JP2019013989A - 研削装置 - Google Patents
研削装置 Download PDFInfo
- Publication number
- JP2019013989A JP2019013989A JP2017131102A JP2017131102A JP2019013989A JP 2019013989 A JP2019013989 A JP 2019013989A JP 2017131102 A JP2017131102 A JP 2017131102A JP 2017131102 A JP2017131102 A JP 2017131102A JP 2019013989 A JP2019013989 A JP 2019013989A
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- water
- wafer
- mount
- spindle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 131
- 238000007599 discharging Methods 0.000 claims abstract description 9
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000004575 stone Substances 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 description 6
- 239000006061 abrasive grain Substances 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
- B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Description
5a:保持面 6:蛇腹 7:ネジ
10:研削手段 11:研削ホイール 12:砥石 13:マウント 13a:装着面
14:スピンドル 15:支持手段 16:モータ 17:ホルダ
18:研削水供給源 19:エア供給源
20:研削送り手段 21:ボールネジ 22:モータ 23:ガイドレール
24:昇降板
30:研削水供給手段 31:貫通路 32,32A:研削水ノズル
33:筒体 33a:自由端部 33b:内壁
34,34A:放水部 34a:面取り部 35:誘導部
36:フランジ部 37:ネジ貫通穴 38:自由端部 39:面取り部
Claims (1)
- ウエーハを保持する保持テーブルと、ウエーハの径より小さい径で環状に砥石が配置された研削ホイールが回転可能に装着され該保持テーブルに保持されたウエーハの外周部を残して中央部を研削する研削手段と、該砥石とウエーハとに研削水を供給する研削水供給手段と、を備えた研削装置であって、
該研削手段は、
該研削ホイールを装着する装着面を有するマウントと、
該マウントの中心と軸心とを一致させ一方の端を連結するスピンドルと、
該スピンドルを回転可能に支持する支持手段と、
該スピンドルを回転させるモータとを備え、
該研削水供給手段は、
該スピンドルと該スピンドルに連結された該マウントとを貫通する貫通路と、
該マウントの該装着面側の中心に配設され該貫通路に連通して該研削水を放水する研削水ノズルとを備え、
該研削水ノズルは、
該マウントから垂下する筒体と、
該筒体の自由端部に形成される放水部と、
該貫通路と該放水部との間に配設され、該貫通路を流下した該研削水を該筒体の内壁を伝って流れるように誘導する誘導部と、を備え、
該放水部は、該研削水を末広がりに放水させる面取り部を備える研削装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017131102A JP7067878B2 (ja) | 2017-07-04 | 2017-07-04 | 研削装置 |
TW107119151A TWI763861B (zh) | 2017-07-04 | 2018-06-04 | 磨削裝置 |
CN201810666928.1A CN109202690B (zh) | 2017-07-04 | 2018-06-26 | 磨削装置 |
KR1020180076987A KR102554148B1 (ko) | 2017-07-04 | 2018-07-03 | 연삭 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017131102A JP7067878B2 (ja) | 2017-07-04 | 2017-07-04 | 研削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019013989A true JP2019013989A (ja) | 2019-01-31 |
JP7067878B2 JP7067878B2 (ja) | 2022-05-16 |
Family
ID=64989837
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017131102A Active JP7067878B2 (ja) | 2017-07-04 | 2017-07-04 | 研削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7067878B2 (ja) |
KR (1) | KR102554148B1 (ja) |
CN (1) | CN109202690B (ja) |
TW (1) | TWI763861B (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110181384A (zh) * | 2019-06-06 | 2019-08-30 | 宿迁德特材料科技有限公司 | 一种全封闭冷却抛光机 |
CN111408990B (zh) * | 2020-03-27 | 2021-08-24 | 深圳市赛平精密技术有限公司 | 全自动刮边机 |
EP4144480B1 (de) * | 2021-09-01 | 2024-01-31 | Siltronic AG | Verfahren zum schleifen von halbleiterscheiben |
CN116512118B (zh) * | 2023-07-04 | 2023-09-15 | 云科智能制造(沈阳)有限公司 | 一种龙门式加工中心磨削用主轴动力控制装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52109291U (ja) * | 1976-02-16 | 1977-08-19 | ||
