate holder PH. In this Y step operation of the substrate P, the main controller 50 sucks and holds the back surface of the + Y side end of the substrate P in the state shown in FIG. 8 by the movable portion 88a of the substrate Y step feeding device 88 After releasing the suction of the substrate holder PH to the substrate P, the substrate Y step feeding device with the substrate P lifted by the exhaust of high pressure air from the substrate holder PH and the subsequent exhaust of high pressure air by the air floating unit 84 This is performed by driving the movable portion 88a of 88 in the -Y direction as shown by the solid arrows in FIG. As a result, only the substrate P moves in the -Y direction with respect to the substrate holder PH, and the unexposed shot areas SA3 and SA4 of the substrate P face the substrate holder PH, and the substrate holder PH and 4 on the -Y side. It will be in the state mounted across the two air floating units 84. At this time, the substrate P is floated and supported by the substrate holder PH and the air floating unit 84. Then, the substrate holder PH is switched from the exhaust to the intake (suction) by the main control device 50. Thereby, a part (about 1/2 of the whole substrate P) of the substrate P is adsorbed and fixed by the substrate holder PH, and a part of the substrate P (about the other half of the whole substrate P) by the four air floating units 84. ) Is supported by floating. Immediately after the start of the suction operation of the substrate P by the substrate holder PH, the main controller 50 cancels the suction of the substrate P by the substrate Y step-feed device 88.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area provided in advance on the substrate P is performed. In the alignment measurement, the X step operation of the substrate P described above is performed as needed so that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 9) .

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 based on the result, as indicated by the cross arrow in FIG. Precise micro-positioning drive in the X-axis, Y-axis and θz directions (or 6 degrees of freedom) is performed for 32A.

  Next, as indicated by the outlined arrows in FIG. 10, the main controller 50 starts acceleration of the substrate P and the mask M in the + X direction, and scan exposure is performed on the shot area SA3 as described above. FIG. 11 shows a state in which the scanning exposure on the shot area SA3 is completed and the substrate stages (26, 28, 32A, 32B, PH) are stopped.

  Next, in preparation for acceleration for the next exposure by main controller 50, the substrate stage (26, 28, 32A, 32B, PH) is slightly moved as shown by an outline arrow in FIG. An X step operation of driving in the X direction is performed. FIG. 12 shows a state where the substrate stage (26, 28, 32A, 32B, PH) has moved to the scan start position for exposure of the shot area SA4.

  Then, main controller 50 starts acceleration of substrate P and mask M in the + X direction as shown by an outlined arrow in FIG. 12, and scan exposure is performed on shot area SA4 in the same manner as described above. . FIG. 13 shows a state in which the substrate exposure (26, 28, 32A, 32B, PH) has stopped after the scan exposure for the shot area SA4 is completed.

  As described above, in the exposure apparatus 100 according to the present embodiment, exposure (overlapping of the pattern of the mask M) on the entire substrate P (all shot areas SA1 to SA4 on the substrate) is repeated by repeating the scan exposure and the step operation. Coincidence transfer is performed.

  Here, the order of exposure and the direction of scanning for the shot areas SA1 to SA4 on the substrate P are not limited to the above-described order and direction. Also, the irradiation of the illumination light IL onto the substrate P through the projection optical system PL is performed only when the mask stage MST and the fine movement stage 26 are synchronized at the same speed in the X-axis direction only. The position of the blade or the opening and closing of the shutter is performed. Further, the width of the exposure area IA may be changed by making the opening width of the masking blade variable.

  As described above, in the exposure apparatus 100 according to the present embodiment, the substrate P is mounted, and the substrate holding surface (substrate mounting surface) of the substrate holder PH which is held by suction in a state where the flatness of the substrate P is secured. Since the area of about 1/2 of the conventional substrate holder is sufficient, the substrate holder PH can be made smaller and lighter. In addition, the fine movement stage 26 supporting the lightweight substrate holder PH is also reduced in size and weight, and high-speed, high acceleration / deceleration drive of the fine movement stage 26 by each voice coil motor 54X, 54Y, 54Z, and improvement of position controllability It becomes possible. Further, by miniaturizing the substrate holder PH, the processing time of the flatness of the substrate holding portion is shortened, and the processing accuracy is also improved. Further, in the present embodiment, the fine movement stage 26 does not perform step movement in the Y-axis direction, and only the substrate P is step movement in the Y-axis direction with rough precision by the substrate Y step-feed device 88 on the coarse movement table 32A. Therefore, the structure of the coarse movement table 32A is also simple, small, lightweight, and can be reduced in cost.

  The substrate stage apparatus PST provided in the exposure apparatus 100 according to the present embodiment is effective in a multiple layout in which a plurality of shot areas are arranged on the substrate P in the cross scan direction (Y-axis direction).

  In the above embodiment, the area (total area) of the substrate support surface of the air floating unit disposed on the + Y side and the −Y side of the substrate holder PH does not necessarily have to be about 1/2 of the substrate P. Also, the dimension in the cross scan direction does not necessarily have to be about half the size of the substrate P. That is, the substrate P may be floated by an air floating unit having a substrate supporting surface of smaller area and size. In this case, an air bearing structure capable of increasing the air rigidity can be used as the air floating unit, and an air bearing structure having a low air rigidity is used, and an air flow is generated by a fan having a large load capacity. You may make it float.

Second Embodiment
Next, a second embodiment will be described based on FIGS. 14 to 16. Here, about the component the same as that of 1st Embodiment mentioned above, or equivalent, while using the code | symbol of the same or resemblance | analogue, the description is simplified or abbreviate | omitted.

  FIG. 14 schematically shows the configuration of an exposure apparatus 200 according to the second embodiment, and FIG. 15 shows a plan view in which the exposure apparatus 200 is partially omitted. In FIG. 16, a schematic side view of the exposure apparatus 200 as viewed from the + X direction is partially omitted. However, in FIG. 16, the coarse movement table 32A is shown in a cross-sectional view as in FIG. 3 described above.

  The exposure apparatus 200 according to the second embodiment differs from the first embodiment described above in that a substrate stage apparatus PSTa is provided instead of the substrate stage apparatus PST described above, but other parts The configuration and the like of this embodiment are the same as those of the first embodiment described above.

  As can be seen from FIGS. 15 and 16, the substrate stage device PSTa eliminates the coarse movement table 32B on the -Y side of the two coarse movement tables 32A and 32B included in the substrate stage device PST described above, and accordingly, The air floating unit on the −Y side of the substrate holder PH is different from the above-described substrate stage device PST in that the air floating unit is not movable but fixed. Hereinafter, the substrate stage device PSTa according to the second embodiment will be described focusing on the differences.

  On the −Y side of the substrate holder PH, as shown in FIG. 15, the air levitation unit 84A and the air levitation unit 84B are arranged in pairs with a slight gap in the pair Y axis direction to form a pair, The sets are arranged in the X-axis direction in a predetermined order. The air levitation unit 84A has a support surface having substantially the same shape and size as the air levitation unit 84 described above, and the air levitation unit 84B has the same length in the Y axis direction as the air levitation unit 84A, and is in the X axis direction. Has a length of about 1/3 of the supporting surface.

  The air levitation units 84A and 84B are both configured similarly to the air levitation unit 84. In the second embodiment, four air levitation units 84A and three air levitation units 84B are used in total, seven in total. A total of seven sets of air levitation units 84A and 84B have a width in the Y-axis direction about 1/2 of the width in the Y-axis direction of the substrate P, and a length in the X-axis direction when the substrate holder PH moves for scanning It is disposed at a predetermined interval in the X-axis direction within a rectangular area of substantially the same length as the range. A total of seven sets of air levitation units 84A and 84B are fixed on the frame 110 fixed to the floor surface F so as not to contact the rack 18 as shown in FIG.

  As shown in FIG. 15, the X position of the center of the exposure area IA and the center of the arrangement area of a total of seven air levitation units 84A and 84B is substantially coincident, and one set (one The air levitation unit 84B is disposed. A pair of air levitation unit 84B and a pair of air levitation units 84A adjacent to the pair of air levitation units 84B are spaced in the X axis direction from the Y interferometer 98Y. The measurement beam is irradiated to the Y moving mirror 94Y. In this case, the Y interferometer 98Y is fixed to the side frame 20 of the body BD positioned on the -Y side of the seven air levitation units 84A and 84B. As the Y interferometer 98Y, a multi-axis interferometer capable of measuring the rolling amount of the fine movement stage 26 is used (see FIG. 16).

  In addition, as shown in FIGS. 14 and 16, the movable portion of the leveling device 78 can be inclined to the Z-slider 68 of the weight cancellation device 28 with a minute stroke about an axis (for example, X and Y axes) in a horizontal plane. Is attached to In the leveling device 78, for example, the upper surface (the upper half of the spherical surface) is fixed to the fine movement stage 26, and the upper surface of the Z slider 68 has a recess that allows rotation (tilting) of the leveling device 78 in the θx and θy directions. It can be formed. Alternatively, conversely, in the leveling device 78, for example, a concave portion in which the lower surface (the lower half of the spherical surface) is fixed to the Z slider 68 and the tilt of the fine movement stage 26 with respect to the leveling device 78 in the θx and θy directions is It may be formed on the stage 26. In any case, the leveling device 78 is supported by the Z-slider 68 from below, and allows the fine movement stage 26 to tilt within a small angle range about an axis (for example, X axis and Y axis) in a horizontal plane.

  In the substrate stage apparatus PSTa according to the second embodiment, the Z-slider 68 doubles as a fixed part of the leveling device 78, no sealing pad is provided, and the weight cancellation device 28 is integrated with the fine movement stage 26. In addition, since the weight cancellation device 28 is integrated with the fine movement stage 26, the connection device 80 (flexure device) or the like for restricting the single movement of the weight cancellation device 28 is not provided. The configuration of the other parts of the substrate stage device PSTa is the same as that of the substrate stage device PST.

  According to the exposure apparatus 200 of the second embodiment configured as described above, the same advantages as those of the exposure apparatus 100 of the first embodiment described above can be obtained, and the -Y side of the substrate holder PH Since the air levitation units 84A and 84B are not mounted on the coarse movement table 32B and fixed to the separately mounted frame 110, the air levitation units 84A and 84B do not block the measurement beam of the Y interferometer 98Y. The Y moving mirror 94Y may be attached to the side surface of the substrate holder PH or the fine adjustment stage 26 via a bracket.

Third Embodiment
Next, a third embodiment will be described based on FIG. 17 and FIG. Here, about the component the same as that of 1st, 2nd embodiment mentioned above, or equivalent, while using the code | symbol of the same or resemblance | analogue, the description is simplified or abbreviate | omitted.

  The substrate stage device PSTb provided in the exposure apparatus according to the third embodiment is shown in a plan view together with a part of the body BD in FIG. 17, and the exposure apparatus according to the third embodiment is shown in FIG. 18. A schematic side view seen from the + X direction is partially omitted. However, in FIG. 18, the coarse movement table 32A (and 32B) is shown in a sectional view as in FIG. 16 described above.

  In substrate stage device PSTb, as shown in FIG. 18, two coarse movement tables 32A and 32B are provided as in the substrate stage device PST according to the first embodiment described above, but on the -Y side The air floating unit is not mounted on the coarse movement table 32B, and the air floating unit on the -Y side of the substrate holder PH is a separately installed frame, as in the substrate stage device PSTa according to the second embodiment described above. It is attached over the entire X-direction movement range of the substrate holder PH at 110 (see FIG. 17). Also in this case, a total of seven sets of air levitation units 84A and 84B arranged in the same manner as in the second embodiment are used as the air levitation units on the -Y side. In addition, a part of the pair of X voice coil motors 54X and a plurality of Z voice coil motors 54Z (in FIG. 18, one of the Z voice coil motors 54Z is shown), the coarse movement table 32B and the fine movement stage 26 And between.

Furthermore, the Y moving mirror 94Y is arranged at a position substantially the same height as the X moving mirrors 94X ₁ and 94X ₂ on the side surface on the -Y side of the substrate holder PH, and -Y of the fine movement stage 26 via the bracket 96A. It is fixed to the side surface. In this case, since the Abbe error does not occur, the Y interferometer 98Y may not necessarily be able to measure the rolling amount.

  Also in this case, the weight cancellation device 28 is integrated with the fine movement stage 26. The configuration of the other parts of the substrate stage device PSTb and the configuration of each part other than the substrate stage device PSTb are the same as those of the first embodiment or the second embodiment described above.

  According to the exposure apparatus of the third embodiment configured as described above, in addition to the same effects as the exposure apparatuses 100 and 200 according to the first and second embodiments described above, the fine movement stage 26 can be obtained. The X voice coil motor 54X and the Z voice coil motor 54Z to be driven can be dispersedly attached to both coarse movement tables 32A and 32B in a well-balanced manner, and motor arrangement with higher rigidity than in the second embodiment becomes possible. (See Figure 18).

  In the third embodiment, the two coarse movement tables 32A and 32B are provided. However, the present invention is not limited to this. As shown in FIG. 19, the coarse movement tables 32A and 32B may be integrated. The coarse movement table 32 may be provided, and the coarse movement table 32 may be slidably mounted on the two X beams 30A and 30B.

  In the first to third embodiments and the modification of FIG. 19, the air floating unit on at least one side of the substrate holder PH in the Y-axis direction is mounted on the coarse movement table 32A or 32, and the X-axis direction is obtained. However, the present invention is not limited to this, and another moving body that moves following the coarse movement table is provided, and the air floating unit is mounted on the other moving body, and is movable in the X axis direction. It is good also as composition. For example, in the first embodiment described above, another moving body is provided which moves along the movement path on the + Y side of the movement path of the coarse movement table 32A and / or on the -Y side of the movement path of the coarse movement table 32B; The air floating unit may be mounted on the other movable body via, for example, an inverted L-shaped support member in the state of being close to the substrate holder PH in the Y-axis direction.

Fourth Embodiment
Next, a fourth embodiment will be described based on FIG. 20 and FIG. Here, about the component the same as that of the 1st, 2nd and 3rd embodiment mentioned above, or equivalent, while using the code which is the same or similar, the explanation is simplified or omitted.

  FIG. 20 is a plan view showing a substrate stage device PSTc provided in the exposure apparatus according to the fourth embodiment together with a part of the body, and FIG. 21 shows the exposure apparatus according to the fourth embodiment. A schematic side view as viewed from the +20 direction of 20 is partially omitted.

  In substrate stage device PSTc, as shown in FIG. 21, an integrated coarse movement table 32 is slidably mounted on two X beams 30A and 30B as in FIG. 19, but the coarse movement table The air levitation unit is not mounted on the 32. In FIG. 21, the coarse movement table 32 is shown in cross section. The air floating unit on the -Y side and + Y side of the substrate holder PH is a frame installed on the floor surface F so as not to contact the gantry 18 like the air floating unit on the -Y side in the second and third embodiments. It is fixed to each of 110A and 110B. In addition, as shown in FIG. 20, each of the air floating units on the −Y side and the + Y side of the substrate holder PH has a width in the Y axis direction about half the width of the substrate P in the Y axis direction, the X axis The length of the direction is arranged within a rectangular area of substantially the same length as the movement range when the substrate holder PH moves for scanning at a predetermined interval in the X-axis direction with a slight gap in the Y-axis direction. ing. In this case, a total of seven sets of air levitation units 84A and 84B arranged in the same manner as the second and third embodiments are used as the air levitation units on the -Y side. On the other hand, as the air floating unit on the + Y side, as shown in FIG. 20, four sets (eight in total) of air floating units 84D arranged with a predetermined gap in the X-axis direction in the above rectangular area. Is used. The air levitation unit 84D is configured in the same manner as the air levitation unit 84 described above. The width in the Y axis direction is equal to that of the air levitation unit 84, but the length in the X axis direction is somewhat longer than that of the air levitation unit 84.

  On the frame 110A to which the four sets of air floating units 84D on the + Y side are fixed, a plurality (three in FIG. 20) of the aforementioned substrate Y step-feed devices 88 are provided at predetermined intervals in the X-axis direction. . Here, even when the substrate P is at any position (position in the Y-axis direction) in the movable region, the back surface of the substrate P can be attracted by the movable portion 88 a and sent in the Y-axis direction. A plurality of substrate Y step feeding devices 88 are provided. Each substrate Y step feeding device 88 is disposed in the gap between the air floating units 84D adjacent in the X-axis direction. The upper surface of the movable portion 88a of each substrate Y step feeding device 88 can adsorb the substrate P floating on the air floating unit 84D and move it in the Y-axis direction, and the adsorption is released and separated from the substrate P It can be done.

  The configuration of the other parts of the substrate stage device PSTc and the configuration of each part other than the substrate stage device PSTc are the same as those of the first, second or third embodiment described above.

  According to the exposure apparatus of the fourth embodiment configured as described above, the same effects as those of the exposure apparatuses of the above-described embodiments can be obtained, and not only the −Y side of the substrate holder PH but also + Y Since the air floating unit 84D located on the side and the substrate Y step feeding device 88 are separated from the coarse movement table 32 and fixed on the frame 110A, the load on the coarse movement table 32 is reduced and the coarse movement is performed. The thrust for driving the table 32 can be reduced.

Fifth Embodiment
Next, a fifth embodiment will be described based on FIG. 22 to FIG. Here, with regard to the same or equivalent constituent parts as those in the first, second, third or fourth embodiment described above, the same or similar reference numerals are used, and the description thereof will be simplified or omitted.

  FIG. 22 schematically shows the configuration of an exposure apparatus 500 according to the fifth embodiment, and FIG. 23 shows a plan view in which the exposure apparatus 500 is partially omitted. In FIG. 24, a schematic side view of the exposure apparatus 500 as viewed in the + X direction of FIG. 22 is partially omitted. In FIG. 24, the coarse movement table 32 is shown in cross section.

The exposure apparatus 500 according to the fifth embodiment is basically configured the same as the exposure apparatus according to the fourth embodiment described above, but the substrate stage device PSTd is the same as that of the fourth embodiment. This is partly different from the substrate stage device PSTc. Specifically, substrate stage device PSTd differs from substrate stage device PSTc in the mounting position of fine movement stage 26 of the pair of X movable mirrors 94X ₁ and 94X ₂ in correspondence with the structure of the X interferometer. Etc. are different from the substrate stage device PSTc. Hereinafter, an exposure apparatus 500 according to the fifth embodiment will be described focusing on differences.

As can be seen from FIG. 22, FIG. 23, and FIG. 24, the pair of X moving mirrors 94X ₁ and 94X ₂ are X axis directions of both side surfaces in the Y axis direction of fine movement stage 26 via moving mirror supporting parts not shown. It is attached near the center. Corresponding to the pair of X movable mirror _94X 1, _{94X 2,} a pair of X interferometer _98x 1 facing, 98x ₂ are provided on each of the pair of X movable mirror _94X 1, _{94X 2.} As shown in FIG. 24, each of the pair of X interferometers 98 X ₁ and 98 X ₂ is an L-shaped frame (X interferometer in which one end (lower end) thereof is fixed to the gantry 18 on the −X side. Frames) are individually fixed to the other ends (upper ends) of the frames 102A and 102B. As the frames 102A and 102B, L-shaped ones are used to avoid interference with the above-described frames 110A and 110B and the coarse movement table 32 moving in the X-axis direction.

Further, the pair of X moving mirrors 94X ₁ and 94X ₂ is at a position lower than the upper surface (surface) of the substrate P on the + X side than the −X side end surface of the substrate holder PH, specifically, slightly lower than the lower surface of the substrate holder PH. It is located at a low position. The pair of X interferometers 98X ₁ and 98X ₂ are positioned lower than the upper surface of the substrate P and opposed to the pair of X moving mirrors 94X ₁ and 94X ₂ with respect to the substrate holder PH and the air floating unit 84D or 84A in the Y axis direction. It is placed at a position that fits in the gap with. Thus, in the substrate stage apparatus PSTd according to the fifth embodiment, the X interferometers 98 X ₁ and 98 X ₂ are X interferometers (pair X The interferometers 98X ₁ , 98X ₂ ) can be arranged closer to the gantry 18 on the −X side than the X interferometer 98X according to the fourth embodiment (and the first to third embodiments) It becomes.

Furthermore, the substrate stage device Pstd, as shown in FIG. 23, + a X movable mirror 94X ₁ of Y side, the fine motion stage 26 so that the Y voice coil motors 54Y that finely drives the Y-axis direction, do not interfere, A pair of Y voice coil motors 54Y are attached at positions near the center (center) of fine movement stage 26 in the X-axis direction. However, not limited thereto, as long as the the X movable mirror 94X ₁ and Y voice coil motors 54Y can be prevented from interfering with each other, a pair of Y voice coil motors 54Y may be anywhere mounting. Although not shown, for example, both side surfaces in the X-axis direction of fine movement stage 26 may be used. In this case, the positions of the pair of Y voice coil motors 54Y are preferably arranged such that the resultant force of the driving force acts on the center of gravity of fine movement stage 26, that is, the center of gravity of fine movement stage 26 can be driven. .

According to the exposure apparatus 500 of the fifth embodiment configured as described above, the same effects as those of the exposure apparatus of the fourth embodiment described above can be obtained, and a pair of X interferometers 98X ₁ , 98X ₂ can be disposed closer to the gantry 18 on the −X side than the X interferometer 98X according to the fourth embodiment (and the first to third embodiments), the frame 102A, The total weight of 102 B is lighter than the weight of interferometer column 102, which has the advantage of increased stiffness.

Sixth Embodiment
Next, a sixth embodiment will be described based on FIG. 25 to FIG. Here, with regard to the same or equivalent constituent parts as those of the first, second, third, fourth or fifth embodiments described above, the same or similar reference numerals are used, and the description thereof will be simplified or omitted.

  A partially omitted plan view of the exposure apparatus according to the sixth embodiment is shown in FIG. Further, in FIG. 26, an XZ sectional view of the exposure apparatus according to the sixth embodiment is partially omitted.

  The exposure apparatus according to the sixth embodiment is basically configured the same as the exposure apparatus according to the fifth embodiment described above, but the substrate stage device PSTe according to the fifth embodiment. Partly different from substrate stage device PSTd.

