JP2019045875A - Exposure device, manufacturing method of flat panel display, device manufacturing method and exposure method - Google Patents

Abstract

To provide an exposure device making adoption of substrate holding member assuming removal of a substrate available in the middle of exposure of the substrate.SOLUTION: A substrate P is step transferred in a plane parallel to a face of the substrate P every time a partition areas are formed on the substrate P during forming a plurality of partition areas (SA1, SA2 or the like) on the substrate P, position information of same detection target part (for example edge) of the substrate P is detected by using a plurality of sensors 122X, 122Xand 122Ybefore and after the step transfer and the substrate P is positioned to a light exposure area IA during forming the partition areas.SELECTED DRAWING: Figure 29

Description

  The present invention relates to an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an exposure method, and more particularly, an exposure apparatus and method for driving a substrate having a plurality of divided regions in a first direction to scan and expose The present invention relates to a method of manufacturing a flat panel display or device using the exposure apparatus or method.

  Conventionally, in a lithography process for manufacturing an electronic device (micro device) such as a liquid crystal display element or a semiconductor element (integrated circuit etc.), a step-and-repeat type projection exposure apparatus (so-called stepper) or a step A scan type projection exposure apparatus (a so-called scanning stepper (also called a scanner)) or the like is used.

  In recent years, the substrate to be exposed by the exposure apparatus, particularly a substrate for a liquid crystal display element (rectangular glass substrate) tends to be increased in size, and accordingly, the stage apparatus of the exposure apparatus is also enlarged. The weight is also increasing. The inventor previously proposed an exposure apparatus for the purpose of coping with such an increase in size of the stage (see, for example, Patent Document 1).

  In the exposure apparatus, a glass plate, a wafer or the like (hereinafter collectively referred to as a substrate) having a sensitive agent applied on the surface thereof is placed on a substrate stage. However, for example, since the glass substrate for liquid crystal tends to be further enlarged, such as 3 meters or more in one side in the latest 10th generation, a new device for realizing further miniaturization of the substrate stage that holds it Development was desired.

  Here, as one method for realizing further miniaturization of the substrate stage, adoption of a substrate stage having a substrate holding surface much smaller than that of the substrate is being studied. In this case, on one substrate In the case of exposing a plurality of areas located on the entire surface of the substrate, it is essential that the substrate be once removed from the substrate stage and held again on the substrate stage between the start and the end of the exposure of the plurality of areas. Become. In this case, unlike the case where the second and subsequent layers are exposed to the substrate, when the first layer is exposed, there is usually no alignment mark on the substrate, so alignment of the substrate to the exposure position is performed. Is a problem.

US Patent Application Publication No. 2010/0018950

  According to a first aspect, there is provided an exposure apparatus which moves a substrate having a plurality of divided areas in a first direction to scan and expose the plurality of divided areas, and detects a mark provided on the substrate. A mark detection unit, a support unit for supporting a part of the substrate, and a drive unit for moving the substrate relative to the support unit in a second direction intersecting the first direction; In the detection unit, after the first region of the plurality of divided regions is scan-exposed, the second region supported by the support unit by the relative movement of the substrate in the second direction by the drive unit is scan-exposed Before being done, an exposure apparatus is provided that detects the marks detected before scanning exposing the first area.

  According to a second aspect, there is provided a method of manufacturing a flat panel display, comprising: exposing the substrate using the exposure apparatus according to the first aspect; and developing the exposed substrate. Ru.

  According to a third aspect, there is provided a device manufacturing method comprising exposing the substrate using the exposure apparatus according to the first aspect and developing the exposed substrate.

  According to a fourth aspect, there is provided an exposure method for moving a substrate having a plurality of divided regions in a first direction to scan and expose each of the plurality of divided regions, the mark detection unit being provided on the substrate Detecting a plurality of marks, supporting a portion of the substrate by a support, and moving the substrate relative to the support in a second direction intersecting the first direction; And in the detecting, after the first region of the plurality of divided regions is scan-exposed, the second region supported by the support portion is scanned by the relative movement of the substrate in the second direction. An exposure method is provided for detecting the mark detected prior to scan exposing the first area before being exposed.

  According to a fifth aspect, there is provided a method of manufacturing a flat panel display, comprising exposing the substrate using the exposure method according to the fourth aspect and developing the exposed substrate. Ru.

  According to a sixth aspect, there is provided a device manufacturing method comprising exposing the substrate using the exposure method according to the fourth aspect and developing the exposed substrate.

FIG. 1 is a view schematically showing a configuration of an exposure apparatus 100 according to a first embodiment. FIG. 2 is a plan view partially showing the exposure apparatus 100. FIG. 3 is a diagram for explaining the arrangement of the alignment detection system shown in FIG. 2, etc., and is a diagram in which some components are further omitted from FIG. 2. FIG. 2 is a side view (partially omitted, partially cross-sectional view) of the exposure apparatus 100 as viewed in the + X direction of FIG. 1. FIG. 2 is a block diagram showing an input / output relationship of a main control device that centrally configures a control system of exposure apparatus 100. FIG. 7 is a diagram (part 1) for describing a series of operations for substrate processing performed in exposure apparatus 100; FIG. 7 is a second diagram to explain a series of operations for substrate processing performed in exposure apparatus 100; FIG. 17 is a diagram (part 3) for describing a series of operations for substrate processing performed by the exposure apparatus 100; FIG. 16 is a diagram for explaining a series of operations for substrate processing performed by the exposure apparatus 100 (part 4). FIG. 17 is a fifth diagram to explain a series of operations for substrate processing performed in the exposure apparatus 100; FIG. 16 is a diagram (part 6) for describing the series of operations for substrate processing performed by the exposure apparatus 100; FIG. 17 is a diagram (No. 7) for describing the series of operations for substrate processing performed in the exposure apparatus 100. FIG. 16 is a diagram (No. 8) for describing a series of operations for substrate processing performed by the exposure apparatus 100. FIG. 17 is a diagram (No. 9) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 17 is a diagram (No. 10) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 16 is a diagram for explaining a series of operations for substrate processing performed in the exposure apparatus 100 (part 11); FIG. 21 is a diagram (No. 12) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 13 is a diagram (No. 13) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 21 is a diagram (No. 14) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 17 is a diagram (No. 15) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 16 is a diagram (No. 16) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 18 is a diagram for explaining a series of operations for substrate processing performed in the exposure apparatus 100 (part 17). FIG. 21 is a diagram (No. 18) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 19 is a diagram (No. 19) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 21 is a diagram (No. 20) for describing a series of operations for substrate processing performed in the exposure apparatus 100. FIG. 21 is a diagram (No. 21) for describing a series of operations for substrate processing performed in the exposure apparatus 100. It is a figure for demonstrating the modification using a board | substrate support member. It is the top view which partially omitted the exposure apparatus 200 which concerns on 2nd Embodiment which shows roughly. FIGS. 29A to 29F are diagrams (parts 1 to 6) for describing a series of operations for substrate processing performed by the exposure apparatus 200. FIGS. FIGS. 30A to 30F are diagrams for explaining a series of operations for substrate processing performed by the exposure apparatus 200 (parts 7 to 12). It is the top view which partially omitted which roughly shows the exposure apparatus 300 which concerns on 3rd Embodiment. FIGS. 32A to 32F are diagrams (parts 1 to 6) for describing a series of operations for substrate processing performed by the exposure apparatus 300. FIGS. FIGS. 33A to 33F are diagrams for explaining a series of operations for substrate processing performed by the exposure apparatus 300 (parts 7 to 12).

First Embodiment
The first embodiment will be described below based on FIGS. 1 to 26. FIG.

  The configuration of the exposure apparatus 100 according to the first embodiment is schematically illustrated in FIG. 1 with the air floating unit group and the like described later being omitted, and part of the exposure apparatus 100 is omitted in FIG. A plan view is shown. FIG. 2 corresponds to a plan view of a portion below the projection optical system PL in FIG. 1 (a portion below the lens barrel surface plate described later). The exposure apparatus 100 is used, for example, for manufacturing a flat panel display, a liquid crystal display (liquid crystal panel), and the like. The exposure apparatus 100 is a projection exposure apparatus in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used for a display panel of a liquid crystal display device or the like is an exposure target.

  The exposure apparatus 100 includes an illumination system IOP, a mask stage MST for holding a mask M, a projection optical system PL, a mask stage MST, a projection optical system PL, etc. A body BD (only a part of which is shown in FIG. , A substrate stage apparatus PST including a fine adjustment stage 26 (substrate table) for holding the substrate P, and a control system of these. In the following description, the direction in which the mask M and the substrate P are scanned relative to the projection optical system PL at the time of exposure is referred to as the X axis direction (X direction), and the direction orthogonal to this in the horizontal plane is the Y axis direction (Y The direction orthogonal to the X axis and Y axis is the Z axis direction (Z direction), and the rotation (inclination) directions around the X axis, Y axis and Z axis are the θx, θy, and θz directions, respectively. Do.

  The illumination system IOP is configured in the same manner as the illumination system disclosed in, for example, US Pat. No. 6,552,775. That is, the illumination system IOP includes illumination light for exposure (not illustrated) through a reflecting mirror, a dichroic mirror, a shutter, a wavelength selection filter, various lenses, and the like. The mask M is illuminated as illumination light IL. As the illumination light IL, for example, light such as i-ray (wavelength 365 nm), g-ray (wavelength 436 nm), h-ray (wavelength 405 nm) or the like (or combined light of the i-ray, g-ray and h-ray) is used. Further, the wavelength of the illumination light IL can be appropriately switched by the wavelength selection filter, for example, according to the required resolution.

  On the mask stage MST, a mask M having a circuit pattern or the like formed on its pattern surface (the lower surface in FIG. 1) is fixed, for example, by vacuum suction (or electrostatic suction). The mask stage MST is supported in a non-contact manner on an unshown mask base plate forming a part of the body BD, for example, via an unshown air bearing fixed to the bottom surface thereof. The mask stage MST is driven with a predetermined stroke in the scanning direction (X-axis direction) by a mask stage drive system 12 (not shown in FIG. 1, see FIG. 5) including a linear motor, for example, And in the .theta.z direction. Position information (including rotation information in the θz direction) of the mask stage MST in the XY plane includes a plurality of laser interferometers that irradiate a measurement beam to a reflection surface provided (or formed) on the mask stage MST. It is measured by a mask laser interferometer system (hereinafter referred to as "mask interferometer system") 14.

  The projection optical system PL is supported below the mask stage MST in FIG. 1 by the barrel surface plate 16 which is a part of the body BD. The projection optical system PL is configured in the same manner as, for example, the projection optical system disclosed in US Pat. No. 6,552,775. That is, the projection optical system PL includes a plurality of projection optical systems (multi-lens projection optical systems) in which projection areas of the pattern image of the mask M are arranged in a zigzag, for example, and has a single Y axis direction as the longitudinal direction. It works the same as a projection optical system with a rectangular (band-like) image field. In this embodiment, as each of the plurality of projection optical systems, for example, one that forms an erecting correct image by a both-side telecentric equal-magnification system is used. Further, hereinafter, a plurality of projection areas arranged in a zigzag form of the projection optical system PL are collectively referred to as an exposure area IA.

  Therefore, when the illumination area on the mask M is illuminated by the illumination light IL from the illumination system IOP, the illumination light IL passing through the mask M causes the circuit of the mask M in the illumination area via the projection optical system PL. A projection area (partial erect image) of a pattern is disposed on the image plane side of the projection optical system PL, and is an irradiation area of the illumination light IL conjugate to the illumination area on the substrate P coated with a resist (sensitive agent) on the surface (Exposure area) It is formed in IA. The mask M is moved relative to the illumination area (illumination light IL) in the scanning direction (X-axis direction) by synchronous driving of the mask stage MST and the substrate holder PH (fine movement stage 26) described later holding the substrate P. At the same time, the substrate P is moved relative to the exposure area IA (illumination light IL) in the scanning direction (X-axis direction), whereby scanning exposure of one shot area (sectioned area) on the substrate P is performed. The pattern of the mask M is transferred to the shot area. That is, in exposure apparatus 100, a pattern of mask M is generated on substrate P by illumination system IOP and projection optical system PL, and exposure of the sensitive layer (resist layer) on substrate P by illumination light IL is performed on substrate P. A pattern is formed.

  The body BD is separated from each other by a predetermined distance in the X-axis direction on the floor surface F as shown in FIG. 1 and FIG. 4 which partially omits a schematic side view of the exposure apparatus 100 from the + X direction. A pair of (two) substrate stage mounts (hereinafter referred to as mounts) 18 consisting of rectangular members arranged in parallel and having the longitudinal direction as the Y-axis direction, and a pair of side frames 20 on the pair of mounts 18. A lens barrel surface plate 16 supported horizontally and a mask surface plate (not shown) are provided. The number of mounts 18 is not limited to two, and may be one or three or more.

  Each gantry 18 is installed on the floor surface F via a plurality of vibration isolation devices 22 (see FIGS. 1 and 4). As shown in FIG. 2 and FIG. 4, the lower ends of the pair of side frames 20 are connected to one end and the other end in the Y-axis direction of the upper surface of the pair of pedestals 18. The lens barrel surface plate 16 is formed of a rectangular parallelepiped member whose longitudinal direction is in the Y-axis direction disposed in parallel to the XY plane, and both ends in the Y-axis direction on the pair of pedestals 18 are downward by the pair of side frames 20. It is supported by

  As shown in FIG. 1, the substrate stage device PST has a coarse movement stage portion 24, a fine movement stage 26, a weight cancellation device 28, and the like. The weight cancellation device 28 is disposed on the upper surface parallel to the XY plane of the X-guide 82 disposed on the pair of pedestals 18 as shown in FIGS. 1 and 4.

  As shown in FIG. 4, the coarse movement stage unit 24 has two (pairs) of X beams 30A and 30B, a coarse movement table 32, and two X beams 30A and 30B on the floor F. And a plurality of supporting legs 34.

  Each of the X beams 30A and 30B is a hollow member in which a YZ cross section extending in the X axis direction is a rectangular frame and is disposed in parallel to each other at a predetermined interval in the Y axis direction (see FIGS. 1 to 4). Each of the X beams 30A and 30B, as shown for the X beam 30A in FIG. 1, has three legs 34 in the vicinity of the longitudinal direction (X-axis direction) both end portions and the central portion, and three legs 34 from below. It is supported on the surface F in a non-contact manner with respect to the pair of mounts 18. Thus, the coarse movement stage unit 24 is vibrationally separated from the pair of racks 18. The arrangement and number of the legs 34 may be arbitrary. The X beams 30A and 30B are not limited to hollow members but may be solid members or rod members having an I-shaped YZ cross section.

  On the upper surface of each of the X beams 30A and 30B, as shown in FIG. 4, an X linear guide 36 extending in the X axis direction is fixed at the center in the Y axis direction. In the present embodiment, the X linear guide 36 has a magnet unit including a plurality of permanent magnets arranged at predetermined intervals in the X axis direction, and doubles as an X stator. In addition to the X linear guide 36, an X stator having a magnet unit may be provided. Also, a plurality of, for example, two X linear guides may be provided on the X beams 30A and 30B.

  The coarse movement table 32 is disposed on the X beams 30A and 30B, as shown in FIG. The coarse movement table 32 is formed of a rectangular plate-like member in a plan view, in which an opening penetrating in the Z-axis direction is formed at the center. In FIG. 4, the coarse movement table 32 is partially shown in cross section, together with a weight cancellation device 28 described later. On the lower surface of the coarse movement table 32, as shown in FIG. 4, the X linear guides 36 fixed to the X beams 30A and 30B are not provided via non-illustrated static gas bearings (for example, air bearings) etc. A plurality of sliders 44 engaged in contact (via predetermined gaps (gaps, clearances)) are fixed. For example, four sliders 44 are provided at predetermined intervals in the X-axis direction with respect to each X linear guide 36 (see FIG. 1), and a total of eight sliders 44 are provided on the lower surface of the coarse movement table 32. Is fixed. The coarse movement table 32 is linearly guided in the X axis direction by a plurality of X linear guide devices including an X linear guide 36 and a slider 44.

  Also, in this case, each slider 44 includes a coil unit, and the coarse movement table 32 is driven with a predetermined stroke in the X-axis direction together with the above-described X stator by a total of eight coil units included in each slider 44 An X linear motor 42 (see FIG. 5) is configured.

  Note that an X mover may be provided separately from the slider 44. In this case, the slider 44 includes rolling elements (for example, a plurality of balls, etc.), and is slidably engaged with each X linear guide 36 You may agree.

  Although not shown in FIGS. 1 to 4, an X scale having the X axis direction as a periodic direction is fixed to a predetermined one of the X beams 30A and 30B, for example, the X beam 30A. The encoder head which comprises the X linear encoder system 46 (refer FIG. 5) which calculates | requires the positional information regarding the X-axis direction of the coarse motion table 32 using X scale is being fixed. The position of the coarse movement table 32 in the X-axis direction is controlled by the main controller 50 (see FIG. 5) based on the output of the encoder head.

