TWI713533B - 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 - Google Patents

用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 Download PDF

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Publication number
TWI713533B
TWI713533B TW105117764A TW105117764A TWI713533B TW I713533 B TWI713533 B TW I713533B TW 105117764 A TW105117764 A TW 105117764A TW 105117764 A TW105117764 A TW 105117764A TW I713533 B TWI713533 B TW I713533B
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Taiwan
Prior art keywords
mirror
semiconductor device
camera
block
housing
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TW105117764A
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English (en)
Chinese (zh)
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TW201721132A (zh
Inventor
卡爾 楚彥斯
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美商克萊譚克公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW105117764A 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 TWI713533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05

Publications (2)

Publication Number Publication Date
TW201721132A TW201721132A (zh) 2017-06-16
TWI713533B true TWI713533B (zh) 2020-12-21

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TW105117764A TWI713533B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品
TW109141582A TWI746289B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品

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TW109141582A TWI746289B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品

Country Status (7)

Country Link
US (1) US10190994B2 (enExample)
EP (1) EP3281219B1 (enExample)
JP (4) JP2018516371A (enExample)
KR (2) KR102286993B1 (enExample)
CN (2) CN107743583B (enExample)
TW (2) TWI713533B (enExample)
WO (1) WO2016195726A1 (enExample)

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WO2016195726A1 (en) * 2015-06-05 2016-12-08 Kla-Tencor Corporation Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) * 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
WO2023157061A1 (ja) * 2022-02-15 2023-08-24 株式会社新川 検査装置、実装装置、検査方法、及びプログラム
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
CN120769972A (zh) * 2023-03-17 2025-10-10 雅马哈发动机株式会社 检查装置及检查方法
KR102974429B1 (ko) * 2025-06-18 2026-06-08 주식회사 블루타일랩 반도체 디바이스의 측면 및 하부면 검사를 위한 비전 검사 장치

Citations (5)

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JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

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KR20030062377A (ko) * 2002-01-16 2003-07-25 아이리텍 잉크 스테레오 얼굴인식을 이용한 홍채인식시스템 및홍채인식방법
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PL222470B1 (pl) 2012-08-14 2016-07-29 Włodarczyk Władysław Igloo Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
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WO2016195726A1 (en) * 2015-06-05 2016-12-08 Kla-Tencor Corporation Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

Also Published As

Publication number Publication date
CN117577551B (zh) 2026-06-26
JP7462095B2 (ja) 2024-04-04
CN117577551A (zh) 2024-02-20
CN107743583B (zh) 2023-12-01
KR20210099172A (ko) 2021-08-11
EP3281219A4 (en) 2018-12-19
WO2016195726A1 (en) 2016-12-08
EP3281219A1 (en) 2018-02-14
JP2023090913A (ja) 2023-06-29
US20170003231A1 (en) 2017-01-05
TW201721132A (zh) 2017-06-16
US10190994B2 (en) 2019-01-29
EP3281219B1 (en) 2021-09-29
JP6968221B2 (ja) 2021-11-17
KR102740720B1 (ko) 2024-12-10
JP2020091300A (ja) 2020-06-11
KR20180015220A (ko) 2018-02-12
JP2022009508A (ja) 2022-01-14
KR102286993B1 (ko) 2021-08-10
TW202111313A (zh) 2021-03-16
TWI746289B (zh) 2021-11-11
JP2018516371A (ja) 2018-06-21
CN107743583A (zh) 2018-02-27

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