  Specifically, in substrate stage apparatus PSTe, as shown in FIG. 25, not only the size in the Y-axis direction but also the size in the X-axis direction of substrate holder PH is greater than the size of substrate P in the X-axis direction. For example, about one half of the substrate P is used. A pair of air levitation units (moving air levitation units) 84C are disposed on both sides of the substrate holder PH in the X axis direction. As shown in FIG. 26, each of the pair of air levitation units 84C has a rough movement table 32 via the support member 112 such that the upper surface thereof has a height substantially equal to (slightly lower than) the substrate holder PH. It is fixed to the upper surface. Each of the pair of air floating units 84C has, for example, a length in the Y-axis direction equal to (or slightly shorter than the substrate holder PH), and a length in the X-axis direction substantially equal to the substrate holder PH Or rather short.

In the substrate stage apparatus PSTe, as shown in FIGS. 25 and 26, the pair of X movable mirrors 94X ₁ and 94X ₂ are not shown movable mirror supports near both ends in the Y axis direction of the −X side of the substrate holder PH. It is fixed via a member. The configuration of the other parts of the substrate stage device PSTe is the same as that of the substrate stage device PSTd according to the fourth embodiment. In this case, the pair of X interferometers 98X ₁ and 98X ₂ do not interfere with the fixed air levitation unit (84A, 84B) and the air levitation unit 84C on the coarse movement table 32, as in the fifth embodiment. In this arrangement, the pair of X movable mirrors 94X ₁ and 94X ₂ can be approached.

As in the fifth embodiment, the pair of X interferometers 98X ₁ and 98X ₂ may be attached near the center in the X-axis direction on both side surfaces of the substrate holder PH. In such a case, the X interferometers 98X ₁ and 98X ₂ can be arranged more on the + X side. Further, the pair of X moving mirrors 94X ₁ and 94X ₂ may be attached to the fine movement stage 26 instead of the substrate holder PH via the X moving mirror support frame.

  Next, a series of operations when processing a substrate in the exposure apparatus according to the sixth embodiment will be described based on FIGS. Here, the case where the shot areas SA1 and SA2 (or the shot areas SA3 and SA4) of the first embodiment described above are first exposed will be described. In FIGS. 26 to 29, illustration of a fixed air floating unit and the like is omitted. In the sixth embodiment, the coarse movement table 32, the weight cancellation device 28, the fine movement stage 26, the substrate holder PH, and the like are integrated with the substrate P (holding a part of the substrate P) X Although a movable body moving in the axial direction is configured, this movable body is hereinafter referred to as a substrate stage (26, 28, 32, PH).

  First, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and substrate transfer device (not shown) transfers substrate stage device PSTe. The substrate P is carried into the upper side. During exposure before the previous layer on the substrate P, as shown in FIG. 25 as an example, a plurality, for example, two in the X-axis direction and two in the Y-axis direction, together with a total of four shot areas SA1 to SA4 A plurality of alignment marks (not shown) transferred simultaneously with the pattern of each shot area are provided for each shot area.

  First, the substrate P is mounted across the substrate holder PH, a part of the plurality of fixed air floating units 84D on the + Y side, and the air floating unit 84C on the + X side. At this time, high pressure air is jetted from the upper surfaces of the substrate holder PH, the air floating unit 84D and the air floating unit 84C, and the substrate P is supported floating. Then, the substrate holder PH is switched from the exhaust to the intake (suction) by the main control device 50. As a result, a part of the substrate P (about 1⁄4 of the entire substrate P corresponding to the rectangular area including the shot area SA1) is attracted and fixed by the substrate holder PH, a part of the plurality of air floating units 84D and the air floating unit Part of the substrate P (about 3/4 of the rest of the entire substrate P) is floated and supported by 84C. Then, the alignment operation is performed by the same method as that of the first embodiment described above (see FIG. 26).

  Subsequently, as shown by white arrows in FIG. 26, the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) are synchronously moved in the −X direction. Thus, as in the first embodiment described above, the first shot area SA1 of the substrate P adsorbed by the substrate holder PH is scan-exposed. FIG. 27 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA1 is completed.

  Next, main controller 50 sucks the back surface of substrate P using movable portion 88a (not shown in FIG. 27, see FIG. 25) of substrate Y step feeding device 88 located at a position facing substrate P at that time. After releasing the suction of the substrate P by the substrate holder PH, the substrate P is lifted by the exhaust of high pressure air from the substrate holder PH and the subsequent exhaust of high pressure air by the air floating unit 84C on the + X side. Thus, the substrate P is held by only the movable portion 88 a of the substrate Y step feeding device 88.

  Next, main controller 50 keeps the substrate stage (26, 28, 32, PH) white in FIG. 27 while maintaining the holding state of substrate P by only movable portion 88a of substrate Y step feeding device 88. The X step of the substrate P, which is driven in the + X direction, is started as indicated by the hollow arrow. Accordingly, the substrate holder PH moves in the + X direction with respect to the substrate P while the substrate P is stopped at the position before the start of the X step. Then, when the substrate holder PH reaches immediately below the next shot area SA2 of the substrate P, main controller 50 stops the substrate stage (26, 28, 32, PH) (see FIG. 28). At this time, the substrate P is placed across the substrate holder PH, a part of the plurality of fixed air floating units 84D on the + Y side, and the air floating unit 84C on the −X side. High-pressure air is jetted from the substrate holder PH, a part of the plurality of air floating units 84D, and the upper surface of the air floating unit 84C, and the substrate P is supported floating.

  In parallel with the drive of the substrate stage (26, 28, 32, PH) for the X step of the substrate P described above, main controller 50 returns mask stage MST to a predetermined acceleration start position.

  Thereafter, suction of the substrate P by the substrate holder PH, release of suction of the substrate P by the movable portion 88a of the substrate Y step-feed device 88, alignment measurement using a new alignment mark on the substrate P, and substrate by the fine movement stage 26. The positioning of P is performed. Thereafter, the substrate stage (26, 28, 32, PH) and the mask stage MST are synchronized and moved in the −X direction as indicated by the outlined arrows in FIG. Scan exposure is performed. FIG. 29 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA2 is completed.

  Thereafter, similarly to the exposure apparatus 100 according to the first embodiment described above, the Y step operation of the substrate P is performed by the substrate Y step feeding device 88, alignment by alignment is performed, and scan exposure is repeatedly performed.

  As described above, according to the exposure apparatus of the sixth embodiment, the same effects as those of the exposure apparatus 500 of the fifth embodiment can be obtained. In addition to this, according to the exposure apparatus of the sixth embodiment, the substrate holder PH is made to have the same size as one shot area (collective exposure area), and the other areas are floated and supported by the air floating unit. Since the substrate holder PH mounted on the fine adjustment stage 26 is smaller and lighter than those of the first to fifth embodiments, it is possible to reduce the size of the substrate holder PH. In addition, since the substrate stage (26, 28, 32, PH) only scans one shot area, the stroke in the X-axis direction of the substrate stage (26, 28, 32, PH) is the above first to fifth It is shorter (about 1/2) than the embodiment of. Therefore, it is possible to further reduce the size and weight of the substrate stage device, and hence the exposure apparatus including the substrate stage device, as well as reduce the cost.

  In the above description, after the first shot area was scan-exposed, the substrate stage (26, 28, 32, PH) was moved in the + X direction for exposure of the next shot area, leaving the substrate P. (See FIGS. 27 and 28), with the substrate stage (26, 28, 32, PH) left, only the substrate is moved in the -X direction by the substrate X step feeding device (not shown), and then the substrate 26, 28, 32, and may be exposed by scanning in the + X direction by PH). The substrate X step feeding device may double as a loading and unloading device for the substrate P.

  In the above description, in the second to sixth embodiments, the air levitation unit separated from the coarse movement stage is fixed to the floor through the frame, but when there is little risk of generating vibration, May be fixed to the gantry 18.

  The substrate stage apparatus and the exposure apparatus according to the first to sixth embodiments described in detail above are summarized as follows. The substrate stage device does not make the substrate holder that adsorbs the substrate and corrects the plane the same size as the substrate like the conventional device, but has the same width (size in the Y-axis direction) as the exposure field by the projection optical system. The length in the scan direction (X-axis direction) is equal to the length of the substrate in the X-axis direction or the same as the scan length of the collective exposure area exposed in one scan operation. The portion of the substrate protruding from the substrate holder is floated and supported by a moving or fixed air floating unit. As a result, the substrate holder is compact and lightweight, and high precision (high flatness) can be easily achieved, and the controllability (positional speed controllability and the like) of the fine movement stage is improved, and high precision and high speed can be achieved. Also, since the coarse movement table is a table (stage) that moves only in one axial direction (X-axis direction) with respect to the exposure field (irradiation area (exposure position) of illumination light IL), the coarse movement stage unit is simple. It becomes a structure and the reduction of cost is attained.

  In addition, since the substrate Y is moved only in the Y direction by the substrate Y step feeding device, the moving mass is light because the step movement of the substrate in the Y direction is performed. In addition, since the Y step positioning of the substrate is performed with rough accuracy, the cost of the substrate Y step feeding apparatus is low. Since the coarse movement stage unit with a simple configuration is separated from the fine movement stage, components that include moving parts with rough accuracy and that have rough accuracy (coarse movement stage unit and substrate Y step feed device, etc.) It can be made using general industrial materials without using a lightweight, high-rigidity ceramic member. Therefore, a large firing furnace required to increase the size of a lightweight, high-rigidity ceramic member and a large grinding machine required to process it with high accuracy are unnecessary. Further, the component including the movable portion with rough accuracy can be formed using a ball or roller rolling guide or the like without using either a highly accurate guide or a highly rigid static pressure gas bearing. In addition, the component including the movable portion with rough accuracy does not use a high thrust and low ripple coreless linear motor (voice coil motor) or the like, which is required when performing high accuracy positioning at high speed, It is possible to use one that is relatively inexpensive and easy to increase in size, such as a linear motor, a ball screw drive, or a belt drive.

  Furthermore, vibration transfer to the fine movement stage can be suppressed by separately arranging the fine movement stage and the coarse movement stage part.

  The positioning after the step movement in the X and Y directions is performed by detecting the alignment mark provided on the substrate in advance by the alignment detection system and moving the fine movement stage based on the detection result. The positioning accuracy at the time of exposure is also high.

Seventh Embodiment
Next, a seventh embodiment will be described based on FIG. 30 to FIG. Here, with respect to the same or equivalent component parts as those of the first to sixth embodiments described above, the same or similar reference numerals are used, and the description thereof will be simplified or omitted.

  The configuration of the exposure apparatus 700 according to the seventh embodiment is schematically shown in FIG. 30 with the air floating unit group and the like described later omitted, and FIG. 31 is a partial view of the exposure apparatus 700. A plan view is shown. FIG. 31 corresponds to a plan view of a portion below the projection optical system PL in FIG. 30 (a portion below the lens barrel surface plate). Further, FIG. 32 shows a side view (partially omitted, a partially sectional view) of the exposure apparatus 700 as viewed in the + X direction of FIG. Further, FIG. 33 is a block diagram showing an input / output relationship of a main control apparatus 50 which centrally configures a control system of the exposure apparatus 700 and performs overall control of each component. In FIG. 33, constituent portions related to the substrate stage system are shown. Main controller 50 includes a work station (or a microcomputer) and the like, and generally controls each component of exposure apparatus 700.

  The exposure apparatus 700 according to the seventh embodiment is different from the first embodiment in that a substrate stage device PSTf is provided instead of the substrate stage device PST described above, but the other parts are different. The configuration and the like of this embodiment are the same as those of the first embodiment described above.

  Among the substrate stage devices PST, PSTa, PSTb, PSTc, PSTd and PSTe described above, the configuration of the substrate stage device PSTf is the substrate stage device PSTd provided in the exposure apparatus 500 according to the fifth embodiment described above. Closest to the configuration. Therefore, in the following, the substrate stage device PSTf provided in the exposure apparatus 700 according to the seventh embodiment will be described focusing on differences from the substrate stage device PSTd.

  As can be seen by comparing FIG. 23 with FIG. 31, the substrate stage device PSTf has the size of the substrate holder PH (fine movement stage 26), the arrangement of air levitation unit groups arranged on both sides in the Y axis direction of the substrate holder PH The configuration is different from the substrate stage device PSTd in that one substrate X step-feed device 91 is disposed in the arrangement region of the air floating unit groups on both sides in the Y-axis direction. Further, as can be seen by comparing FIG. 24 with FIG. 32, the width in the Y-axis direction of the pair of X beams 30A and 30B of the substrate stage device PSTf is narrower than the width of the pair of X beams of the substrate stage device PSTd. (About half).

  As shown in FIG. 32, only one X linear guide 36 extending in the X axis direction is fixed at the center in the Y axis direction on the upper surface of each of the X beams 30A and 30B. In the seventh embodiment, the X linear guide 36 has a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the X-axis direction, and doubles as an X stator. In addition to the X linear guide 36, an X stator having a magnet unit may be provided. Further, a plurality of, for example, two X linear guides may be provided on the X beams 30A and 30B.

  As shown in FIG. 32, the coarse movement table 32 is disposed on the X beams 30A and 30B in the same manner as the substrate stage device PSTd described above. The coarse movement table 32 is formed of a rectangular plate-like member in a plan view, in which an opening penetrating in the Z-axis direction is formed at the center. In FIG. 32, the coarse movement table 32 is partially shown in cross section together with the weight cancellation device 28. On the lower surface of the coarse movement table 32, as shown in FIG. 32, a total of eight sliders 44 are provided at predetermined intervals in the X-axis direction with respect to each X linear guide 36, for example, four (see FIG. 30) It is fixed. The coarse movement table 32 is linearly guided in the X axis direction by a plurality of X linear guide devices including an X linear guide 36 and a slider 44.

  Further, in this case, each slider 44 includes a coil unit, and the coarse movement table 32 is driven with a predetermined stroke in the X-axis direction together with the X stator described above by a total of eight coil units included in each slider 44 An X linear motor 42 (see FIG. 33) is configured.

  Note that an X mover may be provided separately from the slider 44. In this case, the slider 44 includes rolling elements (for example, a plurality of balls etc.) and can slide relative to each X linear guide 36 It may be engaged.

  Although not shown in FIGS. 30 to 32, an X scale having the X axis direction as the periodic direction is fixed to one of the predetermined ones of the X beams 30A and 30B, for example, the X beam 30A. The encoder head which comprises the X linear encoder system 46 (refer FIG. 33) which calculates | requires the positional information regarding the X-axis direction of the coarse motion table 32 using X scale is being fixed. The position of coarse movement table 32 in the X-axis direction is controlled by main controller 50 (see FIG. 33) based on the output of the encoder head.

  Here, although the description will be made before and after, the substrate holder PH mounted on the upper surface of the fine adjustment stage 26 will be described. The substrate holder PH has a length in the X-axis direction equal to that of the substrate P, and a width (length) in the Y-axis direction is about 1/3 of that of the substrate P, as can be seen from FIG. The substrate holder PH adsorbs and holds a part of the substrate P (here, about 1/3 part of the substrate P in the Y-axis direction) by, for example, vacuum adsorption (or electrostatic adsorption), and also a pressurized gas (for example, High-pressure air can be blown upward to support a portion (about 1/3 of the substrate P) of the substrate P from below in a noncontact (floating) manner by the jetting pressure. The switching between the ejection and high-pressure adsorption of high pressure air to the substrate P by the substrate holder PH is performed via a holder suction and discharge switching device 51 (see FIG. 33) for switching and connecting the substrate holder PH to a vacuum pump and high pressure air source (not shown). Is performed by the main controller 50.

  Also in the seventh embodiment, fine movement stage 26 includes a plurality of voice coil motors (or linear motors), for example, a pair of X voice coil motors 54X, a pair of Y voice coil motors 54Y, and four Z voice coil motors 54Z. The fine movement stage drive system 52 (see FIG. 33) configured in the same manner as the first embodiment described above includes six degrees of freedom (X-axis, Y-axis, Z-axis, θx, It is finely driven in each direction of θy and θz). Also in the seventh embodiment, the fine movement stage 26 is a projection optical system by the X linear motor 42 described above and the pair of X voice coil motors 54 X and Y voice coil motors 54 Y of the fine movement stage drive system 52. With respect to the system PL (see FIG. 30), movement is possible (coarse movement) with a long stroke in the X-axis direction, and micro movement (fine movement) is possible in three X DO, Y axis and θz directions.

  As shown in FIG. 32, on the + Y side of the X beam 30A and on the −Y side of the X beam 30B, the width (length) in the Y-axis direction is larger than that of the frame of the fifth embodiment described above Each of the pair of frames 110 </ b> A and 110 </ b> B is installed on the floor surface F so as not to contact the gantry 18. Air floating unit groups 84E and 84F are installed on the upper surfaces of the pair of frames 110A and 110B. The pair of frames 110 </ b> A and 110 </ b> B may be installed on the gantry 18.

  The air floating unit groups 84E and 84F are disposed on both sides of the substrate holder PH in the Y-axis direction, as shown in FIGS. As shown in FIG. 31, each of the air levitation unit groups 84E and 84F has a width in the Y-axis direction equal to a width in the Y-axis direction of the substrate P, and a length in the X-axis direction scanned by the substrate holder PH. A plurality of air floating units distributed at predetermined intervals in the X-axis direction with a slight gap in the Y-axis direction within a rectangular area of substantially the same length as the movement range when moved There is. The X positions of the center of the exposure area IA and the centers of the air floating unit groups 84E and 84F substantially coincide with each other. The upper surface of each air floating unit is set to be equal to or somewhat lower than the upper surface of the substrate holder PH.

  The air levitation units that respectively configure the air levitation unit groups 84E and 84F are configured similarly to the air levitation unit 84 according to the first embodiment described above, although the sizes are different. The on / off of the supply of high pressure air to each air floating unit is controlled by main controller 50 shown in FIG.

  As is clear from the above description, in the seventh embodiment, the entire substrate P is floated by the substrate holder PH and at least one of the air floating unit groups 84E and 84F on both sides (± Y side) of the substrate holder PH. It can be supported. Also, the entire substrate P can be floated and supported by the air floating unit group 84E or 84F on one side (+ Y side or −Y side) of the substrate holder PH.

  In the air floating unit groups 84E and 84F, the width in the Y-axis direction is equal to the width in the Y-axis direction of the substrate P, and the length in the X-axis direction is scan movement of the substrate holder PH. A single large air floating unit may be replaced as long as it has a total supporting area approximately equal to the rectangular area of approximately the same length as the movement range, or the size of each air floating unit may be Differently from the case of FIG. 31, they may be distributed in the rectangular area.

  A plurality of, for example, a plurality of, for example, as shown in FIG. 31, are provided in two rectangular areas on both sides of the substrate holder PH in the Y-axis direction, in which a plurality of air floating units constituting each of the air floating unit groups 84E and 84F are arranged. Three substrate Y step feeding devices 88 and one substrate X step feeding device 91 are arranged asymmetrically with respect to the X axis passing through the center of exposure area IA (the center of projection optical system PL). Each of the substrate Y step feeding device 88 and the substrate X step feeding device 91 is disposed within the two rectangular regions without interfering with the air floating unit. Here, the number of substrate Y step feeding devices 88 may be two or four or more.

  The substrate Y step feeding device 88 is a device for holding (for example, adsorbing) the substrate P and moving it in the Y-axis direction, and in plan view, inside each of the air levitation unit groups 84E and 88F in the X-axis direction. Three are arranged at predetermined intervals. Each substrate Y step feeding device 88 is fixed on a frame 110A or 110B via a support member 89 (see FIG. 32). Each substrate Y step feeding device 88 includes a movable portion 88a that sucks the back surface of the substrate P and moves in the Y axis direction, and a fixed portion 88b fixed to the frame 110A or 110B. The movable portion 88a is, for example, a drive device 90 (not shown in FIG. 32, see FIG. 33) constituted by a linear motor comprising a mover provided on the movable portion 88a and a stator provided on the fixed portion 88b. , In the Y-axis direction with respect to the frame 110A or 110B. The substrate Y step feeding device 88 is provided with a position reading device 92 (not shown in FIG. 32, see FIG. 33) such as an encoder for measuring the position of the movable portion 88a.

  The moving stroke of the movable portion 88a of each substrate Y step feeder 88 in the Y-axis direction is about 2/3 (somewhat short) of the length of the substrate P in the Y-axis direction. Also in the seventh embodiment, the movable portion 88a (substrate suction surface) of each substrate Y step-feed device 88 needs to suck the back surface of the substrate P or separate it from the substrate P by releasing the suction. Therefore, the driving device 90 is configured to be able to finely drive also in the Z-axis direction. Actually, the movable portion 88a sucks the substrate P and moves in the Y-axis direction. However, in the following, the substrate Y step-feed device 88 and the movable portion 88a and the Y-axis direction are required unless distinction is particularly required. Use without distinction.

  The substrate X step feeding device 91 is a device for holding (for example, adsorbing) the substrate P and moving it in the X-axis direction, and one each is disposed inside the air floating unit groups 84E and 84F in plan view. . Each board | substrate X step-feed apparatus 91 is being fixed via the supporting member 93 on frame 110A or 110B, respectively (refer FIG. 32).

  As shown in FIG. 32, each substrate X step-feed device 91 includes a movable portion 91a that sucks the back surface of the substrate P and moves in the X-axis direction, and a fixed portion 91b fixed to the frame 110A or 110B. ing. The movable portion 91a is driven in the X-axis direction with respect to the frame 110A or 110B by a drive device 95 (not shown in FIG. 32, refer to FIG. 33) configured by, for example, a linear motor. The substrate X step feeding device 91 is provided with a position reading device 97 (not shown in FIG. 32, see FIG. 33) such as an encoder for measuring the position of the movable portion 91a. The driving device 95 is not limited to a linear motor, and may be constituted by a driving mechanism using a rotation motor using a ball screw or a belt as a driving source.