  Similarly, although not shown in FIGS. 1 to 4, the coarse movement table 32 measures the relative movement (relative displacement) of the fine movement stage 26 with respect to the coarse movement table 32 in the X-axis and Y-axis directions. Gap sensors 48A, 48B (see FIG. 5) and the like are attached. Main controller 50 immediately stops fine movement stage 26 and coarse movement table 32 when the relative movement amount measured by gap sensors 48A and 48B reaches a predetermined limit value. Instead of or in addition to the gap sensors 48A and 48B, a mechanical stopper member may be provided which mechanically limits the movable amount of the fine movement stage 26 relative to the coarse movement table 32.

  Here, although the description will be made before and after, fine movement stage 26 will be described. As can be seen from FIGS. 1 and 4, the fine adjustment stage 26 is formed of a plate-like (or box-like) member having a rectangular shape in a plan view, and a substrate holder PH (hereinafter abbreviated as a holder) is mounted on the upper surface thereof. The holder PH has a length in the X-axis direction equal to that of the substrate P, and a width (length) in the Y-axis direction is about 1/3 of that of the substrate P, as can be seen from FIG. The holder PH adsorbs and holds a part of the substrate P (here, about 1/3 part of the substrate P in the Y-axis direction) by, for example, vacuum adsorption (or electrostatic adsorption), and also a pressurized gas (for example, high pressure) Air can be blown upward to support a portion (about 1/3 of the substrate P) of the substrate P from below in a non-contact (floating) manner by the jetting pressure. The switching between the ejection of high pressure air to the substrate P by the holder PH and the vacuum adsorption is performed via a holder suction / discharge switching device 51 (see FIG. 5) which switches and connects the holder PH to a vacuum pump and a high pressure air source (not shown). It is performed by the main controller 50.

  Fine movement stage 26 has six degrees of freedom (X-axis, Y-axis, Z-axis, θx) on coarse movement table 32 by fine movement stage drive system 52 (see FIG. 5) including a plurality of voice coil motors (or linear motors). , Θy and θz).

  More specifically, as shown in FIG. 1, a stator 56 is provided on the upper surface of the + X side end of the coarse movement table 32 via the support member 33, and opposed to this, the fine adjustment stage 26 is A mover 58 constituting an X voice coil motor 54X together with the stator 56 is fixed to the side surface on the + X side. Here, in practice, a pair of X voice coil motors 54X having the same configuration are provided at predetermined intervals in the Y-axis direction.

  Although not shown, a stator of a Y voice coil motor is provided on the upper surface of the + Y side end of the coarse movement table 32 via a support member, and the + Y of the fine movement stage 26 is opposed to this. The mover of the Y voice coil motor is fixed to the side of the side. Here, in practice, a pair of Y voice coil motors (hereinafter referred to as Y voice coil motor 54Y for the sake of convenience) having the same configuration are provided in a pair at a predetermined distance in the X axis direction.

  Fine movement stage 26 is synchronously driven by main controller 50 to coarse movement table 32 via a weight cancellation device 28 described later using a pair of X voice coil motors 54X (driven at the same speed in the same direction as coarse movement table 32) Is moved along with the coarse movement table 32 in the X axis direction with a predetermined stroke, and is driven using the pair of Y voice coil motors 54 Y to the coarse movement table 32 also in the Y axis direction. It moves with a very small stroke.

  Further, fine movement stage 26 performs coarse movement by the main controller 50 generating driving forces in opposite directions to each other of each of a pair of X voice coil motors 54X or each of a pair of Y voice coil motors 54Y. The table 32 is moved in the θz direction.

  In this embodiment, the fine movement stage 26 is provided with the projection optical system PL (see FIG. 1) by the X linear motor 42 and the pair of X voice coil motors 54X and Y voice coil motors 54Y of the fine movement stage drive system 52. ) Can be moved with a long stroke in the X-axis direction (coarse movement), and can be finely moved (finely moved) in three degrees of freedom in the X-axis, Y-axis and θz directions.

  In addition, fine movement stage drive system 52 has a plurality of, for example, four, for finely driving fine movement stage 26 in the directions of the remaining three degrees of freedom (each direction of θx, θy, and Z axis), as shown in FIG. It has Z voice coil motor 54Z. Each of the plurality of Z voice coil motors 54 Z includes a stator 59 fixed to the upper surface of the coarse movement table 32 and a mover 57 fixed to the lower surface of the fine movement stage 26. (In FIG. 1, only two of the four Z voice coil motors 54Z are shown in FIG. 1, and the other two are not shown. Also, in FIG. Only one is shown, the other three are not shown). The stators of the voice coil motors 54X, 54Y, 54Z are all attached to the coarse movement table 32. Each voice coil motor 54X, 54Y, 54Z may be either a moving magnet type or a moving coil type. The position measurement system for measuring the position of fine movement stage 26 will be described later.

  As shown in FIG. 4, on the + Y side of the X beam 30A and the −Y side of the X beam 30B, the pair of frames 110A and 110B are placed on the floor F so as not to contact the gantry 18. ing. Air floating unit groups 84A and 84B are installed on the upper surfaces of the pair of frames 110A and 110B.

  The air floating unit groups 84A and 84B are disposed on both sides in the Y-axis direction of the holder PH, as shown in FIGS. 2 and 4. Each of the air floating unit groups 84A and 84B has a width in the Y-axis direction equal to a width in the Y-axis direction of the substrate P as shown in FIG. In the rectangular area of approximately the same length as the movement range of the case, and a plurality of air floating units distributed at predetermined intervals in the X-axis direction with a small gap in the Y-axis direction. . The X positions of the center of the exposure area IA and the centers of the air floating unit groups 84A and 84B substantially coincide with each other. The upper surface of each air floating unit is set to be equal to or somewhat lower than the upper surface of the holder PH.

  The support surface (upper surface) of each of the air levitation units constituting the air levitation unit groups 84A and 84B has a porous body or a thrust type air bearing structure having a plurality of mechanically small holes. Each air floating unit can float and support a part of the substrate P by the supply of pressurized gas (for example, high pressure air) from the gas supply device 85 (see FIG. 5). The on / off of the supply of high pressure air to each air floating unit is controlled by the main controller 50 shown in FIG. Here, in FIG. 5, for convenience of drawing, a single gas supply device 85 is illustrated, but the invention is not limited to this, and the same number of air levitation units individually supplying high pressure air to each air levitation unit. A gas supply device may be used, or two or more gas supply devices connected to a plurality of air levitation units may be used. In FIG. 5, a single gas supply device 85 is shown to represent all of these. In any case, the main controller 50 individually controls on / off of the supply of high pressure air from the gas supply device 85 to each air floating unit.

  As is clear from the above description, in the present embodiment, the entire substrate P can be floated and supported by the holder PH and at least one of the air floating unit groups 84A and 84B on both sides (± Y side) of the holder PH. . Also, the entire substrate P can be floated and supported by the air floating unit group 84A or 84B on one side (+ Y side or -Y side) of the holder PH.

  In the air levitation unit groups 84A and 84B, the width in the Y-axis direction is equal to the width in the Y-axis direction of the substrate P, and the length in the X-axis direction is movement when the holder PH scans. A single large air floating unit may be replaced as long as it has a rectangular area substantially the same length as the range and the total supporting area substantially equal to the size of the individual air floating units. It may be distributed and arranged in the rectangular area different from the case of No.2.

  As shown in FIG. 2, a plurality of, for example, three substrate Y step feeding devices 88 and 1 are provided in the rectangular area in which the plurality of air levitation units constituting each of the air levitation unit groups 84A and 84B are disposed. Two substrate X step feeding devices 91 are arranged asymmetrically with respect to the X axis passing through the center of the exposure area IA (the center of the projection optical system PL). Each of the substrate Y step feeding device 88 and the substrate X step feeding device 91 is disposed within the rectangular area without interfering with the air floating unit. Here, the number of substrate Y step feeding devices 88 may be two or four or more.

  The substrate Y step feeding device 88 is a device for holding (for example, adsorbing) the substrate P and moving it in the Y-axis direction, and in plan view, inside each of the air floating unit groups 84A and 88B in the X-axis direction Three are arranged at predetermined intervals. Each substrate Y step feeding device 88 is fixed on the frame 110A or 110B via the support member 89 (see FIG. 4).

  Each substrate Y step feeding device 88 is fixed to a movable portion 88a that attracts the back surface of the substrate P and moves in the Y-axis direction and the frame 110A or 110B by picking up one on the + Y side as shown in FIG. And a fixing portion 88b. The movable portion 88a is, for example, a drive device 90 (not shown in FIG. 4, see FIG. 5) constituted by a linear motor composed of a mover provided on the movable portion 88a and a stator provided on the fixed portion 88b. , In the Y-axis direction with respect to the frame 110A or 110B. The substrate Y step feeding device 88 is provided with a position reading device 92 (not shown in FIG. 4, see FIG. 5) such as an encoder for measuring the position of the movable portion 88a. The driving device 90 is not limited to a linear motor, and may be constituted by a driving mechanism using a rotating motor using a ball screw or a belt as a driving source.

  The moving stroke of the movable portion 88a of each substrate Y step feeder 88 in the Y-axis direction is about 2/3 (somewhat short) of the length of the substrate P in the Y-axis direction.

  The movable portion 88a (substrate suction surface) of each substrate Y step feed device 88 needs to suck the back surface of the substrate P or release the suction to separate it from the substrate P. It can be driven slightly in the axial direction. Actually, the movable portion 88a sucks the substrate P and moves in the Y-axis direction. However, in the following, the substrate Y step-feed device 88 and the movable portion 88a and the Y-axis direction are required unless distinction is particularly required. Use without distinction.

  The substrate X step feeding device 91 is a device for holding (for example, adsorbing) the substrate P and moving it in the X-axis direction, and one each is disposed inside the air floating unit groups 84A and 88B in plan view. . Each board | substrate X step-feed apparatus 91 is being fixed via the supporting member 93 on frame 110A or 110B, respectively (refer FIG. 4).

  As shown in FIG. 4, each substrate X step-feed device 91 includes a movable portion 91a that sucks the back surface of the substrate P and moves in the X-axis direction, and a fixed portion 91b fixed to the frame 110A or 110B. ing. The movable portion 91a is driven in the X-axis direction with respect to the frame 110A or 110B by a drive device 95 (not shown in FIG. 4, refer to FIG. 5) configured by, for example, a linear motor. The substrate X step feeding device 91 is provided with a position reading device 97 (not shown in FIG. 4, see FIG. 5) such as an encoder for measuring the position of the movable portion 91a. The driving device 95 is not limited to a linear motor, and may be constituted by a driving mechanism using a rotation motor using a ball screw or a belt as a driving source.

  The moving stroke of the movable portion 91 a of each substrate X step feeding device 91 in the X axis direction is about twice the length of the substrate P in the X axis direction. The end portion on the + X side of each fixing portion 91b protrudes from the air floating unit groups 84A and 84B by a predetermined length on the + X side.

  In addition, the movable portion 91a (substrate suction surface) of each substrate X step feeding device 91 needs to suck the back surface of the substrate P or release the suction to separate it from the substrate P. It can be driven slightly in the axial direction. Actually, the movable part 91a sucks the substrate P and moves in the X-axis direction. However, in the following, the substrate X step-feed device 91 and the movable part 91a are used except when distinction is particularly required. Use without distinction.

  In the above description, the movable portions of the substrate Y step feeding device 88 and the substrate X step feeding device 91 are also movable in the Z axis direction because it is necessary to separate and contact the substrate P. However, the fine movement stage 26 may move in the Z-axis direction for the suction of the substrate P by the movable portion (substrate suction surface) and the separation with the substrate P.

  The weight cancellation device 28 is formed of a columnar member extending in the Z-axis direction as shown in FIGS. 1 and 4 and is also referred to as a center pillar. The weight cancellation device 28 supports the fine movement stage 26 from below via a device called a leveling device described later. The weight cancellation device 28 is disposed in the opening of the coarse movement table 32, the upper half of which is exposed above the coarse movement table 32, and the lower half of which is exposed below the coarse movement table 32. .

  The weight cancellation device 28 has a housing 64, an air spring 66, a Z-slider 68 and the like as shown in FIG. The housing 64 is formed of a bottomed cylindrical member opened on the + Z side. On the lower surface of the housing 64, a plurality of air bearings (hereinafter referred to as base pads) 70 whose bearing surfaces face the -Z side are attached. The air spring 66 is housed inside the housing 64. The air spring 66 is supplied with pressurized gas (for example, high pressure air) from the outside. The Z-slider 68 is formed of, for example, a low-profile cylindrical member extending in the Z-axis direction, and is inserted into the housing 64 and mounted on the air spring 66. The Z slider 68 is provided with a guide (not shown) for restricting movement in directions other than the Z axis direction. For example, an air bearing or a parallel leaf spring may be used as the guide. The parallel leaf springs are, for example, radially disposed at the upper end portion and the lower end portion of the Z slider 68, and have a thickness parallel to the XY plane of the three upper and lower sheets (6 sheets in total) connecting the Z slider 68 and the housing 64. It is comprised by the leaf spring which consists of a thin spring steel plate etc. By using a parallel leaf spring (since the stroke is determined by the deflection amount of the leaf spring, the long stroke can not be accommodated as in the case of forming a guide with an air bearing), the Z slider 68 is short in the Z axis direction That is, the structure can be made short in height. Further, as shown in FIGS. 1 and 4, a plurality of arms (referred to as a feeler) 71 are radially arranged and fixed around the housing 64. A target plate 72 used for each of a plurality of light reflection type sensors (also called leveling sensors) 74 mounted on the lower surface of the fine movement stage 26 is installed on the upper surface of the tip of each feeler 71. The light reflection sensors 74 are actually disposed at three or more places that are not on a straight line. A Z-tilt measurement system 76 (see FIG. 5) configured to measure the position of the fine movement stage 26 in the Z-axis direction and the tilt amount (rotation amount in the θx and θy directions) is configured by the plurality of light reflection type sensors 74. There is. In FIG. 4, only one light reflection type sensor 74 is shown in order to avoid the confusion of the drawing.

  The leveling device 78 is a device for supporting the fine movement stage 26 on the Z-slider 68 so as to be tiltable (pivotable in the θx and θy directions with respect to the XY plane). The leveling device 78 has a spherical bearing or a pseudo-spherical bearing structure schematically shown by a spherical member in FIG.

  In this case, for example, the upper surface (upper half of the spherical surface) of the leveling device 78 is fixed to the fine movement stage 26, and the upper surface of the Z slider 68 allows rotation (tilting) of the leveling device 78 in the θx and θy directions. A recess may be formed. Alternatively, conversely, in the leveling device 78, for example, a concave portion in which the lower surface (the lower half of the spherical surface) is fixed to the Z slider 68 and the tilt of the fine movement stage 26 with respect to the leveling device 78 in the θx and θy directions is It may be formed on the stage 26. In any case, the leveling device 78 is supported by the Z-slider 68 from below, and allows the fine movement stage 26 to tilt within a small angle range about an axis (for example, X axis and Y axis) in a horizontal plane.

  The weight cancellation device 28 cancels (cancels) the weight (force in the direction of gravity) of the system including the fine movement stage 26 through the Z slider 68 and the leveling device 78 by the force in the direction of gravity generated by the air spring 66. ) To reduce the load on the plurality of Z voice coil motors 54Z described above.

  The weight cancellation device 28 is connected to the coarse movement table 32 via a pair of coupling devices 80 (see FIG. 1). The Z positions of the pair of coupling devices 80 substantially coincide with the center-of-gravity position of the weight cancellation device 28 in the Z-axis direction. Each connecting device 80 includes a thin steel plate or the like having a thickness parallel to the XY plane, and is also referred to as a flexure device. The pair of connecting devices 80 are disposed facing each other on the + X side and the −X side of the weight cancellation device 28. Each connecting device 80 is disposed between the housing 64 of the weight cancellation device 28 and the coarse movement table 32 in parallel to the X axis, and connects the both. Therefore, the weight cancellation device 28 and the upper component (such as the fine movement stage 26 and the holder PH) supported by the weight cancellation device 28 via the leveling device 78 is a coarse movement table 32 via one of the pair of coupling devices 80. As a result, the coarse movement table 32 is moved integrally with the coarse movement table 32 in the X-axis direction. At this time, a traction force acts on the weight cancellation device 28 in a plane parallel to the XY plane including the position of the center of gravity in the Z-axis direction, so a moment about an axis (Y-axis) orthogonal to the moving direction (X-axis) (Pitching moment) does not work.

  As described above, in the present embodiment, a movable body that moves integrally in the X-axis direction with the substrate P including the coarse movement table 32, the weight cancellation device 28, the fine movement stage 26, the holder PH, etc. Stages (26, 28, 32, PH) are configured.

