|
US4015706A
(en)
|
1971-11-15 |
1977-04-05 |
Chemcut Corporation |
Connecting modules for an etching system
|
|
DE2253944C2
(de)
|
1972-11-03 |
1983-02-24 |
Agfa-Gevaert Ag, 5090 Leverkusen |
Verfahren zur Herstellung eines Reliefbildes
|
|
US4127438A
(en)
|
1977-11-07 |
1978-11-28 |
International Business Machines Corporation |
Adhesion promoter for additively plated printed circuit boards
|
|
DE3402883A1
(de)
|
1984-01-27 |
1985-08-01 |
Siemens AG, 1000 Berlin und 8000 München |
Leiterplatten aus schichtpressstoffen
|
|
DE3683194D1
(de)
|
1985-06-07 |
1992-02-13 |
Sekisui Chemical Co Ltd |
Photovernetzbare zusammensetzung.
|
|
US4946711A
(en)
*
|
1987-10-14 |
1990-08-07 |
Desoto, Inc. |
Masking compositions and method for applying the same
|
|
JP2585070B2
(ja)
*
|
1988-08-02 |
1997-02-26 |
日本ペイント株式会社 |
画像形成方法
|
|
EP0563251A1
(en)
*
|
1990-12-20 |
1993-10-06 |
Exxon Chemical Patents Inc. |
Uv/eb curable butyl copolymers for lithographic and corrosion-resistant coating applications
|
|
JP3799069B2
(ja)
|
1993-12-14 |
2006-07-19 |
キヤノン株式会社 |
エッチングレジスト性組成物、これを用いたパターン形成方法及び配線基板の製造方法
|
|
GB9425031D0
(en)
|
1994-12-09 |
1995-02-08 |
Alpha Metals Ltd |
Printed circuit board manufacture
|
|
EP0753989B1
(en)
|
1995-07-11 |
2005-09-21 |
Delphi Technologies, Inc. |
Coatings and methods, especially for circuit boards
|
|
DE69800652T2
(de)
*
|
1997-02-25 |
2001-08-23 |
E.I. Du Pont De Nemours And Co., Wilmington |
Flexible, flammhemmende fotopolymerisierbare Zusammensetzung zur Beschichtung von Leiterplatten
|
|
US6222136B1
(en)
|
1997-11-12 |
2001-04-24 |
International Business Machines Corporation |
Printed circuit board with continuous connective bumps
|
|
US7282240B1
(en)
*
|
1998-04-21 |
2007-10-16 |
President And Fellows Of Harvard College |
Elastomeric mask and use in fabrication of devices
|
|
IL129307A0
(en)
*
|
1999-04-04 |
2000-02-17 |
Scitex Corp Ltd |
Process for direct digital printing of circuit boards
|
|
GB9916060D0
(en)
|
1999-07-08 |
1999-09-08 |
Isis Innovation |
Printed circuit fabrication
|
|
ATE326354T1
(de)
|
1999-07-30 |
2006-06-15 |
Seiko Epson Corp |
Aufzeichnungsverfahren mit der verwendung eines aufzeichnungsmediums und eines druckverfahrens mit zwei flüssigkomponenten darauf
|
|
US6399273B1
(en)
*
|
1999-08-13 |
2002-06-04 |
Board Of Regents, University Of Texas System |
Water-processable photoresist compositions
|
|
DE60103529T2
(de)
*
|
2000-03-29 |
2005-06-02 |
Kanagawa University, Yokohama |
Durch licht und wärme aushärtbare harzzusammensetzung, aus dieser hergestellte lichtempfindliche trockenfolie und verfahren zur bildung eines musters damit
|
|
DE10066028C2
(de)
|
2000-07-07 |
2003-04-24 |
Atotech Deutschland Gmbh |
Kupfersubstrat mit aufgerauhten Oberflächen
|
|
JP3754303B2
(ja)
|
2001-02-16 |
2006-03-08 |
株式会社日立インフォメーションテクノロジー |
Ｓｄｒａｍリフレッシュ回路
|
|
JP2002254794A
(ja)
*
|
2001-03-01 |
2002-09-11 |
Seiko Epson Corp |
記録媒体に二液を用いて印刷する記録方法
|
|
JP2003012971A
(ja)
*
|
2001-06-28 |
2003-01-15 |
Konica Corp |
インクジェット記録方法
|
|
JP2006517004A
