JP2018530164A - イメージセンシングチップのためのパッケージング方法およびパッケージ構造 - Google Patents
イメージセンシングチップのためのパッケージング方法およびパッケージ構造 Download PDFInfo
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Abstract
Description
本開示は、半導体の技術分野に関し、特に、ウエハレベル半導体チップのためのパッケージング方法に関する。
ウエハレベルチップサイズパッケージング(WLCSP)技術が、現在主流の半導体チップパッケージング技術である。この技術では、ウエハ全体をパッケージ化してテストを行ない、その後ウエハが切断されて個々のチップパージ完成品が得られる。このパッケージング技術を使用することによって、パッケージ化された個々のチップ完成品は個々の結晶粒とほぼ同じサイズになる。このサイズは、より軽く、より小さく、より短く、より薄く、かつより安価のマイクロ電子製品に求められる市場の需要を満たす。ウエハレベルチップサイズパッケージング技術は、現在のパッケージング分野において人気であり、将来の開発動向を示している。
本開示の目的は、再配線層がはんだパッドから剥がれることを防いで不良チップの問題を解決し、イメージセンシングチップパッケージの信頼性を向上するために、ウエハレベルイメージセンシングチップパッケージング方法およびイメージセンシングチップパッケージを提供することである。
本発明によると、イメージセンシングチップパッケージが提供される。このイメージセンシングチップパッケージは、第1の表面および第1の表面と反対側の第2の表面を含む基板と、第1の表面上に配置されたイメージセンシング領域および接触パッドと、第2の表面上に配置され第1の表面に向けて延在する開口部とを備える。接触パッドは開口部を介して露出される。イメージセンシングチップパッケージはさらに、基板の側壁を覆う感光性インクを備える。感光性インクは開口部を覆い、開口部の各々と感光性インクとの間に中空のくぼみが形成されている。基板の側壁は傾斜側壁を含み、傾斜側壁の一方の端部が第2の表面に接続されている。
好ましくは、基板の傾斜側壁と第2の表面との間の角度が40°〜85°の範囲であり得る。
好ましくは、イメージセンシングチップパッケージはさらに、基板の第1の表面と揃えられこれと積層される保護基板と、保護基板と基板との間に配置され、イメージセンシング領域を囲む支持ユニットとを備え得る。感光性インクは、支持ユニットの側壁の少なくとも一部を覆う。イメージセンシングチップパッケージはさらに、開口部の各々の側壁上におよび基板の第2の表面上に配置された絶縁層と、絶縁層上におよび開口部の底部に配置された再配線層とを備え得る。再配線層は接触パッドに電気的に接続され、感光性インクは再配線層を覆い、感光性インクには再配線層が露出される貫通孔が設けられている。イメージセンシングチップパッケージはさらに、貫通孔の各々に配置され、再配線層に電気的に接続されるはんだボールを備え得る。
本開示の特定の実施形態が、図面と共に以下で詳細に説明される。実施形態は本開示に限定することを目的とするものではなく、当業者による実施形態に従った構造、方法、または機能へのさまざまな変更は本開示の保護範囲に含まれる。
保護基板200が設けられ、複数の支持ユニット210が保護基板200の一方側に格子状に配置される。本実施形態では、支持ユニット210は、感光性インクで形成され、露光および現像プロセスで保護基板200の一方側に形成される。
本実施形態では、感光性インク117はスピンコーティングプロセスでウエハ100の第2の表面102上に塗布される。スピンコーティング速度は、感光性インクの粘度に基づいて調節可能であり、感光性インク117はV字形状の切断トレンチ103を完全に充填し開口部113を覆い、開口部113と感光性インク117との間に中空のくぼみ119を形成する。
Claims (15)
- 第1の表面および前記第1の表面と反対側の第2の表面を含むウエハを設けることを備え、前記ウエハはグリッド状に配置された複数のイメージセンシングチップを有し、前記イメージセンシングチップの各々はイメージセンシング領域と接触パッドとを有し、前記イメージセンシング領域および前記接触パッドは前記ウエハの前記第1の表面側に配置されており、
前記ウエハの前記第2の表面上に前記第1の表面に向かって延在する開口部を形成することを備え、前記接触パッドは前記開口部を介して露出されており、
前記ウエハの前記第2の表面上に前記第1の表面に向かって延在するV字形状の切断トレンチを形成することと、
