JP2018530150A5 - - Google Patents

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Publication number
JP2018530150A5
JP2018530150A5 JP2018512877A JP2018512877A JP2018530150A5 JP 2018530150 A5 JP2018530150 A5 JP 2018530150A5 JP 2018512877 A JP2018512877 A JP 2018512877A JP 2018512877 A JP2018512877 A JP 2018512877A JP 2018530150 A5 JP2018530150 A5 JP 2018530150A5
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JP
Japan
Prior art keywords
sensor
sensor assembly
substrate support
support surface
disposed
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Application number
JP2018512877A
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English (en)
Japanese (ja)
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JP6878413B2 (ja
JP2018530150A (ja
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Priority claimed from US14/852,485 external-priority patent/US10879046B2/en
Application filed filed Critical
Publication of JP2018530150A publication Critical patent/JP2018530150A/ja
Publication of JP2018530150A5 publication Critical patent/JP2018530150A5/ja
Priority to JP2021075947A priority Critical patent/JP7112565B2/ja
Application granted granted Critical
Publication of JP6878413B2 publication Critical patent/JP6878413B2/ja
Priority to JP2022116938A priority patent/JP7443430B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018512877A 2015-09-11 2016-08-01 リアルタイムの力および膜応力制御を備えた基板支持体 Active JP6878413B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2021075947A JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体
JP2022116938A JP7443430B2 (ja) 2015-09-11 2022-07-22 リアルタイムの力および膜応力制御を備えた基板支持体

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/852,485 US10879046B2 (en) 2015-09-11 2015-09-11 Substrate support with real time force and film stress control
US14/852,485 2015-09-11
PCT/US2016/044989 WO2017044201A1 (en) 2015-09-11 2016-08-01 Substrate support with real time force and film stress control

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021075947A Division JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体

Publications (3)

Publication Number Publication Date
JP2018530150A JP2018530150A (ja) 2018-10-11
JP2018530150A5 true JP2018530150A5 (https=) 2019-09-12
JP6878413B2 JP6878413B2 (ja) 2021-05-26

Family

ID=58237095

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2018512877A Active JP6878413B2 (ja) 2015-09-11 2016-08-01 リアルタイムの力および膜応力制御を備えた基板支持体
JP2021075947A Active JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体
JP2022116938A Active JP7443430B2 (ja) 2015-09-11 2022-07-22 リアルタイムの力および膜応力制御を備えた基板支持体

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021075947A Active JP7112565B2 (ja) 2015-09-11 2021-04-28 リアルタイムの力および膜応力制御を備えた基板支持体
JP2022116938A Active JP7443430B2 (ja) 2015-09-11 2022-07-22 リアルタイムの力および膜応力制御を備えた基板支持体

Country Status (7)

Country Link
US (4) US10879046B2 (https=)
JP (3) JP6878413B2 (https=)
KR (2) KR20240129089A (https=)
CN (3) CN206610799U (https=)
SG (1) SG10202002453XA (https=)
TW (3) TW202036780A (https=)
WO (1) WO2017044201A1 (https=)

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CN109129410B (zh) * 2018-09-30 2021-07-27 重庆大学 夹爪为光纤Fabry-Perot干涉仪且可夹持力自传感的微夹钳
JP7209515B2 (ja) * 2018-11-27 2023-01-20 東京エレクトロン株式会社 基板保持機構および成膜装置
US12125728B2 (en) * 2019-01-21 2024-10-22 Applied Materials, Inc. Substrate carrier
CN112470249B (zh) * 2019-05-14 2022-05-27 玛特森技术公司 具有聚焦环调整组件的等离子处理设备
US11415463B2 (en) * 2019-06-04 2022-08-16 Applied Materials, Inc. Contactless workpiece temperature sensor
US20220228263A1 (en) * 2019-06-07 2022-07-21 Lam Research Corporation Independently adjustable flowpath conductance in multi-station semiconductor processing
KR20250164864A (ko) * 2019-11-22 2025-11-25 램 리써치 코포레이션 코인 슬롯 및 볼 록 (ball-lock) 세라믹 리프트 핀 홀더들
WO2022174919A1 (en) * 2021-02-19 2022-08-25 Applied Materials, Inc. Substrate support, method of processing a substrate, and processing system
CN215925072U (zh) * 2020-09-24 2022-03-01 株式会社国际电气 基板处理装置
WO2022173720A1 (en) * 2021-02-09 2022-08-18 Fuse Energy Technologies Corp. Adjustable probe for plasma diagnostics
US11851761B2 (en) * 2021-04-16 2023-12-26 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor processing tool
US20230141012A1 (en) * 2021-11-09 2023-05-11 Applied Materials, Inc. Pressure puck diagnostic wafer
CN116476193B (zh) * 2023-03-24 2024-01-05 上海数造机电科技股份有限公司 基于静电吸附的陶瓷3d打印构建平台、方法及系统
CN116552611B (zh) * 2023-05-11 2025-11-25 盛吉盛(宁波)半导体科技有限公司 一种用于支撑与搬运静电卡盘组件的底座工装
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