  An example of the detailed configuration of the weight cancellation device 28 of the present embodiment including the leveling device 78 and the connection device 80 is disclosed in, for example, US Patent Application Publication No. 2010/0018950 (however, however) In the present embodiment, since the weight cancellation device 28 does not move in the Y axis direction, the Y axis connection device is unnecessary. In the above-mentioned U.S. Patent Application Publication, an air bearing called a sealing pad is provided on the upper surface of the Z-slider 68, and the leveling device is supported in a contactless manner from below by the sealing pad. Such a configuration may, of course, be adopted in this embodiment as well.

  As shown in FIG. 1, FIG. 2 and FIG. 4, the X-guide 82 has a rectangular parallelepiped shape whose longitudinal direction is the X-axis direction. The X guides 82 are disposed and fixed on the upper surfaces (+ Z side surfaces) of the pair of mounts 18 so as to cross the pair of mounts 18. The dimensions of the X guide 82 in the longitudinal direction (X axis direction) are the X axis direction dimensions of the pair of racks 18 arranged at predetermined intervals in the X axis direction and the X axis dimension of the gap between the pair of racks 18 It is set somewhat longer (approximately equal) than the sum of

  The upper surface (the surface on the + Z side) of the X guide 82 is parallel to the XY plane and finished with a very high degree of flatness. As shown in FIG. 1 and FIG. 4, the weight cancellation device 28 is mounted on the X guide 82 and float-supported (supported in a non-contact state) via the base pad 70. The upper surface of the X guide 82 is adjusted to be substantially parallel to the horizontal plane (XY plane), and functions as a guide surface when the weight cancellation device 28 moves. The longitudinal dimension of the X guide 82 is set somewhat longer than the movable amount of the weight cancellation device 28 (i.e., the coarse movement table 32) in the X axis direction. The widthwise dimension (the dimension in the Y-axis direction) of the upper surface of the X guide 82 is set to a dimension capable of facing the bearing surface of all of the plurality of base pads 70 (see FIG. 4). The material and manufacturing method of the X guide 82 are not particularly limited. For example, when it is formed by casting cast iron or the like, when it is formed by a stone material (for example, gully rock), ceramics or CFRP (Carbon Fiver Reinforced Plastics) ) May be formed of materials. In addition, the X guide 82 is a solid member or a hollow member having a rib inside, and the shape of the X guide 82 is formed by a rectangular parallelepiped member. The X guide 82 is not limited to a rectangular member, and may be a rod member having an I-shaped YZ cross section.

  As shown in FIGS. 1 and 2, in the vicinity of the X-axis direction center of both side surfaces of fine movement stage 26 in the Y-axis direction, reflecting surfaces orthogonal to the X-axis are provided via movable mirror support parts (not shown). A pair of X movable mirrors 94X consisting of flat mirrors (or corner cubes) are attached. The pair of X moving mirrors 94X are provided at a position lower than the upper surface (surface) of the substrate P on the + X side than the -X side end face of the holder PH, specifically, a position slightly lower than the lower surface of the holder PH. .

As shown in FIG. 4, on the side surface on the -Y side of fine movement stage 26, a Y movement mirror 94Y consisting of a long flat mirror having a reflection surface orthogonal to the Y axis via a mirror holding part (not shown). Is fixed. For positional information of the fine movement stage 26 (holder PH) in the XY plane, a laser interferometer system (hereinafter referred to as a substrate stage interferometer system) 98 using a pair of X moving mirrors 94X and Y moving mirrors 94Y (see FIG. 5) For example, with a resolution of about 0.5 to 1 nm. In actuality, as shown in FIGS. 2 and 5, substrate stage interferometer system 98 is a pair of X laser interferometers corresponding to a pair of X movable mirrors 94X (hereinafter abbreviated as X interferometers). A pair of Y laser interferometers (hereinafter abbreviated as Y interferometer) 98Y ₁ and 98Y ₂ corresponding to 98X ₁ , 98X ₂ and Y moving mirror 94Y are provided. The measurement results of the X interferometers 98X ₁ and 98X ₂ and the Y interferometers 98Y ₁ and 98Y ₂ are supplied to the main controller 50 (see FIG. 5).

As shown in FIG. 4, each of the pair of X interferometers 98 X ₁ and 98 X ₂ has an L shape as viewed from the + X direction in which one end (lower end) of each is fixed to the gantry 18 on the −X side. Are fixed separately to the other end (upper end) of the frame (X interferometer frame) 102A, 102B. Here, since L-shaped frames are used as the frames 102A and 102B, the interference between the frames 102A and 102B and the above-described frames 110A and 110B and the coarse movement table 32 moving in the X-axis direction is avoided. be able to.

Further, the pair of X interferometers 98X ₁ and 98X ₂ face the pair of X moving mirrors 94X, and at a position lower than the upper surface of the substrate P, the holder PH and the air floating unit group 84A or 84B in the Y axis direction. It is placed at a position that fits in the gap. Thus, in the substrate stage apparatus PST according to the present embodiment, the pair of X interferometers 98X ₁ and 98X ₂ is a gantry on the −X side as compared to the case where it is installed outside the movement range of the holder PH in the X axis direction. It is possible to arrange at a position close to 18.

Also, as shown in FIG. 1, as a predetermined _{one of} the X interferometers 98X ₁ and 98X ₂ , for example, the X interferometer 98 X ₂ , two interferometer beams (measurement beams) separated in the Z-axis direction A multi-axis interferometer is used to irradiate the X-moving mirror 94X with X. The reason will be described later.

The X interferometer is not limited to the pair of X interferometers 98X ₁ and 98X ₂ that individually irradiates the interferometer beam (measurement beam) to each of the pair of X movable mirrors 94X, and a pair of X movable mirrors 94X It is also possible to use a multi-axis interferometer which emits a plurality of measurement beams, each of which comprises at least one measurement beam to be illuminated.

A pair of Y interferometer 98Y _1, 98Y _2, as shown in FIG. 2, the first and the air floating unit columns in the column closest to the holder PH constituting the air floating unit group 84B, a second adjacent thereto Arranged at a position opposite to the gap between two adjacent air levitation units, which is located near the center of the first row of air levitation unit rows with the row of air levitation unit rows and in the X-axis direction. It is done. The two gaps are symmetrical with respect to the Y axis passing through the center of the exposure area IA. A pair of Y interferometer _98Y 1, 98Y _2, as shown in FIG. 4, to face the Y moving mirror 94Y on the upper surface of the support member 104 disposed on the upper surface of the aforementioned frame 110B, and air floating unit group It is fixed separately (without contact) with the air floating unit that constitutes the 84B. In this embodiment, a pair of Y interferometer 98Y _1, 98Y _2, through respective gaps at two positions described above, measurement beams (measurement beams) is adapted to be irradiated on Y movable mirror 94Y.

As the Y interferometer, not only the pair of Y interferometers 98Y ₁ and 98Y ₂ that individually irradiates the interferometer moving beam (measuring beam) to the Y moving mirror 94 Y, but also irradiating two measuring beams to the Y moving mirror 94 Y Multi-axis interferometers can also be used.

In the present embodiment, the X interferometers 98X ₁ and 98X ₂ are focused on the surface of the substrate P in the Z-axis direction (in the case of exposure, this surface coincides with the image plane of the projection optical system PL). The position measurement result of the X position includes an Abbe error due to a change in the attitude (pitching) of the fine movement stage 26 during movement in the X-axis direction because it is at a lower position than when leveling control is performed. The main controller 50 detects the pitching amount of the fine movement stage 26 by X interferometer 98x ₂ consisting of multi-axis interferometer described above, based on the detection result, the measurement of the X-position by X interferometer _98x 1, 98x ₂ The Abbe error included in the result is corrected. That is, to correct the Abbe error, X interferometer 98 X ₂ irradiates X interferometer mirror X with two interferometer beams (measurement beams) separated in the Z-axis direction, that is, detects the pitching amount of fine movement stage 26 Possible multi-axis interferometers are used.

Further, the positional information on the θx, θy, and Z-axis directions of the fine movement stage 26 is the Z tilt measurement system 76 described above (three or more light reflection sensors 74 not on a straight line fixed to the lower surface of the fine movement stage 26) Thus, it can be obtained using the target plate 72 at the tip of the feeler 71 described above. The configuration of the position measurement system of fine movement stage 26 described above including Z tilt measurement system 76 is disclosed, for example, in US Patent Application Publication No. 2010/0018950. Therefore, when using a type of interferometer that does not detect the pitching amount of fine movement stage 26 as X interferometers 98X ₁ and 98X ₂ , main controller 50 determines fine movement stage 26 determined by Z tilt measurement system 76. The above-mentioned Abbe error included in the measurement result of the X position by the X interferometers 98X ₁ and 98X ₂ may be corrected based on the positional information (pitching amount) in the θx direction of the above.

  In addition, the position information on the θx, θy, and Z-axis directions of the fine movement stage 26 alone is not measured, and a member above the fine movement stage 26 that can be regarded as integral with the projection optical system PL (a part of the body, for example The position information of the substrate P in the θx, θy, and Z-axis directions may be measured directly from the top by a multipoint focal position detection system (focus sensor) (not shown) fixed to (not shown). Of course, positional information of the substrate P and the fine movement stage 26 in the θx, θy, and Z axis directions may be measured.

  As shown in FIG. 1 and FIG. 2 and FIG. 3 which takes out a part of FIG. 2, a plurality of, for example, eight alignment detection systems AL1 are provided at the lower end portion of the lens barrel surface plate 16 located above the holder PH. To AL8 are provided. The eight alignment detection systems AL1 to AL8 have, for example, the Y-axis direction and the X-axis direction as the row direction and the column direction, respectively, as the detection fields (detection regions) of the respective alignment detection systems (detection regions) are schematically shown in FIG. , 4 rows and 4 columns, four each are arranged on the + X side and the −X side of the projection optical system PL. In this case, the alignment detection systems AL1 to AL4 belong to the first row on the -Y side, and the alignment detection systems AL5 to AL8 belong to the second row on the + Y side. Further, alignment detection systems ALi and AL (i + 4) (i = 1, 2, 3, 4) belong to the i-th column (see FIG. 3).

  The holder PH can pass under the eight alignment detection systems AL1 to AL8 by the movement of the fine movement stage 26 in the X-axis direction. At least a part of the alignment detection systems AL1 to AL8 may change the position in the XY direction according to the arrangement (number of shots, number of chamfers) of the pattern area on the substrate P.

  Each of the alignment detection systems AL1 to AL8 has, for example, a microscope provided with a CCD camera, and when a mark provided at a predetermined position of the substrate P in advance enters the field of view of the microscope, alignment measurement is performed by image processing The position information (positional displacement information in the XY plane) of the mark is sent to the main control unit 50 that controls the position of the movable portion of the substrate stage device PST.

  FIG. 5 is a block diagram showing an input / output relationship of a main control unit 50 that centrally configures a control system of the exposure apparatus 100 and performs overall control of each component. FIG. 5 shows the components related to the substrate stage system. Main controller 50 includes a work station (or a microcomputer) and the like, and generally controls each component of exposure apparatus 100.

  Next, a series of operations for substrate processing performed in the exposure apparatus 100 according to the present embodiment configured as described above will be described. Here, as an example, the case where the substrate P is subjected to the exposure after the first layer will be described based on FIGS. The exposure area IA shown in FIGS. 6 to 26 is an illumination area where the illumination light IL is irradiated through the projection optical system PL at the time of exposure, and is not actually formed except at the time of the exposure However, in order to clarify the positional relationship between the substrate P and the projection optical system PL, it is always shown.

First, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and substrate transfer device (not shown) transfers substrate stage device PST. Loading of the substrate P to the top (loading) is performed. Prior to exposure, a plurality of, for example, four in the X-axis direction and four in the Y-axis direction, for a total of 16 marks M ₁₁ and M, as shown in FIG. ₁₂ , ..., M ₄₄ are marked (provided). These marks are the marks M _j1 , M _j2 , M _j3 , M _j4 , M _{j + 1
1} , M _{j + 1
2} , M _{j + 1
3} , M _{j + 1
4} (j = 1, 2, 3) positional relationship is the position in the horizontal plane of the detection field (hereinafter abbreviated as field of view) of alignment detection systems AL1, AL2, AL3, AL4, AL5, AL6, AL7, AL8 It is marked on the substrate P in an arrangement corresponding to the relationship. Therefore, a total of eight marks in the j-th row and the j + 1-th row can be detected simultaneously and individually by the eight alignment detection systems AL1 to AL8.

  As shown in FIG. 6, main controller 50 floats and supports substrate P carried in by the substrate carrying device above air floating unit group 84B on the −Y side using air floating unit group 84B, The substrate X step feeding device 91 on the -Y side is held by suction and transported in the -X direction as shown by the solid arrows in FIG.

  Next, main controller 50 adsorbs and holds substrate P levitated and supported by air levitation unit group 84B using substrate Y step feeding device 88 on the + X side on the −Y side, and substrate X with respect to substrate P. The suction by the step feeding device 91 is released. Then, using the substrate Y step-feed device 88, main controller 50 transports substrate P in the + Y direction as shown by the broken arrow in FIG.

As a result, as shown in FIG. 7, the substrate P is placed across the holder PH and part of the air floating unit group 84B on the −Y side of the holder PH. At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the suction. As a result, a part of the substrate P (about 1/3 of the entire substrate P) is adsorbed and fixed by the holder PH, and a part of the substrate P (about the remainder of the entire substrate P by a part of the air floating unit group 84B). 3) will be in a state of being floated and supported. At this time, the substrate P is a part of the holder PH and the air floating unit group 84B so that at least two marks on the substrate P fall within the field of view of one of the alignment detection systems and on the holder PH. It is placed across the In FIG. 7, four marks M ₃₃ , M ₃₄ , M ₄₃ and M ₄₄ respectively fall within the field of view of alignment detection systems AL 1, AL 2, AL 5 and AL 6.

  Immediately after the start of the suction operation of the substrate P by the holder PH, the main controller 50 cancels the suction of the substrate P by the substrate Y step feed device 88, and the substrate Y step feed device 88 (movable portion 88a) It is returned to the standby position which is the movement limit position on the -Y side shown in FIG. At this time, the substrate X step feeding device 91 (movable portion 91a) is also returned to the standby position, which is the movement limit position on the -X side shown in FIG.

  Thereafter, main controller 50 determines the position of fine movement stage 26 (holder PH) with respect to projection optical system PL by the same method of alignment measurement as in the prior art. Here, the alignment measurement of the fine movement stage 26 with respect to the projection optical system PL is to measure a reference index (not shown) provided on the fine movement stage 26 by the alignment detection system AL, and the alignment detection different from the alignment detection system You may use a system.

Then, main controller 50 drives fine movement stage 26 via coarse movement table 32 based on the result of the above measurement (alignment measurement of fine movement stage 26 with respect to projection optical system PL, etc.) to at least Two marks are moved into the field of view of any alignment detection system (in this case, four marks M ₃₃ , M ₃₄ , M ₄₃ and M ₄₄ are used for alignment detection systems AL 1, AL 2, AL 5 and AL 6, respectively). Alignment measurement of the substrate P with respect to the projection optical system PL is performed, and a scan start position for exposure of the first region on the substrate P is determined based on the result. Here, since the scan for exposure includes an acceleration section and a deceleration section before and after the constant velocity movement section at the time of scan exposure, the scan start position is, strictly speaking, the acceleration start position. Then, main controller 50 drives coarse movement table 32 and finely drives fine movement stage 26 to position substrate P at the scan start position (acceleration start position). At this time, precise fine positioning drive is performed on the coarse movement table 32 of the fine movement stage 26 (holder PH) in the X-axis, Y-axis and θz directions (or in the direction of six degrees of freedom). FIG. 8 shows the state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the first region on the substrate P in this manner.

  Thereafter, a step-and-scan exposure operation is performed.

  In the step-and-scan exposure operation, a plurality of areas on the substrate P are sequentially exposed. During the scan operation, the substrate P is accelerated for a predetermined acceleration time in the X-axis direction, and then driven at a constant velocity for a predetermined time (exposure (scan exposure) is performed during this constant velocity drive), and then the same time as the acceleration time (Hereinafter, a series of operations of the substrate P is referred to as X scan operation). In addition, the substrate is appropriately driven in the X-axis or Y-axis direction (hereinafter referred to as an X-step operation and a Y-step operation, respectively) at the time of step operation (at the time of movement between shot areas). In the present embodiment, the maximum exposure width (width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4, 5, 6) described later is about 1⁄3 of the substrate P.

  Specifically, the exposure operation is performed as follows.

  From the state of FIG. 8, the substrate stage (26, 28, 32, PH) is driven in the −X direction as shown by the outlined arrow in FIG. 8, and the X scan operation of the substrate P is performed. At this time, the mask M (mask stage MST) is driven in the −X direction in synchronization with the substrate P (fine adjustment stage 26), and the first area (exposure target area) is a mask M by the projection optical system PL. Since it passes through the exposure area IA which is the projection area of the pattern of (1), the scanning exposure is performed on the first area. The scanning exposure is performed by irradiating the substrate P with the illumination light IL via the mask M and the projection optical system PL during the uniform movement of the fine movement stage 26 (holder PH) in the −X direction after acceleration.

