TWI713533B - 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 - Google Patents

用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 Download PDF

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Publication number
TWI713533B
TWI713533B TW105117764A TW105117764A TWI713533B TW I713533 B TWI713533 B TW I713533B TW 105117764 A TW105117764 A TW 105117764A TW 105117764 A TW105117764 A TW 105117764A TW I713533 B TWI713533 B TW I713533B
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Taiwan
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mirror
semiconductor device
camera
block
housing
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TW105117764A
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English (en)
Chinese (zh)
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TW201721132A (zh
Inventor
卡爾 楚彥斯
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美商克萊譚克公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0636—Reflectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
TW105117764A 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品 TWI713533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562171906P 2015-06-05 2015-06-05
US62/171,906 2015-06-05

Publications (2)

Publication Number Publication Date
TW201721132A TW201721132A (zh) 2017-06-16
TWI713533B true TWI713533B (zh) 2020-12-21

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TW105117764A TWI713533B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品
TW109141582A TWI746289B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品

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TW109141582A TWI746289B (zh) 2015-06-05 2016-06-04 用於至少對半導體裝置之側表面檢測之設備、方法及電腦程式產品

Country Status (7)

Country Link
US (1) US10190994B2 (enExample)
EP (1) EP3281219B1 (enExample)
JP (4) JP2018516371A (enExample)
KR (2) KR102286993B1 (enExample)
CN (2) CN107743583B (enExample)
TW (2) TWI713533B (enExample)
WO (1) WO2016195726A1 (enExample)

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JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品
JP6444909B2 (ja) * 2016-02-22 2018-12-26 東京エレクトロン株式会社 基板処理方法、基板処理装置及びコンピュータ読み取り可能な記録媒体
US11340284B2 (en) 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
CN112394030A (zh) * 2019-08-15 2021-02-23 京元电子股份有限公司 Ic芯片外观检验模块
US11686690B2 (en) 2020-11-12 2023-06-27 Kla Corporation System and method for inspection and metrology of four sides of semiconductor devices
KR102780715B1 (ko) * 2022-02-15 2025-03-12 가부시키가이샤 신가와 검사 장치, 실장 장치, 검사 방법, 및 기억 매체
CN114624245B (zh) * 2022-05-12 2022-09-02 泉州师范学院 实现半导体晶粒两端面与两侧面非同步等光程成像检测的光学装置与方法
CN115791807B (zh) * 2023-01-09 2023-05-30 苏州高视半导体技术有限公司 用于检测晶圆缺陷的装置
JPWO2024194923A1 (enExample) * 2023-03-17 2024-09-26

Citations (5)

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JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

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JPH1068614A (ja) * 1996-08-27 1998-03-10 Copal Co Ltd 撮像装置
JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
US6055054A (en) * 1997-05-05 2000-04-25 Beaty; Elwin M. Three dimensional inspection system
US5909285A (en) * 1997-05-05 1999-06-01 Beaty; Elwin M. Three dimensional inspection system
US20010048867A1 (en) * 2000-03-29 2001-12-06 Lebar Technology, Inc. Method and apparatus for processing semiconductor wafers
US20020135757A1 (en) * 2001-01-02 2002-09-26 Robotic Vision Systems, Inc. LCC device inspection module
US7715595B2 (en) * 2002-01-16 2010-05-11 Iritech, Inc. System and method for iris identification using stereoscopic face recognition
US20050084137A1 (en) * 2002-01-16 2005-04-21 Kim Dae-Hoon System and method for iris identification using stereoscopic face recognition
CN100383593C (zh) * 2003-03-07 2008-04-23 伊斯梅卡半导体控股公司 光学装置和检查模件
JP2006093588A (ja) * 2004-09-27 2006-04-06 Nec Electronics Corp 表面に突起部を有する半導体装置および半導体パッケージの識別方法。
CN2791639Y (zh) 2005-03-02 2006-06-28 昆明物理研究所 检测半导体材料内部缺陷的红外装置
KR100820811B1 (ko) * 2005-05-30 2008-04-10 엘지전자 주식회사 휴대 단말기에 장착된 카메라의 렌즈 구동 장치
US9022586B2 (en) * 2006-03-28 2015-05-05 Rosco, Inc. Vehicular mirror having a camera for enhanced vision
US7812971B2 (en) * 2007-06-28 2010-10-12 Quality Vision International, Inc. Multi color autofocus apparatus and method
JP2009150837A (ja) * 2007-12-21 2009-07-09 Canon Machinery Inc 外観検査装置
KR101429723B1 (ko) * 2008-12-08 2014-09-24 삼성전자주식회사 패키지를 다양한 각도에서 조명하고 영상으로 획득하며, 색정보를 이용하여 패키지의 결함을 판단하는 반도체 패키지검사장치
SG163442A1 (en) * 2009-01-13 2010-08-30 Semiconductor Technologies & Instruments System and method for inspecting a wafer
JP2012171628A (ja) * 2011-02-17 2012-09-10 Hitachi High-Tech Instruments Co Ltd テーピング装置及びテーピング方法
PL222470B1 (pl) 2012-08-14 2016-07-29 Włodarczyk Władysław Igloo Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
JP5555839B1 (ja) * 2013-09-02 2014-07-23 上野精機株式会社 外観検査装置
JP2018516371A (ja) * 2015-06-05 2018-06-21 ケーエルエー−テンカー コーポレイション 半導体デバイスの少なくとも側面の検査装置、方法及びコンピュータプログラム製品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1144513A (ja) * 1997-05-29 1999-02-16 Sony Corp 半導体装置の外観検査装置および外観検査方法
JP2006140391A (ja) * 2004-11-15 2006-06-01 Juki Corp 部品認識装置及び部品実装装置
JP2009276338A (ja) * 2008-04-14 2009-11-26 Ueno Seiki Kk 外観検査装置
TWM461051U (zh) * 2013-05-10 2013-09-01 San Shing Fastech Corp 物件外表面的檢測裝置
WO2015076753A1 (en) * 2013-11-20 2015-05-28 Semiconductor Technologies & Instruments Pte, Ltd Apparatus and method for selectively inspecting component sidewalls

Also Published As

Publication number Publication date
KR20210099172A (ko) 2021-08-11
US20170003231A1 (en) 2017-01-05
TWI746289B (zh) 2021-11-11
TW201721132A (zh) 2017-06-16
KR20180015220A (ko) 2018-02-12
EP3281219B1 (en) 2021-09-29
KR102740720B1 (ko) 2024-12-10
EP3281219A1 (en) 2018-02-14
JP6968221B2 (ja) 2021-11-17
JP2020091300A (ja) 2020-06-11
JP2022009508A (ja) 2022-01-14
CN107743583B (zh) 2023-12-01
WO2016195726A1 (en) 2016-12-08
KR102286993B1 (ko) 2021-08-10
US10190994B2 (en) 2019-01-29
EP3281219A4 (en) 2018-12-19
JP2023090913A (ja) 2023-06-29
JP7462095B2 (ja) 2024-04-04
JP2018516371A (ja) 2018-06-21
CN107743583A (zh) 2018-02-27
TW202111313A (zh) 2021-03-16
CN117577551A (zh) 2024-02-20

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