  The moving stroke of the movable portion 91 a of each substrate X step feeding device 91 in the X-axis direction is, for example, about twice the length of the substrate P in the X-axis direction. The end portion on the + X side of each fixing portion 91b protrudes from the air floating unit groups 84E and 84F by a predetermined length on the + X side.

  In addition, the movable portion 91a (substrate suction surface) of each substrate X step feeding device 91 needs to suck the back surface of the substrate P or release the suction to separate it from the substrate P. It can be driven slightly in the axial direction. Actually, the movable part 91a sucks the substrate P and moves in the X-axis direction. However, in the following, the substrate X step-feed device 91 and the movable part 91a are used except when distinction is particularly required. Use without distinction.

  In the above description, the movable portions of the substrate Y step feeding device 88 and the substrate X step feeding device 91 are also movable in the Z axis direction because it is necessary to separate and contact the substrate P. However, the present invention is not limited to this, and the substrate holder PH (fine movement stage 26) that holds a part of the back surface of the substrate P by suction for the suction of the substrate P by the movable portion (substrate suction surface) and separation from the substrate P. May move in the Z-axis direction.

  The weight cancellation device 28 supports the fine movement stage 26 from below via the leveling device 78. The weight cancellation device 28 is disposed in the opening of the coarse movement table 32, the upper half of which is exposed above the coarse movement table 32, and the lower half of which is exposed below the coarse movement table 32. .

  As shown in FIG. 32, the weight cancellation device 28 has a housing 64, an air spring 66, a Z-slider 68, etc., and is configured, for example, in the same manner as the second and subsequent embodiments described above. . That is, in the substrate stage device PSTf according to the seventh embodiment, the Z-slider 68 doubles as a fixing portion of the leveling device 78, no sealing pad is provided, and the weight cancellation device 28 is integrated with the fine movement stage 26. ing. In addition, since the weight cancellation device 28 is integrated with the fine movement stage 26, the connection device 80 (flexure device) or the like for restricting the single movement of the weight cancellation device 28 is not provided. Fine movement stage 26 is freely tiltable on Z slider 68 by a leveling device 78 having a spherical bearing schematically shown by a spherical member in FIG. 32 or a pseudo spherical bearing structure (θx and θy with respect to the XY plane) It is supported in the direction).

  The weight cancellation device 28 and the upper components (such as the fine movement stage 26 and the substrate holder PH) supported by the weight cancellation device 28 via the leveling device 78 are moved by the coarse motion table 32 by the action of the pair of X voice coil motors 54X. And move in the X-axis direction integrally with it. That is, the upper component (fine movement stage 26 and substrate holder PH, etc.) is supported by weight cancellation device 28 by main controller 50 using a pair of X voice coil motors 54X and is synchronously driven (coarse movement) to coarse movement table 32. By being driven at the same speed in the same direction as the moving table 32, it moves with the coarse moving table 32 in the X-axis direction with a predetermined stroke. The upper component (fine movement stage 26, substrate holder PH, etc.) is controlled by main controller 50 via a pair of X voice coil motors 54X, a pair of Y voice coil motors 54Y, and four Z voice coil motors 54Z. The coarse movement table 32 is slightly driven in the direction of six degrees of freedom.

  In the seventh embodiment, a movable body integrally movable with the substrate P in the X-axis direction (hereinafter referred to as a substrate as appropriate) including the coarse movement table 32, the weight cancellation device 28, the fine movement stage 26, and the substrate holder PH. Stages (26, 28, 32, PH) are configured.

As shown in FIGS. 30 and 31, near the X-axis direction center of both side surfaces of fine movement stage 26 in the Y-axis direction, reflection surfaces orthogonal to the X-axis are provided via movable mirror support parts (not shown). A pair of X moving mirrors 94X ₁ , 94X ₂ consisting of plane mirrors (or corner cubes) are mounted as in the fifth embodiment described above. As shown in FIG. 32, on the side surface on the -Y side of fine movement stage 26, Y moving mirror 94Y formed of a long flat mirror having a reflecting surface orthogonal to the Y axis via a mirror holding part (not shown). Is fixed.

In the seventh embodiment, positional information of the fine movement stage 26 (substrate holder PH) in the XY plane is, for example, 0.5 by the substrate stage interferometer system 98 (see FIG. 33) as in the above-described embodiments. It is always detected at a resolution of about 1 nm. In practice, as shown in FIGS. 31 and 33, substrate stage interferometer system 98 is a pair of X laser interferometers (hereinafter referred to as X interferometers) corresponding to a pair of X movable mirrors 94X ₁ and 94X _2. abbreviated _as) 98x 1, 98x _2, and a pair of Y laser interferometer corresponding to Y movable mirror 94Y (hereinafter, abbreviated as Y _{interferometer)} and a 98Y 1, 98Y _2. The measurement results of X interferometers 98X ₁ and 98X ₂ and Y interferometers 98Y ₁ and 98Y ₂ are supplied to main controller 50 (see FIG. 33).

As shown in FIG. 32, each of the pair of X interferometers 98X ₁ and 98X ₂ has an L shape as viewed from the + X direction in which one end (lower end) of each is fixed to the gantry 18 on the −X side. Are fixed separately to the other end (upper end) of the frame (X interferometer frame) 102A, 102B. Here, since L-shaped ones are used as the frames 102A and 102B, the interference between the frames 102A and 102B and the above-mentioned frames 110A and 110B and the coarse movement table 32 moving in the X-axis direction is avoided. be able to.

Further, the pair of X interferometers 98X ₁ and 98X ₂ face the pair of X moving mirrors 94X ₁ and 94X ₂ and at a position lower than the upper surface of the substrate P, the substrate holder PH and the air floating unit group in the Y axis direction. It is arrange | positioned in the position which fits in a clearance gap with 84E or 84F. Thus, in the substrate stage apparatus PSTf according to the present embodiment, the pair of X interferometers 98X ₁ and 98X ₂ are on the −X side as compared to the case where they are installed outside the movement range of the substrate holder PH in the X axis direction. It is possible to arrange at a position near the gantry 18.

Also, as shown in FIG. 30, as a predetermined _{one of} the X interferometers 98X ₁ and 98X ₂ , for example, the X interferometer 98 X ₂ , two interferometer beams (measurement beams) separated in the Z-axis direction multi-axis interferometer which irradiates the X movable mirror 94X ₂ are used. The reason will be described later.

The X interferometer is not limited to the pair of X interferometers 98X ₁ and 98X ₂ that individually irradiates the interferometer beams (measurement beams) to the pair of X movable mirrors 94X ₁ and 94X ₂ , but a pair of X interferometers. It is also possible to use a multi-axis interferometer which emits a plurality of measurement beams including at least one measurement beam respectively irradiated to the movable mirrors 94X ₁ and 94X ₂ .

A pair of Y interferometer 98Y _1, 98Y _2, as shown in FIG. 31, the first and the air floating unit columns in the column closest to the substrate holder PH constituting the air floating unit group 84F, the adjacent thereto Arranged at a position opposite to the two gaps between adjacent air levitation units located near the center of the first row of air levitation unit rows with the two rows of air levitation unit rows. It is done. The two gaps are symmetrical with respect to the Y axis passing through the center of the exposure area IA. A pair of Y interferometer _98Y 1, 98Y _2, as shown in FIG. 32, to face the Y moving mirror 94Y on the upper surface of the installed support members 104 'on the upper surface of the aforementioned frame 110B, and air floating unit It is fixed separately (without contact) with the air floating unit constituting the group 84F. In this embodiment, a pair of Y interferometer 98Y _1, 98Y _2, through respective gaps at two positions described above, measurement beams (measurement beams) is adapted to be irradiated on Y movable mirror 94Y. When a support member for supporting the Y interferometers 98Y ₁ and 98Y ₂ is attached to the frame 110B, the frame 110B is integrated with the projection optical system PL in order to set the measurement standard of the Y interferometer to the projection optical system PL. It is preferable to install it on the rack 18. Alternatively, the support member 104 ′ for supporting the Y interferometers 98Y ₁ and 98Y ₂ may be fixed directly to the gantry 18 instead of the frame 110B installed on the floor surface.

As Y interferometers, not only a pair of Y interferometers 98Y ₁ and 98Y ₂ that individually irradiates interferometer beams (measurement beams) to Y moving mirror 94 Y, but also two measuring beams are irradiated to Y moving mirror 94 Y Multi-axis interferometers can also be used.

In the present embodiment, the X interferometers 98X ₁ and 98X ₂ are focused on the surface of the substrate P in the Z-axis direction (in the case of exposure, the surface of the substrate P coincides with the image plane of the projection optical system PL). The position measurement result of the X position includes an Abbe error due to a change in the attitude (pitching) of the fine movement stage 26 during movement in the X-axis direction because it is at a lower position than when leveling control is performed. The main controller 50 detects the pitching amount of the fine movement stage 26 by X interferometer 98x ₂ consisting of multi-axis interferometer described above, based on the detection result, the measurement of the X-position by X interferometer _98x 1, 98x ₂ The Abbe error included in the result is corrected. That is, since the correction of such Abbe errors, as the X interferometer 98x _2, irradiates two interferometer beams spaced in the Z-axis direction (measurement beam) to the X movable mirror 94X _2, i.e. the pitching amount of the fine movement stage 26 A detectable multi-axis interferometer is used.

  The configuration of the other parts of the substrate stage device PSTf is similar to that of the substrate stage device PSTd. Moreover, each component other than a substrate stage apparatus is the same as that of each above-mentioned embodiment (refer FIGS. 30-33).

  Next, a series of operations for substrate processing performed by the exposure apparatus 700 according to the seventh embodiment configured as described above will be described. Here, as an example, the case where the second and subsequent layers are exposed to the substrate P will be described based on FIG. 34 to FIG. The exposure area IA shown in FIGS. 34 to 49 is an illumination area to which the illumination light IL is applied through the projection optical system PL at the time of exposure, and is not actually formed other than at the time of exposure However, in order to clarify the positional relationship between the substrate P and the projection optical system PL, it is always shown.

  First, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and substrate transfer device (not shown) transfers substrate stage device PSTf. Loading of the substrate P to the top (loading) is performed. At the time of exposure before the previous layer on the substrate P, as shown in FIG. 31 as an example, a plurality of, for example, two in the X-axis direction and three in the Y-axis direction, with a total of six shot areas SA1 to SA6 A plurality of alignment marks (not shown) transferred simultaneously with the pattern of each shot area are provided for each shot area.

  As shown in FIG. 34, main controller 50 levitates and supports substrate P carried in by the substrate carrying device above air floating unit group 84F on the −Y side using air levitation unit group 84F, The substrate X step feeding device 91 on the -Y side is held by suction and transported in the -X direction as shown by the solid arrow in FIG.

  Next, main controller 50 adsorbs and holds substrate P supported by levitation by air levitation unit group 84F using substrate Y step feeding device 88 on the + X side on the −Y side, and substrate X with respect to that substrate P. The suction by the step feeding device 91 is released. Then, using the substrate Y step-feed device 88, main controller 50 transports substrate P in the + Y direction, as shown by the dotted arrow in FIG.

  As a result, as shown in FIG. 35, the substrate P is placed across the substrate holder PH and part of the air floating unit group 84F on the −Y side of the substrate holder PH. At this time, the substrate P is floated and supported by the substrate holder PH and part of the air floating unit group 84F. Then, the substrate holder PH is switched from the exhaust to the suction by the main control device 50. As a result, a part (about 1/3 of the whole substrate P) of the substrate P is adsorbed and fixed by the substrate holder PH, and a part of the substrate P (about the remaining 2 parts of the whole substrate P) by a part of the air floating unit group 84F. / 3) will be in a state of being floated and supported. At this time, the substrate P includes the substrate holder PH and the air levitation unit group 84F so that at least two alignment marks on the substrate P fall within the field of view of one of the alignment detection systems and on the substrate holder PH. Is placed across a part of the

  Immediately after the start of the suction operation of the substrate P by the substrate holder PH, the main controller 50 cancels the suction of the substrate P by the substrate Y step feed device 88, and the substrate Y step feed device 88 (movable portion 88a) It is returned to the standby position which is the movement limit position on the -Y side shown in FIG. At this time, the substrate X step feeding device 91 (movable portion 91a) is also returned by the main control device 50 to the standby position which is the movement limit position on the -X side shown in FIG.

  Thereafter, the position of fine movement stage 26 (substrate holder PH) relative to projection optical system PL and the approximate position of substrate P relative to fine movement stage 26 are determined by main controller 50 using the same method of alignment measurement as in the prior art. The alignment measurement of the substrate P with respect to the fine movement stage 26 may be omitted.

Then, main controller 50 drives fine movement stage 26 via coarse movement table 32 based on the above measurement results to place at least two alignment marks on substrate P within the field of view of one of the alignment detection systems. The movement is performed, alignment measurement of the substrate P with respect to the projection optical system PL is performed, and a scan start position for exposure of the shot area SA1 on the substrate P is obtained based on the result. Here, since the scan for exposure includes an acceleration section and a deceleration section before and after the constant velocity movement section at the time of scan exposure, the scan start position is, strictly speaking, the acceleration start position. Then, main controller 50 drives coarse movement table 32 and finely drives fine movement stage 26 to position substrate P at the scan start position (acceleration start position). At this time, precise fine positioning drive is performed on the coarse movement table 32 of the fine movement stage 26 (substrate holder PH) in the X-axis, Y-axis and θz directions (or in the direction of six degrees of freedom). FIG. 36 shows the state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P in this manner.
Thereafter, a step-and-scan exposure operation is performed.

In the step-and-scan exposure operation, a plurality of shot areas SA1 to SA6 on the substrate P are sequentially exposed. During the scan operation (X scan operation), the substrate P is accelerated in the X-axis direction for a predetermined acceleration time, and then driven at a constant speed for a predetermined time (exposure (scan exposure) is performed during this constant speed drive) It is decelerated by the same time as the acceleration time. In addition, the substrate is appropriately driven in the X-axis or Y-axis direction (hereinafter referred to as an X-step operation and a Y-step operation, respectively) at the time of step operation (at the time of movement between shot areas). In the present embodiment, the maximum exposure width (width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4, 5, 6) is about 1/3 of the substrate P.
Specifically, the exposure operation is performed as follows.

  From the state of FIG. 36, the substrate stage (26, 28, 32, PH) is driven in the −X direction as shown by the outlined arrow in FIG. 36, and the X scan operation of the substrate P is performed. At this time, mask M (mask stage MST) is driven in the −X direction in synchronization with substrate P (fine movement stage 26), and shot area SA1 is a projection area of the pattern of mask M by projection optical system PL. Since the light passes through the exposure area IA, scanning exposure for the shot area SA1 is performed at that time. The scanning exposure is performed by irradiating the substrate P with the illumination light IL through the mask M and the projection optical system PL during the constant velocity movement of the fine movement stage 26 (substrate holder PH) in the −X direction after acceleration. .

  During the above-described X scan operation, main controller 50 adsorbs and fixes a part of substrate P (about 1/3 of the entire substrate P) to substrate holder PH mounted on fine movement stage 26, and on air levitation unit group 84F. The substrate stage (26, 28, 32, PH) is driven in a state in which a part of the substrate P (about 2/3 of the entire substrate P) is floated and supported. At this time, main controller 50 drives coarse movement table 32 in the X-axis direction via X linear motor 42 based on the measurement result of X linear encoder system 46, and substrate stage interferometer system 98, Z tilt Based on the measurement result of measurement system 76, fine movement stage drive system 52 (each voice coil motor 54X, 54Y, 54Z) is driven. Thereby, the substrate P is moved integrally with the coarse movement table 32 in the X-axis direction by the operation of the pair of X voice coil motors 54 X in a state where the substrate P is integrally supported by the weight cancellation device 28 together with the fine movement stage 26. At the same time, the relative movement from the coarse movement table 32 precisely controls the position in the X-axis, Y-axis, Z-axis, θx, θy, and θz directions (6 degrees of freedom). Further, main controller 50 synchronizes with fine movement stage 26 (substrate holder PH) during the X scan operation, and based on the measurement result of mask interferometer system 14, holds mask MST that holds mask M along the X axis. The scanning drive is performed in the direction, and the micro driving is performed in the Y-axis direction and the θz direction. FIG. 37 shows a state in which the scanning exposure on the shot area SA1 is completed and the substrate stage (26, 28, 32, PH) holding a part of the substrate P is stopped.

  Next, in preparation for acceleration for the next exposure, main controller 50 performs the X step operation of substrate P to drive substrate P slightly in the + X direction as shown by the outlined arrow in FIG. Do. The main control unit 50 drives the substrate stage (26, 28, 32, PH) in the same state as the X scan operation (however, the positional deviation during movement is as strict as the scan operation). Do not restrict) In parallel with the X step operation of substrate P, main controller 50 returns mask stage MST to the acceleration start position.

  Then, after the X step operation, main controller 50 starts acceleration in the -X direction of substrate P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST), Similarly, scan exposure is performed on the shot area SA2. FIG. 38 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the scan exposure for the shot area SA2 is completed.

  Next, a Y step operation is performed to move the unexposed area of the substrate P onto the substrate holder PH. The Y step operation of the substrate P is performed by the main controller 50 at the −Y side and the most −X side of the substrate Y step feed device 88 (movable portion 88 a) in the state shown in FIG. After the substrate holder PH is released from adsorption, the substrate P is lifted by the exhaust of high pressure air from the substrate holder PH and the subsequent exhaust of high pressure air by the air floating unit group 84F. Then, as shown by a dotted arrow in FIG. 38, the substrate P is transported by the substrate Y step-feed device 88 in the + Y direction. Thereby, only the substrate P moves in the + Y direction with respect to the substrate holder PH, and as shown in FIG. 39, the unexposed shot areas SA3 and SA4 of the substrate P face the substrate holder PH, and the substrate holder PH And a part of the air floating unit group 84E and a part of the air floating unit group 84F. At this time, the substrate P is floated and supported by the substrate holder PH, a part of the air floating unit group 84E, and a part of the air floating unit group 84F. Then, the substrate holder PH is switched from the exhaust to the intake (suction) by the main control device 50. As a result, a part (about 1/3 of the whole of the substrate P) of the substrate P is adsorbed and fixed by the substrate holder PH, and one part of the substrate P is formed by a part of the air floating unit group 84E and a part of the air floating unit group 84F. The portion (about 2/3 of the rest of the entire substrate P) is floated and supported. Immediately after the start of the suction operation of the substrate P by the substrate holder PH, the main controller 50 cancels the suction of the substrate P by the substrate Y step-feed device 88.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area provided in advance on the substrate P is performed. At the time of this alignment measurement, the X step operation of the substrate P described above is performed as needed so that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 40).

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 based on the result, the X axis, Y axis and θz directions (or the Precise micro positioning drive with 6 degrees of freedom) is performed.

  Next, the main controller 50 starts acceleration in the + X direction of the substrate P and the mask M (see outlined arrows in FIG. 41), and scan exposure is performed on the shot area SA3 as described above. FIG. 41 shows a state in which the scanning exposure on the shot area SA3 is completed and the substrate stage (26, 28, 32, PH) is stopped.

  Next, main controller 50 prepares for acceleration for the next exposure and accelerates X step operation of substrate P and mask stage MST to drive substrate stage (26, 28, 32, PH) in the -X direction. After the return operation to the start position is performed, acceleration in the + X direction of the substrate P and the mask M (see outlined arrows in FIG. 42) is started, and scan exposure is performed on the shot area SA4 as described above. To be done. FIG. 42 shows a state in which the substrate stage (26, 28, 32, PH) has stopped after the scan exposure for the shot area SA4 is completed.

  Next, a Y step operation is performed to move the unexposed area of the substrate P onto the substrate holder PH. During Y step operation of the substrate P, the main controller 50 sucks the back surface of the substrate P in the state shown in FIG. 42 by the substrate Y step feed device 88 (movable portion 88a) on the -Y side and + X side most. A state in which the substrate P is floated by the evacuation of high pressure air from the substrate holder PH and the subsequent evacuation of high pressure air by the air floating unit groups 84E and 84F after holding and releasing adsorption of the substrate holder PH to the substrate P Then, as shown by the solid arrows in FIG. 42, the substrate P is transported by the substrate Y step-feed device 88 in the + Y direction. Thereby, only the substrate P moves in the Y-axis direction with respect to the substrate holder PH (see FIG. 43). At this time, if the stroke of the substrate Y step-feed device 88 on the -Y side is short, the main control unit 50 takes over the feed of the substrate P using the substrate Y step-feed device 88 on the + Y side. Good (see Figure 44). In preparation for this handover, main controller 50 may drive substrate Y step feeding device 88 (movable portion 88 a) on the + Y side in advance in the −Y direction and make it stand by in the vicinity of substrate holder PH ( See Figure 43).

  A portion (about 1/3 of the entire substrate P) of the substrate P which has been driven in the + Y direction by the substrate Y step-feed device 88 and the unexposed shot areas SA5 and SA6 have moved onto the substrate holder PH is the substrate holder It is fixed to the substrate holder PH again by suction by PH, and a part (about 2/3 of the rest of the whole substrate P) is floated and supported by a part of the air floating unit group 84E. Immediately after the start of the suction operation of the substrate P by the substrate holder PH, the main controller 50 cancels the suction of the substrate P by the substrate Y step-feed device 88. Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area provided in advance on the substrate P is performed. In the alignment measurement, the X step operation of the substrate P described above is performed as needed so that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 45) .

  Just before the new alignment measurement of the substrate P described above is started, a new substrate P is loaded into the air floating unit group 84F on the -Y side by the substrate loading device (not shown) (see FIG. 45). At this time, the movable portion 91a of the substrate X step-feed device 91 on the -Y side moves to a position near the movement limit position on the + X side, that is, a position below the newly introduced substrate P and stands by at that position. doing. In addition, the movable portion 88a of the substrate Y step-feed device 88 closest to the -X side on the -Y side is moved by the main control unit 50 to the movement limit position on the -Y side as shown by the solid arrow in FIG. It has been moved.

