JP2018516371A5 - - Google Patents
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- JP2018516371A5 JP2018516371A5 JP2017562982A JP2017562982A JP2018516371A5 JP 2018516371 A5 JP2018516371 A5 JP 2018516371A5 JP 2017562982 A JP2017562982 A JP 2017562982A JP 2017562982 A JP2017562982 A JP 2017562982A JP 2018516371 A5 JP2018516371 A5 JP 2018516371A5
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- JP
- Japan
- Prior art keywords
- mirror
- semiconductor device
- camera
- motor
- block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 36
- 238000000034 method Methods 0.000 claims 15
- 238000003384 imaging method Methods 0.000 claims 10
- 238000004590 computer program Methods 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 2
- 241000238366 Cephalopoda Species 0.000 claims 1
- 238000005286 illumination Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020043121A JP6968221B2 (ja) | 2015-06-05 | 2020-03-12 | 半導体デバイスの側面の検査装置 |
| JP2021174648A JP2022009508A (ja) | 2015-06-05 | 2021-10-26 | 半導体デバイスの側面の検査装置 |
| JP2023077635A JP7462095B2 (ja) | 2015-06-05 | 2023-05-10 | 半導体デバイスの側面の検査装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562171906P | 2015-06-05 | 2015-06-05 | |
| US62/171,906 | 2015-06-05 | ||
| PCT/US2015/042194 WO2016195726A1 (en) | 2015-06-05 | 2015-07-27 | Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020043121A Division JP6968221B2 (ja) | 2015-06-05 | 2020-03-12 | 半導体デバイスの側面の検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018516371A JP2018516371A (ja) | 2018-06-21 |
| JP2018516371A5 true JP2018516371A5 (enExample) | 2018-08-16 |
Family
ID=57441508
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017562982A Pending JP2018516371A (ja) | 2015-06-05 | 2015-07-27 | 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品 |
| JP2020043121A Active JP6968221B2 (ja) | 2015-06-05 | 2020-03-12 | 半導体デバイスの側面の検査装置 |
| JP2021174648A Pending JP2022009508A (ja) | 2015-06-05 | 2021-10-26 | 半導体デバイスの側面の検査装置 |
| JP2023077635A Active JP7462095B2 (ja) | 2015-06-05 | 2023-05-10 | 半導体デバイスの側面の検査装置 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020043121A Active JP6968221B2 (ja) | 2015-06-05 | 2020-03-12 | 半導体デバイスの側面の検査装置 |
| JP2021174648A Pending JP2022009508A (ja) | 2015-06-05 | 2021-10-26 | 半導体デバイスの側面の検査装置 |
| JP2023077635A Active JP7462095B2 (ja) | 2015-06-05 | 2023-05-10 | 半導体デバイスの側面の検査装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10190994B2 (enExample) |
| EP (1) | EP3281219B1 (enExample) |
| JP (4) | JP2018516371A (enExample) |
| KR (2) | KR102286993B1 (enExample) |
| CN (2) | CN107743583B (enExample) |
| TW (2) | TWI713533B (enExample) |
| WO (1) | WO2016195726A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018516371A (ja) * | 2015-06-05 | 2018-06-21 | ケーエルエー−テンカー コーポレイション | 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品 |
| JP6444909B2 (ja) * | 2016-02-22 | 2018-12-26 | 東京エレクトロン株式会社 | 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体 |
| US11340284B2 (en) | 2019-07-23 | 2022-05-24 | Kla Corporation | Combined transmitted and reflected light imaging of internal cracks in semiconductor devices |
| CN112394030A (zh) * | 2019-08-15 | 2021-02-23 | 京元电子股份有限公司 | Ic芯片外观检验模块 |
| US11686690B2 (en) | 2020-11-12 | 2023-06-27 | Kla Corporation | System and method for inspection and metrology of four sides of semiconductor devices |
| KR102780715B1 (ko) * | 2022-02-15 | 2025-03-12 | 가부시키가이샤 신가와 | 검사 장치, 실장 장치, 검사 방법, 및 기억 매체 |
| CN114624245B (zh) * | 2022-05-12 | 2022-09-02 | 泉州师范学院 | 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法 |
| CN115791807B (zh) * | 2023-01-09 | 2023-05-30 | 苏州高视半导体技术有限公司 | 用于检测晶圆缺陷的装置 |