  During the above-described X scan operation, main controller 50 causes holder PH mounted on fine movement stage 26 to adsorb and fix a part of substrate P (about 1⁄3 of the entire substrate P), and causes air floating unit group 84B to move. The substrate stage (26, 28, 32, PH) is driven in a state in which a part of the substrate P (about 2/3 of the entire substrate P) is float-supported. At this time, main controller 50 drives coarse movement table 32 in the X-axis direction via X linear motor 42 based on the measurement result of X linear encoder system 46, and substrate stage interferometer system 98, Z tilt Based on the measurement result of measurement system 76, fine movement stage drive system 52 (each voice coil motor 54X, 54Y, 54Z) is driven. Thus, the substrate P is pulled by the coarse movement table 32 and moved in the X-axis direction in a state where the substrate P is integrally supported on the weight cancellation device 28 integrally with the fine movement stage 26, and from the coarse movement table 32 The relative position control of X axis, Y axis, Z axis, .theta.x, .theta.y and .theta.z (six degrees of freedom) are precisely controlled. Further, main controller 50 synchronizes with fine movement stage 26 (holder PH) in the X scan operation, and based on the measurement result of mask interferometer system 14, holds mask MST in the X-axis direction. Scan drive, and micro-drive in the Y-axis direction and the θz direction. FIG. 9 shows a state in which the scanning exposure for the first region is finished, and the substrate stage (26, 28, 32, PH) holding a part of the substrate P is stopped. By this exposure, a shot area SA1 in which the sensitive layer is exposed is formed on the substrate P.

  Next, a Y step operation is performed to move the unexposed area of the substrate P onto the holder PH. The Y step operation of the substrate P is performed by the main controller 50 on the substrate shown in FIG. 9 by the substrate Y step feed device 88 (movable portion 88a) positioned on the -Y side and in the middle in the X-axis direction. A state in which the substrate P is floated by exhausting high pressure air from the holder PH and subsequent high pressure air exhaust by the air floating unit group 84B after suction holding the back surface of the P and releasing adsorption of the holder PH to the substrate P Then, as shown by the solid arrows in FIG. 9, this is performed by transporting the substrate P in the + Y direction by the substrate Y step-feed device 88. Thereby, only the substrate P moves in the + Y direction with respect to the holder PH, and as shown in FIG. 10, the substrate P is a second unexposed region adjacent to the shot region SA1 on the −Y side (exposure Target area) (and an area adjacent to this on the + X side) faces the holder PH, and is mounted across the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B It becomes. At this time, the substrate P is floated and supported by the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P is formed by a part of the air floating unit group 84A and a part of the air floating unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is in a state of being floated and supported.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of the mark for the next shot area provided in advance on the substrate P is performed. In this alignment measurement, the X step operation of the substrate P is performed as needed so that the mark to be measured is positioned within the detection field of the alignment detection system (see the outlined arrow in FIG. 10). The main control unit 50 drives the substrate stage (26, 28, 32, PH) in the same state as the X scan operation (however, the positional deviation during movement is as strict as the scan operation). Do not restrict)

In alignment measurement, as shown in FIG. 11, main controller 50 simultaneously uses marks M ₂₃ , M ₂₄ , M ₃₃ and M ₃₄ using alignment detection systems AL3, AL4, AL7 and AL8, respectively. Detect individually. Here, some of the plurality of marks to be measured include marks M ₃₃ and M ₃₄ whose positions have been previously detected by the alignment detection systems AL 1 and AL 2, and the two marks M ₃₃ and M _34. Are detected by another alignment detection systems AL7 and AL8 whose positional relationship with the alignment detection systems AL1 and AL2 is known. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for the exposure of the second region can be performed accurately without any problem.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50, based on the result, the scan start position (acceleration start for exposure of the second region on the substrate P Positioning to the position, and precise micropositioning drive in the X-axis, Y-axis and θz directions (or 6 degrees of freedom) with respect to the coarse movement table 32 of the fine movement stage 26 are performed. FIG. 12 shows the state in which the holder PH (fine movement stage 26) is thus positioned at the scan start position.

  Then, main controller 50 accelerates, in the + X direction, substrate P (substrate stages (26, 28, 32, PH)) and mask M (mask stage MST), as shown by white arrows in FIG. And perform scan exposure in the same manner as described above. FIG. 13 shows the state in which the substrate stage (26, 28, 32, PH) has stopped after the scanning exposure for the second area is completed. By this exposure, a shot area SA2 in which the sensitive layer is exposed is formed on the substrate P.

  Next, a Y step operation is performed to move the unexposed area of the substrate P onto the holder PH. The Y step operation of the substrate P is performed by the main controller 50 on the -Y side and the substrate X step feeding device 88 (movable portion 88a) positioned most in the + X direction. After the substrate PH is released from adsorption, the substrate P is floated by the exhaust of high pressure air from the holder PH and the subsequent exhaust of high pressure air by the air floating unit groups 84B and 84A. Then, as shown by the solid arrows in FIG. 13 and FIG. 14, this is performed by transporting the substrate P in the + Y direction by the substrate Y step-feed device 88. At this time, if the stroke of the substrate Y step-feed device 88 on the -Y side is short, the main control unit 50 takes over the feed of the substrate P using the substrate Y step-feed device 88 on the + Y side. Good (see solid arrows in FIG. 15). In preparation for this handover, the main controller 50 may drive the substrate Y step feed device 88 (movable portion 88a) on the + Y side in advance in the -Y direction and wait in the vicinity of the holder PH (see FIG. 13, see FIG. 14).

  By the Y step operation of the substrate P described above, only the substrate P moves with respect to the holder PH in the + Y direction, and as shown in FIG. 15, the substrate P is unexposed adjacent to the shot area SA2 on the −Y side. The third area (area to be exposed) (and the area adjacent to it on the + X side) faces the holder PH, and is placed across the holder PH and part of the air floating unit group 84A. . At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84A.

  Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is adsorbed and fixed by the holder PH, and a part of the substrate P (about the remaining 2 / of the whole substrate P) by a part of the air floating unit group 84A. 3) will be in a state of being floated and supported.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of the mark for the next region provided in advance on the substrate P is performed. In the alignment measurement, the X step operation of the substrate P is performed as necessary so that the mark to be measured is positioned within the detection field of the alignment detection system.

In alignment measurement, as shown in FIG. 15, main controller 50 simultaneously uses marks M ₁₃ , M ₁₄ , M ₂₃ and M ₂₄ using alignment detection systems AL 1, AL 2, AL 5 and AL 6, respectively. Detect individually. Here, some of the plurality of marks to be measured include marks M ₂₃ and M ₂₄ whose positions have been previously detected by the alignment detection systems AL 3 and AL 4, and the two marks M ₂₃ and M _24. Are detected by another alignment detection systems AL5 and AL6 whose positional relationship with the alignment detection systems AL3 and AL4 is known. Therefore, in spite of having removed the substrate P from the holder PH, new alignment measurement for exposure of the third region can be performed accurately without any trouble.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50, based on the result, the scan start position (acceleration start for exposure of the first region on the substrate P The positioning to the position is performed, and as shown by the white arrow in FIG. 15, the −X direction of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) In the same manner as described above, the scan exposure is performed. FIG. 16 shows a state in which the substrate stage (26, 28, 32, PH) has stopped after the scan exposure for the third region is completed. By this exposure, a shot area SA3 in which the sensitive layer is exposed is formed on the substrate P.

Next, in preparation for acceleration for the next exposure, main controller 50 performs an X step operation of substrate P, which drives substrate P slightly in the + X direction as shown by the outlined arrow in FIG. In the middle, as shown in FIG. 17, marks M ₁₁ , M ₁₂ and M ₁₃ , respectively, within the detection field of alignment detection systems AL 1, AL 2, AL 3, AL 4, AL 5, AL 6, AL 7 and AL ₈ . M ₁₄ , M ₂₁ , M ₂₂ , M ₂₃ and M ₂₄ are positioned, and, for example, four marks such as marks M ₁₃ , M ₂₁ , M ₂₂ and M ₂₃ among them, alignment detection systems AL 3, AL 5, AL 6, AL 7 To detect simultaneously and individually. In this case, since the substrate P is not removed from the holder PH after the exposure of the shot area SA3, the substrate may be positioned for the next exposure based on the above alignment result. However, next, once the substrate P is removed from the holder PH, the alignment of the next substrate becomes difficult. Therefore, the positions of a plurality of marks including the marks M ₂₁ and M ₂₂ are detected by the above alignment measurement so that such a situation does not occur. Further, in this case, in addition, a part of the plurality of marks to be measured includes the marks M ₁₃ and M ₂₃ whose positions have been detected by the alignment detection systems AL 1 and AL 5 first, and the two marks M ₁₃ , the M _23, the positional relationship between the alignment detection system AL1, AL5 is detected at a known different alignment detection system AL3, AL7. Therefore, even if the substrate P is temporarily removed from the holder PH after the exposure of the shot area SA3, new alignment measurement for the exposure of the fourth area can be performed accurately without any problem.

  Main controller 50 positions holder PH (fine movement stage 26) at the acceleration start position for the fourth exposure based on the above alignment result, and ends the X step. In parallel with the X step operation of substrate P, main controller 50 returns mask stage MST to the acceleration start position.

  Then, main controller 50 starts acceleration in the -X direction of substrate P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST), and scan exposure is performed as described above. Do. FIG. 18 shows a state in which the scanning exposure on the fourth area on the substrate P is finished and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA4 in which the sensitive layer is exposed is formed on the substrate P.

  Next, a Y step operation is performed to move the unexposed area of the substrate P onto the holder PH. In this Y step operation of the substrate P, the main controller 50 controls the back surface of the substrate P in the state shown in FIG. 18 by the substrate Y step feeding device 88 (movable portion 88a) on the + Y side and the −X side. After the substrate P is lifted by releasing the high pressure air from the holder PH and the subsequent high pressure air discharge by the air floating unit group 84A after releasing the adsorption of the holder PH to the substrate P, as shown in FIG. As shown by the solid arrows in FIG. 18, this is performed by transporting the substrate P in the −Y direction by the substrate Y step feeder 88. At this time, when the stroke of the substrate Y step-feed device 88 on the + Y side is short, the main control unit 50 takes over the feed of the substrate P using the substrate Y step-feed device 88 on the -Y side. Good (see solid arrows in FIG. 19). In preparation for this handover, the main controller 50 may drive the substrate Y step feed device 88 (movable portion 88a) on the + Y side in advance in the -Y direction and wait in the vicinity of the holder PH (see FIG. 18). Thereby, only the substrate P moves in the -Y direction with respect to the holder PH, and as shown in FIG. 19, the shot area SA2 on the substrate P and the fifth area adjacent to the shot area SA2 on the + X side Is opposed to the holder PH, and the substrate P is placed across the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B. At this time, the substrate P is floated and supported by the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P is formed by a part of the air floating unit group 84A and a part of the air floating unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is in a state of being floated and supported.

  Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of the mark for the next region provided in advance on the substrate P is performed. During this alignment measurement, an X step operation is performed as necessary so that the alignment mark to be measured is positioned within the detection field of the alignment detection system.

In alignment measurement, as shown in FIG. 20, main controller 50 simultaneously uses marks M ₂₁ , M ₂₂ , M ₃₁ and M ₃₂ by using alignment detection systems AL 3, AL 4, AL 7 and AL 8, respectively. Detect individually. Here, marks M21 and M22 whose positions have been detected by the alignment detection systems AL5 and AL6 earlier are included in a part of the plurality of marks to be measured, and the two marks M ₂₁ and M ₂₂ are The positional relationship with the alignment detection systems AL5 and AL6 is detected by another alignment detection systems AL3 and AL4 whose known relationship is known. Therefore, new alignment measurement for the exposure of the fifth area can be performed accurately without any problem even though the substrate P is once removed from the holder PH.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 based on the result, the X axis, Y axis and θz directions (or the Precise micro positioning drive with 6 degrees of freedom) is performed.

  Next, the main controller 50 starts acceleration of the substrate P and the mask M in the + X direction as shown by the outlined arrows in FIG. 20, and the same scan exposure as described above is performed. FIG. 21 shows a state in which the scanning exposure on the fifth area on the substrate P is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA5 in which the sensitive layer is exposed is formed on the substrate P.

  Next, a Y step operation is performed to move the last unexposed area of the substrate P onto the holder PH. During Y step operation of the substrate P, main controller 50 sets substrate Y step feeding device 88 (movable portion) in which the back surface of substrate P in the state shown in FIG. After the substrate P is adsorbed and held, and the adsorption of the holder PH to the substrate P is released, the substrate P is levitated by the exhaust of high pressure air from the holder PH and the subsequent exhaust of high pressure air by the air levitation unit groups 84A and 84B. In the state shown in FIG. 21, the substrate P is transported in the -Y direction by the substrate Y step-feed device 88, as indicated by the solid arrows in FIG. Thereby, only the substrate P moves in the Y-axis direction with respect to the holder PH (see FIG. 22).

  The substrate P which is driven in the −Y direction by the substrate Y step feed device 88 and the last unexposed shot region and the shot region SA1 adjacent thereto are moved onto the holder PH is a portion thereof (the entire substrate P About 1/3) is again fixed to the holder PH by adsorption by the holder PH, and a part (about 2/3 of the rest of the whole substrate P) is floated and supported by a part of the air floating unit group 84B. Then, new alignment measurement of the substrate P with respect to the projection optical system PL, that is, measurement of the mark for the next region provided in advance on the substrate P is performed. At the time of this alignment measurement, the X step operation of the substrate P described above is performed as necessary so that the mark to be measured is positioned within the detection field of the alignment detection system (see open arrow in FIG. 22).

In alignment measurement, as shown in FIG. 23, main controller 50 simultaneously uses marks M ₃₁ , M ₃₂ , M ₄₁ and M ₄₂ using alignment detection systems AL 1, AL 2, AL 5 and AL 6, respectively. Detect individually. Here, some of the plurality of marks to be measured include marks M ₃₁ and M ₃₂ whose positions have been previously detected by the alignment detection systems AL 7 and AL 8, and the two marks M ₃₁ and M _32. However, other alignment detection systems AL1 and AL2 having known positional relationships with alignment detection systems AL7 and AL8 are detected. Therefore, new alignment measurement for exposure of the sixth area can be performed with high accuracy without any problem even though the substrate P is once removed from the holder PH.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 based on the result, the scan start position (acceleration start for exposure of the sixth region on the substrate P Positioning (including precise fine positioning in the X-axis, Y-axis and θz directions (or 6 degrees of freedom direction) with respect to coarse movement table 32 of fine movement stage 26). As described above, acceleration of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) in the -X direction is started, and scan exposure is performed as described above. . FIG. 25 shows a state in which the scanning exposure on the sixth area on the substrate P is completed and the substrate stage (26, 28, 32, PH) is stopped. By this exposure, a shot area SA6 in which the sensitive layer is exposed is formed on the substrate P.

  On the other hand, immediately before the new alignment measurement of the substrate P described above is started, as shown in FIG. 23, a new substrate P is carried (loaded) onto the air levitation unit group 84A by the substrate loading device (not shown). ing. At this time, the movable portion 91a of the substrate X step-feed device 91 on the + Y side moves to a position near the movement limit position on the + X side, that is, a position below the newly introduced substrate P and stands by at that position. ing.

  Then, in parallel with the exposure to the shot area SA6 described above, the newly introduced substrate P is held by suction by the substrate X step feeding device 91 on the -Y side by the main controller 50, and is transported to the -X side (See Figure 24).

  On the other hand, the substrate P on which exposure for all the shot areas SA1 to SA6 has been completed is dotted lines in FIG. 25 by the main controller 50 using the substrate Y step-feed device 88 on the −Y side and the most −X side. It is conveyed to the -Y side as indicated by the white arrow, completely retracted from above the holder PH, and carried onto the air floating unit group 84B (see FIG. 26). Almost simultaneously with this, using the substrate Y step-feed device 88 on the + Y side and on the most −X side by the main controller 50, the newly introduced substrate P is painted black in FIG. 25 and FIG. As shown by the arrow, it is transported to the -Y side, a part (part of 1/3) on the -Y side is positioned on the holder PH, and the part is adsorbed (fixed) by the holder PH (See FIG. 26).

  The exposed substrate P carried onto the air floating unit group 84 B is shown by the solid arrow in FIG. 26 by the main controller 50 using the substrate X step-feed device 91 on the −Y side. , And transported in the + X direction by the substrate unloading device (not shown).

  The alignment operation similar to that described above is performed on the substrate P partially fixed to the holder PH in parallel with the unloading of the exposed substrate P, and then + X of the substrate P and the mask M is performed. Acceleration of direction is started, and scan exposure is performed on the first region (the region on the most -Y side and + X side) as described above. Thereafter, in the same procedure as in the exposure of the first substrate P described above, the alignment (X step, Y step), the operation of exposure, etc. to the remaining area on the second substrate P, and Operations such as alignment (X step, Y step) and exposure to the third and subsequent substrates are repeated.