  On the other hand, when a new alignment measurement of the substrate P with respect to the projection optical system PL is completed for the substrate P whose part is fixed (held) to the substrate holder PH, the main controller 50 based on the result. The fine positioning drive is performed precisely on the coarse movement table 32 of the fine movement stage 26 in the X-axis, Y-axis and θz directions (or in the direction of six degrees of freedom). Then, in accordance with the same procedure as in the case of the first shot areas SA1 and SA2 described above, the main control apparatus 50 performs exposure on the last two shot areas SA5 and SA6. FIG. 46 shows the state immediately after the exposure for the last shot area SA6 is completed.

  In parallel with the exposure to the shot areas SA5 and SA6, the newly introduced substrate P is held by suction by the substrate X step-feed device 91 on the -Y side by the main controller 50 and transported to the -X side (See Figure 46).

  On the other hand, the substrate P on which exposure for all the shot areas SA1 to SA6 has been completed is white by the main controller 50 using the substrate Y step-feed device 88 on the + Y side and the most −X side. The substrate is transported to the + Y side as indicated by the removal arrow, completely retracted from above the substrate holder PH, and carried onto the air floating unit group 84E. Almost simultaneously with this, the newly introduced substrate P is shown by a solid arrow in FIG. 47 by using the substrate Y step-feed device 88 on the −Y side and the most −X side by the main controller 50. Thus, the wafer is transported to the + Y side, and the shot areas SA1 and SA2 are positioned on the substrate holder PH (see FIG. 47).

  The exposed substrate P carried onto the air floating unit group 84E is, as shown by the solid arrow in FIG. 48, by the main controller 50 using the substrate X step-feed device 91 on the + Y side, + X. It is transported in the direction, and is unloaded in the + X direction by the substrate unloading device (not shown) (see FIGS. 48 and 49).

  In parallel to the unloading of the exposed substrate P, the same alignment operation as described above is performed on the substrate P on the substrate holder PH, and then acceleration of the substrate P and the mask M in the + X direction is performed. The scan exposure is performed on the first shot area SA2 in the same manner as described above (see FIGS. 48 and 49). Thereafter, in the same procedure as in the exposure of the first substrate P described above, operations such as alignment (X step, Y step), exposure, etc. for the remaining shot areas on the second substrate P, and Operations such as alignment (X step, Y step) and exposure to the third and subsequent substrates are repeated.

  However, as can be understood from the above description that the exposure to the shot area SA2 is first performed for the second substrate P, in this embodiment, the first (odd-numbered) substrates P and 2 are used. The exposure order of the shot areas is different in the substrate P of the first (even) sheet. For the first (odd-numbered) substrate P, the exposure order is the shot areas SA1, SA2, SA3, SA4, SA5 and SA6, whereas for the second (even-numbered) substrate P, the exposure order is Is in the order of the shot areas SA2, SA1, SA4, SA3, SA6 and SA5. However, the order of exposure is not limited to this.

  As described above, the exposure apparatus 700 according to the seventh embodiment can obtain the same effects as those of the exposure apparatus 100 according to the first embodiment described above. In addition to this, according to the exposure apparatus 700 according to the seventh embodiment, the substrate holder PH mounted on the fine movement stage 26 is a part of the surface on the opposite side to the exposed surface (surface to be processed) of the substrate P Hold. That is, the substrate holding surface of the substrate holder PH is smaller than the substrate P, and specifically, is set to about 1/3. Therefore, when the substrate Y step-feed device 88 unloads the substrate P from the fine adjustment stage 26 (substrate holder PH) based on an instruction from the main controller 50, the substrate P is displaced in the Y axis direction in the XY plane. The substrate Y step-feed device 88 carries a distance smaller than the size (width or length) of the substrate P in the Y-axis direction, that is, about 1/7 of the size of the substrate P in the Y-axis. The unloading of the substrate P is completed only by displacing the substrate P in the Y-axis direction by the same distance as the width of the substrate holder PH which is 3 in the Y-axis direction (see, for example, FIGS. 46 and 47). As described above, in the present embodiment, since the moving distance (unloading distance) of the substrate at the time of unloading of the substrate P is smaller than the size of the substrate, the unloading time of the substrate can be shortened as compared with the related art. .

  Further, according to the exposure apparatus 700 according to the seventh embodiment, the Y-axis is located at the position in the X-axis direction where the fine movement stage 26 (substrate holder PH) is located when the scan exposure for the final shot area on the substrate P is completed. The exposed substrate P is slid to one side of the direction and carried out (retracted) from on the substrate holder PH, and the substrate P before exposure is slid from the other side in the Y-axis direction in parallel (almost simultaneously) with this. It is possible to carry in (put in) the substrate holder PH (see FIGS. 46 and 47).

  In addition, when the substrate P before exposure is carried into the fine movement stage 26 (substrate holder PH), the substrate Y step-feed device 88 based on the instruction of the main controller 50 so that the substrate P is displaced in the Y-axis direction. The substrate Y step-feed device 88 is transported by a distance smaller than the size (width or length) of the substrate P in the Y-axis direction, ie, the width of the substrate holder PH in the Y-axis direction. The loading of the substrate P is completed only by displacing the substrate P in the Y-axis direction by the same distance as (about 1/3 of the size of the substrate P in the Y-axis direction). Therefore, in addition to the unloading time of the substrate, the loading time of the substrate can be shortened as compared with the conventional one, and as a result, the replacement time of the substrate can be shortened.

  Further, main controller 50 slides the substrate P from the substrate holder PH to the one side in the Y-axis direction at the position of the shot area on the substrate P and the position of the substrate holder PH in the X-axis direction according to the exposure order. Carrying out and slide carrying of the substrate P onto the substrate holder PH from the other side in the Y-axis direction are performed. Therefore, as in the conventional substrate exchange, the substrate holder PH does not have to move to a determined substrate exchange position (for example, a position near the movement limit position in the + X direction). Thereby, substrate exchange time can be further shortened.

  Here, the description in the above embodiment illustrates the case where the carrying out direction of the exposed substrate P from the substrate holder PH is the + Y direction for any substrate, but the arrangement of the shot area on the substrate and the exposure Depending on the order, at least one of the even-numbered substrate and the odd-numbered substrate can naturally be taken out of the substrate holder PH in the −Y direction. That is, in the present embodiment, the main controller 50 sets the position of the shot area on the substrate P and the position of the substrate holder PH in the X-axis direction according to the order of exposure so as to minimize the replacement time of the substrate. The substrate P is unloaded in the direction (+ Y direction or -Y direction) according to the arrangement of the shot area on P and the order of exposure. Therefore, regardless of the arrangement of the shot areas (processed areas) on the substrate and the order of the processes, the substrate exchange time can be shortened as compared with the case of carrying out in the same direction at a constant X position.

  The size in the Y-axis direction of the support surfaces of the air floating unit groups 84E and 84F on both sides in the Y-axis direction of the substrate holder PH is not limited to the size in the Y-axis direction of the substrate P, and may be larger than that. It may be slightly smaller.

  In addition, the size of the substrate holding surface of the substrate holder PH in the Y-axis direction is not limited to 1/3 of the size of the substrate P in the Y-axis direction, and may be 1/2, 1/4, etc. The size of the substrate holding surface of the substrate holder PH in the Y-axis direction may be smaller than the size of the substrate P in the Y-axis direction to a certain extent or more. In practice, the size is set to be equal to (slightly larger than) the size of the shot area formed on the substrate P.

Eighth Embodiment
Next, an eighth embodiment will be described based on FIG. 50 to FIG. Here, with respect to the same or equivalent component parts as those of the first to seventh embodiments described above, the same or similar reference numerals are used, and the description thereof will be simplified or omitted.

  FIG. 50 schematically shows the arrangement of an exposure apparatus 800 according to the eighth embodiment, omitting the air floating unit groups 84E and 84F. Further, FIG. 51 shows a plan view in which the exposure apparatus 800 is partially omitted. FIG. 51 corresponds to a plan view of a portion below the projection optical system PL in FIG. 50 (a portion below the barrel surface plate 16).

  The exposure apparatus 800 according to the eighth embodiment is basically configured the same as the exposure apparatus 700 according to the seventh embodiment described above, but the substrate stage apparatus PSTg is the seventh embodiment. This is partly different from the substrate stage device PSTf according to the present invention.

  Specifically, in substrate stage device PSTg, as shown in FIG. 51, not only the size in the Y-axis direction but also the size in the X-axis direction of substrate holder PH is greater than the size of substrate P in the X-axis direction. A small size (for example, about 1/2 of the substrate P) is used. The size of the substrate holder PH in the Y-axis direction is about 1/2 of the size of the substrate P in the Y-axis direction. A pair of air levitation units (moving air levitation units) 84G independent of the substrate holder PH and the fine movement stage 26 is disposed on both sides of the substrate holder PH in the X-axis direction. As shown in FIG. 50, each of the pair of air levitation units 84G has the coarse movement table 32 via the support member 112 such that the upper surface thereof has a height substantially equal to (slightly lower than) the substrate holder PH. It is fixed to the upper surface. Each of the pair of air levitation units 84G has, for example, a length in the Y-axis direction equal to (or slightly shorter than the substrate holder PH), and a length in the X-axis direction is, for example, about 1 of the substrate holder PH. It is / 2.

  Further, as shown in FIG. 51, a pair of moving substrate Y step-feed devices 120 is disposed between the substrate holder PH and each of the pair of air floating units 84G. Each of the pair of moving substrate Y step feeding devices 120 is configured in the same manner as the above-mentioned substrate Y step feeding device 88, and is mounted on the coarse movement table 32, as shown in FIG. The movable portion 120 a of each movable substrate Y step feeding device 120 is movable relative to the fixed portion 120 b fixed on the coarse movement table 32 in the Y axis direction. Therefore, each movable substrate Y step feeding device 120 can move in the X axis direction together with the coarse movement table 32, and can transport only the substrate P in the Y axis direction.

In addition, three substrate Y step feeding devices 88 similar to the seventh embodiment are provided in the arrangement regions of the pair of air floating unit groups 84E and 84F arranged on both sides of the substrate holder PH in the Y axis direction. , One substrate X step feeding device 91 is arranged. However, as shown in FIG. 51, in the eighth embodiment, three substrate Y step-feed devices 88 and one substrate X step-feed device 91 in each of the arrangement areas of the air floating unit groups 84E and 84F. Are arranged symmetrically with respect to the X axis passing through the center of the exposure area IA. In addition, the arrangement position of the pair of Y interferometers 98Y ₁ and 98Y ₂ is shifted to the + Y side as compared with the seventh embodiment described above, because of such a symmetrical arrangement.

  Further, as the X beams 30A and 30B, those having a width in the Y-axis direction somewhat wider than that of the X beams 30A and 30B of the seventh embodiment are used. Two X linear guides 36 are fixed on the upper surface of the X beams 30A and 30B, for example, as in the substrate stage device PST described above, and the X stator 38 is interposed between the two X linear guides 36. It is fixed. A plurality of sliders 44 engaged with the respective two X linear guides 36 are fixed to the lower surface of the coarse movement table 32. On the lower surface of the coarse movement table 32, an X mover (not shown) that constitutes an X linear motor together with the X stator 38 is fixed.

The configuration of the other parts of the substrate stage device PSTg is the same as that of the substrate stage device PSTf according to the seventh embodiment. In this case, a pair of X interferometer _98x 1, 98x _2, the air floating unit group 84E fixed, 84F, and without interfering with any of the air floating unit 84G on coarse table 32, a pair of X movable mirror 94X It is arranged to be able to approach ₁ and 94X ₂ .

  The configuration of the other parts of the substrate stage device PSTg is the same as that of the substrate stage device PSTf according to the seventh embodiment. Therefore, also in substrate stage device PSTg, a movable body integrally moving with substrate P in the X-axis direction is configured, including coarse movement table 32, weight cancellation device 28, fine movement stage 26, substrate holder PH and the like. . Also in the eighth embodiment, this movable body is hereinafter referred to as a substrate stage (26, 28, 32, PH) as appropriate.

  Next, a series of operations for substrate processing performed by the exposure apparatus 800 according to the eighth embodiment will be described. Here, the case where the second and subsequent layers are exposed to the substrate P as an example will be described based on FIG. 52 to FIG. Incidentally, the exposure area IA shown in FIGS. 52 to 65 is an illumination area where the illumination light IL is irradiated through the projection optical system PL at the time of exposure, and is not actually formed other than at the time of exposure However, in order to clarify the positional relationship between the substrate P and the projection optical system PL, it is always shown.

  First, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and substrate transfer device (not shown) transfers substrate stage device PSTg. The substrate P is carried into the upper side. During exposure before the previous layer on the substrate P, as shown in FIG. 51 as an example, a plurality, for example, two in the X-axis direction and two in the Y-axis direction, together with a total of four shot areas SA1 to SA4 A plurality of alignment marks (not shown) transferred simultaneously with the pattern of each shot area are provided for each shot area.

  First, according to the same procedure as the first substrate P in the seventh embodiment described above, the substrate P is, as shown in FIG. 52, an air floating unit group on the substrate holder PH and the −Y side of the substrate holder PH. It is placed over a part of the 84F. At this time, the substrate P is floated and supported by the substrate holder PH, a part of the air floating unit group 84F, and the air floating unit 84G on the + X side. Then, the substrate holder PH is switched from the exhaust to the intake (suction) by the main control device 50. As a result, a part of the substrate P (about 1⁄4 of the entire substrate P corresponding to the rectangular area including the shot area SA1) is attracted and fixed by the substrate holder PH, and a part of the air floating unit group 84F and the air floating unit 84G As a result, a part of the substrate P (about 3⁄4 of the entire substrate P) is floated and supported. At this time, the substrate P is placed on the substrate holder PH and the air so that at least two alignment marks on the substrate P come within the field of view of any one of the alignment detection systems (not shown) and on the substrate holder PH. It is mounted straddling a part of the floating unit group 84F and the air floating unit 84G.

  Immediately after the start of the suction operation of the substrate P by the substrate holder PH, the main controller 50 cancels the suction of the substrate P by the substrate Y step-feed device 88. At this time, the substrate Y step feeding device 88 (movable portion 88a) and the substrate X step feeding device 91 (movable portion 91a) are respectively at the standby position which is the movement limit position on the -Y side by the main control device 50, -X. It is returned to the standby position which is the movement limit position on the side.

  Thereafter, the position of fine movement stage 26 relative to projection optical system PL and the approximate position of substrate P relative to fine movement stage 26 are determined by main controller 50 by the same method of alignment measurement as in the prior art. The alignment measurement of the substrate P with respect to the fine movement stage 26 may be omitted.

Then, main controller 50 drives fine movement stage 26 via coarse movement table 32 based on the above measurement results to place at least two alignment marks on substrate P within the field of view of one of the alignment detection systems. The substrate P is moved, alignment measurement of the substrate P with respect to the projection optical system PL is performed, and a scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P is obtained based on the result. Then, main controller 50 drives coarse movement table 32 and finely drives fine movement stage 26 to position substrate P at the scan start position (acceleration start position). At this time, precise fine positioning drive is performed on the coarse movement table 32 of the fine movement stage 26 in the X-axis, Y-axis and θz directions (or in the direction of six degrees of freedom). FIG. 52 shows the state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P in this manner.
Thereafter, a step-and-scan exposure operation is performed.

  In the step-and-scan exposure operation, a plurality of shot areas SA1 to SA4 on the substrate P are sequentially exposed. Also in the eighth embodiment, the aforementioned X scan operation of the substrate P is performed during the scan operation, and the X step operation or the Y step operation of the substrate P is performed during the step operation (when moving between shot areas). It will be. Here, in the eighth embodiment, the Y step operation of the substrate P is the same as that of the seventh embodiment, but the X step operation of the substrate P is different from the seventh embodiment as described later. In the eighth embodiment, the maximum exposure width (the width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4) is about half that of the substrate P.

Specifically, the exposure operation is performed as follows.
From the state of FIG. 52, the substrate stage (26, 28, 32, PH) is driven in the −X direction as shown by the outlined arrow in FIG. 52, and the X scan operation of the substrate P is performed. At this time, the mask M (mask stage MST) is driven in the −X direction in synchronization with the substrate P (fine movement stage 26), and the exposure is a projection area of the pattern of the mask M by the projection optical system PL. Since it passes through the area IA, at this time, the scanning exposure for the shot area SA1 is performed. The scanning exposure is performed by irradiating the substrate P with the illumination light IL through the mask M and the projection optical system PL during the constant velocity movement of the fine movement stage 26 (substrate holder PH) in the −X direction after acceleration. .

  During the above-described X scan operation, main controller 50 causes substrate holder PH on fine movement stage 26 to adsorb and fix a portion of substrate P (about 1⁄4 of the entire substrate P), and a portion of air levitation unit group 84F. The substrate stage (26, 28, 32, PH) is driven in a state where a part of the substrate P (about 3⁄4 of the entire substrate P) is float-supported by the air floating unit 84G on the + X side. At this time, main controller 50 drives coarse movement table 32 in the X-axis direction and drives fine movement stage drive system 52 in the same manner as described above. Thereby, the substrate P is moved integrally with the coarse movement table 32 in the X-axis direction by the operation of the pair of X voice coil motors 54 X in a state where the substrate P is integrally supported by the weight cancellation device 28 together with the fine movement stage 26. At the same time, the relative movement from the coarse movement table 32 precisely controls the position in the X-axis, Y-axis, Z-axis, θx, θy, and θz directions (6 degrees of freedom). Further, main controller 50 scans and drives mask stage MST holding mask M in the X-axis direction (in the Y-axis direction and in the θz direction) in synchronization with fine movement stage 26 (substrate holder PH) during the X scan operation. Micro drive). FIG. 53 shows a state where the scanning exposure on the shot area SA1 is completed and the substrate stage (26, 28, 32, PH) is stopped.

  Next, an X step operation is performed to move the next shot area SA2 of the substrate P onto the substrate holder PH. In this X step operation of the substrate P, the main controller 50 sucks and holds the back surface of the substrate P in the state shown in FIG. 53 by the substrate X step feeding device 91 (movable portion 91a) on the -Y side. After releasing the adsorption of PH, the substrate P is lifted by the exhaust of high pressure air from the substrate holder PH and the exhaust of high pressure air by the air levitation unit group 84F and the air levitation unit 84G on the + X side. As a result, the substrate P is held by only the substrate X step-feed device 91 (movable portion 91a).

  Next, main controller 50 indicates the substrate stage (26, 28, 32, PH) with a white arrow in FIG. 53 while maintaining the holding state of substrate P by only substrate X step feeding device 91. Thus, the X step of the substrate P is started to drive in the + X direction. Accordingly, the substrate holder PH moves in the + X direction with respect to the substrate P while the substrate P is stopped at the position before the start of the X step. Then, when the substrate holder PH reaches immediately below the next shot area SA2 of the substrate P, main controller 50 stops the substrate stage (26, 28, 32, PH) (see FIG. 54). At this time, the substrate P is placed across the substrate holder PH, a part of the air floating unit group 84F, and the air floating unit 84G on the −X side. High-pressure air is ejected from the upper surface of the substrate holder PH, the air floating unit group 84F, and the air floating unit 84G, and the substrate P is supported floating.

  In parallel with the drive of the substrate stage (26, 28, 32, PH) for the X step of the substrate P described above, main controller 50 returns mask stage MST to a predetermined acceleration start position.

  Thereafter, suction of the substrate P by the substrate holder PH and release of suction of the substrate P by the substrate X step-feed device 91, alignment measurement using a new alignment mark on the substrate P, positioning of the substrate P by the fine movement stage 26 , (See open arrow in FIG. 54). Thereafter, the substrate stage (26, 28, 32, PH) and the mask stage MST are synchronized and moved in the −X direction as shown by the outlined arrows in FIG. Scan exposure is performed. FIG. 56 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA2 is completed.

  Next, a Y step operation is performed to move the next shot area SA3 of the substrate P onto the substrate holder PH. The Y step operation of the substrate P is performed as follows. That is, main controller 50 adsorbs and holds the back surface of substrate P in the state shown in FIG. 56 by moving substrate Y step feeding device 120 (movable portion 120 a) on the −X side, and adsorbs substrate holder PH to substrate P Release Thereafter, main controller 50 lifts substrate P by exhausting high pressure air from substrate holder PH and exhausting high pressure air by air levitation unit group 84F and air levitation unit 84G, as shown in FIG. The substrate P is transported in the + Y direction by the moving substrate Y step-feed device 120 on the −X side as indicated by the dotted white arrow in FIG. Thereby, only the substrate P moves in the + Y direction with respect to the substrate holder PH (see FIG. 57). At this time, when the stroke of the moving substrate Y step feeding device 120 on the −X side is insufficient, the main control device 50 uses the substrate Y step feeding device 88 on the + Y side located closest to the −X side. May be taken over (see the solid arrows in FIG. 58).

  At this time, the substrate P is placed across the substrate holder PH, a part of the air floating unit group 84E, and the air floating unit 84G on the −X side. High-pressure air is jetted from the upper surfaces of the substrate holder PH, the air floating unit group 84E and the air floating unit 84G, and the substrate P is supported floating.

  Thereafter, the suction of the substrate P by the substrate holder PH, the suction release of the substrate P by the moving substrate Y step-feed device 120, the alignment measurement using a new alignment mark on the substrate P, and the positioning of the substrate P by the fine movement stage 26. And (see open arrows in FIG. 57 or 58). Thereafter, the substrate stage (26, 28, 32, PH) and the mask stage MST are synchronized and moved in the + X direction, as shown by the outlined arrows in FIG. 59, for the next shot area SA3. Scan exposure is performed. FIG. 60 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA3 is completed.

  Next, an X step operation is performed to move the next shot area SA4 of the substrate P onto the substrate holder PH. The X step operation of the substrate P is performed as follows.

  That is, after the main controller 50 sucks and holds the back surface of the substrate P in the state shown in FIG. 60 by the substrate X step-feed device 91 (movable part 91a) on the + Y side, and releases the suction of the substrate holder PH. The substrate P is floated by the exhaust of high pressure air from the substrate holder PH and the subsequent exhaust of high pressure air by the air levitation unit group 84E and the air levitation unit 84G on the −X side. As a result, the substrate P is held by only the substrate X step-feed device 91 (movable portion 91a).