JPH04109857U (ja) * | 1991-03-04 | 1992-09-24 | 三菱重工業株式会社 | 研削用ホルダ |
JP2009094326A (ja) * | 2007-10-10 | 2009-04-30 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
JP2009125915A (ja) * | 2007-11-28 | 2009-06-11 | Disco Abrasive Syst Ltd | 研削ホイール装着機構 |
JP2011041987A (ja) * | 2009-08-19 | 2011-03-03 | Nsk Ltd | 内面研削装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5117712A (en) * | 1974-08-05 | 1976-02-12 | Tokyo Shibaura Electric Co | Ekireishikitaabinno doyokukyusuisochi |
JPS58143948A (ja) * | 1982-02-19 | 1983-08-26 | Hitachi Ltd | ウエハ研削装置 |
JPH02298464A (ja) * | 1989-05-12 | 1990-12-10 | Matsushita Electric Ind Co Ltd | スピンドル装置 |
CN2228395Y (zh) * | 1995-06-14 | 1996-06-05 | 佛山市北江机械厂 | 磨头组合装置 |
JP2001162533A (ja) * | 1999-12-06 | 2001-06-19 | Seiko Seiki Co Ltd | 加工方法および加工装置 |
SG126885A1 (en) | 2005-04-27 | 2006-11-29 | Disco Corp | Semiconductor wafer and processing method for same |
JP2010052076A (ja) * | 2008-08-27 | 2010-03-11 | Disco Abrasive Syst Ltd | 研削ホイール |
CN201500930U (zh) * | 2009-09-30 | 2010-06-09 | 朱楚中 | 内冷式端面磨头 |
CN102712076B (zh) * | 2010-01-13 | 2014-10-15 | 联合材料公司 | 超级磨粒砂轮、使用了该超级磨粒砂轮的晶片的制造方法以及晶片 |
JP2011167818A (ja) | 2010-02-19 | 2011-09-01 | Disco Corp | 加工装置 |
CN201769087U (zh) * | 2010-07-27 | 2011-03-23 | 佛山市科达石材机械有限公司 | 具有冷却水压力供水装置的磨削加工设备 |
CN102398222B (zh) * | 2011-05-26 | 2013-06-05 | 云南飞隆劳尔设备有限公司 | 一种可传输磨削液的单路高速旋转接头 |
CN102284907B (zh) * | 2011-08-31 | 2013-07-10 | 孟灵杰 | 具有中空冷却冲洗结构的球体磨床磨头主轴总成 |
CN204353954U (zh) * | 2014-12-30 | 2015-05-27 | 平凉市老兵科技研发有限公司 | 电主轴中心处具有磨削冷却进水通道的减薄机 |
CN105108653A (zh) * | 2015-09-25 | 2015-12-02 | 广东赛因迪科技股份有限公司 | 一种瓷片磨削的冷却方法及装置 |
CN205363486U (zh) * | 2015-12-14 | 2016-07-06 | 濮阳贝英数控机械设备有限公司 | 铁路双滚道磨床冷却装置 |
CN206029588U (zh) * | 2016-09-14 | 2017-03-22 | 广东石油化工学院 | 一种应用于五金水磨机的内冷却主轴机构 |
-
2017
- 2017-07-04 JP JP2017131102A patent/JP7067878B2/ja active Active
-
2018
- 2018-06-04 TW TW107119151A patent/TWI763861B/zh active
- 2018-06-26 CN CN201810666928.1A patent/CN109202690B/zh active Active
- 2018-07-03 KR KR1020180076987A patent/KR102554148B1/ko active IP Right Grant
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52109291U (ja) * | 1976-02-16 | 1977-08-19 | ||
JPH04109857U (ja) * | 1991-03-04 | 1992-09-24 | 三菱重工業株式会社 | 研削用ホルダ |
JP2009094326A (ja) * | 2007-10-10 | 2009-04-30 | Disco Abrasive Syst Ltd | ウェーハの研削方法 |
JP2009125915A (ja) * | 2007-11-28 | 2009-06-11 | Disco Abrasive Syst Ltd | 研削ホイール装着機構 |
JP2011041987A (ja) * | 2009-08-19 | 2011-03-03 | Nsk Ltd | 内面研削装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7067878B2 (ja) | 2022-05-16 |
TWI763861B (zh) | 2022-05-11 |
CN109202690A (zh) | 2019-01-15 |
KR20190004667A (ko) | 2019-01-14 |
CN109202690B (zh) | 2022-06-24 |
KR102554148B1 (ko) | 2023-07-10 |
TW201907468A (zh) | 2019-02-16 |
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