  However, with regard to the second substrate P, the above-mentioned first region on the substrate where the fourth exposure is performed on the first substrate and the region on the most -Y side and + X side is exposed first. As can be understood from the description, in this embodiment, the exposure order of the shot areas is different between the first (odd-numbered) substrate P and the second (even-numbered) substrate P. For the first (odd-numbered) substrate P, the exposure order is the shot areas SA1, SA2, SA3, SA4, SA5 and SA6, whereas for the second (even-numbered) substrate P, the exposure order is Is in the order of the shot areas SA4, SA5, SA6, SA1, SA2 and SA3. Further, in this case, the first (odd-numbered) substrate P is carried into the holder PH from the -Y side and is carried out from the holder PH into the -Y side. On the other hand, the second (even-numbered) substrate P is carried into the holder PH from the + Y side and is carried out from the holder PH to the + Y side. However, the order of exposure and the transfer direction of the substrate P with respect to the holder PH are not limited to this.

  As described above, according to the exposure apparatus 100 according to the present embodiment, the main control unit 50 moves the substrate P stepwise in the XY plane (Y step or X every time a shot area is formed on the substrate P). Before and after the step movement, position information of a plurality of marks including at least two identical marks (marked marks) on the substrate P is detected using a part of the alignment detection systems AL1 to AL8. When exposing the processing area on the substrate P (forming a shot area) based on the detection result of the position information of the marks, ie, the alignment measurement result, the substrate P is exposed to the exposure position (exposure area IA) Align to the side. For this reason, not only when performing the X step operation of the substrate P moving the substrate P integrally with the holder PH in the X-axis direction but also using the substrate Y step feeding device 88, only the substrate P can be Y with respect to the holder PH. When performing the Y step operation to move in the axial direction, that is, when removing the substrate P from the holder PH once during the step movement, the substrate P is placed at the exposure position (exposure area IA) without any problem when forming the shot area. On the other hand, accurate alignment is possible. Therefore, when exposing substantially the entire surface of the substrate P, no problem occurs even if the holder PH having a holding surface smaller than the substrate P is adopted on the premise of the removal of the substrate P halfway.

  Further, according to the exposure apparatus 100 according to the present embodiment, the holder PH mounted on the fine movement stage 26 holds a part of the surface of the substrate P opposite to the surface to be exposed (surface to be processed). That is, the substrate holding surface of the holder PH is smaller than the substrate P, and specifically, is set to about 1/3. Therefore, when the substrate Y step-feed device 88 unloads the substrate P from the fine adjustment stage 26 (holder PH) based on an instruction from the main controller 50, the substrate P is displaced in the Y-axis direction in the XY plane. The substrate Y step-feed device 88 has a distance smaller than the size (width or length) of the substrate P in the Y-axis direction, that is, about 1/3 of the size of the substrate P in the Y-axis direction. The unloading of the substrate P is completed only by displacing the substrate P in the Y-axis direction by the same distance as the width of the holder PH in the Y-axis direction (see, for example, FIGS. 25 and 26). As described above, in the present embodiment, since the moving distance (unloading distance) of the substrate at the time of unloading of the substrate P is smaller than the size of the substrate, the unloading time of the substrate can be shortened as compared with the related art. .

  Further, according to the exposure apparatus 100 according to the present embodiment, when the scanning exposure for the final shot area on the substrate P is completed, the fine movement stage 26 (holder PH) is at one position in the X axis direction at one position in the Y axis direction. The exposed substrate P is slid out of the holder PH (retracted), and in parallel (almost simultaneously) with the other side in the Y-axis direction, the substrate P before exposure is slid onto the holder PH. It becomes possible to (input) (see FIG. 25 and FIG. 26).

  Further, also when substrate P before exposure is carried into fine movement stage 26 (holder PH), substrate Y is stepped by substrate Y step-feed device 88 based on the instruction of main controller 50 so that substrate P is displaced in the Y-axis direction. The substrate Y step-feed device 88 is transported within the XY plane, in which case the distance smaller than the size (width or length) of the substrate P in the Y-axis direction, ie, the width of the holder PH in the Y-axis direction (substrate The loading of the substrate P is completed only by displacing the substrate P in the Y-axis direction by the same distance as about 1/3 of the size of P in the Y-axis direction. Therefore, in addition to the unloading time of the substrate, the loading time of the substrate can be shortened as compared with the prior art, and as a result, the replacement time of the substrate can be shortened.

  In exposure apparatus 100, main controller 50 arranges the shot areas to be formed on substrate P, and the Y-axis from above holder PH of substrate P at the position of holder PH in the X-axis direction according to the order of exposure. Slide out to one side is performed. Further, the main controller 50 arranges the shot area to be formed on the substrate P, and the position of the holder PH in the X-axis direction according to the order of exposure from the other side in the Y-axis direction onto the holder PH of the substrate P. Slide loading is performed. Further, measurement for alignment of the substrate P with respect to the exposure position of the substrate P, that is, measurement of the above-mentioned marks is started by the main controller 50 at the position in the X-axis direction of the slide-in substrate P. That is, according to the arrangement of the shot area to be formed on the substrate P and the order of exposure, the alignment detection system used to measure the marks after the substrate P is loaded is determined to start alignment measurement in the shortest time. ing.

  Therefore, according to the exposure apparatus 100 according to the present embodiment, the holder PH needs to move to a determined substrate exchange position (for example, a position near the movement limit position in the + X direction) as in the conventional substrate exchange. This can further shorten the substrate exchange time. In addition to this, alignment measurement can always be started in the shortest time regardless of the position of the holder PH where the substrate exchange is performed, and it is possible to improve the throughput also in this respect.

  Further, in the above embodiment, the first (odd-numbered) substrate P is carried into the holder PH from the -Y side, and is carried out from the holder PH into the -Y side. On the other hand, the second (even-numbered) substrate P is carried into the holder PH from the + Y side and is carried out from the holder PH to the + Y side. As a result, with either the odd-numbered substrate P or the even-numbered substrate P, it is possible to carry out the substrate P from the holder PH in the shortest time.

  Here, in the description of the above embodiment, the case where the carrying out direction of the exposed substrate P from the holder PH is opposite to the odd-numbered substrate and the even-numbered substrate is exemplified. Depending on the arrangement of shot areas to be formed on the upper surface and the exposure order, substrates may be unloaded from the holder PH in the -Y direction (or + Y direction) for both the even and odd substrates. Naturally it is possible. That is, in the present embodiment, main controller 50 arranges the shot areas to be formed on substrate P and positions of holder PH in the X-axis direction according to the order of exposure so as to minimize the exchange time of the substrate. The substrate P is unloaded in a direction according to the arrangement of shot areas to be formed on the substrate P and the order of exposure. Therefore, regardless of the arrangement of the shot area (processed area) to be formed on the substrate and the order of processing, the substrate exchange time can be shortened as compared with the case of carrying out in the same direction at a constant X position. It is.

  In the exposure apparatus 100, the alignment mark is transferred together with the pattern of the mask for each shot area on the substrate P in the exposure of the first layer described above. For this reason, in the exposure apparatus 100, when the substrate P is subjected to the exposure of the second and subsequent layers, alignment measurement similar to the conventional one is performed using those alignment marks, and based on the measurement result. Position control (including X scan, X step and Y step) of the substrate P at the time of exposure is performed.

  Further, in the exposure apparatus 100 according to the present embodiment, the substrate holding surface (substrate mounting surface) of the holder PH on which the substrate P is placed and held by suction in a state where the flatness of the substrate P is secured is the conventional holder. Since an area of about 1/3 is sufficient, the holder PH can be reduced in size and weight. The fine movement stage 26 supporting the lighter holder PH is also smaller and lighter, and high speed, high acceleration / deceleration drive of the fine movement stage 26 by each voice coil motor 54X, 54Y, 54Z, and improvement of position controllability are possible. It becomes. Further, by miniaturizing the holder PH, the processing time of the flatness of the substrate holding portion is shortened, and the processing accuracy is improved. Further, in the present embodiment, the fine movement stage 26 does not perform step movement in the Y axis direction, is pulled by the coarse movement table 32, moves with a long stroke in the X axis direction, and has six degrees of freedom with respect to the coarse movement table 32 It is slightly driven. Therefore, the coarse movement table 32 may have rough drive accuracy, may have a simple structure, and may be small, lightweight, and low in cost. Further, at the time of the Y step operation of the substrate P, the substrate Y step feeding device 88 step moves only the substrate P in the Y axis direction with rough accuracy. Therefore, the structure of the substrate Y step feeding device 88 may be simple, and the size, weight and cost can be reduced.

  The substrate stage apparatus PST provided in the exposure apparatus 100 according to the present embodiment is effective in a multiple layout in which a plurality of shot areas are arranged on the substrate P in the cross scan direction (Y-axis direction).

  In addition, the size in the Y-axis direction of the support surfaces of the air floating unit groups 84A and 84B on both sides in the Y-axis direction of the holder PH is not limited to the size in the Y-axis direction of the substrate P, and may be larger than that. It may be slightly smaller.

  In the above embodiment, the case where marks used for the alignment of the substrate P are formed corresponding to the arrangement of the fields of view of the alignment detection systems AL1 to AL8 in portions other than the area where shot areas are formed after exposure However, the present invention is not limited to this. For example, when the field of view of a plurality of alignment detection systems is fixed, detection can be performed by the plurality of alignment detection systems in the outer peripheral portion of the area where a plurality of shot areas are formed. In the arrangement, the marks may be formed by a tighter. Alternatively, marks may be provided on the back surface of the substrate P in an arrangement that allows detection by a plurality of alignment detection systems. In this case, a plurality of alignment detection systems are provided, for example, inside the holder PH.

  Further, in the above embodiment, in order to prevent the occurrence of an alignment error caused by the rotation of the substrate P, at least two identical marks are detected by different alignment detection systems whose positional relationship is known before and after the stepping of the substrate P. Although the case has been illustrated, the present invention is not limited thereto. For example, in the case where the rotation of the substrate P hardly occurs or the rotation of the substrate P can be neglected, at least one same mark before and after the stepping of the substrate P It may be detected by a different alignment detection system whose relationship is known.

  In the above embodiment, although the case where the weight cancellation device (center pillar) is integral with the fine movement stage has been described, the present invention is not limited to this, and may be separated from the fine movement stage. There may not be a feeler for the leveling sensor target. Also, the leveling mechanism and the weight cancellation mechanism may be arranged upside down. Thus, the structure of the weight cancellation device is not limited to the above embodiment.

<< Modification >>
In the exposure apparatus of the above embodiment, it is possible to use a frame-shaped substrate support member capable of integrally holding the substrate P and floating the substrate P integrally by the air floating unit. As an example, the case where this substrate support member is applied to an exposure apparatus having the same configuration as the exposure apparatus 100 according to the first embodiment will be described based on FIG.

  As shown in FIG. 27, the substrate supporting member 69 has a rectangular (substantially square) outline in plan view, and has a rectangular opening in plan view rectangular shape penetrating in the Z-axis direction at the central portion, in the thickness direction It consists of a frame-like member of small size (thin). The substrate support member 69 has a pair of X frame members 61x, which are flat plate members parallel to the XY plane with the X axis direction as the longitudinal direction, at predetermined intervals in the Y axis direction, and the pair of X frame members 61x Each of the end portions on the + X side and the −X side is connected by a Y frame member 61 y which is a flat plate-like member parallel to the XY plane having the Y axis direction as a longitudinal direction. Each of the pair of X frame members 61x and the pair of Y frame members 61y may be made of, for example, a fiber reinforced synthetic resin material such as GFRP (Glass Fiber Reinforced Plastics), or ceramics, etc. to secure rigidity and reduce weight. It is preferable from the viewpoint of

  On the upper surface of the X frame member 61x on the -Y side, a Y moving mirror 194Y formed of a flat mirror having a reflection surface on the -Y side surface is fixed. Further, on the upper surface of the Y frame member 61y on the -X side, an X moving mirror 194X formed of a plane mirror having a reflection surface on the -X side surface is fixed. In this case, neither the holder PH nor the fine movement stage 26 may be provided with the X moving mirror or the Y moving mirror.

Position information (including rotation information in the θz direction) of the substrate support member 69 (ie, the substrate P) in the XY plane is a pair of X interferometers 98X ₁ , 98X that irradiates a measurement beam to the reflection surface of the X moving mirror 194X. ₂ and the above-mentioned substrate stage interferometer system 98 including a pair of Y interferometers 98Y ₁ and 98Y ₂ for irradiating a measurement beam onto the reflection surface of the Y moving mirror 194 Y, for example, constantly detected with a resolution of about 0.5 nm Ru. In this modification, the Y interferometers 98Y ₁ and 98Y ₂ are attached to the side frame 20 on the -Y side of the air floating unit group 84B, and the space above the optical path of the Y interferometer of the first embodiment described above The Y movement mirror 194Y is irradiated with a measurement beam parallel to the Y axis.

  Note that the X interferometer and the Y interferometer each have at least one measurement beam within the movable range of the substrate support member 69 so that the corresponding movable mirror is irradiated with the number and / or length measurement beams. The number or spacing of the optical axes is set. Therefore, the number of interferometers (the number of optical axes) is not limited to two, and depending on the movement stroke of the substrate support member, for example, only one (one axis) or three (three axes) or more good.

  The substrate support member 69 has a plurality of, for example, four holding units 65 for holding the end (outer peripheral edge) of the substrate P by vacuum suction from below. The four holding units 65 are separately attached in the X-axis direction, two by two on opposing surfaces of the pair of X frame members 61x facing each other. The number and arrangement of the holding units are not limited to this, and may be appropriately added according to, for example, the size of the substrate, the ease of bending, and the like. Further, the holding unit may be attached to the Y frame member. The holding unit 65 is, for example, a substrate placement member having an L-shaped cross section provided with a suction pad for suctioning the substrate P by vacuum suction on its upper surface, and a parallel for connecting the substrate placement member to the X frame member 61x. The position of the substrate mounting member is constrained by the rigidity of the parallel plate spring with respect to the X frame member 61x and the Y axis direction with respect to the X frame member 61x, and the elasticity of the plate spring It is configured to be displaced (vertical movement) in the Z-axis direction without rotating in the θx direction. The substrate holding frame having the same configuration as the holding unit 65 and the substrate support member 69 provided with the same is disclosed in detail, for example, in US Patent Application Publication No. 2011/0042874.

  In the modified example of FIG. 27, when the substrate P performs X step or Y step operation, or when the substrate P is carried in and out of the substrate stage device PST, the main controller 50 controls the movable portion 91a of the substrate X step feeding device 91 or the substrate Y. Either the X frame member 61x or the Y frame member 61y of the substrate support member 69 may be adsorbed or held by the movable portion 88a of the step feeding device 88, or the substrate P may be adsorbed or held.

  In the modification of FIG. 27, since the position of the substrate P can be measured by the substrate stage interferometer system 98 via the X movable mirror 194X and the Y movable mirror 194Y fixed to the substrate support member 69, this modification Even when the exposure of the first layer on the substrate P is performed using the exposure apparatus according to the example, the substrate according to the design value based on the positional information of the substrate P measured by the substrate stage interferometer system 98 It becomes possible to perform positioning to the acceleration start position for exposure of each shot area of P with sufficient accuracy. Therefore, according to this modification, it is not necessary to form a mark on the substrate P in advance using a tighter or the like also when exposing the substrate P to the first layer.

  If it is possible to form reflecting surfaces corresponding to the reflecting surfaces of the X moving mirror 94X and the Y moving mirror 94Y on the Y frame member 61y and the X frame member 61x of the substrate support member 69, the X moving mirror 94X is not necessarily required. There is no need to provide the Y movable mirror 94Y. In this case, the weight of the substrate support member 69 can be reduced accordingly.

  The substrate supporting member may be used only at the time of exposure of the first layer to the substrate P, or may be used at the time of exposure of the second and subsequent layers. In the former case, the substrate stage interferometer system 98 needs to measure the position of the fine movement stage 26 when exposing the second and subsequent layers, so for example, the pair of X moving mirrors 94X consisting of the above-mentioned corner cube and It is necessary to attach the Y movable mirror 94Y consisting of a long mirror at the same position as that of the first embodiment described above. Further, in this case, the substrate stage interferometer system 98 is used to measure positional information of the substrate support member 96 (substrate P) at the time of exposure of the first layer and the fine movement stage 26 at the time of exposure of the second layer. However, the present invention is not limited to this, and a substrate interferometer system for measuring the position of the substrate support member 96 (substrate P) may be provided separately from the substrate stage interferometer system 98.

  In addition, as a board | substrate support member, you may use not only a frame-shaped member but the board | substrate support member of a shape where a part of flame | frame was missing. For example, a U-shaped substrate holding frame as disclosed in the eighth embodiment of the above-mentioned US Patent Application Publication No. 2011/0042874 may be used. In addition, as long as the operation at the time of scan exposure of the substrate is not adversely affected, a drive mechanism for assisting drive of the substrate support member 69 in the XY plane, for example, long stroke drive in the X axis direction may be additionally provided. .