前記ウエハの前記第2の表面に感光性インクを塗布して前記感光性インクで前記V字形状の切断トレンチを充填し、前記感光性インクで前記開口部を覆い、かつ、前記開口部の各々と前記感光性インクとの間に中空のくぼみを形成することとを備える、イメージセンシングチップパッケージング方法。 - 前記V字形状の切断トレンチおよび前記開口部は、同じエッチングプロセスで前記ウエハの前記第2の表面に形成される、請求項1に記載のイメージセンシングチップパッケージング方法。
- 前記V字形状の切断トレンチは、カッターを用いた前記ウエハの前記第2の表面からの切断によって形成される、請求項1に記載のイメージセンシングチップパッケージング方法。
- 前記V字形状の切断トレンチおよび前記開口部を前記ウエハの前記第2の表面に形成する前に、
保護基板を設けることをさらに備え、前記保護基板は格子状に配置された支持ユニットを有し、前記支持ユニットの各々が前記複数のイメージセンシングチップのうちの1つに対応し、
前記支持ユニットが前記ウエハと前記保護基板との間に位置している状態で、前記ウエハの前記第1の表面を前記保護基板と揃え前記保護基板と積層することと、
前記ウエハの前記第2の表面を研磨して薄くすることとをさらに備える、請求項1に記載のイメージセンシングチップパッケージング方法。 - 前記V字形状の切断トレンチを形成した後で前記感光性インクを塗布する前に、カッターによって、前記V字形状の切断トレンチに沿って切断して前記支持ユニットの少なくとも一部内を切断することをさらに備える、請求項4に記載のイメージセンシングチップパッケージング方法。
- 前記カッターの切断幅は、前記ウエハの前記第2の表面付近の前記V字形状の溝の各々の開口部の幅よりも小さい、請求項5に記載のイメージセンシングチップパッケージング方法。
- 前記V字形状の切断トレンチは、前記ウエハの前記第2の表面からのカッターによる切断によって形成され、前記カッターは、前記支持ユニットの一部内を少なくとも切断する、請求項4に記載のイメージセンシングチップパッケージング方法。
- 前記感光性インクを塗布する前に、
前記開口部の各々の側壁上に、および前記ウエハの前記第2の表面上に絶縁層を形成することと、
前記接触パッドに電気的に接続される再配線層を前記絶縁層上におよび前記開口部の前記底部に形成することとをさらに備え、前記感光性インクを前記ウエハの前記第2の表面に塗布した後に、
前記感光性インクに複数の貫通孔を形成することをさらに備え、前記再配線層は前記貫通孔を介して露出され、
前記再配線層に電気的に接続されるはんだボールを前記貫通孔の各々において形成することをさらに備える、請求項1に記載のイメージセンシングチップパッケージング方法。 - 前記感光性インクの粘度は12Kcps以上である、請求項1に記載のイメージセンシングチップパッケージング方法。
- 第1の表面および前記第1の表面と反対側の第2の表面を含む基板と、
前記第1の表面上に配置されたイメージセンシング領域および接触パッドと、
前記第2の表面上に配置され前記第1の表面に向けて延在する開口部とを備え、前記接触パッドは前記開口部を介して露出され、
前記基板の側壁を覆う感光性インクを備え、
前記感光性インクは前記開口部を覆い、前記開口部の各々と前記感光性インクとの間に中空のくぼみが形成され、
前記基板の前記側壁は傾斜側壁を含み、前記傾斜側壁の一方の端部が前記第2の表面に接続されている、イメージセンシングチップパッケージ。 - 前記基板の前記側壁はさらに縦方向側壁を含み、前記縦方向側壁の一方の端部が前記傾斜側壁に接続され、前記縦方向側壁の他方の端部が前記第1の表面に接続される、請求項10に記載のイメージセンシングチップパッケージ。
- 前記傾斜側壁の他方の端部が前記基板の前記第1の表面に接続されている、請求項10に記載のイメージセンシングチップパッケージ。
- 前記傾斜側壁と前記基板の前記第2の表面との間の角度が40°〜85°の範囲である、請求項10に記載のイメージセンシングチップパッケージ。
- 前記感光性インクの粘度は12Kcps以上である、請求項10に記載のイメージセンシングチップパッケージ。
- 前記基板の前記第1の表面と揃えられ前記第1の表面と積層される保護基板と、
前記保護基板と前記基板との間に配置され、前記イメージセンシング領域を囲む支持ユニットとをさらに備え、前記感光性インクは前記支持ユニットの側壁の少なくとも一部を覆い、
前記開口部の各々の側壁上と前記基板の前記第2の表面上に配置された絶縁層と、
前記絶縁層上と前記開口部の前記底部とに配置された再配線層とをさらに備え、前記再配線層は前記接触パッドに電気的に接続され、前記感光性インクは前記再配線層を覆い、前記感光性インクには前記再配線層が露出される貫通孔が設けられており、
前記貫通孔の各々に配置され、前記再配線層に電気的に接続されるはんだボールをさらに備える、請求項10に記載のイメージセンシングチップパッケージ。
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