  Next, main controller 50 causes the substrate stage (26, 28, 32, PH) to be shown by a white arrow in FIG. 60 while maintaining the holding state of substrate P by only substrate X step feeding device 91. Start the X step driving in the -X direction. Thereby, the substrate holder PH moves with respect to this board | substrate P to-X direction, stopping the board | substrate P in the position before X step start of a substrate stage (26, 28, 32, PH) start. Then, when the substrate holder PH reaches directly below the next shot area SA4 of the substrate P, main controller 50 stops the substrate stage (26, 28, 32, PH) (see FIG. 61). At this time, the substrate P is mounted across the substrate holder PH, a part of the air floating unit group 84E, and the air floating unit 84G on the + X side. High-pressure air is jetted from the upper surfaces of the substrate holder PH, the air floating unit group 84E and the air floating unit 84G, and the substrate P is supported floating.

  In parallel with the step driving of the substrate stage (26, 28, 32, PH) described above, main controller 50 returns mask stage MST to a predetermined acceleration start position.

  Thereafter, suction of the substrate P by the substrate holder PH and release of suction of the substrate P by the substrate X step-feed device 91, alignment measurement using a new alignment mark on the substrate P, positioning of the substrate P by the fine movement stage 26 , (See open arrow in FIG. 61). Thereafter, the substrate stage (26, 28, 32, PH) and the mask stage MST are synchronized and moved in the + X direction, as shown by the outlined arrows in FIG. 62, for the next shot area SA4. Scan exposure is performed. FIG. 63 shows a state in which the substrate stage (26, 28, 32, PH) is stopped after the exposure of the shot area SA4 is completed.

  Prior to the scan exposure of the shot area SA4 on the substrate P described above, the main control unit 50 causes the movable portion 91a of the substrate X step-feed device 91 on the -Y side to prepare for loading of the next substrate. It is driven to a standby position near the movement limit position of H.sub.1 and kept at that position (see the solid arrows in FIG. 62).

  Then, in parallel with the scan exposure of the shot area SA4 on the substrate P described above, the substrate P newly introduced onto the air floating unit group 84F by the substrate loading device (not shown) is moved by the main controller 50 -Y. The substrate X step feeding device 91 (movable part 91a) on the side sucks and holds it, and is transported to the -X side (see the white arrow in FIG. 63).

  On the other hand, using the moving substrate Y step-feed device 120 on the + X side by the main controller 50, the substrate P on which exposure for all the shot areas SA1 to SA4 has been completed is + Y as shown by the dotted arrow in FIG. It is transported to the side, completely retracted from above the substrate holder PH, and transported onto the air floating unit group 84E on the + Y side. At this time, if the stroke of the moving substrate Y step feeding device 120 on the + X side is insufficient, the main control unit 50 takes over the substrate feeding using the substrate Y step feeding device 88 on the + Y side most + X side. You may do it (refer FIG. 64). Almost simultaneously with this, the newly introduced substrate P is shown by a solid arrow in FIG. 64 by using the substrate Y step-feed device 88 on the −Y side and the + X side most by the main controller 50. The shot area SA1 is placed on the substrate holder (see FIG. 64).

  The exposed substrate P carried onto the air floating unit group 84E is carried by the main controller 50 in the + X direction using the substrate X step feeding device 91 on the + Y side, and is carried out by the substrate unloading device (not shown). It is carried out in the + X direction (see FIGS. 64 and 65).

  The alignment operation similar to that described above is performed on the substrate P of which a part is held by the substrate holder PH in parallel with the unloading of the exposed substrate P, and then the substrate P and the mask M are removed. Acceleration in the + X direction is started, and scan exposure for the first shot area SA1 is performed in the same manner as described above (see FIG. 65). Thereafter, in the same procedure as in the exposure of the first substrate P described above, alignment (X step, Y step), exposure, etc. with respect to the remaining shot areas on the second and subsequent substrates P. And operations such as alignment (X step, Y step) and exposure to the third and subsequent substrates are repeated. In this case, both the odd-numbered substrate P and the even-numbered substrate P are exposed in the order of the shot areas SA1, SA2, SA3, and SA4.

  As described above, according to the exposure apparatus 800 of the eighth embodiment, the same advantages as those of the exposure apparatus 700 of the seventh embodiment described above can be obtained, and the substrate holder PH and the substrate holder PH are mounted. The fine movement stage 26 and the weight cancellation device 28 supporting the same can be made lighter and more compact than the first embodiment.

<< Modification >>
In the exposure apparatus of each of the above-described embodiments, a frame-shaped substrate support member may be used which holds the substrate P integrally and can be floated integrally with the substrate P by the air floating unit. As an example, a case where this substrate support member is applied to an exposure apparatus 800 according to the eighth embodiment will be described based on FIG.

  The substrate support member 69 has a rectangular (substantially square) outline in plan view, as shown in FIG. 66, and has a rectangular opening in a plan view rectangular shape penetrating in the Z-axis direction at the central portion. Is a small (thin) frame-like member. The substrate support member 69 has a pair of X frame members 61x, which are flat plate members parallel to the XY plane with the X axis direction as the longitudinal direction, at predetermined intervals in the Y axis direction, and the pair of X frame members 61x Each of the end portions on the + X side and the −X side is connected by a Y frame member 61 y which is a flat plate-like member parallel to the XY plane having the Y axis direction as a longitudinal direction. Each of the pair of X frame members 61x and the pair of Y frame members 61y may be made of, for example, a fiber reinforced synthetic resin material such as GFRP (Glass Fiber Reinforced Plastics), or ceramics, etc. to secure rigidity and reduce weight. It is preferable from the viewpoint of

  On the upper surface of the X frame member 61x on the -Y side, a Y moving mirror 94Y having a reflective surface on the surface on the -Y side is fixed. Further, on the upper surface of the Y frame member 61y on the -X side, an X moving mirror 94X formed of a plane mirror having a reflection surface on the -X side surface is fixed. In this case, it is not necessary to provide an X moving mirror or a Y moving mirror on any of the substrate holder PH and the fine movement stage 26.

Position information (including rotation information in the θz direction) of the substrate support member 69 (ie, the substrate P) in the XY plane is a pair of X interferometers 98X ₁ , 98X that irradiates the measurement surface of the reflection surface of the X moving mirror 94X. ₂ and the above-mentioned substrate stage interferometer system 98 including a pair of Y interferometers 98Y ₁ and 98Y ₂ for irradiating a measurement beam onto the reflection surface of the Y moving mirror 94Y, for example, constantly detected with a resolution of about 0.5 nm Ru.

  Note that the X interferometer and the Y interferometer each have at least one measurement beam within the movable range of the substrate support member 69 so that the corresponding movable mirror is irradiated with the number and / or length measurement beams. The number or spacing of the optical axes is set. Therefore, the number of interferometers (the number of optical axes) is not limited to two, and depending on the movement stroke of the substrate support member, for example, only one (one axis) or three (three axes) or more good.

  The substrate support member 69 has a plurality of, for example, four holding units 65 for holding the end (outer peripheral edge) of the substrate P by vacuum suction from below. The four holding units 65 are separately attached in the X-axis direction, two by two on opposing surfaces of the pair of X frame members 61x facing each other. The number and arrangement of the holding units are not limited to this, and may be appropriately added according to, for example, the size of the substrate, the ease of bending, and the like. Further, the holding unit may be attached to the Y frame member. The holding unit 65 is, for example, a substrate placement member having an L-shaped cross section provided with a suction pad for suctioning the substrate P by vacuum suction on its upper surface, and a parallel for connecting the substrate placement member to the X frame member 61x. The position of the substrate mounting member is constrained by the rigidity of the parallel plate spring with respect to the X frame member 61x and the Y axis direction with respect to the X frame member 61x, and the elasticity of the plate spring It is configured to be displaced (vertical movement) in the Z-axis direction without rotating in the θx direction. The substrate holding frame having the same configuration as the holding unit 65 and the substrate support member 69 provided with the same is disclosed in detail, for example, in US Patent Application Publication No. 2011/0042874.

  In the modified example of FIG. 66, main controller 50 moves movable portion 91a of substrate X step feeding device 91 or substrate Y when X step or Y step operation of substrate P or substrate P is carried in / out substrate stage device PSTg. Either the X frame member 61x or the Y frame member 61y of the substrate support member 69 may be adsorbed or held by the movable portion 88a of the step feeding device 88, or the substrate P may be adsorbed or held.

  In the modified example of FIG. 66, the position of the substrate P can be measured by the substrate stage interferometer system 98 via the X moving mirror 94X and the Y moving mirror 94Y fixed to the substrate support member 69, so this deformation is Even when the exposure of the first layer on the substrate P is performed using the exposure apparatus according to the example, the substrate according to the design value based on the positional information of the substrate P measured by the substrate stage interferometer system 98 It becomes possible to perform positioning to the acceleration start position for exposure of each shot area of P with sufficient accuracy.

  If it is possible to form reflecting surfaces corresponding to the reflecting surfaces of the X moving mirror 94X and the Y moving mirror 94Y on the Y frame member 61y and the X frame member 61x of the substrate support member 69, the X moving mirror 94X is not necessarily required. There is no need to provide the Y movable mirror 94Y. In this case, the weight of the substrate support member 69 can be reduced accordingly.

The substrate support member may be used only at the time of exposure of the first layer to the substrate P, or may be used at the time of exposure of the second and subsequent layers. In the former case, the substrate stage interferometer system 98 needs to measure the position of the fine movement stage 26 at the time of exposure for the second and subsequent layers, so for example, the pair of X moving mirrors 94X ₁ and 94X consisting of the corner cube described above. _2, and a Y movable mirror 94Y formed of an elongated mirror, it is necessary to attach to the position of the same as the eighth embodiment described above. Further, in this case, the substrate stage interferometer system 98 is also used to measure the positional information of the substrate support member 69 (substrate P) in the first exposure and the fine movement stage 26 in the second exposure. However, the present invention is not limited to this, and a substrate interferometer system for measuring the position of the substrate support member 69 (substrate P) may be provided separately from the substrate stage interferometer system 98.

  In addition, as a board | substrate support member, you may use not only a frame-shaped member but the board | substrate support member of a shape where a part of flame | frame was missing. For example, a U-shaped substrate holding frame as disclosed in the eighth embodiment of the above-mentioned US Patent Application Publication No. 2011/0042874 may be used. In addition, as long as the operation at the time of scan exposure of the substrate is not adversely affected, a drive mechanism for assisting drive of the substrate support member 69 in the XY plane, for example, long stroke drive in the X axis direction may be additionally provided. .

  In the above description, the eighth embodiment has been described as a representative example, but the substrate support member described above is used to support the substrate P also in the first to seventh embodiments described above. Of course it is also good.

  In the seventh and eighth embodiments, the air floating unit is disposed on a frame which is disposed separately from the coarse movement table 32 and the fine movement stage 26 on one side and the other side of the substrate holder PH in the Y-axis direction. Although the case where the groups 84E and 84F are installed has been described, at least one of the air levitation unit groups 84E and 84F may be mounted on the coarse movement table 32 so as to be movable in the X-axis direction. Not limited to this, another movable body that moves following the coarse movement table may be provided, and the air levitation unit group may be mounted on the other movable body so as to be movable in the X-axis direction. In this case, the above-mentioned substrate Y step-feed device 88 disposed inside the air levitation unit group on the coarse movement table 32 on which the air levitation unit group is mounted or another moving body that moves following the coarse movement table. May be provided. In addition, although the air levitation unit groups 84E and 84F are installed on the floor via the frame, they may be installed on a gantry.

The ninth embodiment
Next, a ninth embodiment will be described based on FIG. 67 to FIG. Here, with regard to the same or equivalent constituent parts as the first to eighth embodiments described above, the same or similar reference numerals are used, and the description thereof will be simplified or omitted.

  The configuration of an exposure apparatus 900 according to the ninth embodiment is schematically shown in FIG. 67 with the air floating unit group etc. omitted. FIG. 68 shows a partially omitted plan view of the exposure apparatus 900, that is, a plan view of a portion below the projection optical system PL in FIG. 67 (a portion below the lens barrel surface plate described later). Further, FIG. 69 shows a schematic side view in which the exposure apparatus according to the ninth embodiment is partially omitted as seen from the + X direction of FIG. In FIG. 70, a part of the plan view of FIG. 68 is taken out and enlarged. Further, FIG. 71 is a block diagram showing the input / output relationship of the main control unit 50 that centrally configures the control system of the exposure apparatus 900 and that centrally controls each component. In FIG. 71, constituent parts related to the substrate stage system are shown. Main controller 50 includes a work station (or a microcomputer) and the like, and generally controls each component of exposure apparatus 900.

  The exposure apparatus 900 includes an illumination system IOP, a mask stage MST for holding a mask M, a projection optical system PL, a mask stage MST, a projection optical system PL, etc. A body BD (only a part of which is shown in FIG. , A substrate stage apparatus PSTh including a fine adjustment stage 26 (substrate table), and control systems thereof and the like, and overall, in the same manner as each exposure apparatus according to the first to eighth embodiments described above. It is configured. However, the substrate stage device PSth described above can hold a part of each of two substrates (the substrate P1 and the substrate P2 are shown in FIG. 67). Different from PST to PSTg.

  As shown in FIGS. 67 and 69, the substrate stage device PSTh has a coarse movement stage portion 24, a fine movement stage 26, a weight cancellation device 28, and the like. As can be seen from FIGS. 67 and 69, the substrate holder PH is mounted on the top surface of the fine adjustment stage 26. As seen from FIG. 68, the substrate holder PH has a length in the X-axis direction equal to that of the substrate (P1, P2), and a width (length) in the Y-axis direction is approximately 1/1 / that of the substrate (P1, P2) It is three.

  At the central portion in the X-axis direction of the upper surface of the substrate holder PH, as shown in FIG. 70, a groove 150 parallel to the Y-axis is provided which divides the upper surface into two holding areas ADA1 and ADA2. In the two holding areas ADA1 and ADA2 divided by the groove 150, a part of the substrates P1 and P2 (here, about 1/3 part of the substrates P1 and P2 in the Y-axis direction, independently of each other), (1/6 area of each substrate which is + X side or -X side half) is adsorbed and held by, for example, vacuum adsorption (or electrostatic adsorption), and pressurized gas (for example, high pressure air) is blown upward The ejection pressure enables noncontact (floating) support of a part of the substrates P1 and P2 (an area of about 1/6 of each substrate) from below.

  Switching between high pressure air ejection and vacuum adsorption for each substrate by holding areas ADA1 and ADA2 of substrate holder PH individually switches and connects holding areas ADA1 and ADA2 of substrate holder PH to a vacuum pump and a high pressure air source (not shown). This operation is performed by the main control device 50 via the holder air suction switching devices 51A, 51B (see FIG. 71).

  As shown in FIG. 69, the coarse movement stage unit 24 has two (pairs) X beams 30A and 30B, two (pairs) coarse movement tables 32A and 32B, and two X beams 30A and 30B. And a plurality of legs 34 for supporting each on the floor surface F. The coarse movement tables 32A and 32B are configured, for example, in the same manner as the two coarse movement tables provided in the substrate stage device PST described above.

  Above each of coarse movement tables 32A and 32B, as shown in FIGS. 68 and 69, a plurality of, in this case, eight air floating units 84H each having a support surface (upper surface) rectangular in plan view are disposed, It is being fixed to the upper surface of coarse movement table 32A, 32B via the supporting member 86, respectively. Each of the eight air levitation units 84H is 2/3 of the size of the substrates P1 and P2 in the Y-axis direction and the substrate in the X-axis direction on the + Y side and the −Y side of the exposure area IA (projection optical system PL) It is arranged in a two-dimensional manner in an area of approximately the same size as the total size in the X-axis direction of P1 and P2. The upper surface of each air floating unit 84H is set to be equal to or somewhat lower than the upper surface of the substrate holder PH. In the following description, each of the eight air floating units 84H is referred to as an air floating unit group 84H on the + Y side and an air floating unit group 84H on the −Y side.

  Further, as shown in FIG. 68, a pair of air floating units 84I are arranged on both sides of the substrate holder PH in the X-axis direction. As shown in FIG. 67, each pair of air levitation units 84I has a support member 112 with an L-shaped XZ cross section so that the upper surface thereof has a height substantially equal to (slightly lower than) the substrate holder PH. It is fixed to the upper surface of coarse movement table 32A. In each air floating unit 84I, for example, the length in the Y-axis direction is somewhat shorter than 1/2 of the substrate holder PH, and the length in the X-axis direction is somewhat shorter than 1/2 of the substrate holder PH.

  As shown in FIG. 69, on the + Y side of the X beam 30A and the −Y side of the X beam 30B, the pair of frames 110A and 110B are placed on the floor F so as not to contact the gantry 18. ing. On the upper surface of each of the pair of frames 110A and 110B, a plurality of, for example, four air floating units 84J are installed (see FIG. 68).

  As shown in FIGS. 68 and 69, each of the four air levitation units 84J is located on the + Y side of the + Y side air levitation unit group 84H and on the −Y side of the −Y side air levitation unit group 84H. It is arranged. As shown in FIG. 68, each of the four air levitation units 84J has a width in the Y-axis direction which is approximately one-third the length of the substrates P1 and P2 in the Y-axis direction, and a length in the X-axis direction And somewhat shorter than half the length of the substrate holder PH in the X-axis direction. In the following description, each of the four air levitation units 84J is referred to as an air levitation unit group 84J on the + Y side and an air levitation unit group 84J on the −Y side. In each of the air floating unit group 84J on the + Y side and the -Y side, the size in the Y-axis direction is approximately 1⁄3 of the length of the substrate P in the Y-axis direction, and the size in the X-axis direction is the substrates P1 and P2. Are arranged in the X-axis direction within a region of approximately the same size as the total size of the X-axis direction. The X positions of the center of the exposure area IA and the centers of the air floating unit group 84J on the + Y side and the −Y side substantially coincide with each other. The upper surface of each air floating unit 84J is set to be equal to or somewhat lower than the upper surface of the substrate holder PH.

  The support surface (upper surface) of each of the air floating units 84H, 84I, and 84J described above has a porous body or a thrust type air bearing structure having a plurality of mechanically small holes. Each air levitation unit 84H, 84I, and 84J levitates and supports a part of the substrate (for example, P1 and P2) by supplying pressurized gas (for example, high pressure air) from the gas supply device 85 (see FIG. 71). It is possible to The on / off of the supply of high pressure air to each air floating unit 84H, 84I, and 84J is individually controlled by main controller 50 shown in FIG.

  As is apparent from the above description, in the present embodiment, the entire two substrates can be floated and supported by the + Y side or −Y side air floating unit groups 84H and 84J. Further, the entire one substrate can be floated and supported by the holding area ADA1 of the substrate holder PH, the pair of air floating units 84I on the + X side, and the four air floating units 84H on the + Y side or the −Y side. Further, the entire one substrate can be floated and supported by the holding area ADA2 of the substrate holder PH and the pair of air floating units 84I on the −X side and the four air floating units 84H on the + Y side or the −Y side. Further, the entire one substrate can be floated and supported by the substrate holder PH and the four air floating units 84H on the + Y side or the −Y side of the substrate holder PH.

  The air levitation unit groups 84H and 84J may be replaced by a single large air levitation unit as long as they have a total supporting area substantially equal to that of each of the rectangular regions described above. The size of the floating unit may be different from the case of FIG. Instead of the pair of air levitation units 84I, a single air levitation unit may be used in which the area of the support surface is doubled. Since the air floating unit is for floating the substrate, it is not necessary to cover the entire surface, and it may be disposed at a predetermined position at a predetermined interval appropriately according to the floating capacity (load capacity) of the air floating unit.

  As shown in FIGS. 68 and 70, a pair of substrate Y step feed devices 88 is disposed between the pair of air floating units 84I on the + X side and the −X side and the substrate holder PH. .

  Each substrate Y step feeding device 88 is a device for holding (for example, adsorbing) a substrate (for example, P1 or P2) and moving it in the Y-axis direction, and is fixed to the upper surface of the support member 112 described above (see FIG. See 67). Each substrate Y step feeding device 88, as shown in FIGS. 67 and 70, a fixing portion 88b extending in the Y-axis direction fixed to the coarse movement table 32A via the support member 112, and a substrate (for example P1 or P2). And a movable portion 88a that moves along the fixed portion 88b in the Y-axis direction by suction. In the present embodiment, the moving stroke of the movable portion 88a of each substrate Y step feeding device 88 in the Y-axis direction is equal to the width of the substrate holder PH in the Y-axis direction.

  Actually, the movable portion 88a sucks the substrate P and moves in the Y-axis direction. However, in the following, the substrate Y step-feed device 88 and the movable portion 88a and the Y-axis direction are required unless distinction is particularly required. Use without distinction.

  Between the air floating unit group 84H on the + Y side and the −Y side and the substrate holder PH, as shown in FIGS. 68 and 70, a pair of substrate X step-feed devices 91 is arranged.

  The substrate X step feeding device 91 is a device for holding (for example, adsorbing) the substrate (for example, P1 or P2) and moving it in the X-axis direction, and + Y side, −Y side of the + X side half of the substrate holder PH. A pair of air levitation units 84H arranged in the is fixed to the surface facing the substrate holder PH via a support member (see FIG. 69).

  As shown in FIGS. 69 and 70, each substrate X step-feed device 91 has a fixed portion 91b extending in the X-axis direction fixed to the coarse movement table 32A or 32B together with the air floating unit 84H, and a substrate (for example P1 or And a movable portion 91a that moves along the fixed portion 91b in the X-axis direction by suctioning the back surface of P2). The movable portion 91a is driven in the X-axis direction with respect to the coarse movement table 32A or 32B by a drive device 95 (not shown in FIGS. 69 and 70, refer to FIG. 71) configured by, for example, a linear motor. The substrate X step feeding device 91 is provided with a position reading device 97 (not shown in FIGS. 69 and 70, see FIG. 71) such as an encoder that measures the position of the movable portion 91a. The driving device 95 is not limited to a linear motor, and may be constituted by a driving mechanism using a rotation motor using a ball screw or a belt as a driving source.