Second Embodiment
Next, a second embodiment will be described based on FIG. 28 to FIG. 30 (F). Here, about the component the same as that of a 1st embodiment mentioned above, or equivalent, while using the code which is the same or similar, the explanation is simplified or omitted. The exposure apparatus according to the second embodiment differs from the exposure apparatus 100 according to the first embodiment described above in terms of the components related to the alignment of the substrate P in the exposure of the first layer. The parts are the same as in the first embodiment.

  A plan view of an exposure apparatus 200 according to the second embodiment is simplified and shown in FIG. In FIG. 28, illustration of parts other than the air floating unit groups 84A and 84B, the holder PH, the exposure area IA, and the edge sensor described later is omitted.

Exposure apparatus 200 is a pair of edge sensors for X position measurement (hereinafter abbreviated as X sensor) shown in FIG. 28 in addition to the same components as exposure apparatus 100 according to the first embodiment described above. and 122X _1, 122X _2, 3 one edge sensor for Y position measurement and a (hereinafter, Y sensor _{abbreviated) 122Y 1, 122Y 2, 122Y} 3.

The pair of X sensors 122X ₁ and 122X ₂ are provided on the holder PH. Each of the pair of X sensors 122X ₁ and 122X ₂ irradiates the measurement beam to a scale 120X having a grating having a Y-axis direction as a periodic direction, which is disposed inside the holder PH with the Y-axis direction as the longitudinal direction. It is integrally fixed to the + Z side surface of a pair of encoder heads (not shown) that measure the position (Y position) in the Y-axis direction at the irradiation point of each measurement beam. The X each sensor 122X ₁ and X sensor 122X _2, does not interfere with the adsorption of the substrate P by the holder PH, and are attached to the holder PH so as to be movable in the Y-axis direction integrally with the encoder head. In the present embodiment, the pair of X sensors 122X ₁ and 122X ₂ are used to detect the X position of the edge on the −X side of the substrate P (X position of the substrate P with respect to the holder PH) and rotation in the θz direction. The measurement values of the pair of encoder heads to which each of the X sensors 122X ₁ and 122X ₂ is fixed are used, for example, when detecting the rotation of the substrate P in the θz direction.

The Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ are provided on the lower surface of the barrel base 16 above the air floating unit group 84B. Each of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ is attached to the lens barrel surface plate 16 and has a grating whose periodic direction is in the Y-axis direction relative to a scale (not shown) whose longitudinal direction is in the Y-axis direction. The measurement beams are respectively irradiated, and are separately fixed to the surfaces on the -Z side of three encoder heads that measure the position in the Y-axis direction at the irradiation point of each measurement beam. Each of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ is movable integrally with the encoder head along Y guides 121a, 121b, 121c whose longitudinal direction is the Y-axis direction. Each of the Y guides 121a, 121b, and 121c is driven in the Y-axis direction by, for example, a linear motor. In the present embodiment, each of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ is used to detect the Y position of the edge on the −Y side of the substrate P.

The measurement results of the pair of X sensors 122X ₁ and 122X ₂ and the three Y sensors 122Y ₁ , 122Y ₂ and 122Y ₃ are supplied to the main controller 50. Further, the measurement results of the five encoder heads to which each of the X sensor 122X ₁ , 122X ₂ and the three Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ are fixed are also supplied to the main controller 50. The main controller 50 includes a measurement result by the X sensor 122X _1, 122X _2, they are based on the measurement result of the pair of the encoder head fixed, at each of the detection points of the pair of X sensors 122X _1, 122X ₂ The X position and the θz rotation of the measurement target edge (edge on the -X side) of the substrate P are obtained, and the measurement target edge (on the -Y side) of the substrate P at each detection point of the Y sensors 122Y ₁ , 122Y ₂ , 122Y ₃ Find the Y position of the edge).

  In the exposure apparatus 200 according to the second embodiment, the method of alignment of the substrate at the time of exposure of the first layer to the substrate P is different from that of the first embodiment described above. The same operation is performed in the same procedure as that of the exposure apparatus 100 according to the present embodiment. Hereinafter, the case where the first layer exposure is performed on the substrate P, focusing on the differences, will be described based on FIGS. 29A to 30F and referring to other drawings as appropriate. Do. The exposure area IA shown in FIGS. 29A to 30F is an illumination area to which the illumination light IL is applied via the projection optical system PL at the time of exposure, and in fact, it is not at the time of exposure Although not formed, it is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL. In FIGS. 29A to 30F, the air floating unit groups 84A and 84B are partially omitted.

  Here, the case where six shot areas SA1 to SA6 shown in FIG. 28 are formed in the substrate P will be described.

First, as described above, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and also by substrate transfer device (not shown) The substrate P is carried in (loaded) onto the substrate stage device PST, and the substrate P is placed across the holder PH and part of the air floating unit group 84B (see FIG. 29A). . At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the suction. As a result, a part of the substrate P (about 1/3 of the entire substrate P) is adsorbed and fixed by the holder PH, and a part of the substrate P (about the remainder of the entire substrate P by a part of the air floating unit group 84B). 3) will be in a state of being floated and supported. At this time, as shown in FIG. 29A, the pair of X sensors 122 X ₁ and 122 X ₂ is one end of the first area (the area where the shot area SA 1 is formed) of the substrate P and the Y axis direction. The main controller 50 sets the position of the edge on the −X side corresponding to the other end. Here, the distance between the X sensors 122X ₁ and 122X ₂ is set to be substantially the same as the movement distance of the substrate P in the Y step.

Thereafter, main controller 50 determines the position of fine movement stage 26 (holder PH) with respect to projection optical system PL by the same method of alignment measurement as in the prior art. Next, main controller 50 measures _two X positions and θz rotations of the edge on the −X side of substrate P using a pair of X sensors 122X ₁ and 122X ₂ and Y sensor 122 Y on the most + X side. ₁ is used to measure the Y position of the edge on the -Y side of the substrate P, and alignment measurement of the substrate P with respect to the projection optical system PL is performed. Then, main controller 50 drives coarse movement table 32 and minutely drives fine movement stage 26 based on the measurement result of each edge position and the result of alignment measurement of fine movement stage 26 with respect to projection optical system PL. , And position the substrate P at the scan start position (acceleration start position). At this time, precise fine positioning drive is performed on the coarse movement table 32 of the fine movement stage 26 (holder PH) in the X-axis, Y-axis and θz directions (or in the direction of six degrees of freedom). FIG. 29A shows the state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the first region on the substrate P in this manner. .

  Thereafter, a step-and-scan exposure operation is performed. In the step-and-scan exposure operation, a plurality of areas on the substrate P are sequentially exposed. In the second embodiment, the maximum exposure width (width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4, 5, 6) described later is about 1/3 of the substrate P. .

  From the state of FIG. 29A, the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) are shown as outlined arrows in FIG. 29A. , X direction, and the X scan operation of the substrate P is performed as described above. As a result of this exposure, a shot area SA1 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 29B).

  Next, the Y step operation in the + Y direction for moving the unexposed area of the substrate P onto the holder PH is performed in the same manner as in the first embodiment described above. As a result, the substrate P is such that the second unexposed region (exposure target region) (and the region adjacent thereto on the + X side) adjacent to the shot area SA1 on the −Y side faces the holder PH, and the holder PH And a part of the air floating unit group 84A and a part of the air floating unit group 84B (see FIG. 29C). At this time, the substrate P is floated and supported by the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P is formed by a part of the air floating unit group 84A and a part of the air floating unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is in a state of being floated and supported.

Then, main controller 50 measures the X position and θz rotation of two places of the edge on the −X side of substrate P using the pair of X sensors 122X ₁ and 122X ₂ and Y sensor 122 Y on the most + X side. _1. Measure the Y position of the edge on the -Y side of the substrate P using ₁ .

In the position measurement (alignment measurement) of the substrate P with respect to the projection optical system PL using the above three edge sensors, the main controller 50 first performs one of the exposures before the exposure of the front shot area (in this case, the shot area SA1). substantially the same position as the position on the edge of the -X side of the substrate P measured by using the edge sensor 122X ₂ (measurement point) is measured using the other edge sensor 122X _1. Therefore, main controller 50 can measure the amount of change (displacement) in the X-axis direction of the same measurement target position (measurement point) on the edge on the −X side of substrate P. The main control unit 50, previously before the shot area (in this case, the shot area SA1) using an edge sensor 122Y ₁ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge. That is, main controller 50 measures the displacement amount in the Y-axis direction of the edge on the -Y side of substrate P. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for the exposure of the second region can be performed accurately without any problem.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50, based on the measurement result, the scan start position (acceleration for the second region on the substrate P) Positioning of the substrate P to the start position) and precise micropositioning drive in the X-axis, Y-axis and θz directions (or six degrees of freedom) with respect to the coarse movement table 32 of the fine movement stage 26 are performed. FIG. 29C shows a state in which the substrate P (the holder PH (fine movement stage 26)) is positioned at the scan start position in this manner.

  Then, main controller 50 causes + X of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) as shown by the outlined arrow in FIG. 29C. Directional acceleration is started, and scan exposure is performed as described above. By this exposure, a shot area SA2 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 29D).

  Next, the Y step operation in the + Y direction for moving the unexposed area of the substrate P onto the holder PH is performed in the same manner as described above. Thereby, as shown in FIG. 29E, the substrate P is adjacent to the third unexposed region (exposure target region) (and to this on the + X side) adjacent to the shot area SA2 on the -Y side. Region) faces the holder PH, and is placed across the holder PH and part of the air floating unit group 84A. At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84A. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is adsorbed and fixed by the holder PH, and a part of the substrate P (about the remaining 2 / of the whole substrate P) by a part of the air floating unit group 84A. 3) will be in a state of being floated and supported.

Then, main controller 50 measures the X position of the two locations on the −X side edge of substrate P using the pair of X sensors 122 X ₁ and 122 X ₂ and also uses substrate Y using the Y sensor 122 Y _1. Measure the Y position of the edge on the -Y side of. Also in this case, the position (measurement point) substantially the same as the position on the edge on the −X side of the substrate P measured using one edge sensor 122 X ₂ before exposure of the previous shot area, as described above edge sensor 122X ₁ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₁ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge of. For this reason, in spite of having removed the substrate P from the holder PH once, new alignment measurement for exposure of the 3rd field can be performed with sufficient accuracy, without hindrance.

  Then, based on the result of the alignment measurement, main controller 50 positions substrate P at the scan start position (acceleration start position) for exposure of the third region on substrate P, as shown in FIG. 29 (E), acceleration of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) in the -X direction is started, as indicated by the outlined arrows in FIG. Scan exposure is performed in the same manner as in FIG. FIG. 29F shows a state in which the scan exposure for the third region on the substrate P is completed and the substrate P (substrate stages (26, 28, 32, PH)) is stopped. By this exposure, a shot area SA3 in which the sensitive layer is exposed is formed on the substrate P.

Next, main controller 50 prepares for acceleration for the next exposure, and X of substrate P is driven slightly in the + X direction, as shown by the outlined arrow in FIG. 29 (F). While performing the step operation. in this case, as shown in FIG. 29 (F), by performing simultaneous measurement by the Y sensor 122Y ₁ and 122Y _3, previously prior to the formation of shot areas SA3, the substrate P the measurement values of the Y sensor 122Y ₁ of measuring the Y position of the -Y side edge, the measurement of the Y sensor 122Y ₃ used for measuring the Y position of the -Y side edge of the substrate P before the exposure of the next region The relationship with the value is determined (calibration is performed between the Y sensors 122Y ₁ and 122Y ₃ ). In this calibration, it is desirable to adjust so that the rotation of the substrate P becomes substantially zero. In this case, since the substrate P is not removed from the holder PH after the exposure of the shot area SA3, the substrate may be positioned for the next exposure based on the above alignment result. However, next, once the substrate P is removed from the holder PH, the subsequent alignment of the substrate becomes difficult. Accordingly, as such a situation does not occur, and calibrated between Y sensor 122Y ₁ and 122Y ₃ and simultaneous measurement and Y sensor 122Y _1, 122Y ₃ by. Therefore, even if the substrate P is once removed from the holder PH after the exposure of the shot area SA3, new alignment measurement for the exposure of the fourth area (the projection optical system PL relative to the projection optical system PL) is performed without any problem. Position measurement can be performed with high accuracy. Incidentally, depending on the arrangement of the shot areas on the substrate P, when X step, if simultaneous measurement is difficult also contemplated by the Y sensor 122Y ₁ and 122Y _3. In such a case, with the movement of the substrate, simultaneous measurement by the Y sensor 122Y ₁ and 122Y _2, and subsequent to this, by performing simultaneous measurement by the Y sensor 122Y ₂ and 122Y _3, both at the same time the measurement result of the The calibration between the Y sensors 122Y ₁ and 122Y ₃ may be performed based on this.

  Main controller 50 positions substrate P (holder PH (fine movement stage 26)) at the acceleration start position for exposure of the fourth region based on the above measurement results, and ends the X step. FIG. 30A shows the holder PH (fine movement stage 26) positioned at the scan start position. In parallel with the X step operation of substrate P, main controller 50 returns mask stage MST to the acceleration start position.

  Then, main controller 50, as shown by the white arrow in FIG. 30A, the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) Acceleration in the X direction is started, and scan exposure is performed as described above. By this exposure, a shot area SA4 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 30B).

  Next, the Y step operation in the -Y direction for moving the unexposed area of the substrate P onto the holder PH is performed in the same manner as described above. Thus, in the substrate P, the shot area SA2 and the fifth area adjacent to the shot area SA2 on the + X side face the holder PH, and the holder PH, a part of the air floating unit group 84A, and the air floating unit group It will be in the state mounted across a part of 84B (refer FIG.30 (C)). At this time, the substrate P is floated and supported by the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P is formed by a part of the air floating unit group 84A and a part of the air floating unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is in a state of being floated and supported.

Then, main controller 50 uses a pair of X sensors 122X _1, 122X _2, with measuring the X position of the two positions of the -X side edge of the substrate P, with Y sensor 122Y _3, the substrate P Measure the Y position of the edge on the -Y side of. Also in this case, the position (measurement point) substantially the same as the position on the edge on the -X side of the substrate P measured using _one edge sensor 122X ₁ before exposure of the previous shot area, as described above, edge sensors 122X ₂ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₃ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge of. For this reason, new alignment measurement for exposure of the fifth area can be performed accurately without any trouble even though the substrate P is once removed from the holder PH.

  Then, based on the result of the alignment measurement, main controller 50 positions substrate P at the scan start position (acceleration start position) for exposure of the fifth region on substrate P, as shown in FIG. 30 (C), as indicated by the outlined arrows, start acceleration of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) in the -X direction, The scan exposure is performed in the same manner as described above. By this exposure, a shot area SA5 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 30D).

Next, the Y step operation in the -Y direction for moving the last unexposed area of the substrate P onto the holder PH is performed in the same manner as described above. As a result, the substrate P is placed so that the last unexposed shot area and the shot area SA1 adjacent thereto face the holder PH and straddle the holder PH and part of the air floating unit group 84B. It will be in a state (refer FIG. 30 (E)). At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P (about the remaining part of the entire substrate P is about 2 /). 3) will be in a state of being floated and supported. Then, main controller 50 measures X position of two locations of the edge on the -X side of substrate P using a pair of X sensors 122X ₁ and 122X ₂ and rotates in the θz direction, and Y sensor 122Y ₃ The Y position of the edge on the -Y side of the substrate P is measured. Also in this case, the position (measurement point) substantially the same as the position on the edge on the -X side of the substrate P measured using _one edge sensor 122X ₁ before exposure of the previous shot area, as described above, edge sensors 122X ₂ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₃ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge of. Therefore, new alignment measurement for exposure of the sixth area can be performed with high accuracy without any problem even though the substrate P is once removed from the holder PH.

  Then, main controller 50 positions substrate P at the scan start position (acceleration start position) for exposure of the sixth region on substrate P based on the result of the alignment measurement (the fine movement stage 26 Substrate (including precise fine positioning in the X-axis, Y-axis and θz directions (or 6 DOF directions) with respect to coarse movement table 32), and as shown by the outlined arrows in FIG. Acceleration in the -X direction of P (substrate stage (26, 28, 32, PH)) and mask M (mask stage MST) is started, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA6 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 30F).

  On the other hand, immediately before the new alignment measurement of the substrate P is started, a new substrate P is carried (charged) onto the air floating unit group 84A by the substrate carry-in device (not shown), and the exposure for the shot area SA6 is performed. At the same time, the newly introduced substrate P is transported. On the other hand, the substrate P after exposure for all the shot areas SA1 to SA6 is carried from the holder PH onto the air floating unit group 84B by the main controller 50, and carried out in the + X direction by the substrate carry-out device (not shown). Be done.