| JPWO2024194923A1 (enExample) * | 2023-03-17 | 2024-09-26 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1068614A (ja) * | 1996-08-27 | 1998-03-10 | Copal Co Ltd | 撮像装置 |
| JP2897754B2 (ja) | 1997-03-27 | 1999-05-31 | 日本電気株式会社 | 半導体装置の検査方法 |
| US6055054A (en) * | 1997-05-05 | 2000-04-25 | Beaty; Elwin M. | Three dimensional inspection system |
| US5909285A (en) * | 1997-05-05 | 1999-06-01 | Beaty; Elwin M. | Three dimensional inspection system |
| JPH1144513A (ja) * | 1997-05-29 | 1999-02-16 | Sony Corp | 半導体装置の外観検査装置および外観検査方法 |
| US20010048867A1 (en) * | 2000-03-29 | 2001-12-06 | Lebar Technology, Inc. | Method and apparatus for processing semiconductor wafers |
| US20020135757A1 (en) * | 2001-01-02 | 2002-09-26 | Robotic Vision Systems, Inc. | LCC device inspection module |
| US7715595B2 (en) * | 2002-01-16 | 2010-05-11 | Iritech, Inc. | System and method for iris identification using stereoscopic face recognition |
| US20050084137A1 (en) * | 2002-01-16 | 2005-04-21 | Kim Dae-Hoon | System and method for iris identification using stereoscopic face recognition |
| CN100383593C (zh) * | 2003-03-07 | 2008-04-23 | 伊斯梅卡半导体控股公司 | 光学装置和检查模件 |
| JP2006093588A (ja) * | 2004-09-27 | 2006-04-06 | Nec Electronics Corp | 表面に突起部を有する半導体装置および半導体パッケージの識別方法。 |
| JP2006140391A (ja) * | 2004-11-15 | 2006-06-01 | Juki Corp | 部品認識装置及び部品実装装置 |
| CN2791639Y (zh) | 2005-03-02 | 2006-06-28 | 昆明物理研究所 | 检测半导体材料内部缺陷的红外装置 |
| KR100820811B1 (ko) * | 2005-05-30 | 2008-04-10 | 엘지전자 주식회사 | 휴대 단말기에 장착된 카메라의 렌즈 구동 장치 |
| US9022586B2 (en) * | 2006-03-28 | 2015-05-05 | Rosco, Inc. | Vehicular mirror having a camera for enhanced vision |
| US7812971B2 (en) * | 2007-06-28 | 2010-10-12 | Quality Vision International, Inc. | Multi color autofocus apparatus and method |
| JP2009150837A (ja) * | 2007-12-21 | 2009-07-09 | Canon Machinery Inc | 外観検査装置 |
| JP5240771B2 (ja) * | 2008-04-14 | 2013-07-17 | 上野精機株式会社 | 外観検査装置 |
| KR101429723B1 (ko) * | 2008-12-08 | 2014-09-24 | 삼성전자주식회사 | 패키지를 다양한 각도에서 조명하고 영상으로 획득하며, 색정보를 이용하여 패키지의 결함을 판단하는 반도체 패키지검사장치 |
| SG163442A1 (en) * | 2009-01-13 | 2010-08-30 | Semiconductor Technologies & Instruments | System and method for inspecting a wafer |
| JP2012171628A (ja) * | 2011-02-17 | 2012-09-10 | Hitachi High-Tech Instruments Co Ltd | テーピング装置及びテーピング方法 |
| PL222470B1 (pl) | 2012-08-14 | 2016-07-29 | Włodarczyk Władysław Igloo | Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT |
| TWM461051U (zh) * | 2013-05-10 | 2013-09-01 | San Shing Fastech Corp | 物件外表面的檢測裝置 |
| JP5555839B1 (ja) * | 2013-09-02 | 2014-07-23 | 上野精機株式会社 | 外観検査装置 |
| CN106062509B (zh) * | 2013-11-20 | 2019-03-08 | 联达科技设备私人有限公司 | 用于选择性地检验部件侧壁的装置和方法 |
| JP2018516371A (ja) * | 2015-06-05 | 2018-06-21 | ケーエルエー−テンカー コーポレイション | 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品 |
-
2015
- 2015-07-27 JP JP2017562982A patent/JP2018516371A/ja active Pending
- 2015-07-27 CN CN201580080747.5A patent/CN107743583B/zh active Active
- 2015-07-27 WO PCT/US2015/042194 patent/WO2016195726A1/en not_active Ceased
- 2015-07-27 EP EP15894487.6A patent/EP3281219B1/en active Active
- 2015-07-27 CN CN202311535411.6A patent/CN117577551A/zh active Pending
- 2015-07-27 KR KR1020187000081A patent/KR102286993B1/ko active Active
- 2015-07-27 KR KR1020217024180A patent/KR102740720B1/ko active Active
-
2016
- 2016-06-04 TW TW105117764A patent/TWI713533B/zh active
- 2016-06-04 TW TW109141582A patent/TWI746289B/zh active
- 2016-09-14 US US15/265,186 patent/US10190994B2/en active Active
-
2020
- 2020-03-12 JP JP2020043121A patent/JP6968221B2/ja active Active
-
2021
- 2021-10-26 JP JP2021174648A patent/JP2022009508A/ja active Pending
-
2023
- 2023-05-10 JP JP2023077635A patent/JP7462095B2/ja active Active
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