  The moving stroke of the movable portion 91 a of each substrate X step feeding device 91 in the X-axis direction is approximately half (somewhat longer) of the length of the substrate holder in the X-axis direction. The end on the −X side of each fixing portion 91 b protrudes from the air floating unit 84 H to which each is fixed to the −X side by a predetermined length.

  In addition, the movable portion 91a (substrate suction surface) of each substrate X step feeding device 91 needs to suck the back surface of the substrate P or release the suction to separate it from the substrate P. It can be driven slightly in the axial direction. Actually, the movable part 91a sucks the substrate P and moves in the X-axis direction. However, in the following, the substrate X step-feed device 91 and the movable part 91a are used except when distinction is particularly required. Use without distinction.

  Also in the present embodiment, the fine movement stage 26 is Z for suctioning the substrate P by the movable parts (substrate suction surface) of the substrate Y step feeding device 88 and the substrate X step feeding device 91 and separation from the substrate. It may move in the axial direction.

  The weight cancellation device 28 has a housing 64, an air spring 66, a Z-slider 68, etc., as shown in FIG. 69, and is configured, for example, in the same manner as the second and subsequent embodiments described above. . That is, in the substrate stage device PSthh according to the ninth embodiment, the Z slider 68 doubles as a fixing portion of the leveling device 78, no sealing pad is provided, and the weight cancellation device 28 is integrated with the fine movement stage 26. ing. In addition, since the weight cancellation device 28 is integrated with the fine movement stage 26, the connection device 80 (flexure device) or the like for restricting the single movement of the weight cancellation device 28 is not provided. Fine movement stage 26 is freely tiltable on Z slider 68 by a leveling device 78 having a spherical bearing or a pseudo-spherical bearing structure schematically shown by a spherical member in FIG. 69 (θx and θy with respect to the XY plane) It is supported in the direction).

  The weight cancellation device 28 and the upper component (such as the fine movement stage 26 and the substrate holder PH) supported by the weight cancellation device 28 via the leveling device 78 are coarse movement table 32A by the function of the pair of X voice coil motors 54X. And move in the X-axis direction integrally with it. That is, the upper component (fine movement stage 26, substrate holder PH, etc.) is supported by weight cancellation device 28 by main controller 50 using a pair of X voice coil motors 54X, and is synchronously driven (coarse movement) to coarse movement table 32A. By being driven at the same speed in the same direction as the moving table 32A, the movable table 32A is moved with a predetermined stroke in the X-axis direction. The upper component (fine movement stage 26, substrate holder PH, etc.) is controlled by main controller 50 via a pair of X voice coil motors 54X, a pair of Y voice coil motors 54Y, and four Z voice coil motors 54Z. The coarse movement table 32A is slightly driven in the direction of six degrees of freedom.

  In the ninth embodiment, the coarse movement table 32A (and 32B), the weight cancellation device 28, the fine movement stage 26, the substrate holder PH, etc. are moved integrally with the substrate (P1, P2) in the X-axis direction A movable body (hereinafter referred to as a substrate stage (PH, 26, 28, 32A, 32B) as appropriate) is configured.

In exposure apparatus 900 according to the ninth embodiment, positional information of fine movement stage 26 (substrate holder PH) in the XY plane has a resolution of about 0.5 to 1 nm by substrate stage interferometer system 98 (see FIG. 71). Is always detected. The substrate stage interferometer system 98 according to the ninth embodiment has the substrate stage interferometer system according to the seventh embodiment described above, as can be seen by comparing FIGS. 67 to 69 with FIGS. 30 to 32. It is configured the same as 98. However, in the exposure apparatus 900 according to the ninth embodiment, the Y interferometers 98Y ₁ and 98Y ₂ face the Y moving mirror 94Y below the air floating unit 84H, as shown in FIG. They are arranged at predetermined intervals in the X-axis direction. The Y interferometers 98Y ₁ and 98Y ₂ are fixed to the pair of mounts 18 via the support members 104 respectively.

  The configuration of the other parts of the substrate stage device PSTh is, for example, similar to that of the substrate stage devices PSTa, PSTf, and the like. Further, each component other than the substrate stage device is the same as that in each of the embodiments described above (see FIGS. 67 to 71).

  Next, a series of operations for exposure processing of a substrate performed by the exposure apparatus 900 according to the present embodiment configured as described above will be described. Here, an exposure procedure explanatory view for describing a series of operation procedures (that is, exposure procedures) for exposure processing of a substrate in the case where exposure of the second and subsequent layers is performed on a plurality of substrates as an example. 72 to 74 and 76 to 99 corresponding to (Part 1 to Part 27), and FIG. 75 (A) showing parallel operation of exposure of the shot area of one substrate and Y step operation of the other substrate. A description will be given based on FIG. 75 (D). In order to make the description easy to understand, FIGS. 72 to 99 further simplify FIG. 70 and show only the substrate holder PH and the substrate. Also, the exposure area IA shown in FIGS. 72 to 99 is an illumination area where the illumination light IL is irradiated through the projection optical system PL at the time of exposure, and is not actually formed other than at the time of exposure However, in order to clarify the positional relationship between the substrate P and the projection optical system PL, it is always shown. Further, here, the case of performing exposure of 6 chamfers (total of 6 scans) of 2 planes (2 scans) in the X axis direction and 3 planes (3 scans) in the Y axis direction will be described for each substrate.

  First, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and substrate transfer device (not shown) transfers substrate stage device PSTh. Loading (loading) of the two substrates P1 and P2 to the top is performed. During exposure before the front layer, each of the substrates P1 and P2 has a total of six shot areas SA1, for example, two in the X-axis direction and three in the Y-axis direction, as shown in FIG. A plurality of alignment marks PM (see FIG. 70) transferred simultaneously with the pattern of each shot area are provided for each shot area together with ~ 6. In FIG. 70, illustration of each shot area is omitted.

  In this case, the two substrates P2 and P1 are transported by the substrate loading device in the + Y direction and the -Y direction as shown by the solid arrows and the hollow arrows in FIG. It is carried into the position shown in FIG. In this case, the substrate P2 is placed across the holding area ADA1 of the substrate holder PH, a pair of air floating units 84I on the + X side, and part of the air floating unit group 84H on the −Y side, and the substrate P1 is The holding area ADA2 of the substrate holder PH, the pair of air floating units 84I on the −X side, and part of the air floating unit group 84H on the + Y side are mounted. At this time, the substrate P2 is floated and supported by the holding area ADA1 of the substrate holder PH, the pair of air floating units 84I on the + X side, and part of the air floating unit group 84H on the −Y side, and the substrate P1 is the substrate holder PH. Is supported by a pair of air floating units 84I on the −X side and a part of the air floating unit group 84H on the + Y side. Each substrate may not necessarily be carried in the direction of each arrow in FIG. For example, you may carry in from the upper side (+ Z side) or the outer side of the X-axis direction.

  Then, the main control device 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from the exhaust to the suction. As a result, a part of the substrates P2 and P1 (about 1/6 of the whole substrate) is attracted and fixed to the holding areas ADA1 and ADA2 of the substrate holder PH, and a pair of air levitation units 84I and a part of the air levitation units 84H As a result, a part of the substrates P2 and P1 (about 5/6 of the rest of the entire substrate) is floated and supported.

  Thereafter, main controller 50 determines the position of fine movement stage 26 (substrate holder PH) relative to projection optical system PL and the approximate positions of substrates P1 and P2 relative to fine movement stage 26 by the same method of alignment measurement as in the prior art. . The alignment measurement of the substrates P1 and P2 with respect to the fine adjustment stage 26 may be omitted.

  Then, main controller 50 drives fine movement stage 26 via coarse movement table 32A based on the above measurement results to at least two alignment marks PM on substrate P1 (not shown in FIG. 72, see FIG. 70). ) Is moved into the field of view of any alignment detection system, alignment measurement of the substrate P1 with respect to the projection optical system PL is performed, and based on the result, the scan start position for exposure of the shot area SA1 on the substrate P1 is set. Ask. Here, since the scan for exposure includes an acceleration section and a deceleration section before and after the constant velocity movement section at the time of scan exposure, the scan start position is, strictly speaking, the acceleration start position. Then, main controller 50 drives coarse movement tables 32A and 32B and minutely drives fine movement stage 26 to position substrate P1 at the scan start position (acceleration start position). At this time, precise fine positioning drive in the X-axis, Y-axis and θz directions (or in the direction of six degrees of freedom) with respect to the coarse movement table 32A of the fine movement stage 26 (substrate holder PH) is performed. FIG. 73 shows the state immediately after the substrate P1 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P1 in this manner. There is.

  Then, from the state of FIG. 73, the substrate stage (PH, 26, 28, 32A, 32B) is driven in the −X direction as shown by the outlined arrow in FIG. 73, and the X scan operation of the substrate P1 is performed. To be done. At this time, main controller 50 drives mask stage MST holding mask M in the −X direction in synchronization with substrate holder PH (fine movement stage 26), and shot area SA1 of substrate P1 is projected Since it passes through the exposure area IA which is the projection area of the pattern of the mask M by the system PL, the scanning exposure to the shot area SA1 is performed at that time. Main controller 50 actually scans mask stage MST in the X-axis direction based on the measurement result of mask interferometer system 14 in synchronization with fine movement stage 26 (substrate holder PH) during the X scan operation. While being driven, it is finely driven in the Y-axis direction and the θz direction.

  The scanning exposure is performed by irradiating the substrate P1 with the illumination light IL via the mask M and the projection optical system PL during the constant velocity movement of the fine movement stage 26 (substrate holder PH) in the −X direction after acceleration. .

  During the above-described X scan operation, main controller 50 adsorbs and fixes a part of substrate P1 (about 1/6 of the entire substrate P1) to holding area ADA2 of substrate holder PH, and + Y side air floating unit group 84H A part of the substrate P1 (about 5/6 of the whole substrate P1) is floated and supported by a part and a pair of air floating units 84 on the −X side and a part of the substrate P2 in the holding area ADA1 of the substrate holder PH (substrate About 1/6 of the entire P2 is adsorbed and fixed, part of the air floating unit group 84H on the -Y side and part of the substrate P2 on the pair of air floating units 84I on the + X side (about 5/6 of the whole substrate P2 The substrate stage (PH, 26, 28, 32A, 32B) is driven in a state of floatingly supporting the substrate stage (PH).

  At this time, main controller 50 drives coarse movement tables 32A and 32B in the X-axis direction via X linear motors 42A and 42B based on the measurement results of X linear encoder systems 46A and 46B, respectively, and the substrate stage Fine movement stage drive system 52 (each voice coil motor 54X, 54Y, 54Z) is driven based on the measurement results of interferometer system 98 and Z tilt measurement system 76. As a result, the substrates P1 and P2 move integrally with the fine movement stage 26 and move integrally with the coarse movement table 32A by the X voice coil motor 54X. The weight cancellation device 28 is also driven by the X voice coil motor 54X integrally with the fine movement stage 26. In addition, the substrates P1 and P2 are integrated with the fine movement stage 26, and relative movement from the coarse movement table 32A causes each direction (six degrees of freedom) of the X axis, Y axis, Z axis, θx, θy, and θz. Precisely position controlled.

  FIG. 74 shows a state in which the scan exposure on the shot area SA1 of the substrate P1 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped.

  Subsequently, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, alignment marks for the next exposure target shot area (in this case, the shot area SA1 on the substrate P2) provided in advance on the substrate P2. The measurement is performed as described above.

  Then, when new alignment measurement of the substrate P2 with respect to the projection optical system PL is completed, the main control device 50 prepares for acceleration for the next exposure based on the result, and the substrate P2 (and the substrate holder PH) is prepared. As shown by white arrows in FIG. 74, the X step operation of the substrate P2 (and the substrate holder PH) driven in the + X direction is performed. In the X step operation of the substrate P2, the main controller 50 drives the substrate stage (PH, 26, 28, 32A, 32B) in the same state as the X scan operation (however, the positional deviation during movement is the scan operation) Do not regulate as strictly Main controller 50 returns mask stage MST to the acceleration start position in parallel with the X step operation of substrate P2. FIG. 76 shows the state immediately after the substrate P2 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P2 in this manner. There is.

  Then, after the X step operation, main controller 50 causes substrate P2 (substrate stage (PH, 26, 28, 32A, 32B)) and mask M (mask stage MST) as shown by white arrows in FIG. Acceleration in the -X direction with the above (1), and performs scan exposure on the shot area SA1 in the same manner as described above. In parallel with this, main controller 50 sends substrate P1 on substrate holder PH in the -Y direction to perform Y step operation of substrate P1, as shown by a solid arrow in FIG. In this Y step operation of the substrate P1, the main controller 50 switches the holding area ADA2 from suction to exhaust to release the adsorption of the substrate P1, and the substrate P1 is moved using the substrate Y step feeding device 88 on the -X side. This is performed by conveying in the -Y direction by a Y step distance substantially equal to the width of the shot area in the Y axis direction. Here, when the holding area ADA2 is switched from suction to exhaust, the substrate Y step-feed device 88 holds the substrate P1 by suction.

  75 (A) to 75 (D), the exposure of the shot area SA1 of the substrate P2 and the Y step operation of the substrate P1 are performed in parallel, in each substrate according to the passage of time. Changes in position etc. are shown. As can be seen visually from FIGS. 75A to 75D, in the present embodiment, the scanning exposure of one substrate (P2) and the Y step operation of the other substrate (P1) are performed in parallel. Can be done. This is because the substrate Y step feeding device 88 used for the Y step is fixed to the coarse movement table 32A, and moves integrally with the coarse movement table 32A in synchronization with the substrate holder PH.

  In this case, main controller 50 temporarily stops the Y step operation of the other substrate during scanning exposure of one substrate, and during acceleration and deceleration before and after scanning exposure of one substrate, the other. The Y step operation of the substrate may be performed. In this way, the Y step operation of the other substrate adversely affects the scanning exposure of one substrate (e.g., the reaction force of the driving force of substrate Y step feeding device 88 does not cause the vibration of fine movement stage 26). As a result of driving the stage 26, the positional control accuracy of the fine movement stage 26 during scanning exposure (and the synchronization accuracy between the mask M and the substrate P2) can be reliably prevented.

  In FIG. 75 (D) and FIG. 77, the scanning exposure with respect to shot_region SA1 on the board | substrate P2 is complete | finished, and the state which the substrate stage (PH, 26, 28, 32A, 32B) stopped is shown. At this time, the Y step operation of the substrate P1 is completed, and the shot area SA2 on the substrate P1 is located on the holding area ADA2 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA2 of the substrate holder PH from the exhaust to the suction, and the portion 1/6 including the shot area SA2 of the substrate P1 is suction fixed to the holding area ADA2. At this time, the remaining portion (about 5/6) of the substrate P1 is a part of the air floating unit group 84H on the + Y side, a part of the air floating unit group 84H on the -Y side, and a pair of -X sides. It is levitated and supported by the air levitation unit 84I.

  Then, new alignment measurement of the substrate P1 with respect to the projection optical system PL, that is, measurement of an alignment mark for the next shot area SA2 provided in advance on the substrate P1 is performed. Prior to the alignment measurement, the X step operation similar to that described above of the substrate P1 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 77).

  Then, when the new alignment measurement of the substrate P1 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P1 to the acceleration start position for exposure of the shot area SA2 on the substrate P1 ( And positioning of the substrate holder PH) and fine positioning drive in the X-axis, Y-axis and θz directions (or in the direction of six degrees of freedom) relative to the coarse movement table 32A of the fine movement stage 26 are performed. FIG. 78 shows the state immediately after this positioning is completed. In the following description, the description of the minute positioning drive for the fine movement table 32A of the fine movement stage 26 will be omitted.

  Then, the main controller 50 starts acceleration of the substrate P1 and the mask M in the + X direction (see outlined arrows in FIG. 78), and scan exposure is performed on the shot area SA2 of the substrate P1 as described above. In parallel with this, main controller 50 performs the same Y step operation as described above of substrate P2 for sending substrate P2 in the + Y direction on substrate holder PH as shown by the solid arrows in FIG. 78. .

  FIG. 79 shows a state in which the scan exposure on the shot area SA2 on the substrate P1 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P2 is completed, and the shot area SA2 on the substrate P2 is located on the holding area ADA1 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA2 of the substrate P2 is suction fixed to the holding area ADA1. At this time, the remaining portion (about 5/6) of the substrate P2 is a part of the + Y side air floating unit group 84H, a part of the −Y side air floating unit group 84H, and a pair of + X side air It is levitated and supported by the levitation unit 84I.

  Then, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, measurement of an alignment mark for the next shot area SA2 provided in advance on the substrate P2 is performed. Prior to the start of alignment measurement, the same X step operation as described above of substrate P2 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 79). ).

  Then, when the new alignment measurement of the substrate P2 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P2 to the acceleration start position for exposure of the shot area SA2 on the substrate P2 ( And positioning of the substrate holder PH). FIG. 80 shows the state immediately after this positioning is completed.

  Then, main controller 50 starts acceleration of substrate P2 and mask M in the -X direction (see outlined arrows in FIG. 80), and scan exposure is performed on shot area SA2 of substrate P2 as described above. . In parallel with this, the main controller 50 performs the same Y step operation as described above of the substrate P1 for sending the substrate P1 in the -Y direction on the substrate holder PH as shown by the solid arrows in FIG. It will be.

  FIG. 81 shows a state in which the scan exposure on the shot area SA2 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P1 is completed, and the shot area SA3 on the substrate P1 is located on the holding area ADA2 of the substrate holder PH.

  After that, the main control unit 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA3 of the substrate P1 is suction fixed to the holding area ADA2. At this time, the remaining portion (about 5/6) of the substrate P1 is floated and supported by a part of the air floating unit group 84H on the -Y side and a pair of air floating units 84I on the -X side.

  Then, new alignment measurement of the substrate P1 with respect to the projection optical system PL, that is, measurement of an alignment mark for the next shot area SA3 provided in advance on the substrate P1 is performed. Prior to the alignment measurement, the same X step operation as described above of the substrate P1 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 81).

  Then, when the new alignment measurement of the substrate P1 with respect to the projection optical system PL is finished, the main controller 50 based on the result, the substrate P1 to the acceleration start position for exposure of the shot area SA3 on the substrate P1 ( And positioning of the substrate holder PH). FIG. 82 shows the state immediately after the end of the positioning.

  Then, main controller 50 starts acceleration in the + X direction of substrate P1 and mask M (see outlined arrows in FIG. 82), and the same scan exposure as described above is performed on shot area SA3 of substrate P1. In parallel with this, main controller 50 performs the same Y step operation as described above of substrate P2 for transferring substrate P2 in the + Y direction on substrate holder PH as shown by the solid arrows in FIG. 82. .

  FIG. 83 shows a state in which the scan exposure on the shot area SA3 on the substrate P1 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P2 is completed, and the shot area SA3 on the substrate P2 is located on the holding area ADA1 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA3 of the substrate P2 is suction fixed to the holding area ADA1. At this time, the remaining portion (about 5/6) of the substrate P2 is floated and supported by a part of the air floating unit group 84H on the + Y side and a pair of air floating units 84I on the + X side.

  Then, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, measurement of an alignment mark for the next shot area SA3 provided in advance on the substrate P2 is performed. Prior to the alignment measurement, the above-described X step operation of the substrate P2 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 83).

  Then, when the new alignment measurement of the substrate P2 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P2 to the acceleration start position for exposure of the shot area SA3 on the substrate P2 ( And positioning of the substrate holder PH). FIG. 84 shows the state immediately after the end of the positioning.

  Then, main controller 50 starts acceleration (see outlined arrows in FIG. 84) between substrate P2 and mask M in the -X direction, and the same scan exposure as described above is performed on shot area SA3 of substrate P2 . In parallel with this, main controller 50 performs the same Y step operation as described above of substrate P1 for transferring substrate P1 in the -Y direction on substrate holder PH as shown by the solid arrows in FIG. 84. It will be. By this Y step operation, the substrate P1 completely separates from the substrate holder PH, and the entire surface is supported by a part of the air floating unit group 84H on the -Y side and a part of the air floating unit group 84J on the -Y side. Will be

  FIG. 85 shows a state in which the scan exposure on the shot area SA3 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the substrate P1 is retracted from above the substrate holder PH.

  Thereafter, main controller 50 switches holding area ADA1 of substrate holder PH from suction to exhaust, and holds substrate P2 by suction by means of substrate X step feeding device 91 (see FIG. 70) on the + Y side. The X-step distance (a distance approximately twice the length of the shot area in the X-axis direction) is transported in the -X direction as indicated by the white arrow. In parallel with this, main controller 50 adsorbs and holds substrate P1 by substrate X step feeding device 91 (see FIG. 70) on the -Y side, and as shown by a solid arrow in FIG. Transport to X step distance. Here, the transport of the substrate P1 in the + X direction and the transport of the substrate P2 in the −X direction are performed without causing the two to interfere with each other.

  FIG. 86 shows the positional relationship between the substrates P1 and P2 with respect to the substrate holder PH when the transportation of the X step distance between the substrates P1 and P2 is completed.

  From the state of FIG. 86, the main control unit 50 sucks and holds the substrate P1 using the + X side substrate Y step feeding device 88, and the suction of the substrate P1 by the substrate X step feeding device 91 on the −Y side is released. Be done. Then, as shown by the solid arrows in FIG. 86, the step movement of the substrate P1 in the + Y direction is performed by the substrate Y step-feed device 88 on the + X side. As a result, although the positions of the substrate P1 and the substrate P2 on the substrate holder PH are reversed, the substrate P1 and the substrate P2 have the same positional relationship as in FIG. 72 on the substrate holder PH (see FIG. 87).