  Almost simultaneously with the slide transport of the exposed substrate P onto the air floating unit group 84B, the newly introduced substrate P is a part (a part of 1/3 of the -Y side by the main controller 50). ) Is placed on the holder PH, and a part of the holder PH is attracted (fixed) by the holder PH. Then, an alignment operation similar to that described above is performed on the substrate P partially fixed to the holder PH in parallel with the unloading of the exposed substrate P, and then the substrate P and the mask M are removed. Acceleration in the + X direction is started, and in the same manner as described above, scan exposure is performed on the first region (the region on the most -Y side and + X side). Thereafter, in the same procedure as in the exposure of the first substrate P described above, the alignment (X step, Y step), the operation of exposure, etc. to the remaining area on the second substrate P, and Operations such as alignment (X step, Y step) and exposure to the third and subsequent substrates are repeated.

  As described above, the exposure apparatus 200 according to the second embodiment can obtain the same effects as those of the exposure apparatus 100 according to the first embodiment described above. In addition to this, according to the exposure apparatus 200, it is not necessary to form a mark on the substrate P in advance using a tighter or the like also when exposing the substrate P to the first layer.

In the second embodiment, the X sensors 122X ₁ and 122X ₂ are provided in the holder PH. However, when the X sensors 122X ₁ and 122X ₂ are not provided in the holder PH, for example, the Y sensors 122Y _{1 to} 122Y described above A pair of X sensors having the same configuration as ₃ may be provided outside the fine adjustment stage 26.

Third Embodiment
Next, an exposure apparatus 300 according to a third embodiment will be described based on FIGS. 31 to 33F. Here, about the component the same as that of 1st Embodiment mentioned above, or equivalent, while using the code | symbol of the same or resemblance | analogue, the description is simplified or abbreviate | omitted. The exposure apparatus according to the third embodiment is different from the exposure apparatus 100 according to the first embodiment described above in the component parts related to the alignment of the substrate P in the exposure of the first layer. The parts are the same as in the first embodiment.

  FIG. 31 is a simplified plan view of an exposure apparatus 300 according to the third embodiment. In FIG. 31, illustration of parts other than the air floating unit groups 84A and 84B, the holder PH, the exposure area IA, the detection unit described later, and the interferometer is omitted.

Exposure apparatus 300 is a detection unit for measuring a pair of X positions (hereinafter referred to as an X detection unit, hereinafter) shown in FIG. 31 in addition to the same components as exposure apparatus 100 according to the first embodiment described above. ) and 124X _1, 124X _2, 3 one Y position measurement of the detection unit (hereinafter, abbreviated as Y detection _unit) and a _{124Y 1, 124Y 2, 124Y 3} .

Each of the pair of X detection units 124X ₁ and 124X ₂ is formed of an L-shaped member with an XZ cross section, and is movable along the guides 126a and 126b arranged in the inside of the holder PH with the X axis direction as the longitudinal direction. ing. Each of the pair of X detection units 124X ₁ and 124X ₂ is mounted on the holder PH so as to be movable in the X-axis direction without interfering with the adsorption of the substrate P by the holder PH, for example, by the linear motor Driven in the X axis direction.

Each of the pair of X detection unit 124x _1, 124x _2, the reflecting surface is provided on the surface of the -X side, the side surface and the back surface of the -X side end of the substrate P can be sucked and fixed. In this case, the main controller 50 performs suction on the substrate P and release, ie, attachment or removal of the suction, of each of the X detection units 124X ₁ and 124X ₂ . Each of the pair of X detection units 124X ₁ and 124X ₂ is provided with a step on the surface opposite to the back surface of the substrate P, and the presence of the step makes the reflecting surface and the substrate P in the X axis direction. The substrate P is fixed by suction so that the positional relationship becomes constant.

In the exposure apparatus 300 according to the third embodiment, a pair of X interferometers 130X ₁ , 130X for measuring the X position of the substrate P by irradiating the measurement beams to the pair of X detection units 124X ₁ , 124X ₂ respectively. ₂ is provided. The X interferometers 130X ₁ and 130X ₂ irradiate measurement beams parallel to the X axis at approximately the same height as the side surface (end surface) of the substrate P on the reflection surface of each of the X detection units 124X ₁ and 124X ₂ . The smaller the distance ΔZ in the Z-axis direction between the measurement beam and the upper surface of the substrate P, the better, and for example, 1 mm or less. When ΔZ exceeds 1 mm, it is desirable that at least one of X interferometers 130X ₁ and 130X ₂ use a multi-axis interferometer capable of measuring the pitching (θy rotation) of X detection unit 124X ₁ or 124X ₂ .

The Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ are provided on the lower surface of the barrel base 16 above the air floating unit group 84B. Each of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ is formed of a member having a U-shaped YZ cross section, and is attached to the barrel base 16 along the guides 121a, 121b, 121c whose longitudinal direction is the Y axis direction. It is movable. Each of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ has at its lower end a suction portion having an L-shaped YZ cross section that can be suction fixed to the side surface and the back surface of the end portion of the substrate P on the -Y side; A reflective surface is provided on the surface on the Y side. In this case, the main controller 50 performs suction on the substrate P and release of suction, that is, attachment or removal of each of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ . Each of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ is driven in the Y-axis direction by, for example, a linear motor.

Each of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ is adsorbed and fixed to the substrate P so that the positional relationship between the reflective surface and the substrate P becomes constant in the Y-axis direction.

In the exposure apparatus 300 according to the third embodiment, three Y interferometers 130Y ₁ for measuring the Y position of the substrate P by irradiating measurement beams to the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ respectively. 130Y ₂ and 130Y ₃ are provided. Y interferometers 130Y ₁ , 130Y ₂ , 130Y ₃ pass through the space above air levitation unit group 84B and measure beams parallel to the Y axis at the respective reflecting surfaces of Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ The light is irradiated to a position substantially at the same height as the side surface (end surface) of the substrate P. The smaller the distance between the measurement beam and the upper surface of the substrate P in the Z-axis direction, the better. For example, it is desirable that the distance be 1 mm or less. Here, when there is a risk that the movement of the Y detection unit 124Y _1, 124Y _2, 124Y ₃ is prevented, the movement of the Y detection unit 124Y _1, 124Y _2, 124Y ₃ a part of the upper surface of the air floating unit group 84B A recess (not shown) is formed along the path.

The measurement results of the pair of X interferometers 130X ₁ , 130X ₂ and the three Y interferometers 130Y ₁ , 130Y ₂ , 130Y ₃ are supplied to the main controller 50. The main controller 50, based on the measurement result by the X interferometer 130X _1, 130X _2, X position of the substrate P at the irradiation point of the respective measurement beams of the pair of X interferometers 130X _1, 130X _2, and the substrate P The θz rotation is determined, and the Y position of the substrate P at the irradiation point of each measurement beam is determined based on the measurement results of each of the Y interferometers 130Y ₁ , 130Y ₂ , 130Y ₃ .

  In the exposure apparatus 300 according to the third embodiment, the method of alignment of the substrate at the time of exposure of the first layer to the substrate P is different from that of the first embodiment described above. The same operation is performed in the same procedure as that of the exposure apparatus 100 according to the present embodiment. In the following, the case where the first layer exposure is performed on the substrate P focusing on the differences will be described based on FIGS. 32A to 33F and referring to other drawings as appropriate. Do. The exposure area IA shown in FIGS. 32A to 33F is an illumination area to which the illumination light IL is applied via the projection optical system PL at the time of exposure, and in fact, it is not at the time of exposure Although not formed, it is always shown in order to clarify the positional relationship between the substrate P and the projection optical system PL. Further, in FIGS. 32A to 33F, the air levitation unit groups 84A and 84B are partially omitted.

  Here, the case where six shot areas SA1 to SA6 shown in FIG. 31 are formed on the substrate P will be described.

First, as described above, under the control of main controller 50, mask transfer device (mask loader) (not shown) loads mask M onto mask stage MST, and also by substrate transfer device (not shown) The substrate P is carried in (loaded) onto the substrate stage device PST, and the substrate P is placed across the holder PH and part of the air floating unit group 84B (see FIG. 32A). . At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the suction. As a result, a part of the substrate P (about 1/3 of the entire substrate P) is adsorbed and fixed by the holder PH, and a part of the substrate P (about the remainder of the entire substrate P by a part of the air floating unit group 84B). 3) will be in a state of being floated and supported. At this time, as shown in FIG. 32A, the main control unit 50 controls the pair of X detection units 124X ₁ and 124X _{2 to} use the first area of the substrate P (the area where the shot area SA1 is formed). Is attached to the position of the edge on the -X side corresponding to one end and the other end in the Y-axis direction of Further, Y detection unit 124Y ₁ the most + X side, by the main control unit 50, is attached to an end portion of the -Y side of the substrate P.

  Thereafter, main controller 50 determines the position of fine movement stage 26 (holder PH) with respect to projection optical system PL by the same method of alignment measurement as in the prior art.

Then, main controller 50 uses the pair of X interferometers 130X ₁ and 130X ₂ to detect the X positions of X detection units 124X ₁ and 124X ₂ , ie, _two X positions of the end face on the −X side of substrate P and with measuring the θz rotation, with Y interferometer 130Y ₁ the most + X side, Y position of the Y detection unit 124Y _1, i.e. (the end surface on the -Y side) of the substrate P to measure the Y position (FIG. 32 ( See A). At this time, the distance between the X interferometers 130X ₁ and 130X ₂ is set to substantially the same distance as the movement distance of the substrate P in the Y step.

Then, main controller 50 drives coarse movement table 32 based on the measurement result of the position of substrate P in the direction of 3 degrees of freedom in the XY plane and the result of alignment measurement of fine movement stage 26 with respect to projection optical system PL. At the same time, the fine movement stage 26 is slightly driven to position the substrate P at the scan start position (acceleration start position). This positioning, first, in a state where the Y detection unit 124Y ₁ is attached to the substrate P, for coarse table 32 of the fine movement stage 26 (holder PH) on the basis of the measurement results Y interferometer 130Y _1, Y-axis direction After positioning of the direction is performed, and thereafter adsorption to the substrate P is released, the X-axis and θz directions (or X-axis, θz, Z-axis, θx, θy) of the coarse movement table 32 of the fine movement stage 26 (holder PH) Precise positioning in each direction). In the following, although the description is omitted, in the third embodiment, when all of the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ are not attached to the substrate P, such as at the time of scan exposure to be described later When measuring the Y position of the substrate P when the Y position of the substrate P can not be measured by any of the total 130Y ₁ , 130Y ₂ , 130Y ₃ , when the substrate P is adsorbed to the holder PH, the substrate stage interferometer described above It is performed by the Y interferometers 98Y ₁ , 98Y _{2 of the} system 98.

  As described above, FIG. 32A shows the state immediately after the substrate P is positioned at the scan start position (acceleration start position) for exposure of the first region on the substrate P. There is.

  Thereafter, in the step-and-scan type exposure operation in which the step-and-scan type exposure operation is performed, a plurality of regions on the substrate P are sequentially exposed. In the third embodiment, the maximum exposure width (the width in the Y-axis direction) of each shot area SAn (n = 1, 2, 3, 4, 5, 6) is about 1/3 of that of the substrate P.

From the state of FIG. 32 (A), the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) are shown as outlined arrows in FIG. 32 (A). , -X direction, and the scan exposure of the substrate P is performed as described above. As a result of this exposure, a shot area SA1 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 32B). In the third embodiment, control of the X position and the θz rotation of the substrate P during scan exposure is performed by the main controller 50 as measurement results of the X interferometers 130X ₁ and 130X ₂ and / or the substrate stage interferometer system It is performed based on the measurement results of the 98 X interferometers 98X ₁ and 98X ₂ .

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and moves the unexposed area of the substrate P onto the holder PH in the + Y direction as described above. Similar to the first embodiment, the step is performed using the substrate Y step-feed device 88 (see the outlined arrow in FIG. 32B). The main control unit 50, the Y detection unit 124Y _1, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _1, the substrate P Drive in the + Y direction. As a result, the substrate P is such that the second unexposed region (exposure target region) (and the region adjacent thereto on the + X side) adjacent to the shot area SA1 on the −Y side faces the holder PH, and the holder PH And the air floating unit group 84A and a part of the air floating unit group 84B (see FIG. 32C). That is, rough positioning of the Y step and the Y position of the substrate P is performed in this manner. At this time, the substrate P is floated and supported by the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P is formed by a part of the air floating unit group 84A and a part of the air floating unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is in a state of being floated and supported.

Then, main controller 50 attaches a pair of X detection units 124X ₁ and 124X ₂ at two positions on the end of substrate P on the −X side, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124 X ₁ While measuring the X position ( _two X positions of the edge on the −X side of the substrate P) and the θz rotation of 124 × ₂ , the Y position of the substrate P is measured using the Y interferometer 130Y ₁ .

In position measurement (alignment measurement) of the substrate P with respect to the projection optical system PL using the three interferometers 130X ₁ , 130X ₂ , and 130Y ₁ described above, the main control device 50 _first obtains the front shot area (in this case, the shot). substantially the same position as the position on the -X side edge of the substrate P measured using one of the X interferometer 130X ₂ before the exposure area SA1) (measurement points), with the other of X interferometer 130X ₁ Measure. Therefore, main controller 50 can measure the amount of change (displacement) in the X-axis direction of the same measurement target position (measurement point) on the edge on the −X side of substrate P. The main control unit 50, previously before the shot area (in this case, the shot area SA1) using Y interferometer 130Y ₁ of measuring the Y position of the substrate P before exposure, to measure the Y position of the substrate P . That is, main controller 50 measures the amount of displacement of substrate P in the Y-axis direction. Therefore, even if the substrate P is once removed from the holder PH, new alignment measurement for the exposure of the second region can be performed accurately without any problem.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, the main controller 50 exposes the second region on the substrate P in the same procedure as described above based on the result of the alignment measurement. Positioning to the scan start position (acceleration start position) for the above, and precise fine positioning in the Y-axis, X-axis and .theta.z directions (or six degrees of freedom) with respect to the coarse movement table 32 of the fine movement stage 26. FIG. 32C shows the state where the holder PH (fine movement stage 26) is positioned at the scan start position in this way.

  Then, main controller 50 causes + X of the substrate P (substrate stage (26, 28, 32, PH)) and the mask M (mask stage MST) as shown by the outlined arrow in FIG. Directional acceleration is started, and scan exposure is performed as described above. By this exposure, a shot area SA2 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 32D).

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and the Y step operation in the + Y direction for moving the unexposed area of the substrate P onto the holder PH is the same as described above. (See open arrow in FIG. 32D). The main control unit 50, the Y detection unit 124Y _1, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _1, the substrate P Drive in the + Y direction. Thereby, as shown in FIG. 32E, the substrate P is adjacent to the third area (exposure target area) (and the exposure target area on the + X side) which is not exposed and adjacent to the shot area SA2 on the -Y side. Region) faces the holder PH, and is placed across the holder PH and part of the air floating unit group 84A. At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84A. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is adsorbed and fixed by the holder PH, and a part of the substrate P (about the remaining part of the entire substrate P is about 2 /). 3) will be in a state of being floated and supported.

Then, main controller 50 mounts a pair of X detection units 124X ₁ and 124X ₂ at two positions on the end of substrate P on the −X side, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124X. _1, X position of 124x ₂ with measuring the and θz rotation (X two positions on the -X side edge of the substrate P), for measuring the Y position of the substrate P by using the Y interferometer 130Y _1. In this case, in the same manner as described above, substantially the same position as the position on the edge of the -X side of the substrate P measured using one of the X interferometer 130X ₂ prior to exposure before the shot area (measurement point), measured using the other of X interferometers 130X _1, before shot area (in this case, the shot area SA2) using Y interferometer 130Y ₁ of measuring the Y position of the substrate P before exposure, Y position of the substrate P Measure For this reason, in spite of having removed the substrate P from the holder PH once, new alignment measurement for exposure of the 3rd field can be performed with sufficient accuracy, without hindrance.

  Then, when new alignment measurement of the substrate P is completed, the main controller 50 starts scanning for exposure of the third region on the substrate P in the same procedure as described above based on the result of alignment measurement. Positioning of the substrate P to the position (acceleration start position) is performed, and the substrate P (substrate stage (26, 28, 32, PH)) and the mask M are performed as shown by the outlined arrow in FIG. Acceleration in the -X direction with (mask stage MST) is started, and scan exposure is performed in the same manner as described above. FIG. 32F shows a state in which the scanning exposure on the third region on the substrate P is completed and the substrate stages (26, 28, 32, PH) are stopped. By this exposure, a shot area SA3 in which the sensitive layer is exposed is formed on the substrate P.

Next, main controller 50 prepares for acceleration for the next exposure, and X of substrate P is driven slightly in the + X direction, as shown by the outlined arrow in FIG. 32 (F). Perform step operation. Prior to this X step operation, main controller 50 removes Y detection unit 124 Y ₃ from substrate P. In this case, since the substrate P is not removed from the holder PH after the exposure of the shot area SA3, the main control apparatus 50 can position the substrate for the next exposure based on the above alignment result. . The X step operation of the substrate P is performed for its positioning. Main controller 50 performs the X step operation of substrate P while monitoring the X position of substrate P and the θz rotation based on the measurement values of X interferometers 130X ₁ and 130X ₂ .