(ja)
|
2001-08-31 |
2006-07-13 |
セミトゥール・インコーポレイテッド |
電気泳動エマルジョン付着装置及び方法
|
|
US20030177639A1
(en)
|
2002-03-19 |
2003-09-25 |
Berg N. Edward |
Process and apparatus for manufacturing printed circuit boards
|
|
US6709962B2
(en)
|
2002-03-19 |
2004-03-23 |
N. Edward Berg |
Process for manufacturing printed circuit boards
|
|
SG107593A1
(en)
|
2002-06-04 |
2004-12-29 |
Agency Science Tech & Res |
Method for electroless metalisation of polymer substrate
|
|
GB0221891D0
(en)
*
|
2002-09-20 |
2002-10-30 |
Avecia Ltd |
Process
|
|
TWI291726B
(en)
|
2002-10-25 |
2007-12-21 |
Nanya Technology Corp |
Process for etching metal layer
|
|
US7005241B2
(en)
|
2003-06-09 |
2006-02-28 |
Shinko Electric Industries Co., Ltd. |
Process for making circuit board or lead frame
|
|
JP2005033049A
(ja)
|
2003-07-08 |
2005-02-03 |
Nec Toppan Circuit Solutions Inc |
プリント配線板の配線パターン形成方法及びプリント配線板の製造方法
|
|
JP2005079479A
(ja)
|
2003-09-02 |
2005-03-24 |
Asahi Kasei Electronics Co Ltd |
レジスト直描用レジストインク
|
|
US7477627B2
(en)
|
2003-09-10 |
2009-01-13 |
Intel Corporation |
Method and device of adaptive control of data rate, fragmentation and request to send protection in wireless networks
|
|
US20050067378A1
(en)
|
2003-09-30 |
2005-03-31 |
Harry Fuerhaupter |
Method for micro-roughening treatment of copper and mixed-metal circuitry
|
|
US7445697B2
(en)
|
2003-10-22 |
2008-11-04 |
Nexx Systems, Inc. |
Method and apparatus for fluid processing a workpiece
|
|
GB0324947D0
(en)
*
|
2003-10-25 |
2003-11-26 |
Avecia Ltd |
Process
|
|
EP1643817A4
(en)
|
2004-03-03 |
2010-04-21 |
Ibiden Co Ltd |
RESIN SOLUTION, PAINT PROCESSING AND PCB
|
|
KR100585138B1
(ko)
*
|
2004-04-08 |
2006-05-30 |
삼성전자주식회사 |
반도체 소자 제조용 마스크 패턴 및 그 형성 방법과 미세패턴을 가지는 반도체 소자의 제조 방법
|
|
US20050250052A1
(en)
*
|
2004-05-10 |
2005-11-10 |
Nguyen Khe C |
Maskless lithography using UV absorbing nano particle
|
|
GB0414840D0
(en)
|
2004-07-02 |
2004-08-04 |
Ncr Int Inc |
Self-service terminal
|
|
JP4731135B2
(ja)
|
2004-07-02 |
2011-07-20 |
ルネサスエレクトロニクス株式会社 |
微細パターン形成材料を用いた電子デバイス装置の製造方法
|
|
KR100733920B1
(ko)
|
2004-09-17 |
2007-07-02 |
주식회사 엘지화학 |
에칭 레지스트용 잉크 조성물, 이를 이용한 에칭 레지스트패턴 형성 방법 및 미세 유로 형성 방법
|
|
JP2009506187A
(ja)
*
|
2005-08-31 |
2009-02-12 |
プリンター リミテッド |
Ｕｖ硬化可能なハイブリッド硬化インクジェットインク組成物およびそれを使用するソルダマスク
|
|
KR100643934B1
(ko)
|
2005-09-02 |
2006-11-10 |
삼성전기주식회사 |
인쇄회로기판의 회로패턴 형성방법
|
|
US7686986B2
(en)
|
2006-01-05 |
2010-03-30 |
Headwaters Technology Innovation, Llc |
Magnesium hydroxide nanoparticles, methods of making same and compositions incorporating same
|
|
JP2007250884A
(ja)
|
2006-03-16 |
2007-09-27 |
Shirai Denshi Kogyo Kk |
フレキシブルプリント基板およびその製造方法
|
|
US20070237899A1
(en)
|
2006-04-05 |
2007-10-11 |
David Sawoska |
Process for creating a pattern on a copper surface
|
|
KR101232179B1
(ko)
*
|
2006-12-04 |
2013-02-12 |
엘지디스플레이 주식회사 |
박막 패턴의 제조장치 및 방법
|
|
CN101052278A
(zh)
*
|
2007-04-19 |
2007-10-10 |
复旦大学 |
一种基于掩膜打印的金属布线方法
|
|
US20080308003A1
(en)
|
2007-06-13 |
2008-12-18 |
Krol Andrew M |
UV inkjet resist
|
|