  Then, the main control device 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from the exhaust to the suction. As a result, a part (about 1/6 of the whole substrate) of the substrates P1 and P2 is attracted and fixed to the holding areas ADA1 and ADA2 of the substrate holder PH, and a pair of air levitation units 84I and a part of the air levitation units 84H As a result, a part of the substrates P1 and P2 (about 5/6 of the rest of the entire substrate) is floated and supported.

  Subsequently, new alignment measurement of the substrate P1 with respect to the projection optical system PL, that is, alignment marks for the next exposure target shot region (in this case, the shot region SA4 on the substrate P1) provided in advance on the substrate P1. The measurement is performed as described above.

  Then, when the new alignment measurement of the substrate P1 with respect to the projection optical system PL is completed, the main control device 50 drives the coarse movement tables 32A and 32B and minutely drives the fine movement stage 26 based on the result. The substrate P1 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) in preparation for acceleration for the exposure of. Thus, FIG. 87 shows a state immediately after the substrate P1 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA4 on the substrate P1. There is.

  Then, main controller 50 causes the substrate P1 (substrate stage (PH, 26, 28, 32A, 32B)) and the mask M (mask stage MST) to be in the + X direction, as shown by the outlined arrows in FIG. Acceleration is started, and scan exposure is performed on the shot area SA4 in the same manner as described above.

  FIG. 88 shows a state in which the scan exposure on the shot area SA4 of the substrate P1 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped.

  Subsequently, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, alignment marks for the next exposure target shot region (in this case, the shot region SA4 on the substrate P2) provided in advance on the substrate P2. The measurement is performed as described above.

  Then, when new alignment measurement of the substrate P2 with respect to the projection optical system PL is completed, the main control device 50 prepares for acceleration for the next exposure based on the result, and the substrate P2 (and the substrate holder PH) is prepared. As shown by white arrows in FIG. 88, the X step operation of the substrate P2 (and the substrate holder PH) driven slightly in the -X direction is performed in the same manner as described above. FIG. 89 shows the state immediately after the substrate P2 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA4 on the substrate P2 in this manner. There is.

  Then, main controller 50 controls the substrate P2 (substrate stage (PH, 26, 28, 32A, 32B)) and the mask M (mask stage MST) in the + X direction, as shown by the outlined arrows in FIG. Acceleration is started, and scan exposure is performed on the shot area SA4 in the same manner as described above. In parallel with this, main controller 50 sends substrate P1 in the + Y direction on substrate holder PH to perform the same Y step operation as described above for substrate P1, as shown by the solid-lined arrow in FIG. 89. .

  FIG. 90 shows a state in which the scan exposure on the shot area SA4 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P1 is completed, and the shot area SA5 on the substrate P1 is located on the holding area ADA1 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA5 of the substrate P1 is suction fixed to the holding area ADA1. At this time, the remaining portion (about 5/6) of the substrate P1 is a part of the air floating unit group 84H on the + Y side, a part of the air floating unit group 84H on the -Y side, and a pair of air on the + X side. It is levitated and supported by the levitation unit 84I.

  Then, new alignment measurement of the substrate P1 with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area SA5 provided in advance on the substrate P1 is performed. Prior to this alignment measurement, the X step operation similar to that described above of substrate P1 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 90).

  Then, when the new alignment measurement of the substrate P1 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P1 to the acceleration start position for exposure of the shot area SA5 on the substrate P1 ( And positioning of the substrate holder PH). FIG. 91 shows a state immediately after the end of the positioning.

  Then, main controller 50 starts acceleration in the -X direction between substrate P1 and mask M (see outlined arrows in FIG. 91), and scan exposure is performed on shot area SA5 of substrate P1 as described above. . In parallel with this, main controller 50 performs the same Y step operation as described above of substrate P2 for transferring substrate P2 in the -Y direction on substrate holder PH as shown by the solid arrows in FIG. 91. It will be.

  FIG. 92 shows a state in which the scanning exposure on the shot area SA5 on the substrate P1 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P2 is completed, and the shot area SA5 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA2 of the substrate holder PH from the exhaust to the suction, and the portion 1/6 including the shot area SA5 of the substrate P2 is suction fixed to the holding area ADA2. At this time, the remaining portion (about 5/6) of the substrate P2 is a part of the air floating unit group 84H on the + Y side, a part of the air floating unit group 84H on the -Y side, and a pair of -X sides. It is levitated and supported by the air levitation unit 84I.

  Then, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area SA5 provided in advance on the substrate P2 is performed. Prior to this alignment measurement, the X step operation similar to that described above of substrate P2 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 92).

  Then, when the new alignment measurement of the substrate P2 with respect to the projection optical system PL is finished, the main controller 50 based on the result, the substrate P2 to the acceleration start position for exposure of the shot area SA5 on the substrate P2 ( And positioning of the substrate holder PH). FIG. 93 shows the state immediately after this positioning is completed.

  Then, the main controller 50 starts acceleration in the + X direction (see outlined arrows in FIG. 93) of the substrate P2 and the mask M, and performs scan exposure on the shot area SA5 of the substrate P2 as described above. In parallel with this, main controller 50 performs the same Y step operation as described above of substrate P1 for sending substrate P1 in the + Y direction on substrate holder PH as shown by a solid arrow in FIG. 93. .

  FIG. 94 shows a state in which the scan exposure on the shot area SA5 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, in the substrate P1, the Y step operation is completed, and the shot area SA6 on the substrate P1 is located on the holding area ADA1 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA6 of the substrate P1 is suction fixed to the holding area ADA1. At this time, the remaining portion (about 5/6) of the substrate P1 is floated and supported by a part of the air floating unit group 84H on the + Y side and a pair of air floating units 84I on the + X side.

  Then, new alignment measurement of the substrate P1 with respect to the projection optical system PL, that is, measurement of an alignment mark for the next shot area SA6 provided in advance on the substrate P1 is performed. Prior to the alignment measurement, the X step operation similar to that described above of the substrate P1 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 94).

  Then, when the new alignment measurement of the substrate P2 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P1 to the acceleration start position for exposure of the shot area SA6 on the substrate P1 ( And positioning of the substrate holder PH). FIG. 95 shows the state immediately after this positioning is completed.

  Then, main controller 50 starts acceleration (see outlined arrows in FIG. 95) between substrate P1 and mask M in the -X direction, and the same scan exposure as described above is performed on shot area SA6 of substrate P1. . Parallel to this, the main controller 50 sends the substrate P2 in the -Y direction on the substrate holder PH as shown by the solid arrows in FIG. To be done.

  FIG. 96 shows a state in which the scan exposure on the shot area SA6 on the substrate P1 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P2 is completed, and the shot area SA6 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA6 of the substrate P2 is suction fixed to the holding area ADA2. At this time, the remaining portion (about 5/6) of the substrate P2 is floated and supported by a part of the air floating unit group 84H on the -Y side and a pair of air floating units 84I on the -X side.

  Then, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area SA6 provided in advance on the substrate P2 is performed. Prior to the alignment measurement, the X step operation similar to that described above of the substrate P2 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 96).

  Then, when the new alignment measurement of the substrate P2 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P2 to the acceleration start position for exposure of the shot area SA6 on the substrate P2 ( And positioning of the substrate holder PH). FIG. 97 shows the state immediately after the end of the positioning.

  Then, main controller 50 starts acceleration in the + X direction of substrate P2 and mask M (see outlined arrows in FIG. 97), and the same scan exposure as described above is performed on shot area SA6 of substrate P2.

  FIG. 98 shows a state in which the scan exposure on the shot area SA6 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped.

  After that, the main controller 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from suction to exhaust and sucks and holds the substrate P2 by the substrate Y step feeding device 88 on the −X side (see FIG. 70). As shown by the solid arrows in 98, carry out (transport) in the -Y direction. In parallel with this, main controller 50 sucks and holds substrate P1 by substrate Y step feeding device 88 (see FIG. 70) on the + X side and carries it out in the + Y direction as shown by the outlined arrow in FIG. (Transport)

  Then, as shown in FIG. 99, the exposed substrates P1 and P2 are unloaded, and new substrates P3 and P4 are loaded onto the substrate holder PH as in FIG. Also in this case, the loading and unloading directions of the respective substrates do not necessarily have to be the directions of the arrows in FIG. For example, loading and / or unloading may be performed from above or in the X-axis direction.

  As described above, in exposure apparatus 900 according to the ninth embodiment, fine movement stage 26 on which a small (1/3 size of the substrate) substrate holder PH is mounted is moved in the direction of one axis (X axis). Since only the substrate is moved in the directions of two axes (X axis and Y axis), the substrate stage device PSth can be reduced in size and weight, and the substrate holder PH and the substrate stage device PSth can be reduced in size as in the above embodiments. It is possible to obtain various effects associated with Furthermore, in exposure apparatus 900 according to the ninth embodiment, main controller 50 places a portion of each of the two substrates on holding areas ADA1 and ADA2 of substrate holder PH, respectively, In parallel with the movement of the substrate stage of which a part thereof is a part in the X-axis direction and the shot area of a part of one of the substrates being scan-exposed, the other substrate is taken as the substrate holder It becomes possible to move in the Y axis direction with respect to PH. Thereby, after the exposure of one shot area (unexposed area) is completed for the first substrate, the substrate is moved stepwise to expose the next shot area (unexposed area), exposure and step movement Is alternately repeated to expose the substrate, and the time taken for the exposure processing of the two substrates can be shortened as compared with the case where the exposure is performed in the same procedure for the second substrate. . Further, in the present embodiment, exposure of two substrates can be alternately performed, and the Y step time of one substrate can be completely overlapped with the X scan time of the other substrate. Considering (time required for scanning exposure of one shot area + alignment time) × number of scans (number of shot areas) + α, more specifically, the conventional step-and-do not perform holding of the substrate on the substrate holder Exposure processing can be performed in approximately the same time as exposure processing by the scan method.

In the ninth embodiment, two substrates are simultaneously carried onto the substrate holder PH (substrate stage device PST) and simultaneously carried out from the substrate holder PH (substrate stage device PSTh). However, in the exposure apparatus 900, two substrates may be alternately carried in and out of the substrate holder PH (substrate stage device PSTh) one at a time, as in the modification described below.
<< Modification of the ninth embodiment >>

  FIG. 100 corresponds to FIG. 85 which is an exposure procedure explanatory view (part 13) in the ninth embodiment described above, but according to the instruction of the main control apparatus 50, by the carry-out device (not shown) The substrate P1 is carried out to the outside of the substrate stage device PSth at this time (see thick solid arrows in FIG. 100). The −X side half of the substrate P1 may be unexposed as shown in FIG. 100 or may be exposed in advance.

  When the substrate P1 is completely retracted from the substrate holder PH during unloading, the main controller 50 sucks and holds the substrate P2 by the substrate X step feeding device 91 (see FIG. 70) on the + Y side, as shown in FIG. The X-step distance (a distance approximately twice the length of the shot area in the X-axis direction) is transported in the -X direction as indicated by the hollow arrow in the inside.

  FIG. 101 shows the positional relationship of the substrate P2 with respect to the substrate holder PH when the transportation of the X step distance of the substrate P2 is completed. At this time, a new substrate P3 is carried onto the air floating unit groups 84H and 84J on the -Y side.

  From the state of FIG. 101, the main control unit 50 sucks and holds the substrate P3 using the + X side substrate Y step-feed device 88, and as shown by the solid arrows in FIG. 101, the + Y direction of the substrate P3 Step movement is performed. As a result, the state shown in FIG. 102 is obtained, and the substrate P2 and the substrate P3 have the same positional relationship as the substrate P1 and the substrate P2 in FIG. 72 on the substrate holder PH.

  Then, the main control device 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from the exhaust to the suction. As a result, a part (about 1/6 of the whole substrate) of the substrates P3 and P2 is attracted and fixed to the holding areas ADA1 and ADA2 of the substrate holder PH, and a pair of air levitation units 84I and a part of the air levitation units 84H As a result, a part of the substrates P3 and P2 (about 5/6 of the rest of the entire substrate) is floated and supported.

  Subsequently, new alignment measurement of the substrate P3 with respect to the projection optical system PL, that is, alignment marks for the next exposure target shot region (in this case, the shot region SA1 on the substrate P3) provided in advance on the substrate P3. The measurement is performed as described above.

  Then, when the new alignment measurement of the substrate P3 with respect to the projection optical system PL is completed, the main control device 50 drives the coarse movement table 32A, 32B and minutely drives the fine movement stage 26 based on the result. The substrate P3 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) in preparation for acceleration for the exposure of. FIG. 102 shows the state immediately after the substrate P3 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA1 on the substrate P3 in this manner. There is.

  Then, main controller 50 controls the substrate P3 (substrate stage (PH, 26, 28, 32A, 32B)) and the mask M (mask stage MST) in the + X direction, as shown by the white arrow in FIG. Acceleration is started, and scan exposure is performed on the shot area SA1 in the same manner as described above.

  FIG. 103 shows a state in which the scan exposure on the shot area SA1 of the substrate P3 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped.

  Subsequently, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, alignment marks for the next exposure target shot region (in this case, the shot region SA4 on the substrate P2) provided in advance on the substrate P2. The measurement is performed as described above.

  Then, when new alignment measurement of the substrate P2 with respect to the projection optical system PL is completed, the main control device 50 prepares for acceleration for the next exposure based on the result, and the substrate P2 (and the substrate holder PH) is prepared. As shown by a white arrow in FIG. 103, the X step operation of the substrate P2 (and the substrate holder PH) driven slightly in the -X direction is performed in the same manner as described above. FIG. 104 shows the state immediately after the substrate P2 (and the substrate holder PH) is positioned at the scan start position (acceleration start position) for exposure of the shot area SA4 on the substrate P2 in this manner. There is.

  Then, main controller 50 controls the substrate P2 (substrate stage (PH, 26, 28, 32A, 32B)) and the mask M (mask stage MST) in the + X direction, as shown by the outlined arrows in FIG. Acceleration is started, and scan exposure is performed on the shot area SA4 in the same manner as described above. In parallel with this, main controller 50 sends substrate P3 on substrate holder PH in the + Y direction to perform the same Y step operation as described above of substrate P3, as shown by the solid arrows in FIG. .

  FIG. 105 shows a state in which the scanning exposure on the shot area SA4 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P3 is completed, and the shot area SA2 on the substrate P3 is located on the holding area ADA1 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA2 of the substrate P3 is suction fixed to the holding area ADA1. At this time, the remaining portion (about 5/6) of the substrate P3 is a part of the + Y side air floating unit group 84H, a part of the −Y side air floating unit group 84H, and a pair of + X side air It is levitated and supported by the levitation unit 84I.

  Then, new alignment measurement of the substrate P3 with respect to the projection optical system PL, that is, measurement of an alignment mark for the next shot area SA2 provided in advance on the substrate P3 is performed. Prior to the alignment measurement, the above-described X step operation of the substrate P3 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 105).

  Then, when the new alignment measurement of the substrate P3 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P3 to the acceleration start position for exposure of the shot area SA2 on the substrate P3 ( And positioning of the substrate holder PH). FIG. 106 shows the state immediately after this positioning is completed.

  Then, main controller 50 starts acceleration in the -X direction between substrate P3 and mask M (see outlined arrows in FIG. 106), and scan exposure is performed on shot area SA2 of substrate P3 as described above. . In parallel with this, the main controller 50 performs the same Y step operation as described above of the substrate P2 for transferring the substrate P2 in the -Y direction on the substrate holder PH as shown by the solid arrows in FIG. It will be.

  FIG. 107 shows a state in which the scan exposure on the shot area SA2 on the substrate P3 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P2 is completed, and the shot area SA5 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA2 of the substrate holder PH from the exhaust to the suction, and the portion 1/6 including the shot area SA5 of the substrate P2 is suction fixed to the holding area ADA2. At this time, the remaining portion (about 5/6) of the substrate P2 is a part of the air floating unit group 84H on the + Y side, a part of the air floating unit group 84H on the -Y side, and a pair of -X sides. It is levitated and supported by the air levitation unit 84I.

  Then, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area SA5 provided in advance on the substrate P2 is performed. Prior to the alignment measurement, the above-described X step operation of the substrate P2 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrows in FIG. 107).

  Then, when the new alignment measurement of the substrate P2 with respect to the projection optical system PL is finished, the main controller 50 based on the result, the substrate P2 to the acceleration start position for exposure of the shot area SA5 on the substrate P2 ( And positioning of the substrate holder PH). FIG. 108 shows the state immediately after the end of the positioning.

  Then, the main controller 50 starts acceleration in the + X direction (see outlined arrows in FIG. 108) between the substrate P2 and the mask M, and performs scan exposure on the shot area SA5 of the substrate P2 as described above. In parallel with this, main controller 50 performs the same Y step operation as described above of substrate P3 for transferring substrate P3 in the + Y direction on substrate holder PH, as shown by the solid arrows in FIG. 108. .

  FIG. 109 shows a state in which the scanning exposure on the shot area SA5 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P3 is completed, and the shot area SA3 on the substrate P3 is located on the holding area ADA1 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA1 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA3 of the substrate P3 is suction fixed to the holding area ADA1. At this time, the remaining portion (about 5/6) of the substrate P3 is floated and supported by a part of the air floating unit group 84H on the + Y side and a pair of air floating units 84I on the + X side.

  Then, new alignment measurement of the substrate P3 with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area SA3 provided in advance on the substrate P3 is performed. Prior to the alignment measurement, the above-described X step operation of the substrate P3 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 109).

  Then, when the new alignment measurement of the substrate P3 with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P3 to the acceleration start position for exposure of the shot area SA3 on the substrate P3 ( And positioning of the substrate holder PH). FIG. 110 shows the state immediately after this positioning is completed.

  Then, main controller 50 starts acceleration in the -X direction between substrate P3 and mask M (see outlined arrows in FIG. 110), and the same scan exposure as described above is performed on shot area SA3 of substrate P3. . In parallel with this, main controller 50 performs the same Y step operation as described above of substrate P2 for transferring substrate P2 in the -Y direction on substrate holder PH as shown by a solid arrow in FIG. 110. It will be.

  FIG. 111 shows a state in which the scanning exposure on the shot area SA3 on the substrate P3 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped. At this time, the Y step operation of the substrate P2 is completed, and the shot area SA6 on the substrate P2 is located on the holding area ADA2 of the substrate holder PH.

  Thereafter, the main control unit 50 switches the holding area ADA2 of the substrate holder PH from exhaust to suction, and the portion 1/6 including the shot area SA6 of the substrate P2 is suction fixed to the holding area ADA2. At this time, the remaining portion (about 5/6) of the substrate P2 is floated and supported by a part of the air floating unit group 84H on the -Y side and a pair of air floating units 84I on the -X side.

  Then, new alignment measurement of the substrate P2 with respect to the projection optical system PL, that is, measurement of the alignment mark for the next shot area SA6 provided in advance on the substrate P2 is performed. Prior to the alignment measurement, the above-described X step operation of the substrate P2 is performed such that the alignment mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 111).

  Then, when new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 based on the result, the substrate P2 to the acceleration start position for exposure of the shot area SA6 on the substrate P2 ( And positioning of the substrate holder PH). FIG. 112 shows the state immediately after this positioning is completed.

  Then, main controller 50 starts acceleration in the + X direction of substrate P2 and mask M (see outlined arrows in FIG. 112), and the same scan exposure as described above is performed on shot area SA6 of substrate P2.

  FIG. 113 shows a state in which the scan exposure on the shot area SA6 on the substrate P2 is completed and the substrate stages (PH, 26, 28, 32A, 32B) are stopped.

  After that, the main controller 50 switches the holding areas ADA1 and ADA2 of the substrate holder PH from suction to exhaust and sucks and holds the substrate P2 by the substrate Y step feeding device 88 on the −X side (see FIG. 70). As shown by the solid arrows in 113, the sheet is carried out (transported) in the -Y direction. In parallel with this, the main control device 50 suction-holds the substrate P3 by the substrate X step-feed device 91 (see FIG. 70) on the + Y side. Then, when the substrate P2 is completely retracted from the substrate holder PH, the main control device 50 transports the substrate P3 by the X step distance in the −X direction as shown by the outlined arrow in FIG.

  Thereafter, as shown in FIG. 114, the substrate P2 for which the exposure of the entire substrate has been finished is carried out, and a new substrate P4 is carried onto the holding area ADA1 of the substrate holder PH.

  Thereafter, the same processes as those for the substrates P2 and P3 described above are repeated for the substrate P3 and the unexposed substrate P4 for which exposure of the three shot areas has been completed.

  As described above, in the present modification, since two substrates are not simultaneously exchanged (carried in / out), the efficiency of the shot area change of the exposure target and the substrate exchange operation is good. Specifically, in the exposure procedure of the ninth embodiment, the biaxial movement of the X axis and the Y axis as in the substrate P1 shown in parts 13 and 14 (FIG. 85 and FIG. 86) is It disappears. Further, since the loading and unloading of the substrates are performed one by one, even if one loading device and one unloading device (not shown) involved in loading and unloading of the substrates can be exchanged in a short time.

  In the ninth embodiment and its modification, the holding areas ADA1 and ADA2 of the substrate holder PH are respectively about 1/6 of the area of the substrate, and two planes in the X-axis direction (two scans) and three in the Y-axis direction Although the case corresponding to 6 chamfers (exposure scan number) of the surface (3 scans) has been illustrated, the present invention is not limited to this, and each of the holding areas ADA1 and ADA2 of the substrate holder PH is set to about 1/4 area of the substrate. You may. In this case, it is possible to cope with four chamfers of two planes in the X-axis direction (two scans) and two planes in the Y-axis direction (two scans).

  Further, the arrangement relationship between the two substrates disposed on the substrate holder PH described above and the order of changing the exposure area are merely an example, and the present invention is not limited to this. For example, in the ninth embodiment and its modification, scanning exposure is alternately performed on one and the other of the two substrates (therefore, the Y step operation of the other and the one substrate is parallel to this). (Alternately, although it has been described), it is not necessary to alternately perform scanning exposure on one side and the other side of the two substrates. However, two substrates are placed in the holding areas ADA1 and ADA2 on the substrate holder PH, and scanning exposure of at least one shot area of one of the substrates and Y step operation of the other substrate are at least partially parallel. It is desirable to perform exposure of at least one shot region of the other substrate between the start and end of exposure of one of the two substrates. According to this, compared with the case where the exposure of one of the two substrates is ended after the exposure of the other substrate is started, the exposure of the two substrates can be completed in a shorter time. become.