After X steps of substrate P, main controller 50 attaches Y detection unit 124 Y ₃ to the end portion of substrate P on the -Y side as shown in FIG. 33A, Y interferometer 130 Y ₃ Is used to measure the Y position of the substrate P, and the Y position of the substrate P is finely adjusted. Thereby, positioning of the fourth area of the substrate P at the acceleration start position for exposure is completed. FIG. 33A shows a state in which the substrate P (the holder PH (fine movement stage 26)) is positioned at the scan start position. In this case, main controller 50 returns mask stage MST to the acceleration start position in parallel with the above-described X step operation of substrate P. Here, in the third embodiment, one of the pair of X detection units 124 X ₁ and 124 X ₂ and Y detection units 124 Y _{1 to} 124 Y ₃ , for example, Y detection unit 124 Y ₃ is attached to the substrate P, and X interferometer 130 X _1, using a 130X _2, detects the X position of the X detection unit 124x _1, 124x _2, by detecting the Y-position of the Y detection unit 124Y ₃ with Y interferometer 130Y _3, reference of the substrate P The position, for example, the position of the center of the substrate in the X, Y, θz directions can be determined. Therefore, after exposure of the shot area SA3, the substrate P can be positioned at the acceleration start position for the fourth exposure without any problem even if it is temporarily removed from the holder PH.

Then, main controller 50, remove the Y detection unit 124Y ₃ from the substrate P, as shown by a white arrow in FIG. 33 (A), the substrate P (substrate stage (26,28,32, PH)) The acceleration in the -X direction of the mask M and the mask M (mask stage MST) is started, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA4 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 33B).

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and moves the unexposed area of the substrate P onto the holder PH in the -Y direction in the Y step described above. Similarly, the process is performed (see the open arrow in FIG. 33 (B)). The main control unit 50, the Y detection unit 124Y _3, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _3, the substrate P Drive in the -Y direction. Thus, the shot area SA2 on the substrate P and the fifth area adjacent to the shot area SA2 on the + X side face the holder PH, and the holder PH, part of the air floating unit group 84A, and the air floating unit group It will be in the state mounted across a part of 84B (refer FIG.33 (C)). At this time, the substrate P is floated and supported by the holder PH, a part of the air floating unit group 84A, and a part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P is formed by a part of the air floating unit group 84A and a part of the air floating unit group 84B. (The remaining approximately 2/3 of the entire substrate P) is in a state of being floated and supported.

Then, main controller 50 mounts a pair of X detection units 124X ₁ and 124X ₂ at two positions on the end of substrate P on the −X side, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124X. _1, X position of 124x ₂ with measuring the and θz rotation (X two positions on the -X side edge of the substrate P), for measuring the Y position of the substrate P by using the Y interferometer 130Y _1. Also in this case, the position (measurement point) substantially the same as the position on the edge on the -X side of the substrate P measured using _one edge sensor 122X ₁ before exposure of the previous shot area, as described above, edge sensors 122X ₂ measured using the previous shot area (in this case, the shot area SA1) using an edge sensor 122Y ₃ of measuring the Y position of the -Y side of the edge of the substrate P before the exposure of the substrate P Measure the Y position of the same edge of. For this reason, new alignment measurement for exposure of the fifth area can be performed accurately without any trouble even though the substrate P is once removed from the holder PH.

  Then, when the new alignment measurement of the substrate P with respect to the projection optical system PL is completed, exposure of the fifth region on the substrate P is performed by the main controller 50 based on the result of the alignment measurement in the same procedure as described above. Positioning of the substrate P to the scan start position (acceleration start position) for the target, and the substrate P (substrate stage (26, 28, 32, PH) as shown by the outlined arrow in FIG. ) And the mask M (mask stage MST) are accelerated in the -X direction, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA5 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 33D).

Next, the main controller 50 removes the X detection units 124X ₁ and 124X ₂ from the substrate P, and moves the last unexposed area of the substrate P onto the holder PH in the -Y direction Y step operation, The process is performed in the same manner as described above (see open arrows in FIG. 33D). The main control unit 50, the Y detection unit 124Y _3, attached to the end portion of the -Y side of the substrate P, during the Y step operation, while monitoring the change in the Y position using the Y interferometer 130Y _3, the substrate P Drive in the -Y direction. As a result, as shown in FIG. 33E, in the substrate P, the last unexposed area and the shot area SA1 adjacent thereto face the holder PH, and the holder PH and the air floating unit group 84B It will be in the state of being placed across a part. At this time, the substrate P is floated and supported by the holder PH and part of the air floating unit group 84B. Then, the main control device 50 switches the holder PH from the exhaust to the intake (suction). As a result, a part of the substrate P (about 1/3 of the entire substrate P) is fixed by suction by the holder PH, and a part of the substrate P (about the remaining part of the entire substrate P is about 2 /). 3) will be in a state of being floated and supported.

Then, main controller 50 mounts a pair of X detection units 124X ₁ and 124X ₂ at two positions on the end of substrate P on the −X side, and uses X interferometers 130X ₁ and 130X ₂ to detect X detection unit 124X. _1, X position of 124x ₂ (2 places of the X position of the -X side edge of the substrate P), and with measuring the θz rotation of the substrate P, measure the Y position of the substrate P by using the Y interferometer 130Y ₃ Do. Also in this case, in the same manner as described above, a position (measurement point) substantially the same as the position on the edge on the -X side of the substrate P measured using _one X interferometer 130X1 before exposure of the previous shot area measured using the other of X interferometer 130X _2, before the shot area (in this case, the shot area SA5) using Y interferometer 130Y ₃ of measuring the Y position of the substrate P before exposure, Y position of the substrate P Measure Therefore, new alignment measurement for exposure of the sixth area can be performed with high accuracy without any problem even though the substrate P is once removed from the holder PH.

  Then, when new alignment measurement of the substrate P is finished, the main controller 50 starts scanning for exposure of the sixth region on the substrate P in the same procedure as described above based on the result of alignment measurement. The positioning of the substrate P to the position (acceleration start position) is performed, and the substrate P (substrate stage (26, 28, 32, PH)) and the mask M are performed as shown by the outlined arrow in FIG. Acceleration in the -X direction with (mask stage MST) is started, and scan exposure is performed in the same manner as described above. By this exposure, a shot area SA6 in which the sensitive layer is exposed is formed on the substrate P (see FIG. 33F).

  On the other hand, immediately before the new alignment measurement of the substrate P is started, a new substrate P is carried (charged) onto the air floating unit group 84A by the substrate carry-in device (not shown), and the exposure for the shot area SA6 is performed. At the same time, the newly introduced substrate P is transported. On the other hand, the substrate P after exposure for all the shot areas SA1 to SA6 is carried from the holder PH onto the air floating unit group 84B by the main controller 50, and carried out in the + X direction by the substrate carry-out device (not shown). Be done.

  Almost simultaneously with the slide transport of the exposed substrate P onto the air floating unit group 84B, the newly introduced substrate P is a part (a part of 1/3 of the -Y side by the main controller 50). ) Is placed on the holder PH, and a part of the holder PH is attracted (fixed) by the holder PH. Then, an alignment operation similar to that described above is performed on the substrate P partially fixed to the holder PH in parallel with the unloading of the exposed substrate P, and then the substrate P and the mask M are removed. Acceleration in the + X direction is started, and in the same manner as described above, scan exposure is performed on the first region (the region on the most -Y side and + X side). Thereafter, in the same procedure as in the exposure of the first substrate P described above, the alignment (X step, Y step), the operation of exposure, etc. to the remaining area on the second substrate P, and Operations such as alignment (X step, Y step) and exposure to the third and subsequent substrates are repeated.

  As described above, according to the exposure apparatus 300 of the third embodiment, the same effects as those of the exposure apparatus 100 of the first embodiment can be obtained. In addition to this, according to the exposure apparatus 300, it is not necessary to form a mark on the substrate P in advance using a tighter or the like also when exposing the substrate P to the first layer.

In the third embodiment, the X detection units 124X ₁ and 124X ₂ are provided in the holder PH, but in the case where the X detection units 124X ₁ and 124X ₂ are not provided in the holder PH, for example, the Y detection unit 124Y described above a pair of Y detection unit having the same constitution as _{1 ~124Y 3} may be provided outside of the fine moving stage 26.

In the third embodiment, the Y detection units 124Y ₁ , 124Y ₂ , 124Y ₃ are provided on the lower surface of the barrel base 16 above the air floating unit group 84B, but the invention is not limited thereto. A space in which the guides 121a, 121b, and 121c can be disposed is provided in a part of one air floating unit group 84B, and the Y detection units 124Y ₁ , 124Y ₂ , and 124Y ₃ are provided in the air gap together with the guides 121a, 121b, and 121c. It may be arranged.

In the third embodiment, the X detection units 124X ₁ and 124X ₂ and the Y detection units 124Y _{1 to} 124Y ₃ are used by using the X interferometers 130X ₁ and 130X ₂ and the Y interferometers 130Y _{1 to} 130Y ₃ respectively. It illustrates about the case of detecting the position of. However, not limited to this, the position of at least one detection unit may be measured by an encoder.

  In the above embodiments, the size of the substrate holding surface of the holder PH in the Y-axis direction is not limited to 1/3 of the size of the substrate P in the Y-axis direction, and may be 1/2, 1/4, etc. The point is that the size of the substrate holding surface of the holder PH in the Y-axis direction may be smaller than the size of the substrate P in the Y-axis direction to some extent or more. In practice, the size is set to be equal to (slightly larger than) the size of the shot area formed on the substrate P.

  In each of the above embodiments, the air levitation unit groups 84A and 84B are installed on a frame separated from the coarse movement table 32 and the fine adjustment stage 26 on one side and the other side of the holder PH in the Y axis direction. However, at least one of the air levitation unit groups 84A and 84B may be mounted on the coarse movement table 32 so as to be movable in the X-axis direction, or by following the coarse movement table Another movable body may be provided, and the air levitation unit group may be mounted on the other movable body so as to be movable in the X-axis direction. In this case, the above-mentioned substrate Y step-feed device 88 disposed inside the air levitation unit group on the coarse movement table 32 on which the air levitation unit group is mounted or another moving body that moves following the coarse movement table. May be provided.

  In each of the above embodiments, the case where the air floating unit groups 84A and 84B are used has been described for the purpose of preventing the bending of the substrate P. However, the present invention is not limited thereto, and contact type rolling bearings using rollers or balls. The drooping prevention device of the substrate provided with the above may be replaced with at least a part of the air floating unit of each of the above embodiments. In order to prevent the deflection of the substrate P, a device for preventing drooping of the substrate provided with a bearing member other than the air floating unit and the rolling bearing may be used.

  In each of the above-described embodiments, the case where the holder PH is mounted on the fine movement stage 26 has been described. However, the present invention is not limited to this. When ceramics or the like is used as a material of the fine movement stage, etching processing etc. The holding unit having the same function as the holder PH for holding the substrate may be integrated with the fine movement stage.

  In addition, there are some components which are not commonly provided in the above-described embodiments, but may not necessarily be provided in the exposure apparatus. For example, a weight cancellation device is not required. In this case, a moving stage for moving the holder is required, but the moving stage may be a so-called coarse / fine adjustment stage or a single 6 DOF stage. The point is that the moving stage only needs to be able to drive the holder in the XY plane (at least in the X-axis direction), and it is more desirable if it can be driven in the direction of six degrees of freedom.

  In each of the above embodiments, the exposure apparatus is a projection exposure apparatus that performs scanning exposure with step-and-scan operation of the substrate P. However, the present invention is not limited to this. A step-and-stitch method is also used. The above embodiments can be applied to the projection exposure apparatus of the present invention, and also to a proximity exposure apparatus which does not use a projection optical system.

In the exposure apparatus of each of the above embodiments, the illumination light is ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm) It may be In addition, as illumination light, for example, single wavelength laser light in the infrared region or visible region oscillated from a DFB semiconductor laser or fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium) Alternatively, harmonics of which wavelength is converted to ultraviolet light using a non-linear optical crystal may be used. Also, a solid state laser (wavelength: 355 nm, 266 nm) or the like may be used.

  In each of the above embodiments, the projection optical system PL is a multi-lens projection optical system including a plurality of projection optical systems (projection optical units). However, the number of projection optical units is not limited to this. There is no limitation, and one or more may be sufficient. Further, the projection optical system is not limited to the multi-lens type projection optical system, and may be, for example, a projection optical system using a large offner type mirror.

  In each of the above embodiments, the projection optical system PL has the same magnification as the projection magnification. However, the present invention is not limited to this. The projection optical system may be either a reduction system or a magnification system.

  In each of the above embodiments, a light transmission type mask in which a predetermined light shielding pattern (or a phase pattern / light reduction pattern) is formed on a light transmitting mask substrate is used. As disclosed in Japanese Patent No. 6,778,257, a transmission pattern or a reflection pattern, or an electronic mask (variable shaped mask) for forming a light emission pattern based on electronic data of a pattern to be exposed, for example, Alternatively, a variable molding mask using a DMD (Digital Micro-mirror Device), which is a type of non-light emitting type image display device (also referred to as a spatial light modulator), may be used.

  The exposure apparatus according to each of the above embodiments is a substrate having a size (including at least one of outer diameter, diagonal and one side) of 500 mm or more, for example, a large substrate for flat panel display (FPD) such as a liquid crystal display element. It is particularly effective to apply to an exposure apparatus that performs exposure. This is because the present invention is made to cope with the increase in size of the substrate.

  Moreover, the liquid crystal display element as a micro device can be manufactured using the exposure apparatus which concerns on said each embodiment. First, a so-called photolithography process is performed in which a pattern image is formed on a photosensitive substrate (a glass substrate or the like coated with a resist). In the photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate using the exposure apparatus of each of the above embodiments. Thereafter, the exposed substrate is subjected to steps such as a developing step, an etching step and a resist removing step to form a predetermined pattern on the substrate. By repeating this pattern formation process a plurality of times, patterns of a plurality of layers are formed in an overlapping manner on the substrate. The alignment in each of the exposure of the first layer and the exposure of the second and subsequent layers is performed as described above. Thereafter, a liquid crystal display device as a microdevice can be obtained by passing through a color filter formation process, a cell assembly process, a module assembly process and the like.

  The exposure apparatus and method of the present invention are suitable for scanning exposure of a substrate having a plurality of divided areas. Further, the device manufacturing method and the flat panel display manufacturing method of the present invention are suitable for manufacturing a liquid crystal display element and the like.

69 ... substrate support member, 98 ... substrate stage interferometer system, 122X ₁ , 122X ₂ ... X sensor, 122Y _{1 to} 122Y ₃ ... Y sensor, 124X ₁ , 124X ₂ ... X detection unit, 124Y _{1 to} 124Y ₃ ... Y detection Unit: 130 X ₁ , 130 X ₂ ... X interferometer, 130 Y _{1 to} 130 Y ₃ ... Y interferometer, P ... substrate, SA _{1 to} SA 6 ... shot area, M _{11 to} M ₄₄ ... mark, AL 1 to AL 8 ... alignment detection system, IL ... illumination light.

Claims (8)

An exposure apparatus which moves a substrate having a plurality of divided regions in a first direction to scan and expose each of the plurality of divided regions.
A mark detection unit that detects a mark provided on the substrate;
A support portion for supporting a portion of the substrate;
A driving unit for moving the substrate relative to the support unit in a second direction intersecting the first direction;
In the mark detection unit, after the first region of the plurality of divided regions is scan-exposed, the second region supported by the support unit by the relative movement of the substrate in the second direction by the drive unit is An exposure apparatus for detecting the mark detected before scanning exposure of the first area before scanning exposure.   The exposure apparatus according to claim 1, wherein the substrate is a flat panel display substrate.   The exposure apparatus according to claim 1, wherein a size of the substrate including at least one of an outer diameter, a diagonal, and one side is 500 mm or more. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 3;
Developing the exposed substrate. Exposing the substrate using the exposure apparatus according to any one of claims 1 to 3;
Developing the exposed substrate. An exposure method for moving a substrate having a plurality of divided regions in a first direction to scan and expose each of the plurality of divided regions,
Detecting a plurality of marks provided on the substrate by the mark detection unit;
Supporting a portion of the substrate by a support portion;
Moving the substrate relative to the support in a second direction that intersects the first direction;
In the detection, after the first region of the plurality of divided regions is scan-exposed, the second region supported by the support portion is scan-exposed by the relative movement of the substrate in the second direction. An exposure method for detecting the mark detected before scanning and exposing the first area. Exposing the substrate using the exposure method according to claim 6;
Developing the exposed substrate. Exposing the substrate using the exposure method according to claim 6;
Developing the exposed substrate.

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