JP5454834B2
(ja)
|
2007-08-30 |
2014-03-26 |
日立化成株式会社 |
粗化処理装置
|
|
JP2009158593A
(ja)
*
|
2007-12-25 |
2009-07-16 |
Tessera Interconnect Materials Inc |
バンプ構造およびその製造方法
|
|
WO2009116401A1
(ja)
*
|
2008-03-17 |
2009-09-24 |
日立化成工業株式会社 |
感光性樹脂組成物、並びにこれを用いた感光性エレメント、ソルダーレジスト及びプリント配線板
|
|
KR100986287B1
(ko)
*
|
2008-05-09 |
2010-10-07 |
삼성전기주식회사 |
잉크젯 토출장치
|
|
EP2562599B1
(en)
|
2009-01-29 |
2014-12-10 |
Digiflex Ltd. |
Process for producing a photomask on a photopolymeric surface
|
|
JP2011171323A
(ja)
|
2010-02-16 |
2011-09-01 |
Mitsubishi Paper Mills Ltd |
銅又は銅合金のエッチング方法
|
|
JP2011243256A
(ja)
|
2010-05-19 |
2011-12-01 |
Dainippon Printing Co Ltd |
サスペンション用フレキシャー基板、サスペンション、ヘッド付サスペンション、およびハードディスクドライブ
|
|
KR20140130234A
(ko)
|
2010-11-17 |
2014-11-07 |
히타치가세이가부시끼가이샤 |
감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조 방법
|
|
US20120288683A1
(en)
|
2011-05-10 |
2012-11-15 |
Chin-Te Kuo |
Protuberant structure and method for making the same
|
|
EP2729595B1
(en)
|
2011-07-07 |
2017-02-01 |
ATOTECH Deutschland GmbH |
Method for providing organic resist adhesion to a copper or copper alloy surface
|
|
US9352544B2
(en)
*
|
2011-08-24 |
2016-05-31 |
Digiflex Ltd. |
Process for dry-coating flexographic surfaces
|
|
WO2013030931A1
(ja)
|
2011-08-29 |
2013-03-07 |
日本碍子株式会社 |
積層焼結セラミック配線基板、及び当該配線基板を含む半導体パッケージ
|
|
US9683305B2
(en)
|
2011-12-20 |
2017-06-20 |
Apple Inc. |
Metal surface and process for treating a metal surface
|
|
BR112014016337A8
(pt)
*
|
2012-01-31 |
2017-07-04 |
Agfa Gevaert |
impressão com tinta a jato de tinta curável por radiação e resistente ao ataque químico
|
|
JP2013162007A
(ja)
|
2012-02-07 |
2013-08-19 |
Toppan Printing Co Ltd |
微細配線パターンの製造方法
|
|
JP5935163B2
(ja)
|
2012-03-30 |
2016-06-15 |
ナガセケムテックス株式会社 |
レジスト密着性向上剤及び銅配線製造方法
|
|
US20140252571A1
(en)
|
2013-03-06 |
2014-09-11 |
Maxim Integrated Products, Inc. |
Wafer-level package mitigated undercut
|
|
EP3104398B1
(en)
*
|
2013-12-06 |
2020-03-11 |
Fujifilm Electronic Materials USA, Inc. |
Cleaning formulation and method for removing residues on surfaces
|
|
JP6164614B2
(ja)
|
2013-12-06 |
2017-07-19 |
メック株式会社 |
エッチング液、補給液及び銅配線の形成方法
|
|
TWI500806B
(zh)
|
2014-03-10 |
2015-09-21 |
Nat Univ Tsing Hua |
碳化矽薄膜的製造方法
|
|
KR20150109932A
(ko)
|
2014-03-21 |
2015-10-02 |
삼성전기주식회사 |
에칭액 조성물 및 이를 이용한 회로 패턴의 제조방법
|
|
JP2015227499A
(ja)
|
2014-06-03 |
2015-12-17 |
四国化成工業株式会社 |
エッチングレジスト材およびプリント配線板の製造方法
|
|
WO2016039259A1
(ja)
*
|
2014-09-08 |
2016-03-17 |
国立大学法人九州大学 |
有機マイクロディスク構造体の製造方法
|
|
GB2538522B
(en)
|
2015-05-19 |
2019-03-06 |
Dst Innovations Ltd |
Electronic circuit and component construction
|
|
WO2016193978A2
(en)
|
2015-06-04 |
2016-12-08 |
Jet Cu Pcb Ltd. |
Methods for producing an etch resist pattern on a metallic surface
|
|
WO2017025949A1
(en)
|
2015-08-13 |
2017-02-16 |
Jet Cu Pcb Ltd. |
Methods for producing an etch resist pattern on a metallic surface
|
|
US10398034B2
(en)
|
2016-12-12 |
2019-08-27 |
Kateeva, Inc. |
Methods of etching conductive features, and related devices and systems
|