  Moreover, although the case where the substrate holder PH having two holding regions divided into two by the groove portion is used is exemplified in the ninth embodiment and the modification, the invention is not limited thereto, and two independent substrate holders may be one It may be lined up and fixed on the fine movement stage.

  Also, although the substrate X step-feed device 91 and the substrate Y step-feed device 88 are arranged around the substrate holder PH, the two substrates are moved relative to the substrate holder PH so as to have the same positional relationship as described above. If possible, the arrangement, number, etc. of the substrate X step feeding device 91 and the substrate Y step feeding device 88 may be arbitrary. However, since it is necessary for the substrate Y step-feed device 88 to perform scan exposure on the shot area on one of the substrates and Y step feed of the other substrate in parallel, the fine movement stage 26 or the substrate holder on which the substrate holder PH is mounted It needs to be provided on a mobile unit that moves integrally with the PH.

Tenth Embodiment
Next, a tenth embodiment will be described based on FIGS. Here, about the component the same as that of 9th Embodiment mentioned above, or equivalent, while using the code | symbol of the same or resemblance | analogue, the description is simplified or abbreviate | omitted.

  FIG. 115 shows a partially omitted plan view of the exposure apparatus 1000 according to the tenth embodiment. In FIG. 116, a schematic side view of the exposure apparatus 1000 as viewed from the + X direction is partially omitted. However, in FIG. 116, the coarse movement table 32 is partially shown in a cross-sectional view together with the weight cancellation device 28 in the same manner as FIG. 69 described above.

  The exposure apparatus 1000 according to the tenth embodiment is different from the above-described ninth embodiment in that a substrate stage device PSTi is provided instead of the above-described substrate stage device PSTh. The configuration and the like of this embodiment are the same as those of the ninth embodiment described above.

  As shown in FIG. 116, substrate stage device PSTi includes coarse movement stage portion 24 'instead of coarse movement stage portion 24 described above. As shown in FIG. 116, the coarse movement stage unit 24 'includes two (pairs) of X beams 30A' and 30B ', a coarse movement table 32, and two X beams 30A' and 30B '. And a plurality of legs 34 supported on the floor surface F.

  Coarse movement table 32 is provided, for example, in place of two coarse movement tables 32A and 32B provided in the above-mentioned substrate stage device PSthh, and as shown in FIGS. 115 and 116, coarse movement tables 32A and 32B are integrated. And has a shape that reduces the size in the Y-axis direction.

  The configuration of each part of the coarse movement stage unit 24 'is similar to, for example, the substrate stage apparatus PSTc included in the exposure apparatus according to the fourth embodiment described above, and thus the detailed description will be omitted.

  In substrate stage device PSTi, as shown in FIG. 116, air floating units on both sides in the Y-axis direction of substrate holder PH are separated from coarse movement table 32 and installed on floor surface F. Furthermore, along with these, a pair of substrate Y step feeding devices 88 and a pair of substrate X step feeding devices 91 are attached to fine movement stage 26.

  On the + Y side of the X beam 30A ′ and the −Y side of the X beam 30B ′, as shown in FIG. 116, the floor F so that each of the pair of frames 110A ′ and 110B ′ does not contact the gantry 18 It is installed on top. Each of the pair of air floating unit groups 84H 'is installed on the top surface of the pair of frames 110A' and 110B '.

  As shown in FIGS. 115 and 116, each of the pair of air floating unit groups 84H 'is disposed on both sides in the Y-axis direction of the substrate holder PH. As shown in FIG. 115, each of the pair of air floating unit groups 84H 'has a width in the Y-axis direction somewhat shorter than the width in the Y-axis direction of the substrate (eg P1 or P2) and a length in the X-axis direction In the rectangular area of substantially the same length as the movement range in the exposure sequence of the pair of air floating unit groups 84I 'described later, the substrate holder PH is dispersed with a predetermined gap in the X axis direction and the Y axis direction. It is comprised by the several air floating unit arrange | positioned. The X positions of the center of the exposure area IA and the centers of each of the pair of air floating unit groups 84H 'substantially coincide with each other. The upper surfaces of the air floating units of the pair of air floating unit groups 84H 'are set to be equal to or somewhat lower than the upper surface of the substrate holder PH.

  Further, in the substrate stage device PSTi, a pair of air levitation unit groups 84I 'is disposed on both sides of the substrate holder PH in the X-axis direction, instead of the pair of air levitation units 84I described above. As shown in FIG. 115, each of the pair of air levitation unit groups 84I 'comprises a plurality of, for example, three elongated rectangular air levitation units arranged in the X axis direction, for example, in the Y axis direction. The length in the Y-axis direction of each air floating unit is somewhat shorter than the distance between the pair of air floating unit groups 84H '. Each of the pair of air levitation unit groups 84I 'is fixed to the upper surface of the coarse movement table 32 in the same manner as the air levitation unit 84I.

  The support surface (upper surface) of each of the air levitation units constituting the pair of air levitation unit groups 84H ′ and the pair of air levitation unit groups 84I ′ is a porous body or a machine as the air levitation units 84 described above. It has a thrust type air bearing structure having a plurality of minute holes. Each air floating unit can float and support a part of the substrate by the supply of pressurized gas (for example, high pressure air) from the above-described gas supply device. The main controller 50 controls the on / off of the supply of high pressure air to each air floating unit.

  In the tenth embodiment, the substrate is moved in the X-axis direction by the substrate stage (PH, 26, 28, 32) by the pair of air floating unit groups 84H ′ and the pair of air floating unit groups 84I ′ described above, for example Even when the full stroke movement is performed, the substrate can be floated and supported while preventing the substrate from drooping.

  The pair of air levitation unit groups 84H ′ may be replaced by a single large air levitation unit as long as each has a total supporting area substantially equal to the above-described rectangular area The shape or size of the floating unit may be different from that in the case of FIG. Similarly, in the pair of air levitation unit groups 84I ', the shape or size of each air levitation unit may be different from that in the case of FIG.

  Further, in substrate stage device PSTi, as shown in FIG. 116, a pair of substrate X step-feed devices 91 are arranged on both sides of substrate holder PH in the Y-axis direction and fixed to fine movement stage 26 via a support member. ing. Similarly, a pair of substrate Y step feed devices 88 are disposed on both sides of the substrate holder PH in the X-axis direction, and fixed to the fine movement stage 26 via the support members (see FIG. 115).

Further, as shown in FIG. 115, the pair of Y interferometers 98Y ₁ and 98Y ₂ form a plurality of air levitation units in the first row near the substrate holder PH, which constitute the air levitation unit group 84H ′ on the −Y side. It is fixed to the side frame 20 at a position opposed to the gap between two adjacent air floating units located in the vicinity of the center in the X-axis direction among them. The two gaps are symmetrical with respect to the Y axis passing through the center of the exposure area IA. In this embodiment, a pair of Y interferometer 98Y _1, 98Y _2, through respective gaps at two positions described above, measurement beams (measurement beams) is adapted to be irradiated on Y movable mirror 94Y.

  The configuration of the other parts of substrate stage device PSTi is the same as that of substrate stage device PSth described above.

  A substrate feeding device (not shown) different from the above-mentioned substrate X step feeding device 91 and substrate Y step feeding device 88 is provided in the vicinity of the pair of air floating unit groups 84H '. It is good also as carrying out.

  In the exposure apparatus 1000 according to the tenth embodiment, a series of operations such as substrate exchange, alignment, exposure and the like are performed in the same procedure as the exposure apparatus 900 according to the ninth embodiment described above.

  The exposure apparatus 1000 according to the tenth embodiment described above can obtain the same effect as the exposure apparatus 900 according to the ninth embodiment described above. In addition to this, in the exposure apparatus 1000, the air floating unit groups 84H ′ on both sides of the substrate holder PH in the Y-axis direction are fixed and configured by a plurality of air floating units arranged in a wide range in the X-axis direction. At the time of substrate exchange, it becomes possible to put the substrate on standby in advance on the fixed air floating unit group 84H ′, and it becomes possible to carry out substrate exchange efficiently and in a short time. In FIG. 117, as an example, the substrate replacement (see FIG. 114) shown in the exposure procedure explanatory view (part 15) in the modification of the above-mentioned ninth embodiment is the exposure apparatus 1000 according to the tenth embodiment. The top view in the case of performing by is shown. In this case, as can be seen from FIG. 117, in the exposure procedure 14 (see FIG. 113) prior to the exposure procedure 15, the new substrate P4 can be made to stand by at the illustrated position. Further, also in the case of performing the two-substrate simultaneous substrate exchange (see FIG. 99) shown in the exposure procedure explanatory view (part 27) in the ninth embodiment described above, two new substrates in advance and a pair of air floating unit groups Since it can be made to stand by on 84H ', it becomes possible to perform substrate exchange efficiently and at high speed.

Further, according to the exposure apparatus 1000 of the tenth embodiment, since the air floating unit groups 84H ′ on both sides of the substrate holder PH in the Y axis direction are separated from the substrate stage (coarse movement table 32), the substrate stage (coarse movement) The load on the table 32) is reduced, and the controllability of the substrate stage is improved. Further, since no move each air floating unit air floating unit group 84H ', there is no possibility that the measurement beams of Y interferometer 98Y _1, 98Y ₂ for measuring the Y-axis direction position of the fine movement stage 26 is blocked by the air floating unit . For this reason, it is possible to install the Y interferometers 98Y ₁ and 98Y ₂ on the side frame 20 of the apparatus main body outside the air floating unit group 84H ′ (−Y side) (see FIGS. 115 and 116). .

  In the exposure apparatus 1000 according to the tenth embodiment, the movable air floating unit, the substrate X step feeding device 91 and the substrate Y step feeding device 88 are mechanically different from the substrate holder PH (i.e., the fine movement stage 26). It may be attached to the separated coarse movement table 32, or may be attached to the substrate holder PH or the fine adjustment stage 26 integrally.

<< Modification of Tenth Embodiment >>
In the tenth embodiment, a part of the plurality of air levitation units constituting the pair of air levitation unit groups 84H ′ is attached to the substrate stage (the coarse movement table 32 or the fine movement stage 26), and the first embodiment described above As in the embodiment, a movable air floating unit may be used. For example, as in the modified example shown in FIGS. 118 and 119, the air floating unit group 84H ′ on the −Y side of the substrate holder PH is configured by a fixed air floating unit, and the air floating unit group on the + Y side of the substrate holder 84H may be mounted on a substrate stage (coarse movement table 32) to be movable. Also, the fixed air floating unit group 84H ′ is mechanically and vibrationally separated from the body BD (exposure apparatus main body) on which the substrate stage is mounted in FIG. 118 and installed on the floor surface F. You may install on BD.

Eleventh Embodiment
Next, an eleventh embodiment will be described based on FIG. FIG. 120 schematically shows the arrangement of an exposure apparatus 1100 according to the eleventh embodiment. As shown in FIG. 120, in exposure apparatus 1100, unlike the exposure apparatus of each of the above embodiments, a plurality of alignment detection systems AL for detecting alignment marks of the substrate are substrate holders on which substrates P1, P2, etc. are mounted. It is provided in PH.

  At least two alignment marks correspond to one of the plurality of alignment detection systems AL on the back surface (surface on the -Z side) of the substrates P1, P2, etc. used in the exposure apparatus 1100 according to the eleventh embodiment. It is provided at a predetermined position. Each alignment mark has, for example, a plurality of scale lines, and the alignment detection system AL can measure the position of the substrate relative to the substrate holder PH (or the amount of positional deviation from the reference position).

  The other part of the exposure apparatus 1100 includes a substrate stage apparatus PSth and is configured in the same manner as the exposure apparatus 900 according to the above-described ninth embodiment. Therefore, the exposure apparatus 1100 according to the eleventh embodiment can obtain the same effect as the exposure apparatus 900 according to the ninth embodiment. In addition to this, in the exposure apparatus 1100, even while the substrate stage including the fine movement stage 26 is moving, alignment measurement of the substrate becomes possible. Specifically, main controller 50 can perform alignment measurement with respect to the substrate holder PH of the other substrate during X scan with respect to two substrates, for example, one of substrates P1 and P2. Therefore, main controller 50 moves the other substrate as it is, together with fine movement stage 26 (substrate holder PH), on the basis of the result of the alignment measurement as described above, immediately after the X scan of the one substrate is completed. The position of the other substrate can be corrected. For this reason, it is possible to immediately start scan exposure of the other substrate after scan exposure of one substrate is finished, and throughput is improved.

  In exposure apparatus 1100, alignment detection system AL may be provided not only on substrate holder PH but also on fine movement stage 26 on which substrate holder PH is mounted.

  In the exposure apparatuses according to the ninth to eleventh embodiments, the air floating unit mounted on the coarse movement table, the substrate Y step feeding device, the substrate X step feeding device, etc. are mounted on the fine movement stage. Alternatively, another moving body that moves following the coarse movement table may be provided, and the air floating unit may be mounted on the other moving body so as to be movable in the X-axis direction. In this case, the above-mentioned substrate Y step-feed device 88 may be provided on another moving body that follows the coarse movement table and on which the air floating unit is mounted. In each of the ninth to eleventh embodiments, the substrate X step-feed device 91 may be disposed outside the substrate stage.

  In the first to eleventh embodiments, the width of the substrate holder PH in the Y-axis direction is about 1/3 or 1/2 of that of the substrate, but the width of the substrate holder PH in the Y-axis direction is the substrate If it is clearly shorter than the width in the Y-axis direction of the holder PH, it is not limited to these. The width of the substrate holder PH in the Y-axis direction may be equal to or greater than the exposure field width (Y direction) of the projection optical system. For example, if the exposure field width (Y direction) by the projection optical system is about 1 / n (n is an integer of 2 or more) of the substrate, then the width of the substrate holder PH is also about 1 / n the Y dimension of the substrate. It is good. In this case, the width in the Y-axis direction of the air floating units arranged on both sides in the Y-axis direction of the substrate holder PH is about (n-1) / (dimension of the substrate in the Y-axis direction) in order to suppress bending of the substrate. It is good to make it n. Then, it is desirable that the substrate Y step feeding device have a Y stroke which can move the entire substrate to the area on the substrate holder.

  In the above embodiments, the air floating unit is used for the purpose of preventing the bending of the substrate P. However, the present invention is not limited to this, and a substrate provided with a contact type rolling bearing using rollers or balls. The sagging prevention device may be replaced with at least a part of the air floating unit in each of the above embodiments. In order to prevent the deflection of the substrate P, a device for preventing drooping of the substrate provided with a bearing member other than the air floating unit and the rolling bearing may be used.

  In each of the above embodiments, the weight cancellation device (center pillar) may be one separated from the fine movement stage (see FIGS. 1 and 3) as in the first embodiment, or the second to eleventh embodiments As in the embodiment, it may be integral with the fine movement stage. Moreover, the feeler for the target of the leveling sensor may not be necessary. Also, the leveling mechanism and the weight cancellation mechanism may be arranged upside down. Thus, the structure of the weight cancellation device is not limited to the embodiments described above.

  In each of the above embodiments, the case where the substrate holder PH is mounted on the fine movement stage 26 has been described. However, the present invention is not limited to this. When using ceramics or the like as the material of the fine movement stage, etching processing etc. The holding unit having the same function as the substrate holder PH for holding the substrate may be integrated with the fine movement stage.

  In addition, there are some components which are not commonly provided in the above-described embodiments, but may not necessarily be provided in the exposure apparatus. For example, in the case of a so-called vertical exposure apparatus in which the substrate P is held parallel to a plane perpendicular to the horizontal plane to perform exposure, no sagging occurs due to the weight of the substrate, so a substrate supporting apparatus such as an air floating unit It is not necessary to provide it. Also, a weight cancellation device is not essential. In this case, a moving stage for moving the substrate holder is required, but the moving stage may be a so-called coarse / fine adjustment stage or a single 6 DOF stage. The point is that the moving stage only needs to be able to drive the substrate holder in the XY plane (at least in the X-axis direction), and it is more desirable if it can be driven in the direction of six degrees of freedom. Further, as long as the configurations do not contradict each other, the components of the first to eleventh embodiments may be combined arbitrarily.

  In each of the above embodiments, the exposure apparatus is a projection exposure apparatus that performs scanning exposure with step-and-scan operation of the substrate P. However, the present invention is not limited to this. A step-and-stitch method is also used. The above embodiments can be applied to the projection exposure apparatus of the present invention, and also to a proximity exposure apparatus which does not use a projection optical system.

In the exposure apparatus of each of the above embodiments, the illumination light is ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm) It may be In addition, as illumination light, for example, single wavelength laser light in the infrared region or visible region oscillated from a DFB semiconductor laser or fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium) Alternatively, harmonics of which wavelength is converted to ultraviolet light using a non-linear optical crystal may be used. Also, a solid state laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In each of the above embodiments, the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical systems (projection optical units). However, the number of projection optical units is not limited to this. There is no limitation, and one or more may be sufficient. Further, the projection optical system is not limited to the multi-lens type projection optical system, and may be, for example, a projection optical system using a large offner type mirror.

  In each of the above embodiments, the projection optical system PL has the same magnification as the projection magnification. However, the present invention is not limited to this. The projection optical system may be either a reduction system or a magnification system.

  In each of the above embodiments, a light transmission type mask in which a predetermined light shielding pattern (or a phase pattern / light reduction pattern) is formed on a light transmitting mask substrate is used. As disclosed in Japanese Patent No. 6,778,257, a transmission pattern or a reflection pattern, or an electronic mask (variable shaped mask) for forming a light emission pattern based on electronic data of a pattern to be exposed, for example, Alternatively, a variable molding mask using a DMD (Digital Micro-mirror Device), which is a type of non-light emitting type image display device (also referred to as a spatial light modulator), may be used.

  The exposure apparatus according to each of the above embodiments is a substrate having a size (including at least one of outer diameter, diagonal and one side) of 500 mm or more, for example, a large substrate for flat panel display (FPD) such as a liquid crystal display element. It is particularly effective to apply to an exposure apparatus that performs exposure. This is because the present invention is made to cope with the increase in size of the substrate.

  Moreover, the liquid crystal display element as a micro device can be manufactured using the exposure apparatus which concerns on said each embodiment. First, a so-called photolithography process is performed in which a pattern image is formed on a photosensitive substrate (a glass substrate or the like coated with a resist). By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to steps such as a developing step, an etching step and a resist removing step to form a predetermined pattern on the substrate. Thereafter, a liquid crystal display device as a microdevice can be obtained by passing through a color filter formation process, a cell assembly process, a module assembly process and the like.

  In each of the above embodiments, the exposure apparatus has been described as the substrate processing apparatus. However, the present invention is not limited to this. For example, an element manufacturing apparatus provided with an inkjet type functional liquid deposition apparatus or a substrate other than an exposure apparatus such as an inspection apparatus At least a part of the first to eleventh embodiments may be applied to the processing apparatus.

  The disclosures of all publications, International Publications, U.S. Patent Application Publications, and U.S. Patent Applications, all of which are incorporated herein by reference, are incorporated herein by reference.

  The exposure method and the exposure apparatus of the present invention are suitable for the exposure of a large substrate. Further, the device manufacturing method and the flat panel display manufacturing method of the present invention are suitable for manufacturing a liquid crystal display element and the like.

Claims (17)

An exposure apparatus which irradiates illumination light from an optical system to an object, moves the object relative to the illumination light, and scans and exposes a plurality of regions of the object.
A first support that supports a portion of the object including at least one of the plurality of regions;
A second support that supports the other part of the object;
An exposure apparatus comprising: a driving unit for relatively moving the first and second support units supporting the object in a scanning direction intersecting the optical axis direction of the optical system in the scanning exposure.   An object transfer unit configured to move the object in a non-scanning direction intersecting the scanning direction such that the other portion of the object supported by the second support is supported by the first support; An exposure apparatus according to item 1. The exposure according to claim 2, wherein the object transfer unit moves the object in the non-scanning direction such that a part of the object supported by the first support unit is supported by the second support unit. apparatus.   The exposure apparatus according to any one of claims 1 to 3, wherein the second support portion is disposed on both sides of the first support portion in the second direction.   The exposure apparatus according to any one of claims 1 to 4, wherein the drive unit moves the other support relative to one of the first and second supports.   The exposure apparatus according to any one of claims 1 to 5, wherein the second support portion has a gas supply hole for supplying a gas to the lower surface of the object.   The exposure apparatus according to any one of claims 1 to 6, wherein the first support portion has a suction hole for sucking the gas on the lower surface of the object.   The exposure apparatus according to any one of claims 1 to 7, wherein the first support portion has a supply hole for supplying gas of the lower surface of the object.   The exposure apparatus according to any one of claims 1 to 8, wherein the second support portion is formed of a porous body.   The exposure apparatus according to any one of claims 1 to 9, further comprising a patterning device that forms a predetermined pattern on the object using an energy beam.   The exposure apparatus according to claim 10, wherein the object is a substrate used for a flat panel display.   The exposure apparatus according to claim 11, wherein a length or a diagonal length of at least one side of the substrate is 500 mm or more. Exposing the object using the exposure apparatus according to claim 11 or 12;
Developing the exposed substrate. Exposing the object using the exposure apparatus according to claim 10;
Developing the exposed object. An exposure method of irradiating illumination light onto an object, moving the object relative to the illumination light, and scanningly exposing a plurality of regions of the object.
Supporting a part of the object including at least one of the plurality of regions on a first support;
Supporting the other part of the object on a second support;
And moving the first and second supporting portions for supporting the object relative to each other in a scanning direction intersecting the direction in which the illumination light is irradiated.   A method of manufacturing a flat panel display, comprising developing the object exposed by the exposure method according to claim 15.   A device manufacturing method comprising: developing the object exposed by the exposure method according to claim 15.

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